Copper bar with nickel electroplated on surface

Abstract

The utility model discloses a copper bar with nickel electroplated on the surface, which relates to the technical field of electrical connection and comprises a bottom connecting part, an upper connecting part and a connecting part used for connecting the bottom connecting part and the upper connecting part. Wherein the outer sides of the bottom connecting part, the upper connecting part and the connecting part are respectively provided with an electroplated nickel layer; the bottom connecting part and the upper connecting part are both in an L shape, the ends, connected with the connecting part, of the bottom connecting part and the upper connecting part are perpendicular or parallel to each other, and the other ends of the bottom connecting part and the upper connecting part are parallel to each other. According to the utility model, the L-shaped bottom connecting part and the L-shaped upper connecting part are connected through the connecting part so as to improve the connecting stability, and the electronickelling layer is adopted so as to effectively avoid the problem that the conductivity is reduced due to a surface oxidation film.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical connection, and more specifically to a copper busbar with nickel electroplating on its surface. Background Art

[0002] Copper busbars are commonly used in electrical connection tools. Copper is one of the best conductors of heat and electricity and is the only metal that can be produced naturally in large quantities. Therefore, it is widely used in the electrical field due to its low cost and high electrical conductivity.

[0003] A Chinese patent with announcement number CN220856833U discloses a copper bar fixing bracket and a copper bar assembly, wherein the copper bar assembly comprises the copper bar fixing bracket and a copper bar; the copper bar is clamped in an open groove, and a stop protrusion limits the copper bar.

[0004] However, the copper busbar assembly is fixed with a copper busbar fixing bracket, which has the problems of poor stability and high production and assembly costs. Therefore, injection molded copper busbars came into being. However, injection molded copper busbars also have the problem of relative shaking of the copper busbar due to insufficient connection stability between the copper busbar and the injection molded part. In addition, since the copper busbar undergoes high temperature treatment of about 200°C during the injection molding process, the copper busbar under high temperature conditions reacts with oxygen in the air and forms an oxide film, thereby affecting the conductive properties of the injection molded copper busbar, which needs to be improved. Summary of the invention

[0005] In view of this, the purpose of this application is to provide a copper busbar with nickel electroplating on the surface to achieve stable connection and avoid the reduction of conductivity. The specific scheme is as follows:

[0006] A copper busbar with surface electroplated nickel comprises a bottom connection portion, an upper connection portion and a connecting portion for connecting the bottom connection portion and the upper connection portion; wherein the outer sides of the bottom connection portion, the upper connection portion and the connecting portion are all provided with an electroplated nickel layer; the bottom connection portion and the upper connection portion are both L-shaped, and one end of the bottom connection portion and the upper connection portion connected to the connecting portion are perpendicular or parallel to each other, and the other ends are parallel to each other.

[0007] Preferably: the upper end of the bottom connection portion is vertical, the connecting portion extends horizontally or laterally and one end is used to connect to the upper end of the bottom connection portion; the lower end of the upper connection portion is vertical, and the lower end is used to connect to the other end of the connecting portion, and the thickness of the electroplated nickel layer is 8-15μm.

[0008] Preferably, a connecting head is disposed at the upper end of the upper connecting portion, the connecting head and the lower end of the bottom connecting portion are both horizontal, and the width of the connecting head is greater than the width of the upper connecting portion.

[0009] Preferably, one side of the connecting head along the width direction is flush with a corresponding side of the upper end of the connecting head, and the other side protrudes from the other side of the connecting head.

[0010] Preferably, a folded convex portion is provided on one side of the connecting head that is flush with the corresponding side of the upper end of the connecting head or on the other side along the length direction.

[0011] Preferably, the folded protrusion is perpendicular to the connecting head along the vertical direction and extends upward.

[0012] It can be seen from the above scheme that the present application provides a copper busbar with a nickel electroplated surface, which has the following beneficial effects:

[0013] 1. The L-shaped bottom connection part and the upper connection part are connected through the connection part to improve the connection stability, and the electroplated nickel layer is used to effectively avoid the problem of reduced conductivity caused by surface oxide film;

[0014] 2. By the difference in width between the connecting head and the upper connecting part, and the folding convex part connected to the connecting head and extending upward, the connection stability between the surface electroplated nickel copper busbar and the injection molded part is improved;

[0015] 3. The connection structure between the upper connection part and the connection part and the connection structure between the connection part and the bottom connection part are used to improve the connection stability between the surface nickel-plated copper busbar and the injection molded part. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of this embodiment.

[0017] Explanation of the reference numerals: 1. bottom connecting portion; 2. upper connecting portion; 3. connecting head; 31. folded convex portion; 4. connecting portion. DETAILED DESCRIPTION

[0018] In order to make the technical solution and advantages of the utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0019] like Figure 1As shown, a copper busbar with nickel electroplating on the surface comprises a bottom connection part 1, an upper connection part 2 and a connection part 4 for connecting the bottom connection part 1 and the upper connection part 2. The connection part 4 is in an "I" shape, and the thickness and width of both ends match the corresponding bottom connection part 1 and the upper connection part 2. Therefore, the connection part 4 vertically connects the corresponding ends of the bottom connection part 1 and the upper connection part 2, and then obtains the injection-molded copper busbar through injection molding, which has the effect of effectively improving the connection stability.

[0020] It should be mentioned that the outer sides of the bottom connection part 1, the upper connection part 2 and the connecting part 4 are all provided with an electroplated nickel layer, and the thickness of the electroplated nickel layer is 8-15μm, which will make the electroplated nickel layer effectively avoid the problem of decreased conductivity caused by the surface oxide film. The preparation process steps of the electroplated nickel layer are loading, degreasing, water washing, activation, water washing, electroplating nickel, water washing, hot water washing, drying, unloading and inspection. And after testing, the surface electroplated nickel copper bus has a CASS salt spray test of up to 16 hours. At the same time, the bottom connection part 1 and the upper connection part 2 are both L-shaped, and the ends of the bottom connection part 1 and the upper connection part 2 connected to the connecting part 4 are perpendicular or parallel to each other, and the other ends are parallel to each other.

[0021] like Figure 1 As shown, the upper end of the bottom connection part 1 is vertical, and the connection part 4 extends horizontally or laterally and one end is used to connect with the upper end of the bottom connection part 1. The lower end of the upper connection part 2 is vertical, and the lower end is used to connect with the other end of the connection part 4. At the same time, a connection head 3 is provided at the upper end of the upper connection part 2. The connection head 3 and the lower end of the bottom connection part 1 are both horizontal, and the width of the connection head 3 is greater than the width of the upper connection part 2. Therefore, the lower end of the bottom connection part 1 is embedded in the injection molding material, and the connection head 3 is embedded in the injection molding material, so that the surface electroplated nickel copper busbar has the effect of significantly improving the connection stability.

[0022] It should be noted that one side of the connection head 3 along the width direction is flush with the corresponding side of the upper end of the connection head 3, and the other side protrudes from the other side of the connection head 3. A folded protrusion 31 is provided on the side of the connection head 3 that is flush with the corresponding side of the upper end of the connection head 3 or on the other side along the length direction. The folded protrusion 31 is perpendicular to the connection head 3 in the vertical direction and extends upward. Therefore, the surface electroplated nickel copper busbar achieves the effect of improving the connection stability between the surface electroplated nickel copper busbar and the injection molded part through the width difference between the connection head 3 and the upper connection part 2, and the folded protrusion 31 is connected to the connection head 3 and extends upward.

[0023] In summary, the present application provides a surface electroplated nickel copper busbar, which connects an L-shaped bottom connection portion 1 and an upper connection portion 2 through an I-shaped connection portion 4 to improve the connection stability, and adopts an electroplated nickel layer to effectively avoid the problem of reduced conductivity due to a surface oxide film; wherein, the connection structure between the upper connection portion 2 and the connection portion 4 and the connection structure between the connection portion 4 and the bottom connection portion 1 have the effect of improving the connection stability between the surface electroplated nickel copper busbar and the injection molded part.

[0024] The "first", "second", "third", "fourth", etc. (if any) referred to in this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods or devices.

[0025] It should be noted that the descriptions involving "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0026] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A copper busbar with nickel electroplating on the surface, characterized in that: The invention comprises a bottom connection part (1), an upper connection part (2) and a connecting part (4) for connecting the bottom connection part (1) and the upper connection part (2); wherein the outer sides of the bottom connection part (1), the upper connection part (2) and the connecting part (4) are all provided with an electroplated nickel layer; the bottom connection part (1) and the upper connection part (2) are both L-shaped, and one end of the bottom connection part (1) and the upper connection part (2) connected to the connecting part (4) are perpendicular or parallel to each other, and the other ends are parallel to each other.

2. A copper busbar with nickel electroplating on the surface according to claim 1, characterized in that: The upper end of the bottom connection part (1) is vertical, the connecting part (4) extends horizontally or laterally and one end is used to connect with the upper end of the bottom connection part (1); the lower end of the upper connection part (2) is vertical, and the lower end is used to connect with the other end of the connecting part (4), and the thickness of the electroplated nickel layer is 8-15 μm.

3. A copper busbar with surface electroplating nickel according to claim 2, characterized in that: A connecting head (3) is provided at the upper end of the upper connecting portion (2); the connecting head (3) and the lower end of the bottom connecting portion (1) are both horizontal, and the width of the connecting head (3) is greater than the width of the upper connecting portion (2).

4. The surface-nickel-plated copper busbar according to claim 3, characterized in that: One side of the connecting head (3) along the width direction is flush with a corresponding side of the upper end of the connecting head (3), and the other side protrudes from the other side of the connecting head (3).

5. The surface-nickel-plated copper busbar according to claim 4, characterized in that: A folded convex portion (31) is provided on one side of the connecting head (3) that is flush with the corresponding side of the upper end of the connecting head (3) or on the other side along the length direction.

6. The surface-nickel-plated copper busbar according to claim 5, characterized in that: The folded convex portion (31) is perpendicular to the connecting head (3) in the vertical direction and extends upward.

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