Laser heating system for simulating chip heating
By designing a laser heating system that simulates chip heating, using laser modules and conductive fiber shaping laser beams, efficient heat dissipation verification of shells of different materials is solved, and the problems of low verification efficiency and high R&D costs in the existing technology are solved.
Patent Information
- Application Number
- CN202421009842.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-10
AI Technical Summary
When the prior art performs heat dissipation verification of shells of different materials, the efficiency of using chips for verification is low, and the R&D time is longer, resulting in higher risks and costs.
A laser heating system that simulates the heating of the chip is designed, including a case, a laser module, a conductive fiber and a control module. The laser beam is output through the laser module, and the conductive fiber shaped the laser beam into a square spot, and the laser heating is controlled through the control module.
The system can accurately simulate the heating state during the chip operation, improve the efficiency of heat dissipation verification, reduce R&D time and risks, and reduce costs.
Smart Images
Figure CN222464843U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser heating, in particular to a laser heating system for simulating chip heating. Background Art
[0002] With the continuous development and progress of science and technology, equipment is becoming more and more miniaturized and integrated, especially for electronic products such as mobile phones, laptops, routers, set-top boxes, etc. In order to verify the design of heat-generating chips in the early stage, it is necessary to compare the heat dissipation differences of various shells of different materials and verify the thermal design performance of the product; in related technologies, when performing heat dissipation verification on shells of different materials, the efficiency of using chips for verification is low, and the research and development time is long, resulting in higher risks and costs. Utility Model Content
[0003] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one purpose of the utility model is to provide a laser heating system for simulating chip heating, comprising:
[0004] chassis;
[0005] A laser module, which is disposed in the housing and is used to output a laser beam;
[0006] A transmission optical fiber, which is connected to the laser module and is used to shape the laser beam into a square spot and output it;
[0007] A control module is disposed in the housing and is electrically connected to the laser module to control the laser module to output a laser beam.
[0008] Preferably, the laser module is a semiconductor laser with a wavelength of 808nm-980nm.
[0009] Preferably, a processing head is also provided on the transmission optical fiber, and the processing head is used to irradiate the square light spot to a designated position when being operated.
[0010] Preferably, the transmission optical fiber comprises:
[0011] A core layer, the core layer is used to conduct the laser beam;
[0012] An outer cladding layer, the outer cladding layer surrounds the core layer;
[0013] The coating layer has at least two layers and surrounds the outer cladding layer.
[0014] Preferably, an optical cladding is provided between the core layer and the outer cladding, and the optical cladding is adjacent to the processing head and is used for shaping the laser beam into a square spot and outputting the spot.
[0015] Preferably, the radial cross-section of the optical cladding is a square ring structure with a side length of 400-1000um.
[0016] Preferably, the power of the laser module is 10±2%W.
[0017] Preferably, the housing is further provided with a plurality of interfaces, and the plurality of interfaces are electrically connected to the control module for external connection to a display device.
[0018] The above solution of the utility model includes at least the following beneficial effects:
[0019] The laser heating system for simulating chip heating provided by the utility model can control the laser module to output a laser beam through a control module, so that the laser beam can be shaped into a square spot through a conduction relationship and output to a specified position of a product shell for heating, so that when heat dissipation verification is performed on shells of different materials, the heating state of the chip during operation can be accurately simulated, the verification efficiency is higher, the R&D time is reduced, and the R&D risks and costs are reduced.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0022] Figure 1 It is a structural schematic diagram of a laser heating system for simulating chip heating provided in an embodiment of the utility model;
[0023] Figure 2 It is a cross-sectional view of a transmission optical fiber provided in an embodiment of the utility model.
[0024] Description of Figure Numbers:
[0025] 10. Housing; 20. Transmitting optical fiber; 21. Core layer; 22. Outer cladding; 23. Coating layer; 24. Optical cladding; 30. Processing head; 40. Interface.
[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0027] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.
[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0030] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0032] The laser heating system for simulating chip heating according to an embodiment of the utility model will be described in detail below with reference to the accompanying drawings.
[0033] Reference Figure 1 and Figure 2 As shown, the laser heating system for simulating chip heating provided in the embodiment of the utility model includes: a housing 10, a laser module (not shown in the figure), a transmission optical fiber 20 and a control module (not shown in the figure). The laser module is arranged in the housing 10 and is used to output a laser beam; the transmission optical fiber 20 is connected to the laser module and is used to shape the laser beam into a square spot and output it; the control module is arranged in the housing 10 and is electrically connected to the laser module to control the laser module to output the laser beam.
[0034] Among them, most chips are usually square, so by shaping the laser beam into a square spot, the chip heating can be simulated more closely to reality and the energy distribution can be more uniform; it can be understood that the laser module is a semiconductor laser with a wavelength of 808nm-980nm, and the power of the laser module is 10±2% W. In the laser heating process, a laser with a wavelength of 980nm is usually used, which can more accurately simulate the chip heating.
[0035] The laser heating system for simulating chip heating provided by the utility model can control the laser module to output a laser beam through a control module, so that the laser beam can be shaped into a square spot through a conduction relationship and output to a specified position of a product shell for heating, so that when heat dissipation verification is performed on shells of different materials, the heating state of the chip during operation can be accurately simulated, the verification efficiency is higher, the R&D time is reduced, and the R&D risks and costs are reduced.
[0036] Specifically, a processing head 30 is also provided on the transmission optical fiber 20, and the processing head 30 is used to irradiate a square light spot to a specified position when operated. Among them, a power detection device can be equipped on the processing head 30 to monitor the laser power output by the processing head 30, so as to more accurately simulate the heating of the chip; and after the processing head 30 is irradiated to the specified position of the product shell, the square light spot can make the specified position heat up, so as to more accurately verify the heat dissipation difference of the product shell, and the operation is simpler and more convenient.
[0037] Specifically, the transmission optical fiber 20 includes a core layer 21, an outer cladding layer 22 and a coating layer 23, wherein the core layer 21 is used to transmit the laser beam; the outer cladding layer 22 surrounds the core layer 21; the coating layer 23 has at least two layers and surrounds the outer cladding layer 22; further, an optical cladding layer 24 is provided between the core layer 21 and the outer cladding layer 22, and the optical cladding layer 24 is adjacent to the processing head 30, and is used to shape the laser beam into a square spot and output it.
[0038] In this embodiment, the radial cross-section of the optical cladding 24 is a square ring structure with a side length of 400-1000um. When the laser module emits a laser beam, the laser beam is usually a circular spot. The laser beam is transmitted through the core layer 21, and the light wave is confined in the core layer 21 through the outer cladding 22 for propagation, so that the laser beam can be shaped into a square spot after passing through the optical cladding 24, thereby better simulating chip heating; optionally, the side length of the square spot is variable within a certain range, thereby being able to adapt to different types of chips to simulate heating, and having a wider range of applications.
[0039] As an optional embodiment, the housing 10 is further provided with a plurality of interfaces 40 , and the plurality of interfaces 40 are electrically connected to the control module.
[0040] In this embodiment, the multiple interfaces 40 may include a power interface 40, an RS232 interface 40, a control interface 40, etc., and are connected to a display device through each interface 40, so that when the simulated chip heats up, the laser power and heat data can be output and displayed.
[0041] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0042] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. A laser heating system for simulating chip heating, characterized in that: include: chassis; A laser module, which is disposed in the housing and is used to output a laser beam; A transmission optical fiber, which is connected to the laser module and is used to shape the laser beam into a square spot and output it; A control module is disposed in the housing and is electrically connected to the laser module to control the laser module to output a laser beam.
2. The laser heating system for simulating chip heating according to claim 1, characterized in that: The laser module is a semiconductor laser with a wavelength of 808nm-980nm.
3. The laser heating system for simulating chip heating according to claim 1, characterized in that: The transmission optical fiber is also provided with a processing head, and the processing head is used to irradiate the square light spot to a designated position when being operated.
4. The laser heating system for simulating chip heating according to claim 3, characterized in that: The transmission optical fiber comprises: A core layer, the core layer is used to conduct the laser beam; An outer cladding layer, the outer cladding layer surrounds the core layer; The coating layer has at least two layers and surrounds the outer cladding layer.
5. The laser heating system for simulating chip heating according to claim 4, characterized in that: An optical cladding is provided between the core layer and the outer cladding. The optical cladding is adjacent to the processing head and is used for shaping the laser beam into a square spot and outputting the spot.
6. The laser heating system for simulating chip heating according to claim 5, characterized in that: The radial cross section of the optical cladding is a square ring structure with a side length of 400-1000um.
7. The laser heating system for simulating chip heating according to claim 1, characterized in that: The power of the laser module is 10±2%W.
8. The laser heating system for simulating chip heating according to claim 1, characterized in that: The housing is also provided with a plurality of interfaces, and the plurality of interfaces are electrically connected to the control module.