Radiator and server board card

Abstract

The utility model provides a radiator and a server board card, and the radiator comprises a main substrate and at least one group of flexible heat pipe heat dissipation assemblies, and each flexible heat pipe heat dissipation assembly comprises a first heat dissipation fin and at least one three-section type flexible heat pipe, the three-section type flexible heat pipe comprises an evaporation section of a flexible assembly, a heat insulation section of the flexible assembly and a condensation section of the flexible assembly, the evaporation section of the flexible assembly is embedded into the bottom of the main substrate, and the condensation section of the flexible assembly is inserted into the first heat dissipation fins in a penetrating mode. The flexible heat pipe capable of being bent is adopted, the heat dissipation area is expanded, heat concentrated on the main chip can be transmitted to the far end for heat dissipation, the space above the server mainboard can be fully utilized for heat dissipation, and the heat dissipation efficiency is improved. The heat insulation section of the flexible assembly has the characteristic of being bendable, so that later maintenance is facilitated, and other parts are convenient to plug and pull. The radiator has the advantages of being high in space utilization rate, high in heat dissipation performance, convenient to maintain and the like.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a heat sink and a server board. Background Art

[0002] With the development of cloud computing, big data, artificial intelligence and other technologies, the computing performance, power consumption and integration of servers are constantly improving. As the core component of the server, the heat dissipation effect and stability of the central processing unit (CPU) have an important impact on the performance of the server. The server radiator is limited by the space and location requirements of the server. The volume and heat dissipation area of ​​the server are difficult to meet the heat dissipation requirements of high-power density servers, resulting in problems such as server overheating, performance degradation, and reduced stability.

[0003] Increasing the length, width and height of the radiator can increase the heat dissipation area of ​​the radiator, and increasing the heat dissipation area can enhance the heat dissipation performance of the radiator. However, as the integration of servers becomes higher and higher, there are more and more high-power components and modules on the motherboard. For example, high-density modules such as memory sticks, graphics processing units (GPUs), and high-speed connection lines occupy more and more motherboard areas, so the space left for the CPU radiator on the motherboard is greatly limited. The CPU radiator cannot increase the heat dissipation area by simply increasing the length and width. Utility Model Content

[0004] The purpose of the present application is to provide a heat sink and a server card to at least partially improve the above-mentioned problems.

[0005] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0006] In a first aspect, an embodiment of the present application provides a radiator, which comprises: a main substrate and at least one group of flexible heat pipe heat dissipation components, the flexible heat pipe heat dissipation components comprising a first heat dissipation fin and at least one three-section flexible heat pipe, the three-section flexible heat pipe comprising an evaporation section of a flexible component, an insulation section of a flexible component and a condensation section of a flexible component which are sequentially connected; the evaporation section of the flexible component is embedded in the bottom of the main substrate, and the condensation section of the flexible component is interspersed with the first heat dissipation fin.

[0007] The use of a bendable flexible heat pipe expands the heat dissipation area and can transfer the heat concentrated in the main chip to the remote end for heat dissipation, which can make full use of the space above the server motherboard for heat dissipation and improve the heat dissipation efficiency. Since the insulation section of the flexible component is bendable, it is convenient for later maintenance and convenient for plugging and unplugging other components (such as memory). The radiator solution provided by this application has the characteristics of high space utilization, strong heat dissipation performance, and easy maintenance.

[0008] Optionally, the radiator further includes second heat dissipation fins, which are vertically arranged on the main substrate to fully utilize the space above the main substrate for heat dissipation.

[0009] Optionally, the radiator further comprises at least one group of rigid heat pipe heat dissipation components, the rigid heat pipe heat dissipation components comprising a third heat dissipation fin and at least one metal heat pipe, the metal heat pipe comprising an evaporation section of the rigid component, a first heat insulation section of the rigid component and a first condensation section of the rigid component which are sequentially connected; the evaporation section of the rigid component is embedded in the bottom of the main substrate, and the first condensation section of the rigid component is inserted in the third heat dissipation fin. This further improves the heat dissipation utilization rate of the space above the main substrate.

[0010] Optionally, the metal heat pipe further includes a second heat-insulating section of the rigid component and a second condensing section of the rigid component, and the radiator further includes a fourth heat-dissipating fin; the evaporating section of the rigid component, the second heat-insulating section of the rigid component, and the second condensing section of the rigid component are sequentially connected; the second condensing section of the rigid component is inserted in the fourth heat-dissipating fin, and the fourth heat-dissipating fin is arranged parallel to the main substrate. This further improves the heat dissipation utilization rate of the space above the main substrate.

[0011] Optionally, the fourth heat dissipation fin is located above the second heat dissipation fin, and the length of the fourth heat dissipation fin is smaller than the length of the second heat dissipation fin.

[0012] Optionally, the tube shell of the evaporation section of the flexible component and the tube shell of the condensation section of the flexible component are both copper tubes, and the tube shell of the insulation section of the flexible component is a polymer flexible tube or a metal bellows.

[0013] Optionally, the wick of the evaporation section of the flexible component, the wick of the condensation section of the flexible component and the wick of the insulation section of the flexible component are made of wire mesh wick, groove wick or wire mesh-groove composite wick.

[0014] In a second aspect, an embodiment of the present application provides a server board, which includes a server mainboard, a main chip, a memory module and the above-mentioned heat sink; the main chip is deployed on the server mainboard, and the memory module is deployed on the server mainboard adjacent to the main chip; the main substrate of the heat sink is in thermal contact with the outer shell of the main chip.

[0015] Optionally, when the radiator is in an expanded mode, the first heat dissipation fin is located directly above the memory module; when the radiator is in a maintenance mode, the first heat dissipation fin is flipped at a preset angle in a direction away from the memory module.

[0016] Optionally, the server board is further equipped with a fan, and any heat dissipation fins in the radiator are arranged along the downwind direction.

[0017] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, embodiments are given below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 An exploded view of the radiator provided for this application;

[0020] Figure 2 A cross-sectional view of a radiator provided for this application;

[0021] Figure 3 A schematic diagram of the layout of the server board provided for this application;

[0022] Figure 4 A cross-sectional view of a bent heat sink provided in an embodiment of the present application.

[0023] In the figure: 10-server motherboard; 20-acceleration card; 30-radiator; 40-fan; 50-memory module; 60-main chip; 311-main substrate; 312-second heat sink fin; 313-fourth heat sink fin; 321-first heat sink fin; 322-three-section flexible heat pipe; 331-third heat sink fin; 332-metal heat pipe; 322-1-evaporation section of the flexible component; 322-2-insulation section of the flexible component; 322-3-condensation section of the flexible component. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0026] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0028] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0030] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0031] The present application provides a radiator deployed on a server card board, which uses a bendable flexible heat pipe to expand the heat dissipation area of ​​the radiator and can transfer the heat concentrated on the main chip (such as the CPU) to the remote end for heat dissipation. The space above the server motherboard can be fully utilized to arrange the radiator, and it is convenient for later maintenance and plugging and unplugging of other components (such as memory). The radiator solution provided by the present application has the characteristics of high space utilization, strong heat dissipation performance, and convenient maintenance.

[0032] Please refer to Figure 1 and Figure 2 , Figure 1 An exploded view of the radiator provided for this application, Figure 2 The cross-sectional view of the heat sink provided in the present application. The heat sink 30 includes: a main substrate 311 and at least one group of flexible heat pipe heat dissipation components, the flexible heat pipe heat dissipation components include a first heat dissipation fin 321 and at least one three-section flexible heat pipe 322, the three-section flexible heat pipe 322 includes an evaporation section 322-1 of the flexible component, an insulation section 322-2 of the flexible component, and a condensation section 322-3 of the flexible component that are sequentially connected.

[0033] The main substrate 311 may be, but is not limited to, a copper substrate, an aluminum substrate or a VC substrate.

[0034] Optionally, the first heat sink fin 321 may be arranged along the downwind direction of the fan deployed on the server board. One first heat sink fin 321 may correspond to two first heat sink fins 321. The evaporation section 322-1 of the flexible component, the insulation section 322-2 of the flexible component, and the condensation section 322-3 of the flexible component may be connected by glue or welding.

[0035] Optionally, the tube shell of the evaporation section 322-1 of the flexible component and the tube shell of the condensation section 322-3 of the flexible component are both copper tubes, and the tube shell of the insulation section 322-2 of the flexible component is a polymer flexible tube or a metal bellows.

[0036] Optionally, the wick of the evaporation section 322-1 of the flexible component, the wick of the condensation section 322-3 of the flexible component and the wick of the insulation section 322-2 of the flexible component are made of wire mesh wick, groove wick or wire mesh-groove composite wick.

[0037] The evaporation section 322 - 1 of the flexible component is embedded in the bottom of the main substrate 311 , and the condensation section 322 - 3 of the flexible component is inserted into the first heat dissipation fin 321 .

[0038] Optionally, the evaporation section 322-1 of the flexible component is embedded in the bottom of the main substrate 311 in the form of an embedded pipe, and the main substrate 311 can be in heat dissipation contact with the main chip on the server board, that is, the evaporation section 322-1 of the flexible component is in heat dissipation contact with the main chip on the server board. The condensation section 322-3 of the flexible component can be inserted and welded in the first heat sink fin 321.

[0039] The heat generated by the main chip on the server board can be transferred to the first heat sink fins 321 through the three-section flexible heat pipe 322 for heat dissipation.

[0040] The radiator provided by the present application adopts a bendable flexible heat pipe to expand the heat dissipation area and can transfer the heat concentrated in the main chip to the remote end for heat dissipation, which can make full use of the space above the server motherboard for heat dissipation and improve the heat dissipation efficiency. Since the insulation section of the flexible component has the characteristic of being bendable, it is convenient for later maintenance and convenient for plugging and unplugging other components (such as memory). The radiator solution provided by the present application has the characteristics of high space utilization, strong heat dissipation performance, and easy maintenance.

[0041] In order to further improve the heat dissipation performance, regarding the structure of the heat sink, the present application embodiment also provides an optional implementation method, please continue to refer to Figure 1 and Figure 2 .

[0042] The heat sink 30 further includes second heat dissipation fins 312 , which are vertically disposed on the main substrate 311 .

[0043] The second heat dissipation fins 312 can be arranged along the downwind direction of the fan deployed on the server board. The second heat dissipation fins 312 can dissipate the heat generated by the main chip on the server board that is conducted by the main substrate 311 .

[0044] In order to further improve the heat dissipation performance, regarding the structure of the heat sink, the present application embodiment also provides an optional implementation method, please continue to refer to Figure 1The heat sink 30 further includes at least one group of rigid heat pipe heat dissipation components, the rigid heat pipe heat dissipation components include third heat dissipation fins 331 and at least one metal heat pipe 332, the metal heat pipe 332 includes an evaporation section of the rigid component, a first insulation section of the rigid component, and a first condensation section of the rigid component that are sequentially connected. The metal heat pipe 332 can be a metal copper pipe as a tube shell.

[0045] The third heat sink fins 331 may be arranged along the downwind direction of the fan deployed on the server board. One third heat sink fin 331 may correspond to two metal heat pipes 332 .

[0046] The evaporation section of the rigid component is embedded in the bottom of the main substrate 311 , and the first condensation section of the rigid component is inserted into the third heat dissipation fin 331 .

[0047] The evaporation section of the rigid component is embedded in the bottom of the main substrate 311 in the form of an embedded tube, and the first condensation section of the rigid component is inserted into and welded into the third heat dissipation fin 331 .

[0048] The heat generated by the main chip on the server board can be transferred to the third heat sink fins 331 through the metal heat pipe 332 for heat dissipation.

[0049] In order to further improve the heat dissipation performance, regarding the structure of the heat sink, the present application embodiment also provides an optional implementation method, please continue to refer to Figure 1 The metal heat pipe 332 further includes a second heat insulating section of the rigid component and a second condensing section of the rigid component, and the heat sink 30 further includes a fourth heat sink fin 313 .

[0050] The evaporation section of the rigid component, the second insulation section of the rigid component and the second condensation section of the rigid component are connected in sequence.

[0051] The second condensing section of the rigid component is inserted through the fourth heat dissipation fin 313 , and the fourth heat dissipation fin 313 is arranged parallel to the main substrate 311 .

[0052] The fourth heat sink fins 313 may be arranged along the downwind direction of the fan deployed on the server board. The heat generated by the main chip on the server board may be conducted to the fourth heat sink fins 313 through the metal heat pipe 332 for heat dissipation.

[0053] Optionally, the fourth heat dissipation fin 313 is located above the second heat dissipation fin 312 , and the length of the fourth heat dissipation fin 313 is shorter than the length of the second heat dissipation fin 312 .

[0054] The length of the fourth heat sink fin 313 arranged in parallel is less than the length of the second heat sink fin 312 arranged vertically. When viewed from the side, the fourth heat sink fin 313 and the second heat sink fin 312 form an "L"-shaped fin group, and the "L"-shaped notch is used to avoid other accelerator card components (such as AI accelerator card). By cutting off part of the heat sink fins of the fourth heat sink fin 313, a notch is left, and the vacant position of the notch can be used to install a full-size AI accelerator card.

[0055] The heat dissipation fins in the present application (including the first heat dissipation fins 321 , the second heat dissipation fins 312 , the third heat dissipation fins 331 and the fourth heat dissipation fins 313 ) may be copper fins or aluminum fins.

[0056] This application also provides a server card, please refer to Figure 1 , Figure 2 as well as Figure 3 , Figure 3 A schematic diagram of the layout of the server board provided for this application.

[0057] The server board includes a server mainboard 10 , a main chip 60 , a memory module 50 and the above-mentioned heat sink 30 .

[0058] The main chip 60 may be, but is not limited to, a CPU, and the main chip 60 is disposed on the server motherboard 10, and the memory module 50 is disposed on the server motherboard 10 adjacent to the main chip 60. Optionally, the memory modules 50 are disposed on both sides of the main chip 60 (which may be adjacent sides or opposite sides), and the main substrate 311 of the heat sink 30 is in thermal contact with the shell of the main chip 60.

[0059] Please refer to Figure 2 and Figure 4 , Figure 4 A cross-sectional view of a bent heat sink provided in an embodiment of the present application.

[0060] When the heat sink 30 is in the expanded mode, the first heat sink fin 321 is located directly above the memory module 50 (on the side away from the server mainboard 10 ).

[0061] When the heat sink 30 is in the maintenance mode, the first heat dissipation fin 321 is turned by a preset angle in a direction away from the memory module 50 , that is, turned by a preset angle in a direction toward the fourth heat dissipation fin 313 .

[0062] The preset angle may be but is not limited to 90°.

[0063] When the server is operating normally, the radiator 30 connected by the three-section flexible heat pipe 322 is in the unfolded mode. Figure 2The first heat sink 321 is located directly above the memory module 50, and the air volume flowing over the memory module 50 can be used for heat dissipation; when the server is shut down for maintenance, the radiator 30 is in maintenance mode, and the memory module 50 needs to be plugged in or out, the first heat sink 321 connected to the three-section flexible heat pipe 322 can be flipped 90°. Figure 4 As shown, the first heat sink fin 321 is located directly above the main substrate 311, leaving space directly above the memory module 50, so as to facilitate the plugging and unplugging maintenance operation of the memory module 50. After the plugging and unplugging maintenance operation of the memory module 50 is completed, the first heat sink fin 321 connected to the three-section flexible heat pipe 322 is flipped in the opposite direction by a preset angle, and the first heat sink fin 321 is restored to its original position, as shown in FIG. Figure 2 shown.

[0064] Optionally, when the memory modules 50 are disposed on both sides (opposite sides) of the main chip 60, the heat sink 30 includes two sets of flexible heat pipe heat dissipation components, such as Figure 1 and Figure 2 The two groups of flexible heat pipe cooling components form a horn cooling structure, and the two groups of flexible heat pipe cooling components are respectively connected to the corresponding first cooling fins 321 through the corresponding three-section flexible heat pipes 322, so that the first cooling fins 321 are deployed above the memory module 50, making full use of the space between the memory module 50 and the system fan, and increasing the radiator area.

[0065] Please continue to refer to Figure 3 The server board is also equipped with a fan 40, and any heat dissipation fins in the radiator 30 are arranged along the downwind direction.

[0066] Fan 40 is a cooling fan for the server board, which can be 6 6038 / 6056 fans or 4 8038 / 8056 fans. Fan 40 is used to dissipate heat from other heat-generating components on the server motherboard, such as memory, power supply, hard disk, AI acceleration card, etc., to ensure that the server meets the heat dissipation requirements.

[0067] Please continue to refer to Figure 3 In an optional implementation, the server board further includes at least one accelerator card 20 , which may be, but is not limited to, an AI accelerator card. The accelerator card 20 may be disposed adjacent to the heat sink 30 .

[0068] In an optional implementation, the fourth heat sink fin 313 and the second heat sink fin 312 form an “L”-shaped fin group, and the acceleration card 20 is disposed in the “L”-shaped recess between the fourth heat sink fin 313 and the second heat sink fin 312 .

[0069] In summary, the present application provides a radiator and a server board, the radiator comprising: a main substrate and at least one group of flexible heat pipe heat dissipation components, the flexible heat pipe heat dissipation components comprising a first heat dissipation fin and at least one three-section flexible heat pipe, the three-section flexible heat pipe comprising an evaporation section of a flexible component, an insulation section of a flexible component and a condensation section of a flexible component that are sequentially connected; the evaporation section of the flexible component is embedded in the bottom of the main substrate, and the condensation section of the flexible component is interspersed with the first heat dissipation fin. A bendable flexible heat pipe is used to expand the heat dissipation area, and the heat concentrated on the main chip can be transferred to the remote end for heat dissipation, which can make full use of the space above the server motherboard for heat dissipation and improve the heat dissipation efficiency. Since the insulation section of the flexible component has the characteristic of being bendable, it is convenient for later maintenance and convenient for plugging and unplugging other components (such as memory). The radiator solution provided by the present application has the characteristics of high space utilization, strong heat dissipation performance, and convenient maintenance.

[0070] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0071] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A radiator, characterized in that: The radiator comprises: a main substrate and at least one group of flexible heat pipe heat dissipation components, wherein the flexible heat pipe heat dissipation components comprise a first heat dissipation fin and at least one three-section flexible heat pipe, wherein the three-section flexible heat pipe comprises an evaporation section of a flexible component, an insulation section of a flexible component and a condensation section of a flexible component which are sequentially connected; The evaporation section of the flexible component is embedded in the bottom of the main substrate, and the condensation section of the flexible component is inserted in the first heat dissipation fin.

2. The heat sink according to claim 1, characterized in that The heat sink also includes second heat dissipation fins, and the second heat dissipation fins are vertically arranged on the main substrate.

3. The radiator according to claim 1 or 2, characterized in that: The radiator further comprises at least one group of rigid heat pipe heat dissipation components, wherein the rigid heat pipe heat dissipation components comprise a third heat dissipation fin and at least one metal heat pipe, wherein the metal heat pipe comprises an evaporation section of the rigid component, a first heat insulation section of the rigid component, and a first condensation section of the rigid component which are sequentially connected; The evaporation section of the rigid component is embedded in the bottom of the main substrate, and the first condensation section of the rigid component is inserted into the third heat dissipation fin.

4. The heat sink according to claim 3, characterized in that The metal heat pipe further comprises a second heat-insulating section of the rigid component and a second condensing section of the rigid component, and the radiator further comprises a fourth heat-dissipating fin; The evaporation section of the rigid component, the second heat-insulating section of the rigid component, and the second condensing section of the rigid component are connected in sequence; The second condensing section of the rigid component is inserted through the fourth heat dissipation fin, and the fourth heat dissipation fin is arranged parallel to the main substrate.

5. The heat sink according to claim 4, characterized in that The fourth heat dissipation fin is located above the second heat dissipation fin, and the length of the fourth heat dissipation fin is smaller than the length of the second heat dissipation fin.

6. The heat sink according to claim 1, characterized in that The tube shell of the evaporation section of the flexible component and the tube shell of the condensation section of the flexible component are both copper tubes, and the tube shell of the insulation section of the flexible component is a polymer flexible tube or a metal bellows.

7. The heat sink according to claim 1, characterized in that The liquid absorbent core of the evaporation section of the flexible component, the liquid absorbent core of the condensation section of the flexible component and the liquid absorbent core of the insulation section of the flexible component are made of wire mesh liquid absorbent core, groove type liquid absorbent core or wire mesh-groove composite liquid absorbent core.

8. A server card, characterized in that: The server board comprises a server mainboard, a main chip, a memory module and a heat sink as claimed in any one of claims 1 to 7; The main chip is deployed on the server mainboard, and the memory module is deployed on the server mainboard adjacent to the main chip; The main substrate of the heat sink is in thermal contact with the housing of the main chip.

9. The server board as claimed in claim 8, characterized in that: When the heat sink is in the expanded mode, the first heat sink fin is located directly above the memory module; When the heat sink is in a maintenance mode, the first heat sink fins are flipped at a preset angle in a direction away from the memory module.

10. The server board as claimed in claim 8, characterized in that: The server board is also equipped with a fan, and any heat dissipation fins in the radiator are arranged along the downwind direction.

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