Electroplating device for printed circuit board

Abstract

The utility model discloses an electroplating device for a printed circuit board. And an electroplating treatment box is welded to the bottom end of the interior of the lifting type feeding mechanism. By installing the upper positioning block and the like, when the device is used, a user can align the upper positioning block with a line pre-drawn in the middle of the top of a printed circuit board product by using an indicating arrow arranged in the middle of the upper positioning block, so that the printed circuit board product is positioned and fixed; and then two groups of motors and angle sensors which are symmetrically distributed on the clamping seat are started to drive the two side fixing pressing blocks to turn over by a proper angle at the same time, so that the two ends of the printed circuit board product can be clamped and fixed, and the circuit board is fixed by clamping the side edges of the printed circuit board product through the clamping and fixing structure. And the printed circuit board product can be conveniently and flexibly taken and placed, and the problems of excessive surface shielding and poor electroplating effect caused by shielding of the surface of the printed circuit board product are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board processing equipment, in particular to an electroplating device for a printed circuit board. Background Art

[0002] Printed circuit boards are made using electronic printing technology. They are important electronic components, supports for electronic elements, and providers of circuit connections for electronic components. Electroplating or metal coating processes are standard operations to ensure solderability and protect circuits from corrosion. They play an important role in the manufacture of single-sided, double-sided, and multi-layer printed circuit boards. In particular, plating a layer of solderable metal on the printed line has become a standard operation to provide a solderability protective layer for copper printed lines. However, there are still some defects in the actual use of electroplating equipment for printed circuit boards.

[0003] Since the electroplating device for printed circuit boards often requires manual operation to pick and place the circuit boards during actual operation, it is difficult to realize automatic loading and unloading and draining. In addition, it is not easy to automatically replenish the electrolyte, which affects the work efficiency, requires the staff to repeatedly add liquid, and is difficult to operate. It can no longer meet people's needs. Therefore, we propose a new type of electroplating device for printed circuit boards to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of the utility model is to provide an electroplating device for a printed circuit board to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electroplating device for a printed circuit board, comprising:

[0006] A lifting feeding mechanism, wherein an electroplating treatment box is welded to the bottom end of the lifting feeding mechanism, an electrolyte storage box is welded to the lifting feeding mechanism on one side of the electroplating treatment box, an automatic liquid replenishing pipe is connected between the electrolyte storage box and the electroplating treatment box, an electrolyte injection pump is installed on the automatic liquid replenishing pipe, a liquid level sensor matching the electrolyte injection pump is installed at the top end of the electroplating treatment box, and assembly seats are evenly arranged at the bottom end of the electroplating treatment box, and an anode copper rod is threadedly connected to the top end of the assembly seat;

[0007] A clamping seat, wherein the clamping seat is evenly installed at the top of the lifting feeding mechanism, a partition cavity matching the clamping seat is arranged at the top of the electroplating processing box, a connecting frame is welded at the top of the clamping seat, motors are installed at both ends of the connecting frame, a side fixed pressure block is connected to the output end of the motor, an angle sensor is installed between the side fixed pressure block and the motor, an upper positioning block is arranged at the middle position of the bottom of the connecting frame, and a printed circuit board product is installed between the upper positioning block and the side fixed pressure block.

[0008] Furthermore, the lifting feeding mechanism includes a supporting frame and mounting legs. The supporting frame is welded to both ends of the electroplating processing box, and the mounting legs are evenly welded to the bottom of the supporting frame. Screw holes are evenly arranged on the supporting frame to facilitate fixing and installing the bottom of the device by screws.

[0009] Furthermore, the lifting feeding mechanism also includes a screw transmission assembly, a servo motor and a casing. The casing is welded to the inside of the supporting frame, the servo motor is installed inside the supporting frame below the casing, and the screw transmission assembly is installed inside the casing, so that it can realize automatic lifting and lowering processing.

[0010] Furthermore, the screw transmission assembly includes a screw rod and a nut seat, the screw rod is connected to the output end of the servo motor, and the nut seat is threadedly mounted on the screw rod, thereby optimizing the lifting drive mechanism.

[0011] Furthermore, the lifting feeding mechanism also includes a driving top plate, which is connected between adjacent output ends of the screw transmission assemblies. A disassembly and installation structure is formed between the driving top plate and the clamping seat by screws, making it easy to achieve independent disassembly and maintenance of the three clamping seats on the driving top plate.

[0012] Furthermore, a drain port is provided at the bottom of the electroplating treatment box, and a sealing plug is threadedly connected to the drain port to facilitate draining of waste liquid.

[0013] Furthermore, an indicating arrow is provided at the middle position of the upper positioning block, so that it is convenient to position and fix the printed circuit board product by aligning the upper positioning block with a pre-drawn line at the middle position of the top of the printed circuit board product.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The electroplating device for printed circuit boards is equipped with a motor and an upper positioning block, etc., so that the device optimizes its own performance. On the one hand, the user can use the indicator arrow set at the middle position of the upper positioning block to align it with the pre-drawn line at the middle position of the top of the printed circuit board product to achieve the positioning and fixation of the printed circuit board product, and then start the two sets of symmetrically distributed motors and angle sensors on the clamping seat to drive the two side fixed pressure blocks to flip to a suitable angle at the same time, so as to achieve the clamping and fixation of the two ends of the printed circuit board product. This clamping and fixing structure achieves the circuit board fixation by clamping the side of the printed circuit board product, which is convenient for flexible placement of the printed circuit board product and will not block the surface of the printed circuit board product, causing problems such as excessive surface blocking, poor electroplating effect, and insufficient comprehensiveness. On the other hand, the servo motors on the two sets of casings are started to cooperate with the corresponding packaging The transmission action of the screw drive assembly including the screw rod and the nut seat can drive the driving top plate to automatically rise and fall, and then drive the clamping seat to rise and fall, which can not only make the printed circuit board product fixed below it automatically immersed in the electrolyte solution inside the electroplating treatment box to realize electroplating treatment, but also make the printed circuit board product that has completed electroplating automatically lifted up and out of the electroplating treatment box for draining and then taking out the material, which makes the device convenient for realizing the loading and unloading and draining operations of the printed circuit board products and has strong practicality. In addition, by starting the electrolyte injection pump on the electrolyte storage box and cooperating with the liquid guiding function of the automatic liquid replenishing tube, the electrolyte can be automatically replenished to the inside of the electroplating treatment box, and in combination with the liquid level detection function of the liquid level sensor arranged inside the electroplating treatment box, the injection amount can be intelligently controlled, which makes the device convenient for automatically replenishing the required amount of electrolyte. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front view structure of the utility model;

[0017] Figure 2 This is a schematic diagram of a partial cross-sectional structure of the clamping seat of the utility model;

[0018] Figure 3 This is a rear view structural diagram of the lifting feeding mechanism of the utility model;

[0019] Figure 4 It is a schematic diagram of the front cross-sectional structure of the electroplating treatment box of the utility model.

[0020] In the figure: 1. lifting feeding mechanism; 101. driving top plate; 102. screw transmission assembly; 103. servo motor; 104. supporting base; 105. mounting feet; 106. housing; 2. clamping seat; 3. printed circuit board product; 4. electroplating treatment box; 5. automatic liquid replenishing tube; 6. electrolyte injection pump; 7. electrolyte storage box; 8. connecting frame; 9. upper positioning block; 10. angle sensor; 11. motor; 12. side fixed pressure block; 13. anode copper rod; 14. assembly seat; 15. liquid level sensor; 16. partition chamber. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0023] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0024] See also Figure 1-4 , an embodiment provided by the utility model: an electroplating device for a printed circuit board, comprising;

[0025] A lifting feeding mechanism 1, a plating treatment box 4 is welded to the bottom end of the lifting feeding mechanism 1, an electrolyte storage box 7 is welded to the lifting feeding mechanism 1 on one side of the plating treatment box 4, an automatic liquid replenishing pipe 5 is connected between the electrolyte storage box 7 and the plating treatment box 4, an electrolyte injection pump 6 is installed on the automatic liquid replenishing pipe 5, a liquid level sensor 15 matching the electrolyte injection pump 6 is installed at the top end of the electroplating treatment box 4, an assembly seat 14 is evenly arranged at the bottom end of the electroplating treatment box 4, and an anode copper rod 13 is threadedly connected to the top of the assembly seat 14;

[0026] The lifting feeding mechanism 1 includes a supporting frame 104 and mounting legs 105. The supporting frame 104 is welded to both ends of the electroplating treatment box 4. The mounting legs 105 are evenly welded to the bottom of the supporting frame 104. The supporting frame 104 is evenly provided with screw holes, so that it is convenient to fix the bottom of the device with screws.

[0027] The lifting feeding mechanism 1 also includes a screw transmission assembly 102, a servo motor 103 and a housing 106. The housing 106 is welded to the inside of the supporting frame 104. The servo motor 103 is installed inside the supporting frame 104 below the housing 106. The screw transmission assembly 102 is installed inside the housing 106, so that it can realize automatic lifting processing;

[0028] The screw drive assembly 102 includes a screw rod and a nut seat, the screw rod is connected to the output end of the servo motor 103, and the nut seat is threadedly sleeved on the screw rod, so that the lifting drive mechanism is optimized;

[0029] A drain port is provided at the bottom of the electroplating treatment box 4, and a sealing plug is threadedly connected to the drain port to facilitate draining of waste liquid;

[0030] When in use, the electrolyte injection pump 6 on the electrolyte storage box 7 is started, and the liquid guiding function of the automatic liquid replenishing tube 5 is cooperated to automatically replenish the electrolyte into the electroplating treatment box 4, and the liquid level detection function of the liquid level sensor 15 provided inside the electroplating treatment box 4 can be cooperated to intelligently control the injection amount, which makes the device convenient for automatically replenishing the required amount of electrolyte;

[0031] The clamping seat 2 is evenly installed at the top of the lifting feeding mechanism 1. The top of the electroplating treatment box 4 is provided with a partition chamber 16 matching the clamping seat 2. The top of the clamping seat 2 is welded with a connecting frame 8. Both ends of the connecting frame 8 are provided with motors 11. The output end of the motor 11 is connected with a side fixed pressure block 12. An angle sensor 10 is installed between the side fixed pressure block 12 and the motor 11. An upper positioning block 9 is provided at the middle position of the bottom of the connecting frame 8. A printed circuit board product 3 is installed between the upper positioning block 9 and the side fixed pressure block 12.

[0032] The lifting feeding mechanism 1 also includes a driving top plate 101, which is connected between the output ends of adjacent lead screw transmission assemblies 102. The driving top plate 101 and the clamping seat 2 form a disassembly and installation structure through screws, so that it is easy to realize the independent disassembly and maintenance of the three clamping seats 2 on the driving top plate 101;

[0033] When in use, the servo motors 103 on the two sets of housings 106 are started, and the corresponding screw drive assembly 102 including the screw rod and the nut seat is cooperated to drive the top plate 101 to automatically move up and down, thereby driving the clamping seat 2 to move up and down, which can not only make the printed circuit board product 3 fixed thereunder automatically immersed in the electrolyte solution inside the electroplating treatment box 4 to achieve electroplating treatment, but also make the electroplated printed circuit board product 3 automatically lifted out of the electroplating treatment box 4 for draining and then taking out the material, which makes the device easy to realize the loading and unloading and draining operations of the printed circuit board product 3, and has strong practicality;

[0034] An indicating arrow is provided at the middle position of the upper positioning block 9 , so that the printed circuit board product 3 can be positioned and fixed by aligning the upper positioning block 9 with a pre-drawn line at the middle position of the top of the printed circuit board product 3 .

[0035] The working principle of the utility model is: first, an external power supply is connected. The user can use the indicator arrow set at the middle position of the upper positioning block 9 to align it with the pre-drawn line at the middle position of the top of the printed circuit board product 3 to achieve the positioning and fixation of the printed circuit board product 3, and then start the two groups of symmetrically distributed motors 11 and angle sensors 10 on the clamping seat 2, drive the two side fixed pressure blocks 12 to flip at a suitable angle at the same time, and then achieve the clamping and fixation of the two ends of the printed circuit board product 3. This clamping and fixing structure realizes the circuit board fixation by clamping the side of the printed circuit board product 3, which is convenient for flexible placement of the printed circuit board product 3, and will not block the surface of the printed circuit board product 3, causing excessive surface blocking, poor electroplating effect, and insufficient comprehensiveness. In addition, the servo motors 103 on the two groups of housings 106 are started, and the corresponding transmission action of the screw transmission assembly 102 including the screw rod and the nut seat can drive the driving top plate 101 to automatically rise and fall, and then drive the clamping seat 2 to rise and fall, which can make the printed circuit board fixed below it The product 3 is automatically immersed in the electrolyte solution inside the electroplating treatment box 4 to achieve electroplating treatment, and the printed circuit board product 3 that has completed electroplating can be automatically lifted up and separated from the electroplating treatment box 4 for draining and then taking out the material. This makes the device easy to realize the loading and unloading and draining operations of the printed circuit board product 3 and has strong practicality. In addition, by starting the electrolyte injection pump 6 on the electrolyte storage box 7 and cooperating with the liquid guiding function of the automatic liquid replenishing tube 5, the electrolyte can be automatically replenished to the inside of the electroplating treatment box 4, and with the liquid level detection function of the liquid level sensor 15 set inside the electroplating treatment box 4, the injection amount can be intelligently controlled, which makes the device easy to automatically replenish the required amount of electrolyte. Secondly, on the one hand, the user can use the threaded connection between the anode copper rod 13 and the assembly seat 14 inside the electroplating treatment box 4 to independently disassemble and replace the anode copper rod 13. On the other hand, the user can use the disassembly and installation structure formed by screws between the clamping seat 2 and the driving top plate 101 on the lifting feeding mechanism 1 to realize independent disassembly and maintenance of the clamping structure.

[0036] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0037] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plating device for a printed circuit board, characterized in that: include; A lifting feeding mechanism (1), wherein a plating treatment box (4) is welded to the bottom end of the lifting feeding mechanism (1), an electrolyte storage box (7) is welded to the lifting feeding mechanism (1) on one side of the plating treatment box (4), an automatic liquid replenishing pipe (5) is connected between the electrolyte storage box (7) and the plating treatment box (4), an electrolyte injection pump (6) is installed on the automatic liquid replenishing pipe (5), a liquid level sensor (15) matching the electrolyte injection pump (6) is installed at the top end of the plating treatment box (4), and an assembly seat (14) is evenly arranged at the bottom end of the plating treatment box (4), and an anode copper rod (13) is threadedly connected to the top end of the assembly seat (14); A clamping seat (2), wherein the clamping seat (2) is evenly installed at the top end of the lifting feeding mechanism (1), the top end of the electroplating treatment box (4) is provided with a partition cavity (16) matching the clamping seat (2), the top end of the clamping seat (2) is welded with a connecting frame (8), both ends of the connecting frame (8) are provided with a motor (11), the output end of the motor (11) is connected to a side fixed pressure block (12), an angle sensor (10) is installed between the side fixed pressure block (12) and the motor (11), an upper positioning block (9) is provided at the middle position of the bottom of the connecting frame (8), and a printed circuit board product (3) is installed between the upper positioning block (9) and the side fixed pressure block (12).

2. The electroplating device for a printed circuit board according to claim 1, characterized in that: The lifting feeding mechanism (1) comprises a supporting frame (104) and mounting legs (105); the supporting frame (104) is welded to two ends of an electroplating treatment box (4); the mounting legs (105) are evenly welded to the bottom of the supporting frame (104); and screw holes are evenly arranged on the supporting frame (104).

3. The electroplating device for a printed circuit board according to claim 2, characterized in that: The lifting feeding mechanism (1) further comprises a screw transmission assembly (102), a servo motor (103) and a casing (106); the casing (106) is welded to the inside of the supporting base frame (104); the servo motor (103) is installed inside the supporting base frame (104) below the casing (106); and the screw transmission assembly (102) is installed inside the casing (106).

4. The electroplating device for a printed circuit board according to claim 3, characterized in that: The screw transmission assembly (102) comprises a screw rod and a nut seat, the screw rod is connected to the output end of the servo motor (103), and the nut seat is threadedly sleeved on the screw rod.

5. The electroplating device for a printed circuit board according to claim 3, characterized in that: The lifting feeding mechanism (1) further comprises a driving top plate (101), wherein the driving top plate (101) is connected between the output ends of adjacent lead screw transmission assemblies (102), and a disassembly and installation structure is formed between the driving top plate (101) and the clamping seat (2) by screws.

6. The electroplating device for a printed circuit board according to claim 1, characterized in that: The bottom of the electroplating treatment box (4) is provided with a liquid discharge port, and a sealing plug is threadedly connected to the liquid discharge port.

7. The electroplating device for a printed circuit board according to claim 1, characterized in that: An indicating arrow is arranged at the middle position of the upper positioning block (9).

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