LED support and package
By designing the electrode plate bent forming step-shaped welding table of the LED bracket, the problem of insufficient position of the second solder joints during welding of large-size chips is solved, and the spatial flexibility and reliability of welding are achieved.
Patent Information
- Application Number
- CN202323646826.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2033-12-29
AI Technical Summary
When welding large-size chips, the second solder joint is not in place enough to prevent wire soldering.
Design an LED bracket with its electrode plate bent to form a step-shaped welding table, enlarge the position of the second welding joint to avoid space limitations, and block the infiltration of flux or harmful substances through the step form.
The space flexibility of welding on large-sized chips is achieved, avoiding dummy welding, and improving the reliability of welding.
Smart Images
Figure CN222485220U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LEDs, in particular to an LED bracket and a package. Background Art
[0002] LED chips are usually packaged in LED brackets. The space of LED brackets is small. When working with large chips, there is a problem that the second soldering point position is not enough and the wire cannot be soldered. Summary of the invention
[0003] The technical problem to be solved by the utility model is to provide an LED bracket and a package to solve the problem that the positions of the two solder joints of a large-size chip are insufficient.
[0004] In order to solve the above technical problems, one of the technical solutions of the utility model is: an LED bracket, including a plastic frame, a first electrode plate and a second electrode plate are provided at the bottom of the plastic frame, and an insulating strip is provided between the first electrode plate and the second electrode plate; a first solid crystal area is formed on the first electrode plate, and a second solid crystal area is formed on the second electrode plate, and a first welding station formed by bending the first electrode plate is provided in the first solid crystal area, and a second welding station formed by bending the second electrode plate is provided in the second solid crystal area. Principle of the utility model: the two welding positions are designed to be stepped, and there is no spatial limitation on the two welding points, the size of the chip can be enlarged, and the solid crystal is not limited by the spatial area; because the two welding points and the solid crystal position are not on the same horizontal plane, the two welding points are prevented from sticking to the solid crystal glue to cause a cold solder joint; the step shape effectively blocks the flux or harmful substances from penetrating along the joint gap between the plastic and the metal electrode plate, thereby improving reliability.
[0005] As an improvement, the first electrode plate, the second electrode plate and the plastic frame are integrally formed.
[0006] In order to solve the above technical problems, the second technical solution of the utility model is: an LED package, including a bracket and an LED chip arranged in the bracket, the bracket includes a plastic frame, the bottom of the plastic frame is provided with a first electrode plate and a second electrode plate, and an insulating strip is provided between the first electrode plate and the second electrode plate; a first solid crystal area is formed on the first electrode plate, a second solid crystal area is formed on the second electrode plate, a first welding platform formed by bending the first electrode plate is provided in the first solid crystal area, and a second welding platform formed by bending the second electrode plate is provided in the second solid crystal area; a first LED chip is provided on the first electrode plate, and two welding points of the first LED chip are provided on the first welding platform; a second LED chip is provided on the second electrode plate, and two welding points of the second LED chip are provided on the second welding platform. Principle of the utility model: the two welding positions are designed into a step shape, the two welding points do not have spatial limitations, the size of the chip can be enlarged, and the solid crystal is not limited by the spatial area; because the two welding point positions and the solid crystal position are not on the same horizontal plane, the two welding points are prevented from sticking to the solid crystal glue and causing a cold solder joint; the step shape effectively blocks the flux or harmful substances from penetrating along the joint gap between the plastic and the metal electrode plate, thereby improving reliability.
[0007] As an improvement, the first electrode plate, the second electrode plate and the plastic frame are integrally formed.
[0008] As an improvement, the first welding platform is higher than the first LED chip, and the second welding platform is higher than the second LED chip.
[0009] As an improvement, the width of the first welding platform is greater than the two welding points of the first LED chip, and the width of the second welding platform is greater than the two welding points of the second LED chip.
[0010] Compared with the prior art, the utility model has the following beneficial effects:
[0011] The second welding position is designed to be a step shape. There is no spatial limitation for the second welding point, the size of the chip can be enlarged, and the die bonding is not limited by the spatial area. Since the second welding point position and the die bonding position are not on the same horizontal plane, the second welding point is prevented from sticking to the die bonding glue and causing cold soldering. The step shape effectively blocks the flux or harmful substances from penetrating along the joint gap between the plastic and the metal electrode plate, thereby improving reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a cross-sectional view of the LED package. Implementation
[0013] The utility model will be further described below in conjunction with the accompanying drawings.
[0014] like Figure 1As shown, an LED package includes a bracket and an LED chip arranged in the bracket. The bracket includes a plastic frame 6, a first electrode plate 1 and a second electrode plate 2 are arranged at the bottom of the plastic frame 6, and an insulating tape 5 is arranged between the first electrode plate 1 and the second electrode plate 2; the first electrode plate 1, the second electrode plate 2 and the plastic frame 6 are integrally formed. A first solid crystal region is formed on the first electrode plate 1, and a second solid crystal region is formed on the second electrode plate 2. A first welding platform 3 formed by bending the first electrode plate 1 is provided in the first solid crystal region, and a second welding platform 4 formed by bending the second electrode plate 2 is provided in the second solid crystal region; a first LED chip 9 is provided on the first electrode plate 1, and two welding points 7 of the first LED chip 9 are provided on the first welding platform 3; a second LED chip 10 is provided on the second electrode plate 2, and two welding points 8 of the second LED chip 10 are provided on the second welding platform 4; the first welding platform 3 is higher than the first LED chip 9, and the second welding platform 4 is higher than the second LED chip 10, and can be set to be greater than 250um to prevent the solid crystal glue from creeping; the width of the first welding platform 3 is greater than the two welding points of the first LED chip 9, and the width of the second welding platform 4 is greater than the two welding points of the second LED chip 10, and can be set to be greater than 50um.
[0015] The principle of the utility model is as follows: the two welding positions are designed to be stepped, the two welding points are not limited by space, the size of the chip can be enlarged, and the solid crystal is not limited by the spatial area; because the two welding points and the solid crystal position are not on the same horizontal plane, the two welding points are prevented from being adhered to the solid crystal glue and causing cold welding; the step shape effectively blocks the flux or harmful substances from penetrating along the joint gap between the plastic and the metal electrode plate, thereby improving reliability.
Claims
1. An LED bracket, comprising a plastic frame, wherein a first electrode plate and a second electrode plate are provided at the bottom of the plastic frame, and an insulating tape is provided between the first electrode plate and the second electrode plate; characterized in that: A first crystal-bonding region is formed on the first electrode plate, and a second crystal-bonding region is formed on the second electrode plate. A first welding platform formed by bending the first electrode plate is provided in the first crystal-bonding region, and a second welding platform formed by bending the second electrode plate is provided in the second crystal-bonding region.
2. The LED bracket according to claim 1, characterized in that: The first electrode plate, the second electrode plate and the plastic frame are integrally formed.
3. An LED package, comprising a bracket and an LED chip arranged in the bracket, wherein the bracket comprises a plastic frame, a first electrode plate and a second electrode plate are arranged at the bottom of the plastic frame, and an insulating tape is arranged between the first electrode plate and the second electrode plate; characterized in that: A first crystal bonding area is formed on the first electrode plate, and a second crystal bonding area is formed on the second electrode plate. A first welding platform formed by bending the first electrode plate is provided in the first crystal bonding area, and a second welding platform formed by bending the second electrode plate is provided in the second crystal bonding area. A first LED chip is provided on the first electrode plate, and two welding points of the first LED chip are provided on the first welding platform. A second LED chip is provided on the second electrode plate, and two welding points of the second LED chip are provided on the second welding platform.
4. The LED package according to claim 3, characterized in that: The first electrode plate, the second electrode plate and the plastic frame are integrally formed.
5. The LED package according to claim 3, characterized in that: The first welding platform is higher than the first LED chip, and the second welding platform is higher than the second LED chip.
6. The LED package according to claim 3, characterized in that: The width of the first welding platform is greater than the two welding points of the first LED chip, and the width of the second welding platform is greater than the two welding points of the second LED chip.