Low-density universal multifunctional interchangeable communication system

Abstract

The utility model discloses a low-density universal multifunctional interchangeable communication system. Comprising a shell, a first upper-layer expansion card, a first hard disk, a mainboard, a second hard disk, an IO module, a first upper-layer adapter card, a second upper-layer adapter card, a lower-layer adapter card and a power supply for supplying power, wherein the mainboard, the second hard disk, the IO module, the first upper-layer adapter card, the second upper-layer adapter card and the lower-layer adapter card are arranged in the shell; the lower-layer expansion card is arranged in the lower-layer expansion card position; each of the first upper-layer expansion cards, the second upper-layer expansion card and the lower-layer expansion card is provided with eight network ports, the two first upper-layer expansion cards are arranged side by side left and right, and the two first upper-layer expansion cards and the first hard disk are respectively arranged in the first upper-layer expansion card positions in a mutually exclusive manner; expansion of multiple expansion cards and network ports thereof or double hard disks matched with multiple network ports can be realized, the use performance of the mainboard is improved, and convenience is brought to use; and moreover, the installation space is greatly saved.

Description

Technical Field

[0001] The utility model relates to the field of communication systems, in particular to a low-density, universal, multifunctional, interchangeable communication system. Background Art

[0002] In the existing communication system, the communication management machine has multiple downstream communication interfaces and one or more upstream network interfaces, which is equivalent to the front-end machine, i.e., the monitoring computer. It is used to organize and summarize the communication data of all intelligent monitoring / protection devices in a substation, and then send it to the upper-level master station system (back-end machine and DCS of the monitoring center) to complete the remote signaling and telemetry functions. On the other hand, it receives the commands issued by the back-end machine or DCS and forwards them to the intelligent series units in the substation to complete the remote control of the opening and closing of each switchgear in the plant or the parameter setting of the device, and realize the remote control and remote adjustment functions. At the same time, it should also be equipped with multiple serial interfaces to facilitate communication with other intelligent devices in the plant.

[0003] The mainboard in the existing communication management machine has poor performance and can only use a single expansion card, resulting in a limited number of network ports. In addition, the existing mainboard only uses one hard disk, and it is not possible to increase or decrease the hard disk or expansion card according to the use requirements.

[0004] Therefore, it is necessary to develop a new technology to solve the above problems. Utility Model Content

[0005] In view of this, the utility model aims to solve the deficiencies in the prior art, and its main purpose is to provide a low-density, universal, multi-functional interchangeable communication system, which can realize the expansion of multiple expansion cards and their network ports or replace them with dual hard drives with multiple network ports, thereby improving the performance of the motherboard and bringing convenience to use; moreover, it greatly saves installation space.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A low-density universal multifunctional interchangeable communication system includes a housing, a first upper expansion card, a first hard disk, a mainboard installed in the housing, a second hard disk, an IO module, a first upper adapter card, a second upper adapter card, a lower adapter card, and a power supply for power supply;

[0008] The second hard disk, the IO module, the first upper-layer adapter card, and the lower-layer adapter card are respectively connected to the mainboard in hot-swap mode; the mainboard is provided with an Intel C5000 series processor, and the Intel C5000 series processor is respectively electrically connected to the second hard disk, the IO module, the first upper-layer adapter card, and the lower-layer adapter card;

[0009] An expansion bracket is installed in the front area of ​​the housing, and the expansion bracket is provided with 5 expansion slots, and the 5 expansion slots are divided into upper and lower layers, wherein the upper layer expansion slots are provided with 3, and the lower layer expansion slots are provided with 2, and the 3 upper layer expansion slots are respectively provided with 1 first upper layer expansion slot and 2 second upper layer expansion slots from left to right, and the two lower layer expansion slots are provided side by side from left to right;

[0010] The first upper-layer riser card is connected to the second upper-layer riser card. The front end of the second upper-layer riser card is provided with two first expansion slots and two second expansion slots from left to right. The two second expansion slots are respectively connected to a second upper-layer expansion card. Each second upper-layer expansion card is installed in a second upper-layer expansion card position. The first expansion slot is used to connect the first upper-layer expansion card.

[0011] The lower-layer adapter card is provided with two third expansion slots arranged side by side, each of which is connected to a lower-layer expansion card, and each lower-layer expansion card is installed in a lower-layer expansion card position;

[0012] The first upper expansion card, the second upper expansion card and the lower expansion card are each provided with 8 network ports, the network ports include optical ports and electrical ports, two first upper expansion cards are provided and are arranged side by side on the left and right, and the two first upper expansion cards and a first hard disk are respectively and mutually exclusive installed in the first upper expansion card positions;

[0013] When two first upper layer expansion cards are installed in the first upper layer expansion card position, each first upper layer expansion card is connected to a first expansion slot;

[0014] When the first hard disk is installed in the first upper expansion card slot, the first hard disk is hot-pluggably connected to the mainboard, and the Intel C5000 series processor is electrically connected to the first hard disk.

[0015] As a preferred solution, a heat dissipation component for dissipating heat from the Intel C5000 series processor is also provided in the housing, and the heat dissipation component includes a heat dissipation fan bracket, two heat dissipation fans, and a heat dissipation cover for covering the Intel C5000 series processor and the two heat dissipation fans;

[0016] The two cooling fan brackets are both located behind the mainboard, and the cooling fan bracket is provided with two cooling fan mounting positions arranged side by side on the left and right. The rear side wall of the housing is provided with a cooling fan mounting opening corresponding to the two cooling fan mounting positions, and each cooling fan is mounted on the cooling fan bracket through the cooling fan mounting opening;

[0017] The heat dissipation cover has a heat dissipation cavity with a lower opening and a rear opening. The Intel C5000 series processor enters the heat dissipation cavity from the lower opening, and two heat dissipation fans enter the heat dissipation cavity through the rear opening to discharge the heat generated by the Intel C5000 series processor through the heat dissipation cavity and the heat dissipation fans in sequence.

[0018] As a preferred solution, the second hard disk is located behind the lower adapter card, and the heat dissipation cover is located between the power supply and the second hard disk.

[0019] As a preferred solution, it also includes a power supply bracket, which is provided with two power supply installation positions arranged in parallel up and down, the rear side wall of the shell is provided with a power supply installation port corresponding to each power supply installation position, and a plug-in cavity is provided corresponding to each power supply installation position. Two power supplies are provided, and each power supply is pluggably installed in the corresponding plug-in cavity from the power supply installation port in a drawer-like manner.

[0020] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that it can realize the expansion of multiple expansion cards and their network ports or replace them with dual hard disks with multiple network ports according to the use requirements, improve the use performance of the mainboard, and bring convenience to use; moreover, the first hard disk is arranged in the first upper expansion card position, which greatly saves the installation space;

[0021] Secondly, the heat dissipation component can centrally dissipate the heat of the Intel C5000 series processors on the motherboard, thereby improving the heat dissipation effect and extending its service life.

[0022] In order to more clearly illustrate the structural features, technical means and specific purposes and functions achieved by the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the first assembly structure of an embodiment of the utility model (mainly showing the first upper expansion card);

[0024] Figure 2 It is a schematic diagram of the second assembly structure of the embodiment of the utility model (mainly showing the first hard disk);

[0025] Figure 3 It is a schematic diagram of the exploded structure of an embodiment of the utility model;

[0026] Figure 4 It is a schematic diagram of the first partial structure of an embodiment of the utility model (mainly showing the first upper layer expansion card);

[0027] Figure 5It is a second partial structural diagram of an embodiment of the utility model (mainly showing the first hard disk);

[0028] Figure 6 It is a first control block diagram of an embodiment of the utility model (mainly showing the first upper layer expansion card);

[0029] Figure 7 This is a second control block diagram of an embodiment of the present utility model (mainly showing the first hard disk).

[0030] Description of the accompanying drawings:

[0031] 11. Shell 12. Mainboard

[0032] 121. Intel C5000 series processors

[0033] 13. Second hard disk 14. IO module

[0034] 15. Extension bracket

[0035] 21. First upper layer riser card 22. Second upper layer riser card

[0036] 221, first expansion slot 222, second expansion slot

[0037] 23. Lower riser card 231. Third expansion slot

[0038] 24. Power supply 25. Second upper expansion card

[0039] 26. Lower expansion card

[0040] 31. First upper expansion card 32. First hard disk

[0041] 40. Network port

[0042] 51. Cooling fan bracket 52. Cooling fan

[0043] 53. Heat sink. DETAILED DESCRIPTION

[0044] Please refer to Figures 1 to 7 As shown, it shows the specific structure of an embodiment of the utility model.

[0045] A low-density universal multifunctional interchangeable communication system includes a housing 11, a first upper expansion card 31, a first hard disk 32, a mainboard 12 installed in the housing 11, a second hard disk 13, an IO module 14, a first upper adapter card 21, a second upper adapter card 22, a lower adapter card 23, and a power supply 24 for power supply;

[0046] The second hard disk 13 , the IO module 14 , the first upper adapter card 21 , and the lower adapter card 23 are respectively connected to the mainboard 12 in a hot-swappable manner, and the second hard disk 13 is located behind the lower adapter card 23 .

[0047] It also includes a power supply bracket, which is provided with two power supply installation positions arranged in parallel up and down, the rear side wall of the shell 11 is provided with a power supply installation port corresponding to each power supply installation position, and a plug-in cavity is provided corresponding to each power supply installation position, and two power supplies 24 are provided, and each power supply 24 is pluggably installed in the corresponding plug-in cavity from the power supply installation port in a drawer-like manner.

[0048] The mainboard 12 is provided with an Intel C5000 series processor 121, and the Intel C5000 series processor 121 is electrically connected to the second hard disk 13, the IO module 14, the first upper adapter card 21, and the lower adapter card 23 respectively; preferably, the Intel C5000 series processor 121 adopts an Intel C5315 processor or an Intel C5325 processor.

[0049] An expansion bracket 15 is installed in the front area of ​​the housing 11, and the expansion bracket 15 is provided with 5 expansion card positions, and the 5 expansion card positions are divided into upper and lower layers, wherein the upper layer expansion card positions are provided with 3, and the lower layer expansion card positions 26 are provided with 2, and the 3 upper layer expansion card positions are respectively provided from left to right, namely, 1 first upper layer expansion card 31 position and 2 second upper layer expansion card positions, and the two lower layer expansion cards 26 positions are provided side by side from left to right;

[0050] The first upper riser card 21 is connected to the second upper riser card 22. The front end of the second upper riser card 22 is provided with two first expansion slots 221 and two second expansion slots 222 from left to right. The two second expansion slots 222 are respectively connected to a second upper expansion card 25. Each second upper expansion card 25 is installed in a second upper expansion card position. The first expansion slot 221 is used to connect to the first upper expansion card 31.

[0051] The lower layer adapter card 23 is provided with two third expansion slots 231 arranged side by side, each third expansion slot 231 is connected to a lower layer expansion card 26, and each lower layer expansion card 26 is installed in a lower layer expansion card 26 position;

[0052] The first upper expansion card 31, the second upper expansion card 25 and the lower expansion card 26 are each provided with eight network ports 40, and the network ports 40 include optical ports and electrical ports. Two first upper expansion cards 31 are provided and are arranged side by side. The two first upper expansion cards 31 and a first hard disk 32 are respectively and mutually exclusive installed in the first upper expansion card 31.

[0053] When two first upper expansion cards 31 are installed in the first upper expansion card 31 position, each first upper expansion card 31 is connected to a first expansion slot 221;

[0054] When the first hard disk 32 is installed in the first upper expansion card 31 , the first hard disk 32 is hot-pluggably connected to the motherboard 12 , and the Intel C5000 series processor 121 is electrically connected to the first hard disk 32 .

[0055] In this embodiment, a heat dissipation component for dissipating heat from the Intel C5000 series processor 121 is further disposed in the housing 11, and the heat dissipation component includes a heat dissipation fan bracket 51, two heat dissipation fans 52, and a heat dissipation cover 53 for covering the Intel C5000 series processor 121 and the two heat dissipation fans 52;

[0056] The two cooling fan brackets 51 are both located behind the mainboard 12. The cooling fan bracket 51 is provided with two cooling fan installation positions arranged side by side on the left and right. The rear side wall of the housing 11 is provided with a cooling fan installation opening corresponding to the two cooling fan installation positions. Each cooling fan 52 is installed on the cooling fan bracket 51 through the cooling fan installation opening.

[0057] The heat dissipation cover 53 is located between the power supply 24 and the second hard disk 13. The heat dissipation cover 53 has a heat dissipation cavity with a lower opening and a rear opening. The Intel C5000 series processor 121 enters the heat dissipation cavity from the lower opening, and two heat dissipation fans 52 enter the heat dissipation cavity through the rear opening to discharge the heat generated by the Intel C5000 series processor 121 through the heat dissipation cavity and the heat dissipation fans 52 in sequence.

[0058] In summary, the design focus of the utility model is that it can realize the expansion of multiple expansion cards and their network ports or replace them with dual hard disks with multiple network ports according to the use requirements, improve the use performance of the motherboard, and bring convenience to use; moreover, the first hard disk is arranged in the first upper expansion card position, which greatly saves the installation space;

[0059] Secondly, the heat dissipation component can centrally dissipate the heat of the Intel C5000 series processors on the motherboard, thereby improving the heat dissipation effect and extending its service life.

Claims

1. A low-density, general-purpose, multifunctional interchangeable communication system, characterized in that: It includes a housing, a first upper expansion card, a first hard disk, a mainboard installed in the housing, a second hard disk, an IO module, a first upper adapter card, a second upper adapter card, a lower adapter card, and a power supply for power supply; The second hard disk, the IO module, the first upper-layer adapter card, and the lower-layer adapter card are respectively hot-swappable connected to the mainboard, the mainboard is provided with an Intel C5000 series processor, and the Intel C5000 series processor is respectively electrically connected to the second hard disk, the IO module, the first upper-layer adapter card, and the lower-layer adapter card; An expansion bracket is installed in the front area of ​​the housing, and the expansion bracket is provided with 5 expansion slots, and the 5 expansion slots are divided into upper and lower layers, wherein the upper layer expansion slots are provided with 3, and the lower layer expansion slots are provided with 2, and the 3 upper layer expansion slots are respectively provided with 1 first upper layer expansion slot and 2 second upper layer expansion slots from left to right, and the two lower layer expansion slots are provided side by side from left to right; The first upper-layer riser card is connected to the second upper-layer riser card. The front end of the second upper-layer riser card is provided with two first expansion slots and two second expansion slots from left to right. The two second expansion slots are respectively connected to a second upper-layer expansion card. Each second upper-layer expansion card is installed in a second upper-layer expansion card position. The first expansion slot is used to connect the first upper-layer expansion card. The lower-layer adapter card is provided with two third expansion slots arranged side by side, each of which is connected to a lower-layer expansion card, and each lower-layer expansion card is installed in a lower-layer expansion card position; The first upper expansion card, the second upper expansion card and the lower expansion card are each provided with 8 network ports, the network ports include optical ports and electrical ports, two first upper expansion cards are provided and are arranged side by side on the left and right, and the two first upper expansion cards and a first hard disk are respectively and mutually exclusive installed in the first upper expansion card positions; When two first upper layer expansion cards are installed in the first upper layer expansion card position, each first upper layer expansion card is connected to a first expansion slot; When the first hard disk is installed in the first upper expansion card slot, the first hard disk is hot-pluggably connected to the mainboard, and the Intel C5000 series processor is electrically connected to the first hard disk.

2. The low-density, universal, multifunctional interchangeable communication system according to claim 1, characterized in that: The housing is also provided with a heat dissipation assembly for dissipating heat for the Intel C5000 series processor, the heat dissipation assembly comprising a heat dissipation fan bracket, two heat dissipation fans, and a heat dissipation cover for covering the Intel C5000 series processor and the two heat dissipation fans; The two cooling fan brackets are both located behind the mainboard, and the cooling fan bracket is provided with two cooling fan mounting positions arranged side by side on the left and right. The rear side wall of the housing is provided with a cooling fan mounting opening corresponding to the two cooling fan mounting positions, and each cooling fan is mounted on the cooling fan bracket through the cooling fan mounting opening; The heat dissipation cover has a heat dissipation cavity with a lower opening and a rear opening. The Intel C5000 series processor enters the heat dissipation cavity from the lower opening, and two heat dissipation fans enter the heat dissipation cavity through the rear opening to discharge the heat generated by the Intel C5000 series processor through the heat dissipation cavity and the heat dissipation fans in sequence.

3. The low-density universal multifunctional interchangeable communication system according to claim 2, characterized in that: The second hard disk is located behind the lower adapter card, and the heat dissipation cover is located between the power supply and the second hard disk.

4. The low-density, universal, multifunctional interchangeable communication system according to claim 1, characterized in that: It also includes a power supply bracket, which is provided with two power supply installation positions arranged in parallel up and down, the rear side wall of the shell is provided with a power supply installation port corresponding to each power supply installation position, and a plug-in cavity is provided corresponding to each power supply installation position. Two power supplies are provided, and each power supply is pluggably installed in the corresponding plug-in cavity from the power supply installation port in a drawer-like manner.

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