Component packaging structure
By setting up a raised structure sealing element and connection line on the substrate, the problems of component drop and connection line short circuit are solved, and the firmness of the component and the performance of the circuit board are improved.
Patent Information
- Application Number
- CN202420390760.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-02-28
AI Technical Summary
In the prior art, components are prone to fall off the substrate, and exposed connection lines may cause short circuits.
A component packaging structure is designed, by setting up a raised structure on the substrate, the patch element, wafer and metal-bound wire are sealed inside, and the stability of the packaging is enhanced by using silk screen layers and packaging grooves.
It effectively avoids components falling off or falling off, enhances component firmness, and avoids short circuits in connection lines, ensuring the performance of the circuit board and the normal operation of signals.
Smart Images
Figure CN222462895U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of component packaging, in particular to a component packaging structure. Background Art
[0002] In the prior art, components are usually mounted on a substrate by plug-in or patch method.
[0003] However, during the packaging, installation or transportation of the circuit boards, the components of the circuit boards assembled in this way are easily impacted, which may cause the solder joints of the components to become loose or even fall off, resulting in poor contact of the entire circuit board. In addition, when multiple chips electrically connected to each other are installed on the circuit board, the existing assembly method will cause the connection lines between the multiple chips to be exposed on the surface of the circuit board. If foreign objects come into contact with these lines, the lines will be disturbed, which will most likely cause a short circuit. Utility Model Content
[0004] In order to overcome the technical problems in the prior art that components are easy to fall off the substrate and the connection circuits are exposed, which may cause circuit short circuits, the utility model provides a component packaging structure that can enhance the firmness of the components and prevent the connection circuits from being exposed.
[0005] The technical solution adopted by the utility model to solve its technical problems is:
[0006] A component packaging structure comprises a substrate, wherein a protrusion structure is provided on the substrate;
[0007] The protruding structure seals a plurality of patch components, a wafer, and metal binding wires for connecting various wafer pads and circuit pads.
[0008] In the component packaging structure as described above, the protruding structure is an opaque component.
[0009] In the component packaging structure as described above, a silk-screen layer is provided on the substrate, the silk-screen layer encloses a packaging area, and the protruding structure is provided in the packaging area.
[0010] In the component packaging structure as described above, a packaging groove is provided on the substrate in the packaging area.
[0011] In the component packaging structure as described above, a plurality of circuit pads are provided on the packaging groove, and the plurality of circuit pads are electrically connected to the plurality of wafers by welding and binding metal wires;
[0012] The circuit pad is arranged to protrude from the bottom of the packaging groove.
[0013] In the component packaging structure as described above, the patch component includes at least one of a resistor, a diode, a transistor or a capacitor.
[0014] In the component packaging structure as described above, the substrate is provided with a gold finger, the wafer is fixed on the gold finger, and the wafer is electrically connected to the circuit pad via a binding wire.
[0015] In the component packaging structure as described above, the width of the gold finger is greater than the width of the wafer by more than 0.1 mm; the length of the gold finger is greater than the length of the wafer by more than 0.1 mm.
[0016] As described above, in the component packaging structure, a plurality of wafer pads are provided on the wafer, and the wafer is fixed on the gold finger by a die bonding machine; a plurality of circuit pads are provided next to the gold finger on the substrate, and a plurality of wafer pads are provided on the wafer, and the wafer pads are welded to the circuit pads by metal wires through a binding machine.
[0017] The component packaging structure as described above, the distance d between the circuit pad and the wafer;
[0018] The height of the wafer is H;
[0019] The relationship between d and H satisfies: d>H+1.7mm.
[0020] The beneficial effects of the utility model are:
[0021] Since the components are sealed in the raised structure, they can be prevented from directly colliding with external objects, thereby preventing the components from being desoldered or falling off due to collision, thereby enhancing the firmness of the components and ensuring the performance of the circuit board; and the connecting lines between the components are sealed in the raised structure, which not only makes the components occupy a smaller area of the substrate and can effectively reduce the volume of the substrate, but also prevents external objects from touching the connecting lines, thereby ensuring the normal operation of communication signals and reducing the occurrence of short circuits in the connecting lines. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0023] Figure 1 is one of the schematic diagrams of the component packaging structure in this embodiment;
[0024] Figure 2 This is the second schematic diagram of the component packaging structure in this embodiment;
[0025] Figure 3 This is the third schematic diagram of the component packaging structure in this embodiment. DETAILED DESCRIPTION
[0026] The following will clearly and completely describe the concept, specific structure and technical effects of the utility model in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the utility model can be combined interchangeably without conflicting with each other.
[0027] A component packaging structure comprises a substrate 1, on which a protrusion structure 2 is provided;
[0028] The protruding structure 2 contains a plurality of patch components, a wafer 31 , and metal binding wires 34 for connecting each wafer pad 41 and the circuit pad 4 .
[0029] Since the chip components and wafers are sealed in the raised structure, they can avoid direct collision between the chip components and wafers and external objects, thereby preventing the chip components and wafers from being desoldered or falling off due to collisions, thereby enhancing the firmness of the chip components and wafers and ensuring the performance of the circuit board; and the connecting lines between the chip components and the wafers are sealed in the raised structure, which not only makes the components occupy a smaller area of the substrate and effectively reduces the volume of the substrate, but also prevents external objects from touching the connecting lines, thereby ensuring the normal operation of communication signals and reducing the occurrence of short circuits in the connecting lines.
[0030] Specifically, the protruding structure 2 is encapsulated by using a glue dripping process;
[0031] Specifically, the substrate 1 is a PCB or a FPC.
[0032] Furthermore, the protruding structure 2 is an opaque component.
[0033] In the traditional component packaging structure, competitors can analyze the chip model used in the product through the characters and pins on the package, and then analyze and crack the chip; the wafers of the chip of the utility model are all installed in the glue, and the chip model, quantity, pins, circuits and other information cannot be seen, which further strengthens the confidentiality of the product;
[0034] Specifically, the opaque component is any one of black, red, yellow, blue and white; the purpose is to hide all the components inside the protruding structure 2 from the appearance;
[0035] Specifically, the opaque component shown is made of a one-component heat-curing epoxy resin material;
[0036] Furthermore, a silk-screen layer is disposed on the substrate 1 , the silk-screen layer encloses a packaging area 11 , and the protruding structure 2 is disposed in the packaging area 11 .
[0037] The design of the silk-screen layer makes the information on the substrate 1 clearer and easier for users to identify. At the same time, the packaging area 11 enclosed by the silk-screen layer makes the position of the protruding structure 2 clearer, which is conducive to the packaging operation;
[0038] Specifically, the packaging area 11 is circular. The setting of the circular packaging area can effectively prevent the dripping glue from penetrating outward, so that the dripping glue dripping into the packaging area is more likely to form a regular circle.
[0039] More specifically, no solder resist oil and silk screen are applied to the substrate 1 within the circular packaging area, and solder resist oil is applied to the substrate 1 outside the circular packaging area and a circular silk screen is printed on the solder resist oil, so that the solder resist oil and the circular silk screen surround the circular packaging area; since the solder resist oil and the silk screen layer have a certain thickness, the height inside the packaging area is lower than the outside of the packaging area, which can effectively prevent the glue from penetrating outward, making it easier for the glue dripping in the packaging area to form a regular circle.
[0040] Specifically, the substrate 1 is provided with a packaging groove in the packaging area 11. The design of the packaging groove enables the protrusion structure 2 to be better fixed on the substrate 1, thereby enhancing the stability of the entire packaging structure.
[0041] More specifically, a plurality of circuit pads 4 are provided on the packaging groove, and the plurality of circuit pads 4 are electrically connected to the plurality of wafers 31 by welding and binding metal wires;
[0042] The circuit pad 4 is arranged to protrude from the bottom of the packaging groove.
[0043] More specifically, the height of the patch component is less than 1 mm. If the height of the component is greater than 1 mm, it is easy to damage the steel mouth of the binding machine and the glue cannot cover it.
[0044] Specifically, a solder resist area 61 is provided on the substrate 1; the solder resist area 61 is coated with solder resist oil to prevent tin from flowing and causing a short circuit during SMT mounting of components;
[0045] More specifically, the patch component includes at least one of a resistor 32, a capacitor 33, a diode 36 or a triode. This design makes the application range of the packaging structure wider and can be applied to different types of components.
[0046] More specifically, the substrate 1 is further provided with a component pad 62 for fixing components such as capacitors 33, resistors 32 or diodes 36; there are multiple component pads 62, and the distance D between the multiple pads 62 satisfies: D≧0.15mm.
[0047] More specifically, a gold finger 5 is provided on the substrate 1 , the wafer 31 is fixed on the gold finger 5 , and the wafer 31 is electrically connected to the circuit pad 4 via a binding wire.
[0048] The specific component packaging method has the following process (taking the packaging wafer as an example); the wafer 31 is fixed on the gold finger 5 of the substrate 1 by a die bonding machine, and after baking and curing, it is put on a binding machine for wire binding, and the metal binding wire 34 is welded from the wafer pad 41 on the wafer 31 to the corresponding circuit pad 4 on the substrate, and the connection lines of the wafer 31 and other components are placed in the packaging area 11. After binding the wires for each component, glue is dripped in the packaging area 11. After the glue dripping is completed, it is placed in an oven to bake and cure the glue to form a protruding structure 2, and the packaging is completed.
[0049] More specifically, the width of the gold finger 5 is greater than the width of the wafer 31 by more than 0.1 mm; the length of the gold finger 5 is greater than the length of the wafer 31 by more than 0.1 mm. The width and length of the gold finger 5 are greater than the width and length of the wafer 31, which makes it easier for the wafer 31 to be placed in the designated position of the package by the die bonder.
[0050] More specifically, a plurality of wafer pads 41 are disposed on the wafer 31 .
[0051] Specifically, a bonding wire 34 is provided between the circuit pad 4 and the wafer 31 , and the bonding wire 34 has a length L; the length of L satisfies the following relationship: 2 mm<L<5 mm.
[0052] Furthermore, a plurality of wafer pads 41 are disposed on the wafer 31 , and the size of the wafer pads 41 is greater than 63 μm*80 μm; and the spacing between the plurality of wafer pads 41 is greater than 5 μm.
[0053] More specifically, the distance d from the circuit pad 4 to the wafer 31;
[0054] The height of the wafer 31 is H;
[0055] The relationship between d and H satisfies: d>H+1.7mm.
[0056] By setting the relationship between d and H, it can be ensured that the wafer 31 will not be damaged due to excessive pressure during the packaging process, further ensuring the service life and stability of the wafer 31.
[0057] Specifically, the wafer is fixed on the gold finger by a die bonding machine; a plurality of circuit pads are provided next to the gold finger on the substrate, and a plurality of wafer pads are provided on the wafer. The wafer pads are welded to the circuit pads by metal wires through a binding machine, so that the pins of the wafer are electrically connected to the corresponding circuits of the substrate.
[0058] The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the described embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A component packaging structure, characterized in that: It comprises a substrate (1), on which a protruding structure (2) is provided; The protruding structure (2) contains a plurality of patch components, a wafer (31), and a metal binding wire (34) for connecting each wafer pad (41) and a circuit pad (4).
2. The component packaging structure according to claim 1, characterized in that: The protruding structure (2) is an opaque component.
3. The component packaging structure according to claim 1, characterized in that: A silk-screen layer is provided on the substrate (1), the silk-screen layer encloses a packaging area (11), and the protruding structure (2) is provided in the packaging area (11).
4. The component packaging structure according to claim 3, characterized in that: A packaging groove is provided in the packaging area (11).
5. The component packaging structure according to claim 4, characterized in that: A plurality of circuit pads (4) are provided on the packaging groove, and the plurality of circuit pads (4) are electrically connected to the plurality of wafers (31) by welding and binding metal wires; The circuit pad (4) is arranged to protrude from the bottom of the packaging groove.
6. The component packaging structure according to claim 5, characterized in that: The patch element includes at least one of a resistor (32), a diode (36), a transistor or a capacitor (33).
7. The component packaging structure according to claim 6, characterized in that: A gold finger (5) is provided on the substrate (1), the wafer (31) is fixed on the gold finger (5), and the wafer (31) is electrically connected to the circuit pad (4) via a binding wire.
8. The component packaging structure according to claim 7, characterized in that: The width of the gold finger (5) is greater than the width of the wafer (31) by more than 0.1 mm; and the length of the gold finger (5) is greater than the length of the wafer (31) by more than 0.1 mm.
9. The component packaging structure according to claim 7, characterized in that: The wafer (31) is provided with a plurality of wafer pads (41), and the wafer (31) is fixed and attached to the gold finger (5) by a crystal bonding machine; a plurality of circuit pads (4) are provided next to the gold finger (5) on the substrate (1), and the wafer pads (41) are welded to the circuit pads (4) by metal wire bonding by a binding machine.
10. The component packaging structure according to claim 1, wherein: A distance d from the circuit pad (4) to the wafer (31); The height of the wafer (31) is H; The relationship between d and H satisfies: d>H+1.7mm.