Chip cutting device

Abstract

The chip cutting device comprises a base, sliding grooves are formed in the two sides of the upper side wall of the base correspondingly, a U-shaped support is arranged between the two sliding grooves in a sliding mode, an electric telescopic rod is installed at the center of the outer wall of the upper side of the U-shaped support, and the telescopic end of the electric telescopic rod penetrates through the upper side wall of the U-shaped support and is fixedly connected with a lifting frame; a slitting assembly is arranged on the lifting frame, and a clamping assembly is further arranged on the upper side wall of the base. Compared with the prior art, the silicon wafer slitting device has the advantages that a plurality of silicon wafers can be slit at the same time through the arranged slitting assembly, the slitting distance can be adjusted according to needs, the working efficiency is greatly improved, the silicon wafer slitting device is more practical, the silicon wafers of various sizes can be fixed through the arranged clamping assembly, the applicability is high, and the silicon wafer slitting device is more practical. And through the arranged buffer springs and buffer cotton, the cut silicon wafers cannot be in rigid contact with the bearing plate when falling into the collecting box, and the silicon wafers are prevented from being broken.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip cutting device. Background Art

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is often part of a computer or other electronic device. The preparation of biochips mainly relies on micromachining, automation, and chemical synthesis technology.

[0003] After searching, a Chinese patent with announcement number CN218241787U was found, which discloses an automatically controlled vehicle-mounted chip processing device, including a base, on which a sliding seat is slidably connected, and the sliding seat slides back and forth on the base along a first direction; a slitting mechanism is arranged above the base, and the slitting mechanism moves back and forth along a second direction, and the slitting mechanism can slitting the silicon wafer placed on the sliding seat; the first direction is arranged perpendicular to the second direction.

[0004] The above-mentioned prior art solutions have the following disadvantages: during cutting, only one silicon wafer can be cut out each time, which results in low working efficiency, and the two slide slots can only load silicon wafers of fixed sizes, which results in low applicability. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the utility model provides a chip cutting device to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above-mentioned purpose of the utility model, the technical solution adopted by the utility model is a chip cutting device, including a base, wherein sliding grooves are respectively opened on both sides of the upper side wall of the base, a U-shaped bracket is slidably arranged between the two sliding grooves, an electric telescopic rod is installed at the center of the upper outer wall of the U-shaped bracket, the telescopic end of the electric telescopic rod passes through the upper side wall of the U-shaped bracket and is fixedly connected to a lifting frame, a cutting assembly is provided on the lifting frame, and a clamping assembly is also provided on the upper side wall of the base.

[0007] As an improvement: the slitting assembly includes a groove, a lifting block, an adjustment plate, a first screw, a knob, a connecting rod, a pressure block, a fixed rod, a mounting plate, a diamond blade, a force block, a first return spring and a second return spring. Grooves are provided on the inner walls of both sides of the lifting frame, and a lifting block is slidably provided in the groove. An adjustment plate is fixedly connected between the two lifting blocks. A first screw is rotatably provided on the lower side wall of one of the grooves. The upper end of the first screw thread passes through the lifting block and extends to the top of the lifting frame and is fixedly connected to the knob. A plurality of connecting rods are provided on the lower side wall of the adjustment plate. The connecting rod on the far right is connected to The adjusting plate is fixedly connected, and the rest of the connecting rods are slidably connected to the adjusting plate. A pressure block is fixedly connected to the bottom wall of the connecting rod. A fixing rod is fixedly connected between the inner walls on both sides of the lifting frame. A plurality of mounting plates are arranged on the fixing rod. The mounting plate on the far right is fixedly sleeved on the fixing rod, and the rest of the mounting plates are slidably sleeved on the fixing rod. A diamond blade is installed on the bottom wall of the mounting plate. A force block matching the pressure block is fixedly connected to one side wall where the plurality of mounting plates are close to each other. A first return spring is arranged between the plurality of connecting rods, and a second return spring is arranged between the plurality of mounting plates.

[0008] As an improvement: the clamping assembly includes a transverse groove, a slider, a second screw, a handwheel, a movable splint and a fixed splint. A transverse groove is opened on the rear of the upper side wall of the base, a slider is slidably provided in the transverse groove, a second screw is rotatably provided on one side wall of the transverse groove, the other end of the second screw threadedly passes through the slider and extends to the outside of the base and is fixedly connected to the handwheel, a movable splint is fixedly connected to the upper side wall of the slider, and a fixed splint is also fixedly connected to one side of the upper side wall of the base.

[0009] As an improvement: a collection box is slidably provided inside the base, a receiving plate is slidably provided inside the collection box, buffer springs are respectively provided at the four corners of the lower inner wall of the collection box, the other end of the buffer spring is fixedly connected to the receiving plate, and buffer cotton is provided on the upper side wall of the receiving plate.

[0010] As an improvement: a distance ruler is fixedly connected to one side of the front side wall of the lifting frame.

[0011] As an improvement: guide rods are slidably inserted on the upper side wall of the U-shaped bracket and on both sides of the electric telescopic rod, and the bottom ends of the guide rods are fixedly connected to the lifting frame.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. Through the setting of the slitting component, multiple silicon wafers can be cut out at the same time, and the slitting distance can be adjusted as needed, which greatly improves the work efficiency and is more practical. The setting of the clamping component can fix silicon wafers of various sizes, which is highly applicable and more practical. Through the setting of the buffer spring and buffer cotton, the cut silicon wafer will not have hard contact with the receiving plate when it falls into the collection box, avoiding the silicon wafer from breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a chip cutting device of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of a slitting component of a chip slitting device of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of a clamping assembly of a chip cutting device of the utility model;

[0017] Figure 4 This is a cross-sectional view of a collection box of a chip cutting device of the utility model;

[0018] As shown in the figure:

[0019] 1. Base; 1.1. Slide; 1.2. U-shaped bracket; 1.3. Electric telescopic rod; 1.4. Lifting frame; 2. Cutting assembly; 3. Clamping assembly; 2.1. Groove; 2.2. Lifting block; 2.3. Adjusting plate; 2.4. First screw; 2.5. Knob; 2.6. Connecting rod; 2.7. Pressing block; 2.8. Fixed rod; 2.9. Mounting plate; 2.10. Force block; 2.11. First return spring; 2.12. Second return spring; 3.1. Horizontal groove; 3.2. Sliding block; 3.3. Second screw; 3.4. Handwheel; 3.5. Movable splint; 3.6. Fixed splint; 1.5. Collecting box; 1.51. Receiver plate; 1.52. Buffer spring; 1.53. Buffer cotton; 1.41. Distance ruler; 1.21. Guide rod. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features and purpose effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both sides", "one side", "the other side" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] like Figure 1 As shown, a chip cutting device comprises a base 1, wherein slide grooves 1.1 are respectively provided on both sides of the upper side wall of the base 1, a U-shaped bracket 1.2 is slidably provided between the two slide grooves 1.1, an electric telescopic rod 1.3 is installed at the center of the upper outer wall of the U-shaped bracket 1.2, the telescopic end of the electric telescopic rod 1.3 passes through the upper side wall of the U-shaped bracket 1.2 and is fixedly connected to a lifting frame 1.4, the telescopic end of the electric telescopic rod 1.3 can drive the lifting frame 1.4 to move up and down, and when moving downward, the diamond blade can contact the silicon wafer to be cut, and push the U-shaped bracket 1.2 to slide between the two slide grooves 1.1. When sliding, the diamond blade completes the cutting of the silicon wafer, a cutting component 2 is provided on the lifting frame 1.4, and a clamping component 3 is also provided on the upper side wall of the base 1.

[0024] Specifically, Figure 2As shown, a chip cutting device, the slitting assembly 2 includes a groove 2.1, a lifting block 2.2, an adjusting plate 2.3, a first screw 2.4, a knob 2.5, a connecting rod 2.6, a pressing block 2.7, a fixing rod 2.8, a mounting plate 2.9, a diamond blade, a force block 2.10, a first return spring 2.11 and a second return spring 2.12, grooves 2.1 are provided on the inner walls of both sides of the lifting frame 1.4, lifting blocks 2.2 are slidably provided in the grooves 2.1, an adjusting plate 2.3 is fixedly connected between the two lifting blocks 2.2, and a first screw is rotatably provided on the lower side wall of one of the grooves 2.1 Rod 2.4, the upper end of the first screw rod 2.4 is threaded through the lifting block 2.2 and extends to the top of the lifting frame 1.4 and is fixedly connected with a knob 2.5, a plurality of connecting rods 2.6 are arranged on the lower side wall of the adjusting plate 2.3, the rightmost connecting rod 2.6 is fixedly connected to the adjusting plate 2.3, and the remaining connecting rods 2.6 are all slidably connected to the adjusting plate 2.3, a pressing block 2.7 is fixedly connected to the bottom wall of the connecting rod 2.6, a fixing rod 2.8 is fixedly connected between the inner walls of both sides of the lifting frame 1.4, a plurality of mounting plates 2.9 are arranged on the fixing rod 2.8, and the rightmost mounting plate 2.9 is fixedly sleeved on the fixing rod 2.8, The remaining mounting plates 2.9 are all slidably sleeved on the fixed rod 2.8, a diamond blade is installed on the bottom wall of the mounting plate 2.9, a force block 2.10 matching with the pressure block 2.7 is fixedly connected to the side walls of the plurality of mounting plates 2.9 close to each other, a first return spring 2.11 is arranged between the plurality of connecting rods 2.6, and a second return spring 2.12 is arranged between the plurality of mounting plates 2.9. When the slitting distance needs to be adjusted, the knob 2.5 is turned to drive the first screw rod 2.4 to rotate, and when the first screw rod 2.4 rotates, the lifting block 2.2 will drive the adjusting plate 2.3 to move downward, so that the connecting rod 2.6 brings The dynamic pressure block 2.7 moves downward, and the pressure block 2.7 will squeeze the force block 2.10 when it moves downward. After the force block 2.10 is squeezed, it will force the mounting plate 2.9 to move leftward, and the distance between the multiple mounting plates 2.9 will increase synchronously, thereby increasing the distance between each diamond blade. The reverse knob 2.5 will move upward after transmission, and when the adjusting plate 2.3 moves upward, under the pull of the first return spring 2.11 and the second return spring 2.12, the distance between each diamond blade will decrease synchronously, and the distance between the diamond blades can be adjusted according to needs, which is more practical.

[0025] Specifically, Figure 3As shown, a chip cutting device, the clamping assembly 3 includes a transverse groove 3.1, a slider 3.2, a second screw 3.3, a handwheel 3.4, a movable clamp 3.5 and a fixed clamp 3.6. The upper side wall of the base 1 is provided with a transverse groove 3.1 at the rear, the slider 3.2 is slidably arranged in the transverse groove 3.1, and a second screw 3.3 is rotatably arranged on one side wall of the transverse groove 3.1. The other end of the second screw 3.3 is threaded through the slider 3.2 and extends to the outside of the base 1 and is fixedly connected to the handwheel 3.4. The slider 3. 2 is fixedly connected with a movable clamping plate 3.5, and one side of the upper side wall of the base 1 is also fixedly connected with a fixed clamping plate 3.6. One side of the silicon wafer to be cut is placed on the fixed clamping plate 3.6, and then the hand wheel 3.4 is turned to drive the second screw rod 3.3 to rotate. When the second screw rod 3.3 rotates, the slider 3.2 threadedly connected thereto can drive the movable clamping plate 3.5 to approach the fixed clamping plate 3.6, so that the silicon wafer can be clamped and fixed. It is suitable for fixing silicon wafers of various sizes and has high applicability.

[0026] Specifically, Figure 4 As shown, a chip cutting device is provided, wherein a collecting box 1.5 is slidably provided inside a base 1, a receiving plate 1.51 is slidably provided inside the collecting box 1.5, buffer springs 1.52 are respectively provided at the four corners of the lower inner wall of the collecting box 1.5, the other end of the buffer spring 1.52 is fixedly connected to the receiving plate 1.51, and buffer cotton 1.53 is provided on the upper side wall of the receiving plate 1.51. The cut silicon wafers will fall onto the receiving plate 1.51 in the collecting box 1.5. The setting of the buffer spring 1.52 and the buffer cotton 1.53 ensures that the cut silicon wafers will not have hard contact with the receiving plate 1.51 when falling into the collecting box 1.5, thereby avoiding the silicon wafers from breaking.

[0027] Specifically, Figure 1 As shown, a chip cutting device, a distance ruler 1.41 is fixedly connected to one side of the front side wall of the lifting frame 1.4, and the distance between each diamond blade can be quickly determined in conjunction with the marking line on the front side wall of the second mounting plate 2.9 on the right.

[0028] Specifically, Figure 1 As shown, a chip cutting device, guide rods 1.21 are slidably inserted on the upper side wall of the U-shaped bracket 1.2 and on both sides of the electric telescopic rod 1.3, and the bottom end of the guide rod 1.21 is fixedly connected to the lifting frame 1.4. The setting of the guide rod 1.21 can make the lifting frame 1.4 more stable when it is lifted up and down.

[0029] When the utility model is implemented, one side of the silicon wafer to be cut is placed on the fixed clamping plate 3.6, and then the hand wheel 3.4 is turned to drive the second screw rod 3.3 to rotate. When the second screw rod 3.3 rotates, the slider 3.2 threadedly connected thereto can drive the movable clamping plate 3.5 to approach the fixed clamping plate 3.6, so that the silicon wafer can be clamped and fixed. Then the knob 2.5 is turned to drive the first screw rod 2.4 to rotate. When the first screw rod 2.4 rotates, the lifting block 2.2 will drive the adjustment plate 2.3 to move downward, so that the connecting rod 2.6 drives the pressure block 2.7 to move downward. When the pressure block 2.7 moves downward, it will squeeze the force block 2.10. After the force block 2.10 is squeezed, it will force the mounting plate 2.9 to move leftward, and the distance between the multiple mounting plates 2.9 will increase synchronously, so that the distance between each diamond blade will increase. The knob 2.5 is reversed. After transmission, the adjustment plate 2.3 will move upward. When the adjustment plate 2.3 moves upward, under the pull of the first return spring 2.11 and the second return spring 2.12, the distance between each diamond blade will become smaller synchronously. The slitting distance can be quickly determined in conjunction with the fixed distance ruler 1.41. After determining the slitting distance, the telescopic end of the electric telescopic rod 1.3 pushes the lifting frame 1.4 downward to make the diamond blade contact the silicon wafer, and then pushes the U-shaped bracket 1.2 to make it slide between the two slide grooves 1.1. While sliding, the diamond blade completes the slitting of the silicon wafer, and the cut silicon wafer will fall onto the receiving plate 1.51 in the collection box 1.5. The setting of the buffer spring 1.52 and the buffer cotton 1.53 ensures that the cut silicon wafer will not have hard contact with the receiving plate 1.51 when it falls into the collection box 1.5, thereby avoiding the silicon wafer from breaking.

[0030] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A chip cutting device, comprising a base (1), characterized in that: Slide grooves (1.1) are respectively provided on both sides of the upper side wall of the base (1); a U-shaped bracket (1.2) is slidably provided between the two slide grooves (1.1); an electric telescopic rod (1.3) is installed at the center of the upper outer wall of the U-shaped bracket (1.2); the telescopic end of the electric telescopic rod (1.3) passes through the upper side wall of the U-shaped bracket (1.2) and is fixedly connected to a lifting frame (1.4); a cutting assembly (2) is provided on the lifting frame (1.4); and a clamping assembly (3) is also provided on the upper side wall of the base (1).

2. A chip cutting device according to claim 1, characterized in that: The slitting assembly (2) comprises a groove (2.1), a lifting block (2.2), an adjusting plate (2.3), a first screw rod (2.4), a knob (2.5), a connecting rod (2.6), a pressing block (2.7), a fixing rod (2.8), a mounting plate (2.9), a diamond blade, a force block (2.10), a first return spring (2.11) and a second return spring (2.12). The inner walls of both sides of the lifting frame (1.4) are provided with grooves (2.1). A lifting block (2.2) is slidably arranged in the groove (2.1), an adjusting plate (2.3) is fixedly connected between the two lifting blocks (2.2), a first screw rod (2.4) is rotatably arranged on the lower side wall of one of the grooves (2.1), the upper end of the first screw rod (2.4) is threadedly passed through the lifting block (2.2) and extends to the top of the lifting frame (1.4) and is fixedly connected to a knob (2.5), and a plurality of connecting rods (2.6) are arranged on the lower side wall of the adjusting plate (2.3). The rightmost connecting rod (2.6) is fixedly connected to the adjustment plate (2.3), and the other connecting rods (2.6) are slidably connected to the adjustment plate (2.3). A pressure block (2.7) is fixedly connected to the bottom wall of the connecting rod (2.6). A fixing rod (2.8) is fixedly connected between the inner walls on both sides of the lifting frame (1.4). A plurality of mounting plates (2.9) are provided on the fixing rod (2.8). The rightmost mounting plate (2.9) is fixedly sleeved on the fixing rod (2.8). The remaining mounting plates (2.9) are all slidably mounted on the fixed rod (2.8), a diamond blade is mounted on the bottom wall of the mounting plate (2.9), a force-bearing block (2.10) matching with the pressure block (2.7) is fixedly connected to one side wall of the plurality of mounting plates (2.9) close to each other, a first return spring (2.11) is arranged between the plurality of connecting rods (2.6), and a second return spring (2.12) is arranged between the plurality of mounting plates (2.9).

3. A chip cutting device according to claim 1, characterized in that: The clamping assembly (3) comprises a transverse groove (3.1), a slider (3.2), a second screw (3.3), a hand wheel (3.4), a movable clamp (3.5) and a fixed clamp (3.6); a transverse groove (3.1) is provided at the rear of the upper side wall of the base (1); a slider (3.2) is slidably provided in the transverse groove (3.1); a second screw (3.3) is rotatably provided on one side wall of the transverse groove (3.1); the other end of the second screw (3.3) is threadedly passed through the slider (3.2) and extends to the outside of the base (1) and is fixedly connected to the hand wheel (3.4); a movable clamp (3.5) is fixedly connected to the upper side wall of the slider (3.2); and a fixed clamp (3.6) is also fixedly connected to one side of the upper side wall of the base (1).

4. A chip cutting device according to claim 1, characterized in that: A collecting box (1.5) is slidably provided inside the base (1), a receiving plate (1.51) is slidably provided inside the collecting box (1.5), buffer springs (1.52) are respectively provided at four corners on the lower inner wall of the collecting box (1.5), the other end of the buffer spring (1.52) is fixedly connected to the receiving plate (1.51), and buffer cotton (1.53) is provided on the upper side wall of the receiving plate (1.51).

5. The chip cutting device according to claim 1, characterized in that: A distance ruler (1.41) is fixedly connected to one side of the front side wall of the lifting frame (1.4).

6. The chip cutting device according to claim 1, characterized in that: Guide rods (1.21) are slidably inserted on the upper side wall of the U-shaped bracket (1.2) and located on both sides of the electric telescopic rod (1.3), and the bottom ends of the guide rods (1.21) are fixedly connected to the lifting frame (1.4).

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