Injection head of semiconductor packaging mold

Abstract

The utility model provides an injection head of a semiconductor packaging mold. A plurality of conveying pipes are fixedly installed at the lower end of the pushing and pressing rod, a packaging injection head is fixedly installed at the lower end of each conveying pipe, and an injection opening is formed in one end of each packaging injection head. According to the device, the three conveying pipes are arranged in a row and are composed of the three packaging injection heads, when the pushing and pressing rod conducts one stroke downwards, the three packaging injection heads do work downwards at the same time, the working efficiency of packaging equipment can be greatly improved, the injection ports are formed in the lower ends of the injection heads, and therefore the packaging efficiency of the packaging equipment can be greatly improved. And after plastic liquid enters the packaging injection head through the conveying pipe, the plastic liquid enters the packaging mold through the injection opening through downward movement of the pushing and pressing rod, and then the packaging and pouring effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging mold injection heads, and specifically discloses an injection head of a semiconductor packaging mold. Background Art

[0002] With the continuous development of society, the demand for semiconductor molds is getting higher and higher, and the production of semiconductors by mass manufacturers is also increasing. However, in today's market, the semiconductor packaging mold injection heads used in the production process of traditional semiconductor packaging molds often adopt the principle of single-stroke work. Only one semiconductor mold can be packaged during one stroke, which greatly limits the overall packaging work efficiency. In a sense, the work efficiency generated by the old-fashioned semiconductor packaging mold injection heads can no longer meet the product demand in today's market. Therefore, we aim to develop a new and efficient semiconductor packaging mold injection head, and make it have the characteristics of improving production efficiency, improving product quality, cost control, and environmental protection and energy saving. Its most important purpose is to speed up the packaging speed of semiconductor molds in the working process and greatly improve its overall work efficiency. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies in the prior art, the present application aims to provide an injection head for a semiconductor packaging mold, comprising: a pushing rod, a plurality of delivery tubes are fixedly installed at the lower end of the pushing rod, a packaging injection head is fixedly installed at the lower end of the delivery tube, and an injection port is opened at one end of the packaging injection head.

[0004] Preferably, a fixing column is installed at the upper end of the pushing rod, and the pushing rod is slidably installed inside the fixing column.

[0005] Preferably, an assembly plate is fixedly mounted on the upper surface of the fixing column.

[0006] Preferably, a feed pipe is fixedly mounted on the upper end of the assembly plate, and a feed funnel is provided on the upper end of the feed pipe.

[0007] Preferably, a plurality of support columns are fixedly mounted on the lower surface of the assembly plate, a fixed frame plate is fixedly mounted on the lower end of the support columns, and a plurality of support legs are fixedly mounted on the lower end of the fixed frame plate.

[0008] Preferably, an anti-splash shell is fixedly mounted on the lower end of the fixing column, and a plurality of positioning holes are formed on the lower end of the anti-splash shell. Beneficial Effects

[0009] 1. The injection head with a semiconductor packaging mold is slidably installed inside the fixed column through a push rod. When the equipment starts working, the push rod slides downward inside the fixed column, thereby pushing the delivery pipe installed at the lower end to move downward. Through the delivery pipe, the delivery pipe can play a role in transmitting plastic liquid to the inside of the packaging injection head. Through the packaging injection head, the packaging injection head inside this device is different from the conventional semiconductor packaging mold injection. It is composed of three delivery pipes arranged in a row and composed of three packaging injection heads. When the push rod moves downward once, the three packaging injection heads will be worked downward at the same time. Unlike the traditional single-stroke packaging injection mold, this device can greatly improve the working efficiency of the packaging equipment. Through the injection port, the injection port is opened at the lower end of the injection head. After the plastic liquid enters the inside of the packaging injection head through the delivery pipe, the plastic liquid enters the inside of the packaging mold through the injection port through the downward movement of the push rod to complete the packaging casting effect.

[0010] 2. The injection head with the semiconductor packaging mold has an anti-splash shell fixedly installed at the lower end of the fixed column, which prevents the splashing of plastic liquid when the packaging injection head performs mold packaging, thereby playing a barrier and protection role. The semiconductor mold is positioned through the positioning hole opened at the lower end of the anti-splash shell, ensuring that the semiconductor mold can be accurately positioned inside the packaging feed port of the semiconductor mold, thereby playing a fixed positioning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0012] Figure 1 This is a schematic diagram of the structure of the encapsulated injection head of the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the anti-splash casing of the utility model;

[0014] Figure 3 It is a schematic diagram of the overall structure of the utility model.

[0015] In the figure: 1. Assembly plate; 2. Fixed column; 3. Push rod; 4. Anti-splash shell; 5. Positioning hole; 6. Feed pipe; 7. Delivery pipe; 8. Package injection head; 9. Injection port; 10. Feed funnel; 11. Support column; 12. Fixed frame plate; 13. Support leg. DETAILED DESCRIPTION

[0016] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0017] The accompanying drawings in the embodiments of the present invention: different types of section lines in the drawings are not marked according to national standards, nor do they impose any requirements on the materials of the components. Instead, they are used to distinguish the cross-sectional views of the components in the drawings.

[0018] See also Figure 1-3 , an injection head of a semiconductor packaging mold, including; a pushing rod 3, a plurality of delivery tubes 7 are fixedly installed at the lower end of the pushing rod 3, a packaging injection head 8 is fixedly installed at the lower end of the delivery tube 7, and an injection port 9 is opened at one end of the packaging injection head 8.

[0019] The upper end of the push rod 3 is installed with a fixed column 2 , and the push rod 3 is slidably installed inside the fixed column 2 .

[0020] The upper surface of the fixing column 2 is fixedly mounted with the assembly plate 1 .

[0021] A feed pipe 6 is fixedly mounted on the upper end of the assembly plate 1 , and a feed funnel 10 is provided on the upper end of the feed pipe 6 .

[0022] A plurality of support columns 11 are fixedly mounted on the lower surface of the assembly plate 1 , a fixed frame plate 12 is fixedly mounted on the lower end of the support columns 11 , and a plurality of support legs 13 are fixedly mounted on the lower end of the fixed frame plate 12 .

[0023] The lower end of the fixed column 2 is fixedly mounted with an anti-splash shell 4 , and the lower end of the anti-splash shell 4 is provided with a plurality of positioning holes 5 .

[0024] When the system is working, Figure 1-3As shown, when in use, by placing the semiconductor mold at the lower end of the positioning hole 5, the semiconductor mold is placed and aligned with the positioning hole 5 in turn through the arranged positioning hole 5, so that the encapsulation injection head 8 arranged inside can be accurately encapsulated, and the pushing rod 3 is slidably installed inside the fixed column 2. When the device starts to work, the pushing rod 3 slides downward inside the fixed column 2, thereby pushing the delivery pipe 7 installed at the lower end to move downward. Through the arranged delivery pipe 7, the delivery pipe 7 can play a role in transmitting the plastic liquid to the inside of the encapsulation injection head 8. Through the arranged encapsulation injection head 8, the encapsulation injection head 8 inside the device is aligned with the encapsulation injection head 8. Different from the conventional semiconductor packaging mold injection, it is composed of three delivery tubes 7 arranged in a row, and three packaging injection heads 8. When the push rod 3 makes a downward stroke, the three packaging injection heads 8 will be moved downward at the same time. Unlike the traditional single-stroke packaging injection mold, this device can greatly improve the working efficiency of the packaging equipment. By setting the injection port 9, the injection port 9 is opened at the lower end of the packaging injection head 8. When the plastic liquid enters the interior of the packaging injection head 8 through the delivery tube 7, the plastic liquid enters the interior of the packaging mold through the downward movement of the push rod 3, thereby completing the packaging casting effect. The fixed column 2 is provided, and the push rod 3 is slidably installed inside it. The assembly plate 1 is provided, and the fixed column 2 and the support column 11 are fixedly installed on its lower surface. The feed pipe 6 fixedly installed on the upper surface of the assembly plate 1 can convey the plastic liquid to the injection head of the semiconductor packaging mold. The feed funnel 10 is provided, and the plastic liquid can enter the packaging mold through the feed funnel 10 to play the role of feeding and conveying. The support column 11 is provided, and the support column 11 is installed at the lower end of the assembly plate 1, so that the assembly plate 1 can be supported to make all the devices installed above the assembly plate 1 emptied, which is convenient for sealing. The injection head 8 is installed for encapsulation injection. The fixed frame plate 12 is provided to fix the support legs 13 at its lower end. At the same time, due to the existence of the fixed frame plate 12, the support columns 11 can also be fixed on its upper surface to play a carrier role. The anti-splash shell 4 fixedly installed at the lower end of the fixed column 2 can prevent the plastic liquid from splashing when the encapsulation injection head 8 performs mold encapsulation, thereby playing a barrier and protection role. The positioning hole 5 opened at the lower end of the anti-splash shell 4 can be used to position the semiconductor mold through the position of the positioning hole 5 to ensure that the semiconductor mold can be accurately positioned inside the encapsulation feed port of the semiconductor mold, thereby playing a fixed positioning effect.

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. An injection head for a semiconductor packaging mold, comprising: a push rod (3), characterized in that: A plurality of delivery tubes (7) are fixedly mounted on the lower end of the push rod (3), a packaging injection head (8) is fixedly mounted on the lower end of the delivery tube (7), and an injection port (9) is provided at one end of the packaging injection head (8).

2. The injection head of a semiconductor packaging mold according to claim 1, characterized in that: A fixed column (2) is mounted on the upper end of the push rod (3), and the push rod (3) is slidably mounted inside the fixed column (2).

3. The injection head of a semiconductor packaging mold according to claim 2, characterized in that: An assembly plate (1) is fixedly mounted on the upper surface of the fixing column (2).

4. The injection head of a semiconductor packaging mold according to claim 3, characterized in that: A feed pipe (6) is fixedly mounted on the upper end of the assembly plate (1), and a feed funnel (10) is provided on the upper end of the feed pipe (6).

5. The injection head of a semiconductor packaging mold according to claim 4, characterized in that: A plurality of support columns (11) are fixedly mounted on the lower surface of the assembly plate (1), a fixed frame plate (12) is fixedly mounted on the lower end of the support column (11), and a plurality of support legs (13) are fixedly mounted on the lower end of the fixed frame plate (12).

6. The injection head of a semiconductor packaging mold according to claim 2, characterized in that: An anti-splash casing (4) is fixedly mounted on the lower end of the fixed column (2), and a plurality of positioning holes (5) are formed on the lower end of the anti-splash casing (4).

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