Transmission line module for dilution refrigerator, dilution refrigerator and quantum computer

Abstract

The utility model discloses a transmission line module for a dilution refrigerator, the dilution refrigerator and a quantum computer, and the transmission line module comprises a plurality of signal transmission lines, a plurality of electronic devices which are electrically connected with the interior of the dilution refrigerator in a one-to-one correspondence manner, and a control cabinet which is arranged outside the dilution refrigerator, the plurality of electronic devices are dispersedly arranged on different temperature zone segmentation discs of the dilution refrigerator; the plurality of heat sink elements are used for being mounted on the plurality of temperature zone segmentation discs in a one-to-one correspondence manner; wherein the signal transmission line electrically connected with any electronic device in the plurality of electronic devices is in contact with the heat sink element on each temperature zone segmentation disc above the signal transmission line in sequence and then is electrically connected with the control cabinet. The transmission line module is high in integration level and convenient for heat conduction.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a transmission line module for a dilution refrigerator, a dilution refrigerator and a quantum computer. Background Art

[0002] Quantum computers are physical devices that follow the laws of quantum mechanics to perform high-speed mathematical and logical operations, store and process quantum information. The main characteristics of quantum computers are fast operation speed, strong information processing capabilities, and a wide range of applications. Among the many quantum computing technology routes, the superconducting technology route has a very broad prospect, and quantum computers developed based on the superconducting technology route have attracted much attention in the industry.

[0003] The basic unit of superconducting quantum computing is the quantum chip, which needs to work in an ultra-low temperature environment, about 10mK to 20mK (Kelvins). Ultra-low temperature can effectively reduce the impact of environmental noise on quantum chips. Ultra-low temperature environment is usually provided by a dilution refrigerator. Usually, each layer of cold plate inside the dilution refrigerator is equipped with temperature sensors and heaters and other electronic devices. These electronic devices are connected to the control cabinet outside the dilution refrigerator through their own signal transmission lines. When the electronic devices are working, these signal transmission lines will generate heat. If the generated heat cannot be effectively conducted out, it will affect the normal temperature of the temperature zone, and then affect the normal operation of the quantum chip; if a heat sink is separately set on each signal transmission line to achieve heat conduction with the temperature zone dividing plate, although it can solve the heat problem, it is not conducive to the integration of the line. Therefore, it is urgent to provide a transmission line module with high integration and convenient heat conduction to solve the above problems.

[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The utility model aims to provide a transmission line module for a dilution refrigerator, a dilution refrigerator and a quantum computer which are highly integrated and convenient for heat conduction.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The first aspect of the utility model provides a transmission line module for a dilution refrigerator, comprising:

[0008] A plurality of signal transmission lines are used for electrically connecting a plurality of electronic devices inside the dilution refrigerator and a control cabinet outside the dilution refrigerator in a one-to-one correspondence, and the plurality of electronic devices are dispersedly arranged on partition plates of different temperature zones of the dilution refrigerator;

[0009] A plurality of heat sink elements, used for being installed on a plurality of the temperature zone dividing plates in a one-to-one correspondence;

[0010] Wherein, the signal transmission line electrically connected to any electronic device among the plurality of electronic devices sequentially contacts the heat sink element on each temperature zone dividing plate above it and then is electrically connected to the control cabinet.

[0011] The transmission line module for the dilution refrigerator as described above, further, the heat sink element is integrated with a plurality of first signal connectors, each of the first signal connectors is electrically connected to a first transmission line segment, and the other end of the first transmission line segment is provided with a second signal connector;

[0012] The first signal connector on any one of the heat sink elements is electrically connected to the second signal connector or the electronic device connected to its adjacent heat sink element, and the second signal connector connected to any one of the heat sink elements is electrically connected to the first signal connector on the control cabinet or its adjacent heat sink element to achieve electrical connection between the electronic device and the control cabinet.

[0013] As described above, the transmission line module for a dilution refrigerator further comprises: the number of first signal connectors integrated in the heat sink element on any temperature zone dividing plate is greater than or equal to the sum of the number of electronic devices located below the temperature zone dividing plate and electrically connected to the transmission line module.

[0014] The transmission line module for a dilution refrigerator as described above, further, the heat sink element comprises a heat sink seat and an open heat sink cover;

[0015] A plurality of the first signal connectors are integrated in the heat sink seat; the heat sink cover is provided with a first through hole for the first transmission line segment to pass through; the open end of the heat sink cover is covered on the heat sink seat to cover the first signal connector inside the heat sink element.

[0016] As described above, the transmission line module for the dilution refrigerator further comprises: a winding post is provided on a side of the heat sink seat close to the heat sink cover, and the winding post is coaxially arranged with the first through hole.

[0017] As described above, the transmission line module for the dilution refrigerator further comprises: a plurality of coaxially arranged second through holes are provided at the bottom of the heat sink, and the outer wall of the first signal connector is fixedly installed in the second through holes.

[0018] The transmission line module for a dilution refrigerator as described above, further, the open end of the heat sink cover is provided with a first thread segment, and the heat sink seat is provided with a second thread segment matching the first thread segment;

[0019] And / or, the heat sink seat is detachably mounted on the temperature zone dividing plate;

[0020] And / or, the housing of the electronic device is detachably mounted on the temperature zone dividing plate.

[0021] The transmission line module for a dilution refrigerator as described above, further, a thermally conductive adhesive layer is provided between the second through hole and the outer wall of the first signal connector;

[0022] And / or, the heat sink element is made of oxygen-free copper;

[0023] and / or, the surface of the heat sink element is plated with a gold layer;

[0024] And / or, the electronic device includes a temperature sensor and a heater.

[0025] A second aspect of the utility model provides a dilution refrigerator, comprising at least one of the above-mentioned transmission line modules for the dilution refrigerator.

[0026] The third aspect of the utility model provides a quantum computer, comprising the above-mentioned dilution refrigerator and a quantum chip, wherein the quantum chip is installed in the dilution refrigerator.

[0027] The beneficial effects of the utility model are:

[0028] The transmission line module of the present application includes a plurality of signal transmission lines for electrically connecting a plurality of electronic devices inside the dilution refrigerator and a control cabinet outside the dilution refrigerator in a one-to-one correspondence; a plurality of heat sink elements for being installed in a one-to-one correspondence on a plurality of the temperature zone dividing plates; at the same time, the signal transmission line electrically connected to any of the plurality of electronic devices sequentially contacts the heat sink element on each temperature zone dividing plate above it and then is electrically connected to the control cabinet; this ensures that the signal transmission lines electrically connected to the plurality of electronic devices are integrated on the heat sink element in the corresponding temperature zone dividing plate when passing through each temperature zone dividing plate, and the heat of the signal transmission line is conducted to the temperature zone dividing plate through the heat sink element to realize heat conduction, thereby solving the heat problem and, at the same time, improving the integration of the lines, saving space and facilitating regular wiring.

[0029] The dilution refrigerator and quantum computer provided by the present invention include the above-mentioned transmission line module, and therefore have the same beneficial effects, which will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the structure of the transmission line module provided in the embodiment of the utility model arranged in the dilution refrigerator Figure 1 ;

[0031] Figure 2 Schematic diagram of the structure of the transmission line module provided in the embodiment of the utility model arranged in the dilution refrigerator Figure 2 ;

[0032] Figure 3 A schematic diagram of the structure of a heat sink element provided in an embodiment of the utility model;

[0033] Figure 4 A schematic diagram of the structure of a heat sink provided by an embodiment of the utility model;

[0034] In the accompanying drawings: 10, signal transmission line; 20, heat sink element; 30, electronic device; 40, temperature zone dividing plate; 50, control cabinet; 21, heat sink seat; 211, first columnar body; 212, second columnar body; 22, heat sink cover; 221, first through hole; 23, winding column; 231, third through hole; 232, fourth through hole; 233 outlet; 24, first signal connector. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0036] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] The basic unit of superconducting quantum computing is a superconducting quantum chip, which needs to work in an ultra-low temperature environment, about 10mK to 20mK (Kelvins). Ultra-low temperature can effectively reduce the impact of environmental noise on superconducting quantum chips. The ultra-low temperature environment is usually provided by a dilution refrigerator. Usually, each layer of the temperature zone partition plate 40 inside the dilution refrigerator is equipped with temperature sensors and electronic devices 30 such as heaters. These electronic devices 30 are connected to the control cabinet 50 outside the dilution refrigerator through their own signal transmission lines 10. When the electronic devices 30 are working, these signal transmission lines 10 will generate heat. If the generated heat cannot be effectively conducted out, it will affect the normal temperature of the temperature zone, and then affect the normal operation of the quantum chip.

[0039] In order to solve the heat problem of the signal transmission line 10, a heat sink can be set on the temperature partition plate to realize the heat conduction of the signal transmission line 10 to the temperature partition plate. If a heat sink is set on each signal transmission line 10 to realize heat conduction with the temperature zone partition plate 40, since electronic devices 30 are set on each layer of the temperature zone partition plate 40, and the number of electronic devices 30 on each layer of the temperature zone partition plate 40 is more than one, a large number of heat sinks need to be set on the temperature zone partition plate 40 of the dilution refrigerator, which not only occupies a large space, but also is not conducive to the integration of the line. Therefore, it is urgent to provide a transmission line module with high integration and convenient heat conduction to solve the above problems.

[0040] It should be noted that the purpose of setting a temperature sensor on the temperature zone partition plate 40 is to monitor the temperature of the temperature zone partition plate 40. Usually, in order to ensure the accuracy of the monitoring results, multiple temperature sensors need to be arranged on the same temperature zone partition plate 40. The purpose of setting a heater on the temperature zone partition plate 40 is to heat and return to temperature when the dilution refrigerator stops working.

[0041] Based on this, Figure 1 Schematic diagram of the structure of the transmission line module provided in the embodiment of the utility model arranged in the dilution refrigerator Figure 1 ;like Figure 1 As shown: The present application provides a transmission line module for a dilution refrigerator, comprising a plurality of signal transmission lines 10, which are used to electrically connect a plurality of electronic devices 30 inside the dilution refrigerator and a control cabinet 50 outside the dilution refrigerator in a one-to-one correspondence, wherein the plurality of electronic devices 30 are dispersedly arranged on different temperature zone partition plates 40 of the dilution refrigerator; a plurality of heat sink elements 20, which are used to be installed in a one-to-one correspondence on the plurality of temperature zone partition plates 40; wherein the signal transmission line 10 electrically connected to any of the plurality of electronic devices 30 sequentially contacts the heat sink element 20 on each temperature zone partition plate 40 above it and then is electrically connected to the control cabinet 50.

[0042] It should be noted that the room temperature plate and the cold plate in the dilution refrigerator are both referred to as the temperature zone partition plate 40 in this application. The temperature zone partition plate 40 inside the dilution refrigerator is referred to as the cold plate, and the temperature zone partition plate 40 on the top of the dilution refrigerator is referred to as the room temperature plate.

[0043] In this embodiment, the electronic device 30 includes but is not limited to a temperature sensor and a heater.

[0044] The transmission line module of the present application includes a plurality of signal transmission lines 10, which are used to electrically connect a plurality of electronic devices 30 inside the dilution refrigerator and a control cabinet 50 outside the dilution refrigerator in a one-to-one manner; a plurality of heat sink elements 20, which are used to be installed in a one-to-one manner on a plurality of the temperature zone dividing plates 40; at the same time, the signal transmission line 10 electrically connected to any of the electronic devices 30 among the plurality of electronic devices 30 sequentially contacts the heat sink element 20 on each temperature zone dividing plate 40 above it and then electrically connects to the control cabinet 50; this ensures that the signal transmission lines 10 electrically connected to the plurality of electronic devices 30 are integrated on the heat sink element 20 in the corresponding temperature zone dividing plate 40 when passing through each temperature zone dividing plate 40, and the heat of the signal transmission line 10 is conducted to the temperature zone dividing plate 40 through the heat sink element 20 to achieve heat conduction, thereby solving the heat problem and, at the same time, improving the integration of the lines, saving space and facilitating regular wiring.

[0045] Continue as Figure 1 As shown, in a specific implementation of the present embodiment, only one transmission line module is used in the dilution refrigerator, and the number of heat sink elements 20 in the transmission line module is one less than the number of temperature zone dividing plates 40. Specifically, a plurality of heat sink elements 20 are arranged in one-to-one correspondence with other temperature zone dividing plates 40 except the bottom temperature zone dividing plate 40. When arranged in this way, the number of signal transmission lines 10 integrated in any upper heat sink element 20 is higher than the number of signal transmission lines 10 integrated in the lower heat sink element 20. In actual application, when there are enough electronic devices 30 in the dilution refrigerator, if one transmission line module is still used, an arrangement in which the integrated channel of the upper heat sink element 20 is larger than the integrated channel of the lower heat sink element 20 can be adopted; of course, multiple transmission modules can also be arranged in the dilution refrigerator to meet the heat dissipation requirements of the signal transmission lines 10 of more electronic devices 30. For example, Figure 2 Schematic diagram of the structure of the transmission line module provided in the embodiment of the utility model arranged in the dilution refrigerator Figure 2 , Figure 2 Two transmission line integrated modules are arranged in it.

[0046] In order to achieve the reliability of heat conduction when the signal transmission line 10 crosses the temperature zone, in this embodiment, a signal transmission line 10 is divided into a plurality of first transmission line segments that need to be transferred, and then each first transmission line segment is in contact with the heat sink element 20 to achieve the purpose of heat conduction of the signal transmission line 10 across the temperature zone; specifically, in a specific implementation of this embodiment, a plurality of first signal connectors 24 are integrated on the heat sink element 20, each of the first signal connectors 24 is electrically connected to a first transmission line segment, and a second signal connector is provided at the other end of the first transmission line segment; the first signal connector 24 on any of the heat sink elements 20 is electrically connected to the second signal connector connected to its adjacent heat sink element 20 or the electronic device 30, and the second signal connector connected to any of the heat sink elements 20 is electrically connected to the control cabinet 50 or the first signal connector 24 on its adjacent heat sink element 20 to achieve the electrical connection between the electronic device 30 and the control cabinet 50.

[0047] By integrating a plurality of first signal connectors 24 on the heat sink element 20, each of the first signal connectors 24 is electrically connected to a first transmission line segment, so that multiple first transmission line segments are integrated on one heat sink element 20, and at the same time, the heat of each first transmission line segment can be conducted to the heat sink element 20; by setting the first signal connector 24 and the second signal connector, the electrical connection of any two first transmission line segments is achieved, thereby achieving the purpose of cross-temperature zone transfer and heat conduction of a signal transmission line 10.

[0048] In order to further improve the integration, in a specific implementation of the present embodiment, the number of first signal connectors 24 integrated in the heat sink element 20 on any temperature zone partition plate 40 is greater than or equal to the sum of the number of electronic devices 30 located below the temperature zone partition plate 40 and electrically connected to the transmission line module; in this way, except for the bottom layer of temperature zone partition plates 40, only one heat sink element 20 needs to be arranged on each of the other temperature zone partition plates 40 to achieve the purpose of integrating the signal transmission lines 10 of the several electronic devices 30 for heat conduction, which greatly reduces the number of heat sink elements 20 and improves the integration.

[0049] In this embodiment, the specific structure of the heat sink element 20 is not limited, and it only needs to be in contact with the signal transmission line 10 to achieve heat conduction.

[0050] Figure 3 The structure of the heat sink element 20 provided in the embodiment of the utility model is shown in FIG. Figure 1 ;like Figure 3As shown: In a specific implementation of this embodiment, the heat sink element 20 includes a heat sink seat 21 and an open heat sink cover 22; a plurality of the first signal connectors 24 are integrated in the heat sink seat 21; the heat sink cover 22 is provided with a first through hole 221 for the first transmission line segment to pass through; the open end of the heat sink cover 22 is covered on the heat sink seat 21 to cover the first signal connector 24 inside the heat sink element 20. This structure can realize heat conduction between multiple first transmission line segments and the heat sink element 20, thereby improving the integration.

[0051] Further, continue as Figure 3 As shown, a winding post 23 is provided on one side of the heat sink seat 21 close to the heat sink cover 22, and the winding post 23 is coaxially arranged with the first through hole 221; by providing the winding post 23, the first transmission line segment is wound on the winding post 23, the contact area between the first transmission line segment and the heat sink element 20 is increased, and the heat conduction efficiency is improved. At the same time, the winding post 23 is coaxially arranged with the first through hole 221, which is convenient for the first transmission line segment to pass through the heat sink element 20. In order to further improve the integration and facilitate wiring, the winding post 23 can be arranged at the center of the heat sink seat 21, and the plurality of first signal connectors 24 on the heat sink seat 21 can be evenly and symmetrically arranged about the winding post 23.

[0052] Specifically, the integration method of the first signal connector 24 on the heat sink seat 21 is as follows: a plurality of coaxially arranged second through holes are provided at the bottom of the heat sink seat 21, and the outer wall of the first signal connector 24 is fixedly installed in the second through hole. This integration method is not only simple and convenient, but also ensures sufficient contact between the first signal connector 24 and the heat sink seat 21, thereby improving the heat conduction effect; in order to further ensure the reliability of heat conduction, a thermal conductive adhesive layer is arranged between the second through hole and the first signal connector 24. When specifically arranged, after the first signal connector 24 is installed in the second through hole, thermal conductive adhesive is poured into the connection between the first signal connector 24 and the second through hole, and the thermal conductive adhesive layer is formed after solidification.

[0053] In some implementations of this embodiment, the heat sink 21 is detachably mounted on the temperature zone partition plate 40; Figure 3 As shown, the heat sink seat 21 is also provided with threaded holes for detachably mounting the heat sink seat 21 on the temperature zone dividing plate 40 by screws.

[0054] In some implementations of this embodiment, the open end of the heat sink cover 22 is provided with a first threaded section, and the heat sink seat 21 is provided with a second threaded section matching the first threaded section; thus, a detachable fixed connection between the heat sink seat 21 and the heat sink cover 22 is achieved.

[0055] In some implementations of the present embodiment, the housing of the electronic device 30 is detachably mounted on the temperature zone partition plate 40 . Specifically, the housing of the electronic device 30 is detachably mounted on the temperature zone partition plate 40 by screws.

[0056] In some implementations of this embodiment, the heat sink element 20 is made of oxygen-free copper to ensure the thermal conductivity of the heat sink element 20. In order to improve the anti-oxidation performance of the heat sink element 20, the surface of the heat sink element 20 is plated with a gold layer.

[0057] Figure 4 A schematic diagram of the structure of a heat sink 21 provided in an embodiment of the utility model; Figure 4 As shown: In some preferred implementations of this embodiment, in order to facilitate installation, the heat sink seat 21 includes a first columnar body 211 and a second columnar body 212 coaxially sleeved from the inside to the outside.

[0058] Specifically, a winding post 23 is provided on the upper end face of the first columnar body 211, and a plurality of first signal connectors 24 are evenly integrated on the first columnar body 211 with the winding post 23 as the center; the upper section of the first columnar body 211 is provided with a second threaded section that matches the first threaded section at the open end of the heat sink cover 22 so that the heat sink cover 22 and the first columnar body 211 can be detachably fixedly connected.

[0059] Specifically, a threaded hole is provided at the upper end of the second column 212 for detachably connecting with the temperature zone dividing plate 40 by screws, and the lower end of the second column 212 is used to clamp the first column 211. Further, the second column 212 is made of oxygen-free copper, and the second column 212 is provided with a central through hole for sleeved on the outer wall of the first column 211. The lower end of the second column 212 is provided with a T-shaped gap connected with the central through hole, and the T-shaped gap is composed of a radial gap arranged radially and an axial gap arranged axially. Through holes and threaded holes are respectively provided on the second column 212 on both sides of the axial gap, and locking bolts pass through the through holes and are installed in the threaded holes. The locking bolts are tightened to reduce the inner diameter of the second column 212 to achieve clamping of the first column 211.

[0060] Furthermore, the winding post 23 is a hollow cylinder, and a third through hole 231 and a fourth through hole 232 are provided in the radial direction of the cylinder. The third through hole 231 is arranged at the lower section of the cylinder, and the fourth through hole 232 is arranged at the upper section of the cylinder. The top of the cylinder is provided with an outlet 233 for the first transmission line segment to pass through. This arrangement allows the first transmission line segment to be wound as follows: the first transmission line segment first passes through the third through hole 231, then is wound around the winding post 23, and finally passes through the fourth through hole 232 and the outlet 233. This allows the first transmission line segment to reliably contact the winding post 23 for heat conduction, and at the same time, it also plays a limiting role, so that the first transmission line segment passes through the outlet 233 to the first through hole 221 of the heat sink 22, thereby improving the integration.

[0061] Based on the same application concept, the embodiment of the present application also proposes a dilution refrigerator, including the above transmission line module. The dilution refrigerator of the present application includes the above transmission line module, and thus has the same beneficial effects as the above transmission line module, which will not be described in detail here.

[0062] Based on the same application concept, the embodiment of the present application also proposes a quantum computer, including the above-mentioned dilution refrigerator. The quantum computer of the present application includes the above-mentioned dilution refrigerator, and thus has the same beneficial effects as the above-mentioned dilution refrigerator, which will not be described in detail here.

[0063] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0064] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A transmission line module for a dilution refrigerator, characterized in that: include: A plurality of signal transmission lines are used for electrically connecting a plurality of electronic devices inside the dilution refrigerator and a control cabinet outside the dilution refrigerator in a one-to-one correspondence, and the plurality of electronic devices are dispersedly arranged on partition plates of different temperature zones of the dilution refrigerator; A plurality of heat sink elements, used for being installed on a plurality of the temperature zone dividing plates in a one-to-one correspondence; Wherein, the signal transmission line electrically connected to any electronic device among the plurality of electronic devices sequentially contacts the heat sink element on each temperature zone dividing plate above it and then is electrically connected to the control cabinet.

2. The transmission line module for a dilution refrigerator according to claim 1, characterized in that: A plurality of first signal connectors are integrated on the heat sink element, each of the first signal connectors is electrically connected to a first transmission line segment, and a second signal connector is provided at the other end of the first transmission line segment; The first signal connector on any one of the heat sink elements is electrically connected to the second signal connector or the electronic device connected to its adjacent heat sink element, and the second signal connector connected to any one of the heat sink elements is electrically connected to the first signal connector on the control cabinet or its adjacent heat sink element to achieve electrical connection between the electronic device and the control cabinet.

3. The transmission line module for a dilution refrigerator according to claim 2, characterized in that: The number of the first signal connectors integrated in the heat sink element on any temperature zone dividing plate is greater than or equal to the sum of the numbers of the electronic devices located below the temperature zone dividing plate and electrically connected to the transmission line module.

4. The transmission line module for a dilution refrigerator according to claim 2, characterized in that: The heat sink element comprises a heat sink seat and an open heat sink cover; A plurality of the first signal connectors are integrated in the heat sink seat; the heat sink cover is provided with a first through hole for the first transmission line segment to pass through; the open end of the heat sink cover is covered on the heat sink seat to cover the first signal connector inside the heat sink element.

5. The transmission line module for a dilution refrigerator according to claim 4, characterized in that: A winding post is provided on a side of the heat sink seat close to the heat sink cover, and the winding post is coaxially arranged with the first through hole.

6. The transmission line module for a dilution refrigerator according to claim 4, characterized in that: The bottom of the heat sink is provided with a plurality of coaxially arranged second through holes, and the outer wall of the first signal connector is fixedly installed in the second through holes.

7. The transmission line module for a dilution refrigerator according to claim 4, characterized in that: The open end of the heat sink cover is provided with a first thread segment, and the heat sink seat is provided with a second thread segment matching the first thread segment; And / or, the heat sink seat is detachably mounted on the temperature zone dividing plate; And / or, the housing of the electronic device is detachably mounted on the temperature zone dividing plate.

8. The transmission line module for a dilution refrigerator according to claim 6, characterized in that: A heat-conducting adhesive layer is provided between the second through hole and the outer wall of the first signal connector; And / or, the heat sink element is made of oxygen-free copper; and / or, the surface of the heat sink element is plated with a gold layer; And / or, the electronic device includes a temperature sensor and a heater.

9. A dilution refrigerator, characterized in that: include: At least one transmission line module for a dilution refrigerator according to any one of claims 1 to 8.

10. A quantum computer, characterized in that: include: The dilution refrigerator according to claim 9; and a quantum chip, wherein the quantum chip is installed in the dilution refrigerator.

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