Silicon wafer coating mechanism for diode processing

Abstract

The utility model relates to the technical field of diode processing equipment, and discloses a silicon wafer coating mechanism for diode processing, which comprises a placing plate, the periphery of the lower surface of the placing plate is fixedly connected with supporting blocks, the periphery of the upper surface of the placing plate is fixedly connected with connecting plates, and the upper surfaces of the connecting plates are fixedly connected with a top plate; and the outer surface of the moving block is movably connected to the lower side of the front end of the inner surface of the connecting plate. By arranging the movable column, the first fixing plate, the first motor, the cam and the second fixing plate, when the first motor operates, the circular shaft can drive the cam to start to rotate, due to the fact that the cam is connected with the first fixing plate, rotation of the cam can drive the first fixing plate to enable the movable column, the first fixing plate and the second fixing plate to move upwards together, and the movable column is fixed. Therefore, the distance between the second fixing plate and the upper surface of the silicon wafer is changed, and the thickness of the coating on the silicon wafer is controlled.

Description

Technical Field

[0001] The utility model relates to the technical field of diode processing equipment, and more specifically, to a silicon wafer coating mechanism for diode processing. Background Art

[0002] A diode is also called a crystal diode, or simply a diode. It is one of the most commonly used electronic components. Its biggest feature is unidirectional conductivity, that is, current can only flow through the diode in one direction. The main functions of a diode include rectification circuits, detection circuits, voltage stabilization circuits, etc. Various modulation circuits are also mainly composed of diodes. In addition, the diode can also be used as a switch to control the circuit.

[0003] When operators are processing diodes, they often use a silicon wafer coating mechanism to spray a protective layer on the outer surface of the silicon wafer to prevent the diode from failing when voltage is loaded. In actual use, although the existing silicon wafer coating mechanism has basic spraying functions, the existing silicon wafer coating mechanism generally cannot control the spraying thickness of the protective layer and cannot meet the processing needs of operators for different types of diodes. Therefore, it needs to be improved. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a silicon wafer coating mechanism for diode processing, which has the advantage of being able to adjust the coating thickness.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a silicon wafer coating mechanism for diode processing, comprising:

[0006] A placement plate, wherein the lower surface of the placement plate is fixedly connected to support blocks on all sides, the upper surface of the placement plate is fixedly connected to connecting plates on all sides, and the upper surface of the connecting plate is fixedly connected to a top plate;

[0007] The movable block, the outer surface of the movable block is movably connected to the lower side of the front end of the inner surface of the connecting plate, the inner surfaces of the left and right sides of the movable block are movably sleeved with movable columns, the upper and lower ends of the movable columns penetrate the movable block and extend to the outside of the movable block, the top of the movable column is fixedly connected to a No. 1 fixed plate, the bottom end of the movable column is fixedly connected to a No. 2 fixed plate located above the placement plate, the outer surface of the movable column is movably sleeved with a spring located above the movable block, the upper end of the spring is fixedly connected to the lower surface of the No. 1 fixed plate, and the other end of the spring is fixedly connected to the upper surface of the movable block;

[0008] An adjustment mechanism, the adjustment mechanism being arranged between the moving block and the first fixed plate;

[0009] Among them, the adjustment mechanism includes a No. 1 motor, which is fixedly installed in the middle of the left surface of the moving block. The other end of the output shaft of the No. 1 motor is fixedly sleeved with a round shaft, and the outer surface of the round shaft is fixedly sleeved with a cam located between the moving block and the No. 1 fixed plate. The outer surface of the top of the cam is movably connected to the lower surface of the No. 1 fixed plate. The rotation of the cam causes the No. 1 fixed plate to drive the movable column and the No. 2 fixed plate to move upward.

[0010] As a preferred technical solution of the present utility model, a No. 2 motor is fixedly installed on the lower side of the left end of the front surface of the connecting plate, and a single-thread screw is fixedly sleeved on the other end of the output shaft of the No. 2 motor. The rear end of the single-thread screw sequentially penetrates the connecting plate and the moving block and extends to the rear side of the connecting plate. The outer surface of the single-thread screw and the inner surface of the moving block are threadedly sleeved. A limiting shaft is fixedly sleeved on the inner surface of the right side of the front end of the connecting plate. The rear end of the limiting shaft sequentially penetrates the connecting plate and the moving block and extends to the rear side of the connecting plate. The outer surface of the limiting shaft and the inner surface of the moving block are movably sleeved.

[0011] As a preferred technical solution of the utility model, a paint box is fixedly connected to the middle part of the upper surface of the top plate, a valve No. 1 is fixedly installed on the upper surface of the paint box, the bottom end of the valve No. 1 passes through the paint box and extends to the inner side of the paint box, and a spray box is fixedly connected to the middle part of the lower surface of the top plate.

[0012] As a preferred technical solution of the utility model, a liquid pump located on the left side of the paint box is fixedly installed on the upper surface of the top plate, a feed pipe is fixedly connected to the left end of the outer surface of the liquid pump, the left end of the feed pipe passes through the paint box and extends to the interior of the paint box, and a discharge pipe is fixedly connected to the lower surface of the liquid pump, the bottom end of the discharge pipe passes through the top plate and the spray box in sequence and extends to the interior of the spray box.

[0013] As a preferred technical solution of the utility model, a No. 2 valve is fixedly installed at the bottom of the inner surface of the spray box, and the bottom end of the No. 2 valve passes through the spray box and extends to the outside of the spray box and is fixedly connected to a spray head.

[0014] As a preferred technical solution of the utility model, a movable groove is opened in the middle of the upper surface of the placing plate, and the rear side of the middle of the upper surface of the placing plate is fixedly connected with a limiting plate located below the second fixed plate, and the upper surface of the placing plate is fixedly connected with a fixed splint located on the right side of the limiting plate, and the inner surface of the movable groove is movably connected with a movable splint, and the bottom end of the movable splint passes through the placing plate and extends to the bottom of the placing plate.

[0015] As a preferred technical solution of the utility model, mounting blocks are fixedly connected to the left and right sides of the lower surface of the placement plate, a No. 3 motor is fixedly mounted on the outer surface of the left side of the mounting block, a double-threaded lead screw is fixedly sleeved on the other end of the output shaft of the No. 3 motor, the right end of the double-threaded lead screw passes through the mounting block and extends to the right side of the mounting block, movable blocks are threadedly sleeved on the left and right sides of the outer surface of the double-threaded lead screw, there are two movable blocks, and the positions of the two movable blocks are symmetrical about the placement plate.

[0016] As a preferred technical solution of the utility model, the inner surface of the left side of the mounting block is fixedly connected with a limit rod located on the upper side of the double-threaded screw, the right end of the outer surface of the limit rod passes through the two movable blocks and is fixedly connected to the inner surface of the right side of the mounting block, the outer surface of the limit rod and the inner surfaces of the two movable blocks are movably socketed, the lower surfaces of the two movable blocks are hinged with connecting rods, and the other end of the connecting rod is hinged to the lower surface of the movable splint.

[0017] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0018] 1. The utility model is provided with a movable column, a No. 1 fixed plate, a No. 1 motor, a cam and a No. 2 fixed plate. When the No. 1 motor is running, the circular shaft will drive the cam to start rotating. Due to the connection between the cam and the No. 1 fixed plate, the rotation of the cam will drive the No. 1 fixed plate and make the movable column, the No. 1 fixed plate and the No. 2 fixed plate move upward together, which changes the distance between the No. 2 fixed plate and the upper surface of the silicon wafer, realizes the control function of the coating thickness on the silicon wafer, and improves the overall application range of the placement plate.

[0019] 2. The utility model sets a movable splint, a movable groove, a double-threaded screw, a movable block and a limit rod. When the No. 3 motor is running, the double-threaded screw will start to rotate, which makes the two movable blocks start to move towards each other under the limit of the limit rod, and the movement of the two movable blocks will drive the two connecting rods, so that the two connecting rods start to rotate with the bottom ends of the two movable blocks as the axis respectively. In this process, the other ends of the two movable blocks will push the movable splint, so that the movable splint starts to move along the inner surface of the movable groove toward the silicon wafer. Finally, the movable splint will fix the silicon wafer together with the fixed splint to prevent the silicon wafer from moving when the coating is applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a structural schematic diagram of the back of the utility model;

[0022] Figure 3 It is a structural schematic diagram of the bottom of the utility model;

[0023] Figure 4 It is a cross-sectional structural schematic diagram of the back of the utility model;

[0024] Figure 5 It is a schematic cross-sectional structural diagram of the side of the utility model.

[0025] In the figure: 1. Placement plate; 2. Support block; 3. Connecting plate; 4. Top plate; 5. Moving block; 6. Movable column; 7. Fixed plate No. 1; 8. Motor No. 1; 9. Round shaft; 10. Cam; 11. Spring; 12. Fixed plate No. 2; 13. Motor No. 2; 14. Single-thread screw; 15. Limiting shaft; 16. Movable splint; 17. Paint box; 18. Valve No. 1; 19. Spray box; 20. Liquid pump; 21. Feed pipe; 22. Discharge pipe; 23. Valve No. 2; 24. Spray head; 25. Moving groove; 26. Limiting plate; 27. Fixed splint; 28. Mounting block; 29. ​​Motor No. 3; 30. Double-thread screw; 31. Movable block; 32. Limiting rod; 33. Connecting rod. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] like Figures 1 to 5 As shown, the utility model provides a silicon wafer coating mechanism for diode processing, comprising:

[0028] A placing plate 1, wherein the lower surface of the placing plate 1 is fixedly connected with supporting blocks 2 on all sides, the upper surface of the placing plate 1 is fixedly connected with connecting plates 3 on all sides, and the upper surface of the connecting plate 3 is fixedly connected with a top plate 4;

[0029] A moving block 5, the outer surface of the moving block 5 is movably connected to the lower side of the front end of the inner surface of the connecting plate 3, the inner surfaces of the left and right sides of the moving block 5 are movably sleeved with movable columns 6, the upper and lower ends of the movable columns 6 penetrate the moving block 5 and extend to the outside of the moving block 5, the top of the movable column 6 is fixedly connected with a No. 1 fixed plate 7, the bottom end of the movable column 6 is fixedly connected with a No. 2 fixed plate 12 located above the placement plate 1, the outer surface of the movable column 6 is movably sleeved with a spring 11 located above the moving block 5, the upper end of the spring 11 is fixedly connected to the lower surface of the No. 1 fixed plate 7, and the other end of the spring 11 is fixedly connected to the upper surface of the moving block 5;

[0030] An adjustment mechanism, the adjustment mechanism is arranged between the moving block 5 and the first fixed plate 7;

[0031] Among them, the adjustment mechanism includes a No. 1 motor 8, which is fixedly installed in the middle of the left surface of the moving block 5. The other end of the output shaft of the No. 1 motor 8 is fixedly sleeved with a round shaft 9. The outer surface of the round shaft 9 is fixedly sleeved with a cam 10 located between the moving block 5 and the No. 1 fixed plate 7. The outer surface of the top of the cam 10 is movably connected to the lower surface of the No. 1 fixed plate 7. The rotation of the cam 10 causes the No. 1 fixed plate 7 to drive the movable column 6 and the No. 2 fixed plate 12 to move upward.

[0032] When the No. 1 motor 8 is running, the circular shaft 9 will drive the cam 10 to start rotating, and the rotation of the cam 10 will drive the No. 1 fixed plate 7, so that the No. 1 fixed plate 7 as a whole starts to move upward under the limit of the movable column 6, so that the distance between the No. 2 fixed plate 12 and the silicon wafer changes.

[0033] Among them, a No. 2 motor 13 is fixedly installed on the lower side of the left end of the front surface of the connecting plate 3, and a single-thread screw 14 is fixedly sleeved on the other end of the output shaft of the No. 2 motor 13. The rear end of the single-thread screw 14 sequentially penetrates the connecting plate 3 and the moving block 5 and extends to the rear side of the connecting plate 3. The outer surface of the single-thread screw 14 and the inner surface of the moving block 5 are threadedly sleeved. A limiting shaft 15 is fixedly sleeved on the inner surface of the right side of the front end of the connecting plate 3. The rear end of the limiting shaft 15 sequentially penetrates the connecting plate 3 and the moving block 5 and extends to the rear side of the connecting plate 3. The outer surface of the limiting shaft 15 and the inner surface of the moving block 5 are movably sleeved.

[0034] Due to the design of the limiting shaft 15 , when the second motor 13 is running, the moving block 5 as a whole will start to move smoothly toward the silicon wafer under the drive of the single-thread lead screw 14 .

[0035] Among them, a paint box 17 is fixedly connected to the middle of the upper surface of the top plate 4, and a valve No. 1 is fixedly installed on the upper surface of the paint box 17. The bottom end of the valve No. 18 penetrates the paint box 17 and extends to the inner side of the paint box 17. A spray box 19 is fixedly connected to the middle of the lower surface of the top plate 4.

[0036] Due to the design of the No. 1 valve 18 , the operator can inject the coating material into the interior of the coating tank 17 through the No. 1 valve 18 .

[0037] Among them, a liquid pump 20 located on the left side of the paint box 17 is fixedly installed on the upper surface of the top plate 4, and a feed pipe 21 is fixedly connected to the left end of the outer surface of the liquid pump 20. The left end of the feed pipe 21 passes through the paint box 17 and extends to the interior of the paint box 17. A discharge pipe 22 is fixedly connected to the lower surface of the liquid pump 20, and the bottom end of the discharge pipe 22 passes through the top plate 4 and the spray box 19 in sequence and extends to the interior of the spray box 19.

[0038] When the liquid pump 20 is running, the coating material in the coating box 17 is pumped into the liquid pump 20 through the feed pipe 21 for pressurization and then injected into the spray box 19 through the discharge pipe 22 .

[0039] A second valve 23 is fixedly installed at the bottom of the inner surface of the spray box 19 , and the bottom end of the second valve 23 penetrates the spray box 19 and extends to the outside of the spray box 19 and is fixedly connected with a spray head 24 .

[0040] The operator can control the spraying of the coating material inside the spray box 19 by controlling the No. 2 valve 23 .

[0041] Among them, a movable groove 25 is opened in the middle of the upper surface of the placing plate 1, and the rear side of the middle of the upper surface of the placing plate 1 is fixedly connected with a limiting plate 26 located below the second fixed plate 12, and the upper surface of the placing plate 1 is fixedly connected with a fixed clamping plate 27 located on the right side of the limiting plate 26, and the inner surface of the movable groove 25 is movably connected with a movable clamping plate 16, and the bottom end of the movable clamping plate 16 passes through the placing plate 1 and extends to the bottom of the placing plate 1.

[0042] The movable clamping plate 16 can slide left and right along the inner surface of the movable groove 25 , thereby fixing the silicon wafer together with the fixed clamping plate 27 .

[0043] Among them, the left and right sides of the lower surface of the placement plate 1 are fixedly connected with mounting blocks 28, the outer surface of the left side of the mounting block 28 is fixedly installed with a No. 3 motor 29, the other end of the output shaft of the No. 3 motor 29 is fixedly sleeved with a double-threaded screw 30, the right end of the double-threaded screw 30 passes through the mounting block 28 and extends to the right side of the mounting block 28, and the left and right sides of the outer surface of the double-threaded screw 30 are threadedly sleeved with movable blocks 31, the number of the movable blocks 31 is two, and the positions of the two movable blocks 31 are symmetrical about the placement plate 1.

[0044] When the third motor 29 is running, the double-threaded lead screw 30 will rotate and drive the two movable blocks 31 to move toward each other.

[0045] Among them, the inner surface of the left side of the mounting block 28 is fixedly connected to a limiting rod 32 located on the upper side of the double-threaded screw 30, the right end of the outer surface of the limiting rod 32 passes through the two movable blocks 31 and is fixedly connected to the inner surface of the right side of the mounting block 28, the outer surface of the limiting rod 32 and the inner surfaces of the two movable blocks 31 are movably sleeved, and the lower surfaces of the two movable blocks 31 are hinged with connecting rods 33, and the other end of the connecting rod 33 is hinged to the lower surface of the movable splint 16.

[0046] When the two movable blocks 31 start to move toward each other, the two connecting rods 33 start to rotate driven by the two movable blocks 31 , so that the other ends of the two connecting rods 33 push the movable clamping plate 16 to move along the inner surface of the movable groove 25 .

[0047] The working principle and use process of this utility model:

[0048] First, the operator fills the coating box 17 with coating material and places the silicon wafer on the top of the placement plate 1 so that the silicon wafer contacts the limit plate 26 and the fixed clamp 27. Then the operator starts the No. 3 motor 29. As the No. 3 motor 29 runs, the double-threaded screw 30 starts to rotate and drives the two movable blocks 31, so that the two movable blocks 31 start to move toward each other under the limit of the limit rod 32. At this time, the two connecting rods 33 start to rotate with the bottom ends of the two movable blocks 31 as the axis, which makes the other ends of the two connecting rods 33 start to push the movable clamp 16, so that the movable clamp 16 moves along the inner surface of the movable groove 25 toward the direction of the silicon wafer. Finally, the movable clamp 16 contacts the outer surface of the silicon wafer and completes the fixation of the silicon wafer together with the cooperation of the fixed clamp 27.

[0049] At this time, the operator opens valve No. 2 23 and starts the liquid pump 20. The operation of the liquid pump 20 will cause the coating material inside the coating box 17 to be drawn into the liquid pump 20 through the feed pipe 21 for pressurization. The pressurized coating material will pass through the discharge pipe 22 into the spray box 19 and be sprayed on the upper surface of the silicon wafer through valve No. 2 23 and nozzle 24. Then the operator starts motor No. 1 8. The operation of motor No. 1 8 will cause the circular shaft 9 to drive the cam 10 to start rotating. Since the cam 10 and the outer surface of the No. 1 fixed plate 7 are connected to each other, the rotation of the cam 10 will drive the No. 1 fixed plate 7, and the No. 1 fixed plate 7 together with the movable column 6 and the No. 2 fixed plate 12 will start to move upward under the limit of the movable column 6, which changes the distance between the No. 2 fixed plate 12 and the silicon wafer.

[0050] When the distance between the No. 2 fixed plate 12 and the silicon wafer meets the needs of the operator, the operator starts the No. 2 motor 13. The operation of the No. 2 motor 13 will cause the single-thread screw 14 to start rotating, and the rotation of the single-thread screw 14 will drive the moving block 5 as a whole, so that the moving block 5 as a whole starts to move toward the silicon wafer under the limit of the limit shaft 15. During this period, the No. 2 fixed plate 12 scrapes the coating material above the silicon wafer, so that the coating material above the silicon wafer is evenly applied to the upper surface of the silicon wafer, thereby completing the coating of the silicon wafer.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer coating mechanism for diode processing, characterized in that: Included are: A placement plate (1), wherein the lower surface of the placement plate (1) is fixedly connected to support blocks (2) on all four sides, the upper surface of the placement plate (1) is fixedly connected to connecting plates (3) on all four sides, and the upper surface of the connecting plate (3) is fixedly connected to a top plate (4); A movable block (5), wherein the outer surface of the movable block (5) is movably connected to the lower side of the front end of the inner surface of the connecting plate (3), and the inner surfaces of the left and right sides of the movable block (5) are both movably sleeved with movable columns (6), and the upper and lower ends of the movable columns (6) both penetrate the movable block (5) and extend to the outer side of the movable block (5), and the top of the movable column (6) is fixedly connected to a No. 1 fixed plate (7), and the bottom end of the movable column (6) is fixedly connected to a No. 2 fixed plate (12) located above the placement plate (1), and the outer surface of the movable column (6) is movably sleeved with a spring (11) located above the movable block (5), and the upper end of the spring (11) is fixedly connected to the lower surface of the No. 1 fixed plate (7), and the other end of the spring (11) is fixedly connected to the upper surface of the movable block (5); An adjustment mechanism, the adjustment mechanism being arranged between the moving block (5) and the first fixed plate (7); The adjustment mechanism comprises a No. 1 motor (8), which is fixedly mounted on the middle of the left surface of the moving block (5); the other end of the output shaft of the No. 1 motor (8) is fixedly sleeved with a round shaft (9); the outer surface of the round shaft (9) is fixedly sleeved with a cam (10) located between the moving block (5) and the No. 1 fixed plate (7); the outer surface of the top of the cam (10) is movably connected to the lower surface of the No. 1 fixed plate (7); the rotation of the cam (10) causes the No. 1 fixed plate (7) to drive the movable column (6) and the No. 2 fixed plate (12) to move upward.

2. The silicon wafer coating mechanism for diode processing according to claim 1, characterized in that: A No. 2 motor (13) is fixedly mounted on the lower side of the left end of the front surface of the connecting plate (3); a single-thread screw (14) is fixedly sleeved on the other end of the output shaft of the No. 2 motor (13); the rear end of the single-thread screw (14) sequentially penetrates the connecting plate (3) and the moving block (5) and extends to the rear side of the connecting plate (3); the outer surface of the single-thread screw (14) and the inner surface of the moving block (5) are threadedly sleeved; a limiting shaft (15) is fixedly sleeved on the inner surface of the right side of the front end of the connecting plate (3); the rear end of the limiting shaft (15) sequentially penetrates the connecting plate (3) and the moving block (5) and extends to the rear side of the connecting plate (3); the outer surface of the limiting shaft (15) and the inner surface of the moving block (5) are movably sleeved.

3. The silicon wafer coating mechanism for diode processing according to claim 1, characterized in that: A paint box (17) is fixedly connected to the middle of the upper surface of the top plate (4), a valve No. 1 (18) is fixedly installed on the upper surface of the paint box (17), the bottom end of the valve No. 1 (18) passes through the paint box (17) and extends to the inner side of the paint box (17), and a spray box (19) is fixedly connected to the middle of the lower surface of the top plate (4).

4. The silicon wafer coating mechanism for diode processing according to claim 1, characterized in that: A liquid pump (20) located on the left side of the paint box (17) is fixedly mounted on the upper surface of the top plate (4); a feed pipe (21) is fixedly connected to the left end of the outer surface of the liquid pump (20); the left end of the feed pipe (21) passes through the paint box (17) and extends to the interior of the paint box (17); a discharge pipe (22) is fixedly connected to the lower surface of the liquid pump (20); the bottom end of the discharge pipe (22) passes through the top plate (4) and the spray box (19) in sequence and extends to the interior of the spray box (19).

5. The silicon wafer coating mechanism for diode processing according to claim 3, characterized in that: A second valve (23) is fixedly installed at the bottom of the inner surface of the spray box (19), and the bottom end of the second valve (23) passes through the spray box (19) and extends to the outside of the spray box (19) and is fixedly connected to a spray head (24).

6. The silicon wafer coating mechanism for diode processing according to claim 1, characterized in that: A movable groove (25) is provided in the middle of the upper surface of the placement plate (1); a limit plate (26) located below the second fixed plate (12) is fixedly connected to the rear side of the middle of the upper surface of the placement plate (1); a fixed clamping plate (27) located on the right side of the limit plate (26) is fixedly connected to the upper surface of the placement plate (1); a movable clamping plate (16) is movably connected to the inner surface of the movable groove (25); and the bottom end of the movable clamping plate (16) passes through the placement plate (1) and extends to the bottom of the placement plate (1).

7. The silicon wafer coating mechanism for diode processing according to claim 1, characterized in that: The left and right sides of the lower surface of the placement plate (1) are fixedly connected with mounting blocks (28), the outer surface of the left side of the mounting block (28) is fixedly mounted with a third motor (29), the other end of the output shaft of the third motor (29) is fixedly sleeved with a double-threaded lead screw (30), the right end of the double-threaded lead screw (30) passes through the mounting block (28) and extends to the right side of the mounting block (28), the left and right sides of the outer surface of the double-threaded lead screw (30) are threadedly sleeved with movable blocks (31), the number of the movable blocks (31) is two, and the positions of the two movable blocks (31) are symmetrical with respect to the placement plate (1).

8. The silicon wafer coating mechanism for diode processing according to claim 7, characterized in that: The inner surface of the left side of the mounting block (28) is fixedly connected to a limiting rod (32) located on the upper side of the double-threaded screw (30); the right end of the outer surface of the limiting rod (32) passes through the two movable blocks (31) and is fixedly connected to the inner surface of the right side of the mounting block (28); the outer surface of the limiting rod (32) and the inner surfaces of the two movable blocks (31) are movably sleeved; the lower surfaces of the two movable blocks (31) are hinged with connecting rods (33); the other end of the connecting rod (33) is hinged to the lower surface of the movable splint (16).

Images