Gold thread binding structure for solving glare of camera module
By designing a gold-line binding structure that lowers the arc of the gold-line, the problem of glare generated by existing camera modules under strong light is solved, ensuring the normal operation of the module.
Patent Information
- Application Number
- CN202420020143.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-02
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-01-02
AI Technical Summary
Due to the high arc of the existing camera module, the gold-line binding structure is prone to glare and ghosting under strong light, affecting the normal use of the module.
A gold-line binding structure is designed. By setting the gold-line binding structure body, the arc of the gold-line body is reduced, and the possibility of light irradiation to form glare is reduced.
It effectively avoids glare ghosts caused by light exposure and ensures the normal use of the camera module.
Smart Images
Figure CN222485204U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display modules, in particular to a gold wire binding structure for solving the glare problem of camera modules. Background Art
[0002] With the rapid development of smart device technology in recent years, people are paying more and more attention to the weight and size of smart devices, and usually expect them to be light or small in size to achieve the purpose of portability. As an image input device, cameras are widely used in camera shooting, mobile phone video, security monitoring, AR / VR and other fields, so the miniaturization of camera products also faces new challenges. Camera modules are increasingly used in car automatic driving recognition, drone flight obstacle avoidance and photography.
[0003] In the structural design of existing camera modules, gold wire binding technology is usually used to achieve conductivity between the chip and the circuit board. However, the gold wire binding technology in the prior art is usually a fixed mode. Due to the high curvature of the gold wire, this mode will cause glare and ghosting due to the camera module structure or strong light exposure, thus affecting the normal use of the camera module. Utility Model Content
[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a gold wire binding structure for solving the glare of a camera module.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A gold wire binding structure for solving camera module glare, comprising: a camera module body, the camera module body comprising a circuit board and a chip arranged on the circuit board, a gold wire binding structure body for binding is arranged between the chip and the circuit board, the gold wire binding structure body comprises a first lead structure, a gold wire body and a second lead structure, and two ends of the gold wire body are respectively connected to the first lead structure and the second lead structure.
[0007] In one embodiment, the first lead structure includes a first frame, and one end of the gold wire body is connected to the chip through the first frame.
[0008] In one embodiment, the second lead structure includes a second frame, the second frame is located on the surface of the circuit board, and one end of the gold wire away from the first frame is connected to the second frame.
[0009] In one embodiment, the gold wire body includes a first arc segment and a second arc segment, the first arc segment and the second arc segment are both arranged in an arc shape, one end of the first arc segment is connected to the first frame, the other end of the first arc segment is connected to the second arc segment, and the end of the second arc segment away from the first arc segment is connected to the second frame.
[0010] In one embodiment, the point where the first arc segment and the second arc segment are connected is the highest point, and the distance from the highest point to the surface of the circuit board is 12.06 um.
[0011] In one embodiment, a lens is disposed above the chip, and the lens includes a shell and a lens disposed on the shell. The shell is mounted on the surface of the circuit board, the chip is accommodated in the shell, and the lens is located directly above the chip.
[0012] In one embodiment, a filter is attached to the upper surface of the chip, and the filter is located between the lens and the chip.
[0013] In one embodiment, a plurality of components are also arranged on the circuit board, and the plurality of components are all accommodated in the housing.
[0014] In one embodiment, the gold wire body includes a straight segment, a connecting segment and an inclined segment, the two ends of the straight segment are respectively connected to the first frame and the connecting segment, the two ends of the connecting segment are respectively connected to the straight segment and the inclined segment, and the two ends of the inclined segment are respectively connected to the connecting segment and the second frame.
[0015] In one embodiment, the connecting section is located at the highest point of the gold wire body, and the height from the connecting section to the surface of the circuit board is 12.15 um.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The utility model discloses a gold wire binding structure for solving the glare of a camera module. The gold wire binding structure body is provided, and the curvature of the gold wire body is lowered to avoid glare ghosting caused by light exposure, thereby ensuring the normal use of the camera module body. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 A schematic diagram of the structure of a camera module body in a gold wire binding structure for solving the glare of a camera module provided by the utility model;
[0020] Figure 2 A schematic diagram of the structure of the gold wire body in Example 1 of a gold wire binding structure for solving the glare of a camera module provided by the utility model;
[0021] Figure 3 This is a schematic structural diagram of the gold wire body of Example 2 in a gold wire binding structure for solving camera module glare provided by the utility model.
[0022] Description of the drawings: 10. Camera module body; 11. Circuit board; 12. Chip; 13. Lens; 131. Shell; 132. Lens; 14. Filter; 15. Components; 20. Gold wire binding structure body; 30. Gold wire body; 31. First arc segment; 32. Second arc segment; 33. Highest point; 40. First frame; 50. Second frame; 60. Straight line segment; 70. Connecting segment; 80. Inclined segment. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0024] Embodiment 1:
[0025] A gold wire binding structure for solving the glare of camera module, referring to Figure 1 , including a camera module body 10, the camera module body 10 includes a circuit board 11 and a chip 12 arranged on the circuit board 11, and the chip 12 is mounted on the head of the circuit board 11. A lens 13 is arranged above the chip 12, the lens 13 is connected to the circuit board 11, and the lens 13 is mounted on the chip 12.
[0026] Reference Figure 1 The lens 13 includes a shell 131 and a lens 132 arranged on the shell 131. The shell 131 is mounted on the upper surface of the circuit board 11. The lens 132 is installed in the middle position of the shell 131. The shell 131 supports the lens 132 so that the lens 132 is located directly above the chip 12. The chip 12 is accommodated in the shell 131.
[0027] Reference Figure 1 The upper surface of the chip 12 is provided with a filter 14, and the filter 14 is adhered to the upper surface of the chip 12 by optical glue. The filter 14 is located between the lens 132 and the chip 12.
[0028] Reference Figure 1 , a plurality of components 15 are also arranged on the circuit board 11, and the plurality of components 15 are all located at the head of the circuit board 11, and the plurality of components 15 are all accommodated in the housing 131. The components 15 are mounted on the upper surface of the circuit board 11 by the SMT process.
[0029] Reference Figure 2 A gold wire binding structure body 20 for binding is provided between the chip 12 and the circuit board 11. The gold wire binding between the chip 12 and the circuit board 11 is divided into two types: positive punching and reverse punching. The positive punching is to punch the sensor pad first and then the circuit board 11 binding pad. The reverse punching is to punch the circuit board 11 binding pad first and then the sensor pad, so as to complete the fixing of the chip 12 on the circuit board 11.
[0030] The gold wire binding structure body 20 includes a first lead structure, a gold wire body 30 and a second lead structure. Two ends of the gold wire body 30 are connected to the first lead structure and the second lead structure respectively.
[0031] Reference Figure 2 The first lead structure includes a first frame 40 , the chip 12 is disposed on the upper surface of the first frame 40 , and one end of the gold wire body 30 is connected to the chip 12 through the first frame 40 .
[0032] Reference Figure 2 The second lead structure includes a second frame 50 , which is located on the surface of the circuit board 11 , and one end of the gold wire body 30 away from the first frame 40 is connected to the circuit board 11 through the second frame 50 .
[0033] Reference Figure 2 The gold wire body 30 includes a first arc segment 31 and a second arc segment 32 connected to the first arc segment 31. The first arc segment 31 and the second arc segment 32 are both arranged in an arc shape. One end of the first arc segment 31 is connected to the first frame 40, and the other end of the first arc segment 31 is connected to the second arc segment 32. The end of the second arc segment 32 away from the first arc segment 31 is connected to the second frame 50.
[0034] Reference Figure 2 The point where the first arc segment 31 and the second arc segment 32 are connected is the highest point 33 of the gold wire body 30, and the height from the highest point 33 to the surface of the circuit board 11 is 12.06 um. By determining the highest point 33 of the first arc segment 31 and the second arc segment 32, the curvature of the gold wire body 30 is adjusted, and the curvature of the gold wire body 30 is lowered to avoid glare ghosting caused by light exposure.
[0035] Furthermore, the arc height of the gold wire body 30 is less than or equal to 80 um.
[0036] Embodiment 2:
[0037] The difference between this embodiment and the first embodiment is that the structure of the gold wire body 30 is different.
[0038] Reference Figure 3The gold wire body 30 includes a straight segment 60, a connecting segment 70 and an inclined segment 80, and the straight segment 60 and the inclined segment 80 are connected by the connecting segment 70. The straight segment 60 is vertically arranged, one end of the straight segment 60 is connected to the first frame 40, and the other end of the straight segment 60 is connected to the connecting segment 70. The connecting segment 70 is horizontally arranged, and the two ends of the connecting segment 70 are respectively connected to the straight segment 60 and the inclined segment 80. One end of the inclined segment 80 away from the connecting segment 70 is connected to the second frame 50.
[0039] Reference Figure 3 The included angle between the straight section 60 and the connecting section 70 is 90 degrees, and the included angle between the connecting section 70 and the inclined section 80 is 120-150 degrees.
[0040] Further, refer to Figure 3 The connecting section 70 is located at the highest point of the gold wire body 30, and the height from the connecting section 70 to the surface of the circuit board 11 is 12.15um. The connecting section 70 extends horizontally and is connected to the straight section 60 and the inclined section 80, which improves the bending resistance of the connecting section 70, making it difficult for the connecting section 70 to collapse and contact the chip 12 to cause a short circuit. The gold wire body 30 also lowers the curvature, so that the curvature of the body of the chip 12 bound to the circuit board 11 is lower, thereby avoiding glare ghosting caused by light exposure, which affects the normal use of the camera module body 10.
[0041] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A gold wire binding structure for solving the glare of a camera module, characterized in that: include: A camera module body (10), the camera module body (10) comprising a circuit board (11) and a chip (12) arranged on the circuit board (11), a gold wire binding structure body (20) for binding is arranged between the chip (12) and the circuit board (11), the gold wire binding structure body (20) comprising a first lead structure, a gold wire body (30) and a second lead structure, and two ends of the gold wire body (30) are respectively connected to the first lead structure and the second lead structure.
2. A gold wire binding structure for solving camera module glare according to claim 1, characterized in that: The first lead structure comprises a first frame (40), and one end of the gold wire body (30) is connected to the chip (12) through the first frame (40).
3. The gold wire binding structure for solving the glare of the camera module according to claim 2, characterized in that: The second lead structure comprises a second frame (50), the second frame (50) is located on the surface of the circuit board (11), and one end of the gold wire away from the first frame (40) is connected to the second frame (50).
4. The gold wire binding structure for solving the glare of the camera module according to claim 3, characterized in that: The gold wire body (30) comprises a first arc segment (31) and a second arc segment (32); the first arc segment (31) and the second arc segment (32) are both arranged in an arc shape; one end of the first arc segment (31) is connected to the first frame (40); the other end of the first arc segment (31) is connected to the second arc segment (32); and one end of the second arc segment (32) away from the first arc segment (31) is connected to the second frame (50).
5. The gold wire binding structure for solving the glare of the camera module according to claim 4, characterized in that: The point where the first arc segment (31) and the second arc segment (32) are connected is the highest point (33), and the distance from the highest point (33) to the surface of the circuit board (11) is 12.06 um.
6. The gold wire binding structure for solving the glare of the camera module according to claim 1, characterized in that: A lens (13) is arranged above the chip (12), and the lens (13) comprises a shell (131) and a lens (132) arranged on the shell (131); the shell (131) is mounted on the surface of the circuit board (11), the chip (12) is accommodated in the shell (131), and the lens (132) is located directly above the chip (12).
7. The gold wire binding structure for solving the glare problem of the camera module according to claim 6, characterized in that: A filter (14) is attached to the upper surface of the chip (12), and the filter (14) is located between the lens (132) and the chip (12).
8. The gold wire binding structure for solving the glare problem of the camera module according to claim 6, characterized in that: A plurality of components (15) are also arranged on the circuit board (11), and the plurality of components (15) are all accommodated in the housing (131).
9. The gold wire binding structure for solving the glare problem of the camera module according to claim 3, characterized in that: The gold wire body (30) comprises a straight segment (60), a connecting segment (70) and an inclined segment (80); two ends of the straight segment (60) are respectively connected to the first frame (40) and the connecting segment (70); two ends of the connecting segment (70) are respectively connected to the straight segment (60) and the inclined segment (80); and two ends of the inclined segment (80) are respectively connected to the connecting segment (70) and the second frame (50).
10. The gold wire binding structure for solving the glare of the camera module according to claim 9, characterized in that: The connecting section (70) is located at the highest point of the gold wire body (30), and the height from the connecting section (70) to the surface of the circuit board (11) is 12.15 um.