Semiconductor chip packaging waste removing device in frame

Abstract

The utility model discloses a device for removing packaging wastes of semiconductor chips in a frame, relates to the field of semiconductor chips, solves the problem that the conventional device is difficult to cut off chip boards with different specifications according to requirements, and adopts the following scheme: the device comprises a bottom plate and a top plate; a lower tool apron is fixedly installed at the top of the bottom plate, an upper tool apron located above the lower tool apron is assembled on the bottom side of the top plate, and the upper tool apron and the lower tool apron are inclined L-shaped blades. A rail disc is fixedly installed at the bottom of the top plate, and an electric telescopic rod with the output end connected with the upper tool apron is fixedly installed at the bottom of the top plate. According to the device for removing the semiconductor chip packaging waste in the frame, through the arrangement of the shapes of the lower tool apron and the upper tool apron, the rectangular edges of chips can be cut off, when chip boards of different specifications are cut off according to requirements, the two sets of electric telescopic rods are opened to adjust the position of the upper tool apron, and then the chip boards are cut off. And meanwhile, the relative positions of the lower tool apron and the upper tool apron are adjusted according to requirements, so that chip boards of different specifications are cut off.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chips, in particular to a device for removing semiconductor chip packaging waste in a frame. Background Art

[0002] During chip processing, it needs to be plasticized by a plastic packaging machine. The resin injection packaging of the chip is a process in chip packaging, which is used to wrap a layer of resin shell on the surface of the chip to play an isolating and protective role;

[0003] After searching, the application with patent number CN202222735847.7 discloses a semiconductor chip packaging waste removal device in a frame, including a fixing mechanism and a vertical moving mechanism; the fixing mechanism includes a base and a fixing platform; the fixing platform is fixed on the base; a support column is vertically provided at one end of the base, and a mounting shell is provided on the support column directly above the fixing platform, and a rotating shaft is horizontally rotated on one side of the mounting shell, and the rotating shaft passes through one side of the mounting shell and enters the mounting shell, and a gear is fixed on one end of the rotating shaft located in the mounting shell; the vertical moving mechanism includes a support bar and a support plate; the support bar is vertically slidably arranged on the mounting shell, and the two ends of the support bar extend from the top and bottom of the mounting shell respectively; a rack is vertically installed on the side of the support bar facing the gear; the support plate is fixed to the bottom of the support bar; a tool group is provided on the lower surface of the support plate;

[0004] The above application document realizes the cutting of semiconductor waste in the frame below the cutter through the setting of the cutter group and the driving mechanism. However, since the frame contains multiple chipsets and most of the chipsets are rectangular, the cutter group is generally rectangular. However, the specifications of ordinary rectangular cutters are limited and only chips of limited specifications can be cut. Once chipsets of different specifications need to be cut, the cutter needs to be replaced, which is cumbersome and inefficient.

[0005] Therefore, we propose a semiconductor chip packaging waste removal device in the framework. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a device for removing waste semiconductor chip packaging in a frame, which solves the problem that the prior device is difficult to cut off chip boards of different specifications according to demand.

[0007] To achieve the above objectives, the utility model is implemented through the following technical solutions: a semiconductor chip packaging waste removal device in a frame, comprising a bottom plate and a top plate on the top side thereof, and a receiving seat assembled on the output end of a hydraulic cylinder seat is fixedly installed on the top of the top plate;

[0008] A lower knife seat is fixedly installed on the top of the bottom plate, and an upper knife seat located above the lower knife seat is installed on the bottom side of the top plate, and both the lower knife seat and the upper knife seat are inclined L-shaped blades;

[0009] A rail plate is fixedly installed at the bottom of the top plate, and an electric telescopic rod whose output end is connected to the upper knife seat is fixedly installed at the bottom of the top plate.

[0010] Preferably, an oblique sliding groove is provided on the rail plate, and a sliding block which slides with the sliding groove is fixedly installed on the top of the upper knife seat;

[0011] Preferably, the slide groove is a T-shaped groove, and the slider is a T-shaped block;

[0012] The arrangement of the slide groove and the slide block facilitates the upper knife seat to slide obliquely on the slide block, thereby facilitating the adjustment of the relative positions of the upper knife seat and the lower knife seat, thereby cutting off the rectangular chip plate therebetween.

[0013] Preferably, an L-shaped plate is fixedly installed at the bottom of the top plate, two sets of electric telescopic rods are fixedly installed on the inner wall of the top plate, and the outer ends of the two sets of electric telescopic rods are fixedly connected to the outer wall of the slider at the bottom side of the upper knife seat;

[0014] Among them, the setting of the electric telescopic rod is convenient for driving the upper knife seat to adjust the position, so as to cut rectangular chip plates of different specifications.

[0015] Preferably, three groups of column holes are formed on the top plate, and sleeve columns matching the specifications of the three groups of column holes are fixedly mounted on the top of the bottom plate.

[0016] Preferably, the outer edges of the lower knife seat and the upper knife seat are both sharpened edges.

[0017] Preferably, a receiving seat connected to the output end of the bottom hydraulic cylinder seat is installed at the bottom of the base plate.

[0018] Preferably, a clamping seat is fixedly installed on the outer side walls of the bottom plate and the top plate, the main body of the clamping seat is the first electric cylinder seat, and the top end of the first electric cylinder seat is fixedly connected with a chip pressure strip;

[0019] Among them, the setting of two sets of clamping seats can clamp the chip end to ensure that the chip does not warp up during the subsequent downward pressure cutting process, which will affect the subsequent waste cutting effect.

[0020] Preferably, two sets of second electric cylinder seats in opposite positions are fixedly installed at the centers of the bottom plate and the top plate, and support plates located outside the center of the chip to be cut are fixedly installed at the ends of the output shafts of the two sets of second electric cylinder seats.

[0021] The utility model provides a device for removing semiconductor chip packaging waste in a frame. It has the following

[0022] Beneficial effects:

[0023] The semiconductor chip packaging waste removal device in the frame can cut off the chip from the rectangular edge by setting the shape of the lower knife seat and the upper knife seat. When it is necessary to cut off chip boards of different specifications according to needs, it is only necessary to open two sets of electric telescopic rods to adjust the position of the upper knife seat, and at the same time adjust the relative positions of the lower knife seat and the upper knife seat according to needs to cut off chip boards of different specifications, thereby solving the problem that the existing device is difficult to cut off chip boards of different specifications according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the bottom plate of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the top plate of the utility model;

[0027] Figure 4 It is a structural schematic diagram of the upper cutter of the utility model.

[0028] In the figure: 1. bottom plate; 2. top plate; 3. receiving seat; 4. sleeve column; 5. lower knife seat; 6. upper knife seat; 7. rail plate; 8. slide groove; 9. electric telescopic rod; 10. slide block; 11. first electric cylinder seat; 12. second electric cylinder seat; 13. chip pressure strip; 14. support plate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1:

[0031] A semiconductor chip packaging waste removal device in a frame, comprising a bottom plate 1 and a top plate 2 on the top side thereof, wherein a receiving seat 3 mounted on the output end of a hydraulic cylinder seat is fixedly mounted on the top of the top plate 2; a lower knife seat 5 is fixedly mounted on the top of the bottom plate 1, an upper knife seat 6 located above the lower knife seat 5 is mounted on the bottom side of the top plate 2, and both the lower knife seat 5 and the upper knife seat 6 are oblique L-shaped blades; a rail plate 7 is fixedly mounted on the bottom of the top plate 2, and an electric telescopic rod 9 whose output end is connected to the upper knife seat 6 is fixedly mounted on the bottom of the top plate 2; the outer edges of the lower knife seat 5 and the upper knife seat 6 are both sharpened edges, and a receiving seat 3 connected to the output end of the bottom hydraulic cylinder seat is mounted on the bottom of the bottom plate 1;

[0032] The semiconductor chip packaging waste removal device in the frame can cut off the chip from the rectangular edge through the shape setting of the lower knife seat 5 and the upper knife seat 6. When it is necessary to cut off chip boards of different specifications according to needs, it is only necessary to open the two sets of electric telescopic rods 9 to adjust the position of the upper knife seat 6, and at the same time adjust the relative positions of the lower knife seat 5 and the upper knife seat 6 according to needs to cut off chip boards of different specifications, thereby solving the problem that the existing device is difficult to cut off chip boards of different specifications according to needs.

[0033] Embodiment 2:

[0034] An oblique slide groove 8 is provided on the rail plate 7, and a slider 10 that slides with the slide groove 8 is fixedly installed on the top of the upper knife seat 6. The slide groove 8 is a T-shaped groove, and the slider 10 is a T-shaped block. An L-shaped plate is fixedly installed at the bottom of the top plate 2. Two groups of electric telescopic rods 9 are fixedly installed on the inner wall of the top plate 2, and the outer ends of the two groups of electric telescopic rods 9 are fixedly connected to the outer wall of the slider 10 at the bottom side of the upper knife seat 6. Three groups of column holes are provided on the top plate 2, and a sleeve column 4 that matches the specifications of the three groups of column holes is fixedly installed on the top of the bottom plate 1; the bottom plate 1 and the top plate 2 A clamping seat is fixedly installed on the outer wall, and the main body of the clamping seat is the first electric cylinder seat 11, and the top of the first electric cylinder seat 11 is fixedly connected to a chip pressure strip 13; two sets of second electric cylinder seats 12 with opposite positions are fixedly installed at the center of the bottom plate 1 and the top plate 2, and the ends of the output shafts of the two sets of second electric cylinder seats 12 are fixedly installed with support plates 14 located outside the center of the chip to be cut; wherein, the setting of the two sets of clamping seats can clamp the chip end to ensure that the chip does not warp up during the subsequent downward pressure and cutting process, which affects the subsequent waste cutting effect.

[0035] The working principle and use process of the utility model are as follows: when the device is needed to work, the frame and chip board to be cut are placed between the bottom plate 1 and the top plate 2, and then the electric telescopic rod 9 is opened to adjust the position of the upper knife seat 6 according to the different specifications of the chip board, so that the end positions of the upper knife seat 6 and the lower knife seat 5 are aligned with the edges of the chip board relative to each other, and finally the driving mechanism is opened to drive the lower knife seat 5 and the upper knife seat 6 to cut the rectangular chip board from the top and bottom sides.

[0036] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0037] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor chip package waste removal device in a frame, comprising a bottom plate (1) and a top plate (2) on the top side thereof, wherein a receiving seat (3) assembled at the output end of a hydraulic cylinder seat is fixedly mounted on the top of the top plate (2); Features: A lower blade seat (5) is fixedly mounted on the top of the bottom plate (1), and an upper blade seat (6) located above the lower blade seat (5) is mounted on the bottom side of the top plate (2), and both the lower blade seat (5) and the upper blade seat (6) are inclined L-shaped blades; A rail plate (7) is fixedly mounted on the bottom of the top plate (2), and an electric telescopic rod (9) whose output end is connected to the upper knife seat (6) is fixedly mounted on the bottom of the top plate (2).

2. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: The rail plate (7) is provided with an oblique sliding groove (8), and a sliding block (10) which is slidably mounted with the sliding groove (8) is fixedly installed on the top of the upper knife seat (6).

3. The device for removing waste semiconductor chip packaging in a frame according to claim 2, characterized in that: The slide groove (8) is a T-shaped groove, and the slide block (10) is a T-shaped block.

4. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: An L-shaped plate is fixedly mounted on the bottom of the top plate (2), two sets of electric telescopic rods (9) are fixedly mounted on the inner wall of the top plate (2), and the outer ends of the two sets of electric telescopic rods (9) are fixedly connected to the outer wall of the slider (10) at the bottom side of the upper knife seat (6).

5. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: The top plate (2) is provided with three groups of column holes, and a sleeve column (4) matching the specifications of the three groups of column holes is fixedly installed on the top of the bottom plate (1).

6. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: The outer edges of the lower knife seat (5) and the upper knife seat (6) are both sharpened edges.

7. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: A receiving seat (3) connected to the output end of the bottom hydraulic cylinder seat is installed at the bottom of the base plate (1).

8. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: A clamping seat is fixedly mounted on the outer side walls of the bottom plate (1) and the top plate (2); the main body of the clamping seat is a first electric cylinder seat (11), and a chip pressure strip (13) is fixedly connected to the top of the first electric cylinder seat (11).

9. The device for removing waste semiconductor chip packaging in a frame according to claim 1, characterized in that: Two sets of second electric cylinder seats (12) in opposite positions are fixedly installed at the centers of the bottom plate (1) and the top plate (2), and support plates (14) located outside the center of the chip to be cut are fixedly installed at the ends of the output shafts of the two sets of second electric cylinder seats (12).

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