Circuit board with side wall patterns

Abstract

The utility model provides a circuit board with side wall patterns, which comprises a circuit board body, a first outer layer circuit pattern is arranged on the top surface of the circuit board body, a second outer layer circuit pattern is arranged on the bottom surface of the circuit board body, a groove is arranged on the outline edge of the circuit board body, and the side wall patterns are arranged in the groove. The groove inner wall of the groove is provided with an appearance edge circuit pattern, and the appearance edge circuit pattern is communicated with the first outer layer circuit pattern and the second outer layer circuit pattern.

Description

Technical Field

[0001] The utility model relates to the field of circuit board manufacturing, in particular to a circuit board with side wall graphics. Background Art

[0002] As the integration of the electronics industry becomes increasingly high, the size and space requirements of each component are becoming more and more stringent. As the carrier of the electronics integration industry, PCB (Printed Circuit Board) is also facing more and more dense and smaller requirements and challenges: more and more pins, more and more dense wiring, and more and more compact surface mounting positions. In addition to working on the surface of the printed circuit board, the industry has also begun to research and develop transmission functions on the side walls of the circuit board.

[0003] At present, the industry has developed the following functions and designs for sidewalls:

[0004] 1. Side metallization: metallizing or partially metallizing the side wall of the circuit board for shielding and isolation of high-frequency signals.

[0005] 2. Side metal half hole. It means leaving a metal half hole on the side of the circuit board. The special design of this half hole board can provide better circuit connection and signal transmission effect, and improve the performance and stability of the product. Secondly, the half hole board can also be used in the manufacture of electronic components such as power modules, communication modules, display modules, etc., to provide stable power supply and signal transmission for these components.

[0006] The above two designs can solve the simple layout problems of some circuit boards and can realize certain circuit connection functions, but they do not have independent transmission paths and their functions are limited. Utility Model Content

[0007] Based on this, it is necessary to provide a circuit board with sidewall patterns.

[0008] In order to solve the above technical problems, the utility model provides a circuit board with side wall patterns, including a circuit board body, a first outer layer circuit pattern is arranged on the top surface of the circuit board body, a second outer layer circuit pattern is arranged on the bottom surface of the circuit board body, a through hole is opened in the circuit board body, the through hole passes through the top surface and the bottom surface, a side wall pad is arranged on the hole wall of the through hole, the side wall pad is electrically connected to the first outer layer circuit pattern and the second outer layer circuit pattern, a groove is opened on the outer edge of the circuit board body, an outer edge circuit pattern is arranged on the inner wall of the groove, and the outer edge circuit pattern is connected with the first outer layer circuit pattern and the second outer layer circuit pattern.

[0009] Preferably, an inner layer circuit pattern is arranged inside the circuit board body, and the outer edge circuit pattern is connected to the inner layer circuit pattern.

[0010] Preferably, the outer edge line pattern includes a first outer edge line pattern, a second outer edge line pattern and a third outer edge line pattern, the first outer layer line pattern is connected to the first outer edge line pattern, the second outer layer line pattern is connected to the second outer edge line pattern, and the third outer edge line pattern is connected to the inner layer line pattern.

[0011] Preferably, the first outer shape edge line pattern, the second outer shape edge line pattern and the third outer shape edge line pattern are respectively distributed on the inner wall of the groove.

[0012] Preferably, there are several grooves, including a first groove, a second groove and a third groove, the first groove extends to the top surface and penetrates the top surface, and the corresponding first outer layer graphic extends on the top surface to the first groove and is connected to the first outer edge graphic; the second groove extends to the bottom surface and penetrates the bottom surface, and the corresponding second outer layer graphic extends on the bottom surface to the second groove and is connected to the second outer edge graphic; the third groove penetrates to the inner layer circuit graphic, and the third outer edge graphic is connected to the inner layer circuit graphic.

[0013] Preferably, the circuit board body includes a first substrate and a second substrate, the first substrate and the second substrate are superimposed and pressed together as a whole, the first outer layer circuit pattern is located on a side of the first substrate away from the second substrate, the second outer layer circuit pattern is located on a side of the second substrate away from the first substrate, and the inner layer circuit pattern is arranged between the first substrate and the second substrate.

[0014] Preferably, the outer edge circuit pattern, the first outer layer circuit pattern, the second outer layer circuit pattern and the inner layer circuit pattern are all copper layers, and the substrate is made of insulating material.

[0015] Preferably, the thickness of the circuit board body is ≧1 mm, the thickness of the circuit pattern formed by the copper layer is ≧25 μm, and the width of the notch cross section of the groove is ≧0.4 mm.

[0016] Preferably, the outer edge circuit pattern in the groove includes a circuit, a pad and an isolation ring, and the width of the pad and the isolation ring is 0.5 mm.

[0017] Preferably, the first outer layer circuit pattern and the second outer layer circuit pattern are covered with solder resist ink on a side away from the substrate, and the outer edge circuit pattern is covered with an anti-corrosion layer on a side away from the substrate.

[0018] The beneficial effects of the utility model are as follows: a printed circuit board with a patterned side wall is provided, on the outer side wall, the horizontal interlayer circuit is extended to the outer side wall perpendicular to the horizontal interlayer to obtain a vertical circuit, and the circuit, pad and isolation ring are increased, thereby realizing more connection types, providing more connection functions, and being more conducive to the thinness of electronic products.

[0019] The side wall of the present invention has a graphic design, including pads, wires and isolation rings, so as to realize more connection types, provide more connection functions, truly realize the three-dimensional patch of the circuit board, greatly improve the overall component density of the circuit board, and at the same time reduce the surface mounting height, which is more conducive to the thinness of electronic products, forming multiple different electrical networks, thereby meeting more welding types, and freeing up more surface mounting space. The side wall graphics can be connected to the inner layer graphics, and can also be connected to the outer layer graphics. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other purposes, features and advantages of the present invention will become more apparent through a more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals in all the accompanying drawings indicate the same parts, and the drawings are not intentionally scaled to the actual size, but the focus is on illustrating the subject matter of the present invention.

[0021] Figure 1 This is a three-dimensional schematic diagram of a circuit board body in a preferred embodiment of the utility model when the outer edge processing is not performed;

[0022] Figure 2 It is a three-dimensional schematic diagram of a circuit board body having an outer edge circuit pattern obtained after outer edge processing according to a preferred embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the composition structure when the circuit board body of the preferred embodiment of the utility model is a multi-layer printed circuit board;

[0024] In the figure: top surface 1; bottom surface 2; outer edge 3; first outer layer circuit pattern 10; second outer layer circuit pattern 20; outer edge circuit pattern 30; inner layer circuit pattern 40; groove 300; first outer edge circuit pattern 31; second outer edge circuit pattern 32; third outer edge circuit pattern 33; first substrate 11; second substrate 12; through hole 13. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0026] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to another element and integrated therewith, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] refer to Figure 1-Figure 3 The utility model provides a circuit board with side wall patterns, including a circuit board body, a top surface 1 of the circuit board body is provided with a first outer layer circuit pattern 10, a bottom surface 2 of the circuit board body is provided with a second outer layer circuit pattern 20, the circuit board body is provided with a through hole 13, the through hole 13 passes through the top surface 1 and the bottom surface 2, a side wall pad is provided on the hole wall of the through hole 13, the side wall pad is electrically connected to the first outer layer circuit pattern 10 and the second outer layer circuit pattern 20, a groove is provided on the outer edge 3 of the circuit board body, an outer edge circuit pattern 30 is provided on the inner wall of the groove, and the outer edge circuit pattern 30 is connected to the first outer layer circuit pattern 10 and the second outer layer circuit pattern 20.

[0029] The circuit board body includes an insulating substrate and a circuit layer. The outer surface of the circuit board body is composed of a top surface 1, a bottom surface 2 and an outer edge 3. The outer edge 3 is located between the top surface 1 and the bottom surface 2. The circuit board body can be a double-sided printed circuit board or a multi-layer printed circuit board:

[0030] When the circuit board body is a double-sided printed circuit board, the circuit board body includes a substrate, the top surface 1 and the bottom surface 2 of the substrate are covered with a first copper layer, the outer edge 3 of the circuit board body is provided with a groove 300, the outer edge surface of the board body and the inner wall of the groove are covered with a second copper layer, the copper layer is covered with a protective layer, the first copper layer is processed to form a first outer layer circuit pattern 10 and a second outer layer circuit pattern 20, and the second copper layer is processed to form an outer edge circuit pattern 30. Optionally, the protective layer covered with the copper layer is a tin-plated layer.

[0031] refer to Figure 2 and Figure 3When the circuit board body is a multi-layer printed circuit board, an inner layer circuit pattern 40 is also printed inside the circuit board body, and the outer edge circuit pattern 30 is connected to the inner layer circuit pattern 40. The circuit board body includes a first substrate 11 and a second substrate 12, the first substrate 11 and the second substrate 12 are superimposed and pressed together as a whole, the first outer layer circuit pattern 10 is located on a side of the first substrate 11 away from the second substrate 12, the second outer layer circuit pattern 20 is located on a side of the second substrate 12 away from the first substrate 11, and the inner layer circuit pattern 40 is arranged between the first substrate 11 and the second substrate 12.

[0032] The outer edge circuit pattern 30 may be connected to the inner layer circuit pattern 40 , or may be connected to the first outer layer circuit pattern 10 or the second outer layer circuit pattern 20 .

[0033] refer to Figure 2 In a preferred embodiment, the outer edge graphic 30 includes a first outer edge line graphic 31, a second outer edge line graphic 32 and a third outer edge line graphic 33, the first outer layer line graphic 10 is connected to the first outer edge line graphic 31, the second outer layer line graphic 20 is connected to the second outer edge line graphic 32, and the third outer edge line graphic 33 is connected to the inner layer line graphic 40.

[0034] refer to Figure 2 In a preferred embodiment, there are a plurality of grooves 300, and the plurality of grooves 300 are arranged at intervals on the outer edge 3 or are interconnected, and the first outer edge line pattern 31, the second outer edge line pattern 32 and the third outer edge line pattern 33 are respectively distributed on the inner wall of the groove 300.

[0035] In a preferred embodiment, the plurality of grooves 300 include a first groove 301, a second groove 302 and a third groove 303, the first outer edge line pattern 31 is arranged on the inner wall of the groove of the first groove, the second outer edge line pattern 32 is arranged on the inner wall of the groove of the second groove, and the third outer edge line pattern 33 is arranged on the inner wall of the groove of the third groove; the first groove extends to the top surface 1 and penetrates the top surface 1, and the corresponding first outer layer line pattern 10 extends on the top surface 1 to the first groove and is connected to the first outer edge line pattern 31, so that the first outer layer line pattern 10 ... The end of an outer layer circuit pattern 10 and the end of the first outer edge circuit pattern 31 are in contact at the junction of the top surface 1 and the outer edge 3 of the circuit board body, so that the first outer layer circuit pattern is connected with the first outer edge circuit pattern; the second groove extends to the bottom surface 2 and penetrates the bottom surface 2, and the corresponding second outer layer circuit pattern 20 extends on the bottom surface 2 to the second groove and connects with the second outer edge circuit pattern 32; the bottom of the third groove penetrates to the inner layer circuit pattern 40, and the third outer edge circuit pattern 33 is connected with the inner layer circuit pattern 40. The depth direction of the groove is perpendicular to the plane where the outer edge 3 is located, and the extension direction of the groove is parallel to the plane where the outer edge 3 is located.

[0036] Optionally, the PCB board with sidewall circuit patterns provided by the present application includes a first substrate, a second substrate and a third substrate, the second substrate is superimposed and connected to the top surface of the first substrate, and the third substrate is superimposed and connected to the top surface of the second substrate. Optionally, a fourth substrate and a fifth substrate can be sequentially superimposed on the top surface of the third substrate, and the specific number of layers of the circuit board does not constitute a limitation on the specific protection scope of the present application.

[0037] refer to Figure 3 In a preferred embodiment, the outer edge circuit pattern 30, the first outer layer circuit pattern 10, the second outer layer circuit pattern 20 and the inner layer circuit pattern 40 are all copper layers, and the substrate is made of insulating material.

[0038] refer to Figure 1 and Figure 2 In a preferred embodiment, the thickness of the circuit board body is ≧1 mm, the thickness of the circuit pattern formed by the copper layer is ≧25 μm, and the width of the notch cross section of the groove is ≧0.4 mm. Optionally, the thickness of the circuit board body is in the range of (1-1.8) mm, and the width of the notch cross section of the groove is in the range of (0.4-1) mm.

[0039] In a preferred embodiment, the outer edge circuit pattern 30 in the groove includes a circuit, a pad and an isolation ring, and the width of the pad and the isolation ring is 0.5 mm. The outer edge circuit pattern 30 includes a pad, a line and an isolation ring, thereby forming a plurality of different electrical networks, thereby satisfying more welding types and freeing up more mounting space on the outer surface of the circuit board body.

[0040] In a preferred embodiment, the first outer layer circuit pattern 10 and the second outer layer circuit pattern 20 are covered with solder resist ink on one side away from the substrate, and the outer edge circuit pattern 30 is covered with an anti-corrosion layer on one side away from the substrate.

[0041] The circuit board with sidewall patterns of the present application is manufactured by the following method steps:

[0042] Step 1: The circuit board body is a double-sided printed circuit board or a multi-layer printed circuit board, and the overall thickness of the circuit board body for shape edge processing must be above 1mm.

[0043] Step 2: Make a groove or a specific side edge at the position where the side wall circuit needs to be made on the outer edge of the circuit board body by drilling or milling. The minimum cross-sectional diameter of the processed groove is 0.4mm.

[0044] Step 3: The top and bottom surfaces of the substrate are respectively covered with copper layers to obtain a copper-clad laminate, and a photosensitive dry film is attached to the copper-clad laminate; the film pattern is transferred to the photosensitive dry film by exposure; then, the unexposed dry film is dissolved and washed away by the weak alkalinity of the developer, and the copper surface is exposed after the dry film in the unexposed area is removed by the developer; the exposed dry film pattern that protects the copper material circuit pattern is transferred and retained on the top and bottom surfaces of the copper-clad laminate, and then, the metallization of the groove side wall is completed in combination with the copper-tin plating process, that is, the second copper layer and the tin-clad protective layer are plated in sequence on the exposed copper surface position, the outer edge surface and the inner wall of the groove; for reliability considerations, the thickness of the copper clad layer is ≥25μm;

[0045] Step 4: After copper-tin plating, use SES alkaline etching line to strip the exposed dry film, expose the first copper layer, etch and remove the exposed first copper layer, remove the tin foil layer covering the second copper layer, expose the second copper layer on the horizontal surface and side wall surface, remove the unwanted copper and anti-corrosion layer on the surface, complete the production of the circuit board surface circuit, and metallize the side wall;

[0046] Step 5: After etching is completed according to the design requirements, a layer of solder mask ink is superimposed on the second copper layer surface on the top and bottom surfaces, and no ink is printed on the side walls. Nickel and gold are deposited simultaneously on the outer edge surface and the inner wall of the groove to perform surface treatment to protect the copper surface and conduct electrical measurement to obtain product performance status;

[0047] Step 6: Cut out the shape of a single product to expose the edge of the shape. According to the side wall pattern design, laser cut the nickel-gold covering the second copper layer of the side wall to remove part of the nickel-gold and expose the second copper layer under the nickel-gold. Then, perform alkaline etching to remove the exposed second copper layer.

[0048] Step 7: After functional testing of the shape edge pattern position according to the design requirements, a printed circuit board with patterns on the side walls is obtained.

[0049] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0050] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0051] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A circuit board having a sidewall pattern, characterized in that: The invention comprises a circuit board body, wherein a first outer layer circuit pattern is arranged on the top surface of the circuit board body, a second outer layer circuit pattern is arranged on the bottom surface of the circuit board body, a through hole is provided on the circuit board body, the through hole passes through the top surface and the bottom surface, a side wall pad is provided on the hole wall of the through hole, the side wall pad is electrically connected to the first outer layer circuit pattern and the second outer layer circuit pattern, a groove is provided on the outer edge of the circuit board body, an outer edge circuit pattern is provided on the inner wall of the groove, and the outer edge circuit pattern is connected to the first outer layer circuit pattern and the second outer layer circuit pattern.

2. The circuit board according to claim 1, characterized in that: An inner layer circuit pattern is arranged inside the circuit board body, and the outer edge circuit pattern is connected with the inner layer circuit pattern.

3. The circuit board according to claim 2, characterized in that: The outer shape edge line graph includes a first outer shape edge line graph, a second outer shape edge line graph and a third outer shape edge line graph, the first outer layer line graph is connected to the first outer shape edge line graph, the second outer layer line graph is connected to the second outer shape edge line graph, and the third outer shape edge line graph is connected to the inner layer line graph.

4. The circuit board according to claim 3, characterized in that: The first outer shape edge line pattern, the second outer shape edge line pattern and the third outer shape edge line pattern are respectively distributed on the inner wall of the groove.

5. The circuit board according to claim 4, characterized in that: There are several grooves, including a first groove, a second groove and a third groove. The first groove extends to the top surface and penetrates the top surface, and the corresponding first outer layer circuit pattern extends on the top surface to the first groove and is connected to the first outer edge circuit pattern; the second groove extends to the bottom surface and penetrates the bottom surface, and the corresponding second outer layer circuit pattern extends on the bottom surface to the second groove and is connected to the second outer edge circuit pattern; the third groove penetrates to the inner layer circuit pattern, and the third outer edge circuit pattern is connected to the inner layer circuit pattern.

6. The circuit board according to claim 5, characterized in that: The circuit board body includes a first substrate and a second substrate, the first substrate and the second substrate are superimposed and pressed together as a whole, the first outer layer circuit pattern is located on a side of the first substrate away from the second substrate, the second outer layer circuit pattern is located on a side of the second substrate away from the first substrate, and the inner layer circuit pattern is arranged between the first substrate and the second substrate.

7. The circuit board according to claim 2, characterized in that: The circuit board body comprises a substrate, the outer edge circuit pattern, the first outer layer circuit pattern, the second outer layer circuit pattern and the inner layer circuit pattern are all copper layers, and the substrate is made of insulating material.

8. The circuit board according to claim 7, characterized in that: The thickness of the circuit board body is ≧1 mm, the thickness of the circuit pattern formed by the copper layer is ≧25 μm, and the width of the notch cross section of the groove is ≧0.4 mm.

9. The circuit board according to claim 7, characterized in that: The outer edge circuit pattern in the groove includes a circuit, a pad and an isolation ring, and the width of the pad and the isolation ring is 0.5 mm.

10. The circuit board according to claim 1, characterized in that: The circuit board body comprises a substrate, the first outer layer circuit pattern and the second outer layer circuit pattern are covered with solder resist ink on one side away from the substrate, and the outer edge circuit pattern is covered with an anti-corrosion layer on one side away from the substrate.

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