Jet evaporation cavity heat sink

Abstract

The utility model discloses a jet flow evaporation cavity heat sink which comprises an evaporation sheet and a heat sink body, a heat absorption cavity is formed in the middle of the inner side of the evaporation sheet, an expansion valve is fixed to one end of the heat absorption cavity, a pressure regulating valve is fixed to the end, away from the expansion valve, of the heat absorption cavity, and the heat absorption cavity is arranged in a bent shape. The heat sink body is fixed to the bottom end of the evaporation piece and made of red copper, a liquid gold coating is arranged on the top wall in the heat sink body and made of gallium-based liquid metal, and a chip is arranged at the bottom end of the liquid gold coating. Compared with an existing heat sink, the jet flow evaporation cavity heat sink is provided with an evaporation cavity structure, heat dissipation and cooling are carried out in a cooling liquid evaporation heat absorption mode, the heat dissipation efficiency is higher, the cooling speed is higher, meanwhile, the device is provided with a liquid gold heat conduction mechanism, the heat conduction and dissipation speed of the device can be further improved, and the service life of the device is prolonged. And moreover, the situation of liquid gold leakage is avoided, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat sinks, in particular to a jet evaporation chamber heat sink. Background Art

[0002] A heat sink is a component used to bear and disperse the heat generated by a chip during chip design and manufacturing. Its main characteristics are high thermal conductivity, low expansion coefficient and good processing performance.

[0003] The publication number authorized by China is CN117337618A, and the patent is named heat sink structure. The device includes: a metal corrugated plate-shaped fin, whose cross-sectional shape is formed into a corrugated shape and has a plurality of through holes opened on its plate surface; a heat absorption part, which absorbs the heat of the cooling object and transfers the heat to the corrugated plate-shaped fin; and a fluid flow path, which supplies a cooling fluid to the plate surface of the corrugated plate-shaped fin so that the fluid flows along the through holes, and the heat transferred from the heat absorption part to the corrugated plate-shaped fin is dissipated to the fluid passing through the through holes.

[0004] Although the above device can obtain a higher heat exchange capacity, there are still some problems when using the device:

[0005] 1. The device dissipates heat by taking away heat through the flow of fluid, but the amount of heat that can be taken away is relatively limited, which limits the heat dissipation efficiency of the device.

[0006] 2. The device does not have an efficient heat conduction structure. It is directly installed on the heat dissipation object, and some tiny gaps filled with air will appear on the contact surface, resulting in poor heat conduction, which in turn affects the heat dissipation effect of the device.

[0007] In view of the above situation, technical innovation is carried out on the basis of the existing heat sink. Utility Model Content

[0008] The purpose of the utility model is to provide a jet evaporation chamber heat sink to solve the problems raised in the above background technology.

[0009] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a jet evaporation chamber heat sink, comprising an evaporating plate and a heat sink body, a heat absorption chamber is opened in the inner middle part of the evaporating plate, and an expansion valve is fixed at one end of the heat absorption chamber, a pressure regulating valve is fixed at the end of the heat absorption chamber away from the expansion valve, and the heat absorption chamber is arranged in a curved shape, the heat sink body is fixed to the bottom end of the evaporating plate, and the heat sink body is made of copper, the inner top wall of the heat sink body is provided with a liquid gold coating, and the liquid gold coating is made of gallium-based liquid metal, and a chip is arranged at the bottom end of the liquid gold coating.

[0010] Furthermore, the evaporation sheet is made of copper, and the evaporation sheet and the heat sink body are integrally formed.

[0011] Furthermore, sealing pads are arranged on both left and right sides of the bottom end of the heat sink body, and the sealing pads are made of silicone material.

[0012] Furthermore, mounting screws are provided inside the left and right sides of the heat sink body, and the mounting screws are made of stainless steel.

[0013] Furthermore, a fixing component is arranged at the bottom end of the chip, and the fixing component includes an electronic board and an insulating seat, and insulating seats are arranged on both left and right sides of the bottom end of the electronic board.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the device is provided with an evaporation chamber structure, which dissipates heat and cools down the temperature by absorbing heat through evaporation of the coolant, with higher heat dissipation efficiency and faster cooling speed. At the same time, the device is provided with a liquid gold heat conduction mechanism, which can further improve the heat conduction and heat dissipation speed of the device, and there will be no liquid gold leakage, which is beneficial to improving the practicability of the device.

[0015] 1. The utility model is provided with an evaporator, an expansion valve, a heat absorption chamber, a pressure regulating valve and a heat sink body. When installing the device, the user can connect the pressure regulating valve to a condenser and a compressor, and then connect the compressor to the expansion valve. A coolant is provided in the connecting pipeline. When the coolant jet passes through the expansion valve, it will become a coolant mist due to the reduction of the expansion valve pipe diameter. The coolant mist fills the heat absorption chamber and evaporates and absorbs heat, so that the evaporator is quickly cooled, and then the temperature of the heat sink body is reduced, thereby improving the heat dissipation and cooling effect of the heat sink body. Through the above structure, the device dissipates heat and cools down by absorbing heat through the evaporation of the coolant, so the heat dissipation efficiency is higher and the cooling speed is faster.

[0016] 2. The utility model arranges a heat sink body, liquid gold coating, chip, sealing gasket and mounting screws. The liquid gold coating can fill the tiny gap between the chip and the heat sink body, reduce the air cavity on the contact surface between the chip and the heat sink body, thereby increasing the heat conduction area of ​​the chip. At the same time, since the thermal conductivity of liquid gold itself is very good, it can effectively improve the thermal conductivity efficiency of the device. The sealing gasket is made of silicone. When installing the heat sink body, the user can fix the heat sink body on the electronic board by installing screws. When the mounting screws are tightened, the sealing gasket is close to the electronic board surface, thereby effectively avoiding liquid gold leakage and causing a short circuit. Through the above structure, the thermal conductivity and heat dissipation speed of the device can be further improved, and liquid gold leakage will not occur, which is beneficial to improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a front view structural schematic diagram of a jet evaporation chamber heat sink of the utility model;

[0018] Figure 2It is a partial top view and cross-sectional enlarged structural schematic diagram of an evaporation plate, an expansion valve, a heat absorption chamber and a pressure regulating valve of a jet evaporation chamber heat sink of the utility model;

[0019] Figure 3 It is a front view and cross-sectional structure schematic diagram of a jet evaporation chamber heat sink of the utility model.

[0020] In the figure: 1. Evaporator; 2. Expansion valve; 3. Heat absorption chamber; 4. Pressure regulating valve; 5. Heat sink body; 6. Liquid gold coating; 7. Chip; 8. Sealing gasket; 9. Mounting screws; 10. Fixing assembly; 1001. Electronic board; 1002. Insulating seat. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1-3 The principles and features of the present invention are described, and the examples given are only used to explain the present invention, and are not used to limit the scope of the present invention. The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0022] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] like Figure 1 and Figure 2As shown, a jet evaporation chamber heat sink comprises an evaporation sheet 1 and a heat sink body 5, a heat absorption chamber 3 is provided in the middle of the inner side of the evaporation sheet 1, and an expansion valve 2 is fixed to one end of the heat absorption chamber 3, a pressure regulating valve 4 is fixed to one end of the heat absorption chamber 3 away from the expansion valve 2, and the heat absorption chamber 3 is arranged in a curved shape, the heat sink body 5 is fixed to the bottom end of the evaporation sheet 1, and the heat sink body 5 is made of copper, a liquid gold coating 6 is provided on the inner top wall of the heat sink body 5, and the liquid gold coating 6 is made of gallium-based liquid metal, and a chip 7 is provided at the bottom end of the liquid gold coating 6. When installing the device, The user can connect the pressure regulating valve 4 to the condenser and the compressor, and then connect the compressor to the expansion valve 2. A coolant is provided in the connecting pipeline. When the coolant jet passes through the expansion valve 2, it will become coolant mist due to the reduction in the diameter of the expansion valve 2. The coolant mist fills the heat absorption chamber 3 to evaporate and absorb heat, thereby causing the evaporator 1 to cool down quickly, and then the temperature of the heat sink body 5 is reduced, thereby improving the heat dissipation and cooling effect of the heat sink body 5. Through the above structure, the device dissipates heat and cools down by absorbing heat through the evaporation of the coolant, with higher heat dissipation efficiency and faster cooling speed.

[0025] like Figure 1 and Figure 3 As shown, the evaporation sheet 1 is made of copper, and the evaporation sheet 1 and the heat sink body 5 are integrally formed, and sealing pads 8 are arranged on both sides of the bottom end of the heat sink body 5, and the sealing pads 8 are made of silicone material, and mounting screws 9 are arranged inside the left and right sides of the heat sink body 5, and the mounting screws 9 are made of stainless steel, and a fixing component 10 is arranged at the bottom end of the chip 7, and the fixing component 10 includes an electronic board 1001 and an insulating seat 1002, and insulating seats 1002 are arranged on both sides of the bottom end of the electronic board 1001, and the liquid gold coating 6 can fill the small gap between the chip 7 and the heat sink body 5, reducing the chip 7 and the heat sink body. 5, thereby increasing the heat conduction area of ​​the chip 7. At the same time, since the thermal conductivity of liquid gold itself is very good, the thermal conduction efficiency of the device can be effectively improved. The sealing pad 8 is made of silicone. When installing the heat sink body 5, the user can fix the heat sink body 5 on the electronic board 1001 by installing the screws 9. When the mounting screws 9 are tightened, the sealing pad 8 is close to the surface of the electronic board 1001, thereby effectively avoiding liquid gold leakage and causing a short circuit. Through the above structure, the heat conduction and heat dissipation speed of the device can be further improved, and liquid gold leakage will not occur, which is conducive to improving the practicality of the device.

[0026] In summary: when using the jet evaporation chamber heat sink, first, when the chip 7 is electrically connected and installed with the electronic board 1001, the user can evenly apply the liquid gold coating 6 on the surface of the chip 7, and fix the heat sink body 5 to the outside of the chip 7 by installing screws 9, and then connect the condenser, compressor and other refrigeration components with the expansion valve 2 and the pressure regulating valve 4. At this time, the evaporation plate 1 acts like an evaporator. After the coolant enters the evaporation plate 1, it can evaporate and absorb heat, thereby cooling and dissipating the chip 7. When installing the device, the user can connect the pressure regulating valve 4 to the condenser and the compressor, and then connect the compressor to the expansion valve 2. A coolant is provided in the connecting pipeline. When the coolant jet passes through the expansion valve 2, it will become a coolant mist due to the reduction in the diameter of the expansion valve 2. The coolant mist fills the heat absorption chamber 3. The evaporation absorbs heat, so that the evaporator sheet 1 cools down quickly, and then the temperature of the heat sink body 5 is reduced, thereby improving the heat dissipation and cooling effect of the heat sink body 5. The liquid gold coating 6 can fill the tiny gap between the chip 7 and the heat sink body 5, and reduce the air cavity on the contact surface of the chip 7 and the heat sink body 5, thereby increasing the heat conduction area of ​​the chip 7. At the same time, since the thermal conductivity of the liquid gold itself is very good, it can effectively improve the thermal conductivity of the device. The sealing gasket 8 is made of silicone. When installing the heat sink body 5, the user can fix the heat sink body 5 on the electronic board 1001 by installing the screws 9. When the mounting screws 9 are tightened, the sealing gasket 8 is close to the surface of the electronic board 1001, thereby effectively avoiding liquid gold leakage and causing a short circuit. This is the working principle of the jet evaporation chamber heat sink.

[0027] The above are only preferred embodiments of the utility model, and do not impose any form of limitation on the utility model. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings and above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A jet evaporation chamber heat sink, comprising an evaporation sheet (1) and a heat sink body (5), characterized in that: A heat absorption chamber (3) is provided in the middle of the inner side of the evaporation sheet (1), and an expansion valve (2) is fixed to one end of the heat absorption chamber (3), and a pressure regulating valve (4) is fixed to one end of the heat absorption chamber (3) away from the expansion valve (2), and the heat absorption chamber (3) is arranged in a curved shape, the heat sink body (5) is fixed to the bottom end of the evaporation sheet (1), and the heat sink body (5) is made of copper, and a liquid gold coating (6) is provided on the inner top wall of the heat sink body (5), and the liquid gold coating (6) is made of gallium-based liquid metal, and a chip (7) is provided at the bottom end of the liquid gold coating (6).

2. The jet evaporation chamber heat sink according to claim 1, characterized in that: The evaporation plate (1) is made of red copper, and the evaporation plate (1) and the heat sink body (5) are integrally formed.

3. The jet evaporation chamber heat sink according to claim 1, characterized in that: Sealing pads (8) are provided on both left and right sides of the bottom end of the heat sink body (5), and the sealing pads (8) are made of silicone rubber.

4. The jet evaporation chamber heat sink according to claim 1, characterized in that: Mounting screws (9) are arranged inside the left and right sides of the heat sink body (5), and the mounting screws (9) are made of stainless steel.

5. The jet evaporation chamber heat sink according to claim 1, characterized in that: A fixing component (10) is provided at the bottom end of the chip (7), and the fixing component (10) comprises an electronic board (1001) and an insulating seat (1002), and insulating seats (1002) are provided on both left and right sides of the bottom end of the electronic board (1001).

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