Rubber tube binding jig for semiconductor packaging

By designing a bundled hose grill for semiconductor packaging, the problem of two people working together in the prior art is solved, and efficient bundled hose for single person is achieved, improving packaging efficiency and reducing labor costs.

CN222474558UActive Publication Date: 2025-02-14DONGGUAN HAIHE TECH CO LTD
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Patent Information

Application Number
CN202420882225.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-26
Publication Date
2025-02-14
Estimated Expiration
2034-04-26

AI Technical Summary

Technical Problem

The existing semiconductor hose packaging process requires two people to work together, resulting in waste of manpower and inefficient packaging.

Method used

A semiconductor packaging bundled hose grease is designed, including a support base, a fixing block, a fixing plate, a moving column and a discharge component. Through the cooperation of these components, it is possible to operate efficiently bundled hose by a single person.

Benefits of technology

The bundled hose is achieved by single-person operation, which improves packaging efficiency, reduces labor costs, and simplifies the rubber band socket process by adjusting the rubber band socket position.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging binding rubber tube jig which comprises a supporting base, a fixing block, fixing plates, a movable column and a discharging component, the fixing block is arranged at the top of the supporting base, the fixing plates are fixedly connected to the two sides of the top of the fixing block, and the movable column is arranged on the supporting base. The movable column is arranged at one end of the top of the supporting base, the discharging component is installed on one side of the movable column, the supporting base comprises a bottom plate, a rotating block and a sliding groove, the rotating block is rotationally connected to the top of the bottom plate, the sliding groove is formed in one side of the rotating block, and the top of the rotating block is fixedly connected with the bottom of the fixed block. The moving column is slidably connected to the interior of the sliding groove. According to the rubber tube binding jig for semiconductor packaging, rubber tubes can be intensively fixed and placed in order, binding of the rubber tubes is facilitated, the jig can be used by a single person, operation is easy, the rubber tube binding efficiency can be improved, and the labor cost is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a hose fixture used for semiconductor packaging bundling. Background Art

[0002] Semiconductor is a material with conductivity between conductors and insulators at room temperature. The discovery and application of semiconductor materials are the cornerstone of the development of modern electronic technology and play a vital role in the fields of electronics and optoelectronics. Semiconductor hoses usually refer to the packaging form of glue used in the semiconductor manufacturing process, especially the needle tube packaging used in the packaging and dispensing processes.

[0003] Currently, two people are required to work together to package semiconductor hoses. One person places the hoses, and the other person holds the hoses and spreads them upward. Five hoses are placed in a single layer, and three layers are placed for supply. Then, a large rubber band is used to wrap the two ends of the hoses. Two people must work together in the process of packaging and bundling the hoses, which wastes manpower and affects the efficiency of packaging and bundling the hoses. Utility Model Content

[0004] The utility model aims to provide a jig for bundling hoses for semiconductor packaging, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a jig for bundling hoses for semiconductor packaging, comprising a supporting base, a fixed block, a fixed plate, a movable column and a discharge component, wherein the fixed block is arranged at the top of the supporting base, the fixed plate is fixedly connected to both sides of the top of the fixed block, the movable column is arranged at one end of the top of the supporting base, and the discharge component is installed on one side of the movable column.

[0006] The supporting base includes a bottom plate, a rotating block and a slide groove. The rotating block is rotatably connected to the top of the bottom plate. The slide groove is opened on one side of the rotating block. The top of the rotating block is fixedly connected to the bottom of the fixed block. The movable column is slidably connected to the inside of the slide groove, so that the fixed block can rotate on the supporting base. The large rubber band is put on the hose in conjunction with the discharge component, which can improve the efficiency of bundling the hose.

[0007] Preferably, the discharge component includes a mounting plate, a fixed rod, a rotating screw, a moving block, a moving rod and a driving mechanism, the mounting plate is fixedly connected to one side of the moving column, the fixed rod is fixedly connected to one side of the mounting plate, the rotating screw is rotatably connected to the inside of the mounting plate, the moving block is threadedly connected to the outside of the rotating screw, the moving rod is fixedly connected to one end of the moving block, and the driving mechanism is arranged on a side of the mounting plate close to the moving rod. The moving block is driven to move by the rotating screw, and the position of the moving rod can be adjusted. By adjusting the position of the moving rod, the large rubber band can be better fitted on the fixed rod and the moving rod, thereby reducing the difficulty of fitting the large rubber band.

[0008] Preferably, the driving mechanism includes a shell, a rotating disk, a rotating rod, a first transmission rod, a second transmission rod and a transmission belt, the shell is fixedly connected to one side of the mounting plate, the rotating rod is rotatably connected to the inside of the shell, the rotating disk is fixedly connected to the top of the rotating rod and is located outside the shell, the first transmission rod is installed on one side of the rotating rod, the second transmission rod is installed on the other side of the rotating rod, and the transmission belt is respectively sleeved and connected to the outside of the first transmission rod and the second transmission rod, and the rotating disk can drive the first transmission rod and the second transmission rod to rotate through the action of the transmission belt.

[0009] Preferably, the first transmission rod and the second transmission rod penetrate the mounting plate and are fixedly connected to the rotating screw rod, so that the driving mechanism can drive the rotating screw rod to rotate.

[0010] Preferably, the width of the mounting plate is greater than that of the fixed block, so that the width of the fixed rod and the movable rod is greater than that of the fixed plate. In coordination with the movement of the movable column, the large rubber band can be used to secure the entire bundle of hoses.

[0011] Preferably, a groove is provided on the outside of the rotating disk to facilitate the rotation of the rotating disk, so that the large rubber band can be stretched better by transmitting force, thereby facilitating the bundling of the entire bundle of hoses.

[0012] Preferably, the top of the fixing plate is arranged to be arc-shaped to avoid injury to employees when placing the hoses, thereby improving safety in use.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. This fixture for bundling hoses for semiconductor packaging can centrally and neatly place the hoses, making it convenient to bundle the hoses. It can be used by one person and is easy to operate. It can improve the efficiency of hose bundling and reduce labor costs.

[0015] 2. This semiconductor packaging bundling hose jig can adjust the position of the moving rod by rotating the screw rod to drive the moving block to move. By adjusting the position of the moving rod, the large rubber band can be better fitted on the fixed rod and the moving rod, reducing the difficulty of fitting the large rubber band. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the support base of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the discharge component of the utility model;

[0019] Figure 4 It is a schematic diagram of the internal structure of the driving mechanism of the utility model.

[0020] In the figure: 1. support base; 2. fixed block; 3. fixed plate; 4. moving column; 5. discharge component; 101. bottom plate; 102. rotating block; 103. slide groove; 501. mounting plate; 502. fixed rod; 503. rotating screw rod; 504. moving block; 505. moving rod; 506. driving mechanism; 510. housing; 511. rotating disk; 512. rotating rod; 513. first transmission rod; 514. second transmission rod; 515. transmission belt. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model provides a technical solution: a jig for bundling hoses for semiconductor packaging, comprising a support base 1, a fixed block 2, a fixed plate 3, a movable column 4 and a discharge component 5, the fixed block 2 is arranged on the top of the support base 1, the fixed plate 3 is fixedly connected to both sides of the top of the fixed block 2, the movable column 4 is arranged at one end of the top of the support base 1, the discharge component 5 is installed on one side of the movable column 4, and the top of the fixed plate 3 is arranged in an arc shape to avoid injuries to employees when placing hoses, thereby improving safety in use.

[0023] The support base 1 includes a bottom plate 101, a rotating block 102 and a slide groove 103. The rotating block 102 is rotatably connected to the top of the bottom plate 101. The slide groove 103 is opened on one side of the rotating block 102. The top of the rotating block 102 is fixedly connected to the bottom of the fixed block 2. The movable column 4 is slidably connected to the inside of the slide groove 103, so that the fixed block 2 can rotate on the support base 1. The large rubber band is put on the hose in conjunction with the discharge component 5, which can improve the efficiency of bundling the hose.

[0024] The material discharge component 5 includes a mounting plate 501, a fixed rod 502, a rotating screw rod 503, a moving block 504, a moving rod 505 and a driving mechanism 506. The mounting plate 501 is fixedly connected to one side of the moving column 4, the fixed rod 502 is fixedly connected to one side of the mounting plate 501, the rotating screw rod 503 is rotatably connected to the inside of the mounting plate 501, the moving block 504 is threadedly connected to the outside of the rotating screw rod 503, the moving rod 505 is fixedly connected to one end of the moving block 504, and the driving mechanism 506 is arranged on the mounting plate 501 near the moving column 4. On one side of the rod 505, the position of the movable rod 505 can be adjusted by rotating the screw rod 503 to drive the movable block 504 to move. By adjusting the position of the movable rod 505, the large rubber band can be better sleeved on the fixed rod 502 and the movable rod 505, reducing the difficulty of sleeve the large rubber band. The width of the mounting plate 501 is greater than the width of the fixed block 2, so that the width of the fixed rod 502 and the movable rod 505 is greater than the width of the fixed plate 3. In conjunction with the movement of the movable column 4, the large rubber band can be sleeved and fixed to the entire bundle of hoses.

[0025] The driving mechanism 506 includes a housing 510, a rotating disk 511, a rotating rod 512, a first transmission rod 513, a second transmission rod 514 and a transmission belt 515. The housing 510 is fixedly connected to one side of the mounting plate 501, the rotating rod 512 is rotatably connected to the inside of the housing 510, the rotating disk 511 is fixedly connected to the top of the rotating rod 512 and is located outside the housing 510, the first transmission rod 513 is installed on one side of the rotating rod 512, the second transmission rod 514 is installed on the other side of the rotating rod 512, and the transmission belt 515 is sleeved and connected to the first transmission rod 513, the second transmission rod 514 and the transmission belt 515. 13 and the outside of the second transmission rod 514, through the rotation of the rotating disk 511, through the action of the transmission belt 515, the rotating rod 512 can drive the first transmission rod 513 and the second transmission rod 514 to rotate, the first transmission rod 513 and the second transmission rod 514 pass through the mounting plate 501 and are fixedly connected with the rotating screw rod 503, so the driving mechanism 506 can drive the rotating screw rod 503 to rotate, and the outside of the rotating disk 511 is provided with a groove to facilitate the rotation of the rotating disk 511, and the large rubber band can be better stretched by the transmission force, so that the whole bundle of rubber hoses can be conveniently bundled.

[0026] When in use, the hoses are placed on the top of the fixed block 2 in sequence, with five groups placed on each layer, and a total of three layers. Then the movable column 4 is used to drive the discharge component 5 to move, and the pre-placed large rubber bands are moved from the fixed rod 502 and the movable rod 505. The bundled hoses are fixed with rubber bands, and then the fixed block 2 is rotated by the rotating block 102. The other end is also fixed with a rubber band. After the fixation is completed, the bundled hoses are taken out to complete the operation.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A jig for bundling rubber hoses for semiconductor packaging, comprising a supporting base (1), a fixing block (2), a fixing plate (3), a moving column (4) and a material discharge component (5), characterized in that: The fixed block (2) is arranged on the top of the support base (1), the fixed plate (3) is fixedly connected to both sides of the top of the fixed block (2), the movable column (4) is arranged at one end of the top of the support base (1), and the discharge component (5) is installed on one side of the movable column (4); The support base (1) comprises a bottom plate (101), a rotating block (102) and a slide groove (103); the rotating block (102) is rotatably connected to the top of the bottom plate (101); the slide groove (103) is opened on one side of the rotating block (102); the top of the rotating block (102) is fixedly connected to the bottom of the fixed block (2); and the movable column (4) is slidably connected to the inside of the slide groove (103).

2. The semiconductor packaging bundling hose jig according to claim 1, characterized in that: The material discharge component (5) comprises a mounting plate (501), a fixed rod (502), a rotating screw rod (503), a moving block (504), a moving rod (505) and a driving mechanism (506); the mounting plate (501) is fixedly connected to one side of the moving column (4); the fixed rod (502) is fixedly connected to one side of the mounting plate (501); the rotating screw rod (503) is rotatably connected to the inside of the mounting plate (501); the moving block (504) is threadedly connected to the outside of the rotating screw rod (503); the moving rod (505) is fixedly connected to one end of the moving block (504); and the driving mechanism (506) is arranged on one side of the mounting plate (501) close to the moving rod (505).

3. The semiconductor packaging bundling hose jig according to claim 2, characterized in that: The driving mechanism (506) comprises a housing (510), a rotating disk (511), a rotating rod (512), a first transmission rod (513), a second transmission rod (514) and a transmission belt (515); the housing (510) is fixedly connected to one side of the mounting plate (501); the rotating rod (512) is rotatably connected to the inside of the housing (510); the rotating disk (511) is fixedly connected to the top of the rotating rod (512) and is located outside the housing (510); the first transmission rod (513) is installed on one side of the rotating rod (512); the second transmission rod (514) is installed on the other side of the rotating rod (512); and the transmission belt (515) is respectively sleeved and connected to the outside of the first transmission rod (513) and the second transmission rod (514).

4. The semiconductor packaging bundling hose jig according to claim 3, characterized in that: The first transmission rod (513) and the second transmission rod (514) pass through the mounting plate (501) and are fixedly connected to the rotating screw rod (503), so that the driving mechanism (506) can drive the rotating screw rod (503) to rotate.

5. The semiconductor packaging bundling hose jig according to claim 4, characterized in that: The width of the mounting plate (501) is greater than the width of the fixing block (2).

6. The semiconductor packaging bundling hose jig according to claim 5, characterized in that: The rotating disk (511) is provided with a groove on its exterior.

7. The semiconductor packaging bundling hose jig according to claim 6, characterized in that: The top of the fixing plate (3) is arranged in an arc shape.