PCB test board for chip test

By designing a PCB test board for chip testing, and using hinges to install the compression frame and positioning frame, the stable positioning and efficient testing of the chip are achieved, solving the problems of low testing efficiency and easy chip damage in the prior art.

CN222506494UActive Publication Date: 2025-02-18DONGGUAN HUIZHAO ELECTRONICS CO LTD
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Patent Information

Application Number
CN202420682117.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-03
Publication Date
2025-02-18
Estimated Expiration
2034-04-03

AI Technical Summary

Technical Problem

In the existing chip testing methods, the chip needs to be soldered directly on the PCB test board, and needs to be disassembled and assembled after testing, resulting in low testing efficiency and easy damage to the chip.

Method used

A PCB test board for chip testing is designed, using hinges to install the compression frame and positioning frame. The housing of the chip to be tested is inserted into the positioning frame, the pin is inserted into the limit slot, and the pin is made through the extrusion part of the pressure plate. Close contact with the wiring solder joints to avoid welding operations.

Benefits of technology

The stable positioning and efficient testing of the chip are achieved, which avoids pin bending affecting contact, simplifies the disassembly process, improves work efficiency and reduces the risk of chip damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a PCB test board used for chip testing, comprising a PCB test board and a chip to be tested, one side of the PCB test board located at a wiring welding point is provided with a pressing frame through an articulation piece, the outer side surface of the pressing frame is provided with a positioning frame, the inner side surface of the pressing frame protrudes to form a plurality of limiting parts, and the limiting parts are arranged on the inner side surface of the pressing frame. A limiting groove is formed between every two adjacent limiting parts, a shell of a to-be-tested chip is inserted into the positioning frame, pins on the to-be-tested chip are all inserted into the limiting grooves, and a pressing plate for pressing and positioning the to-be-tested chip is installed on the other side, located on the wiring welding point, of the PCB testing board. The LED lamp is simple in structure and convenient to mount and dismount, the pins and the wiring welding spots can be directly pressed and conducted, welding is not needed, and subsequent dismounting is facilitated.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a PCB testing board used for chip testing. Background Art

[0002] With the development of microelectronic device technology, various electronic devices have been widely used in various fields such as aerospace, military industry, scientific research, general electronics, etc. Both daily electronic products and large equipment require chips to achieve automatic control and intelligence, so chips are the most important part of electronic products.

[0003] After the chip is manufactured, it must generally be tested before it can be installed and used. Most of the existing chips are directly soldered on the PCB test board for chip testing. After the test, the chip needs to be disassembled and assembled, which not only has low test efficiency, but also causes damage to the chip during the disassembly and assembly process, and has low work efficiency. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a PCB test board for chip testing, which can perform testing in a compacting manner and can independently separate the pins on the chip to be tested, so as to solve the problems raised in the above-mentioned background technology.

[0005] The utility model is realized through the following technical scheme: a PCB test board for chip testing, comprising a PCB test board and a chip to be tested, wherein a clamping frame is installed on one side of the PCB test board located at a wiring soldering point through a hinge, a positioning frame is installed on the outer side of the clamping frame, a plurality of limiting parts are protruded on the inner side of the clamping frame, limiting grooves are formed between adjacent limiting parts, a shell of the chip to be tested is inserted into the positioning frame, pins on the chip to be tested are inserted into the limiting grooves, and a pressing plate for clamping and positioning the chip to be tested is installed on the other side of the PCB test board located at the wiring soldering point.

[0006] As a preferred technical solution, a mounting hole is provided on the PCB test board, a sealed bearing is installed in the mounting hole, a shaft rod is installed in the inner ring of the sealed bearing, one end of the shaft rod is installed on the bottom surface of the pressure plate, the pressure plate protrudes toward one side of the positioning frame to form an extrusion portion, the bottom surface of the extrusion portion forms a guide portion, and a grip rod is installed on the top surface of the pressure plate.

[0007] As a preferred technical solution, a support block is installed on the top surface of the PCB test board on one side of the hinge, one side of the support block forms a placement portion with an inclined structure, and the outer side surface of the positioning frame leans against the placement portion.

[0008] As a preferred technical solution, the length and width of the inner cavity of the positioning frame match the length and width of the upper shell of the chip to be tested, and the outer side surface of the upper shell of the chip to be tested is arranged to abut against the inner side surface of the positioning frame.

[0009] As a preferred technical solution, a test socket for connecting a test device is installed at one end of the PCB test board.

[0010] As a preferred technical solution, the pressing frame and the positioning frame are both made of insulating plastic material.

[0011] The beneficial effects of the utility model are as follows: the utility model has a simple structure, the chip to be tested can be directly inserted into the positioning frame, and the pins on the chip to be tested can be inserted into the limiting grooves, so that the shell and the pins on the chip to be tested can be positioned, avoiding the pins from bending and affecting the contact with the wiring soldering points, and after the positioning frame is covered, the pressing plate can be pressed on the clamping frame, which can directly clamp and conduct the pins with the wiring soldering points without welding, thus facilitating subsequent disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a side view of the utility model;

[0015] Figure 3 It is a structural schematic diagram of the other side of the utility model.

[0016] Among them, 1. PCB test board; 2. Clamping frame; 3. Chip to be tested; 4. Limiting part; 5. Pressing plate; 6. Extrusion part; 7. Grip rod; 8. Test socket; 9. Shaft rod; 10. Positioning frame; 11. Support block. DETAILED DESCRIPTION

[0017] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0019] Any feature disclosed in this specification (including any additional claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0020] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model is a PCB test board for chip testing, comprising a PCB test board 1 and a chip to be tested 3, wherein the PCB test board 1 is provided with a clamping frame 2 through a hinge on one side of a wiring solder joint, a positioning frame 10 is provided on the outer side of the clamping frame 2, a plurality of limiting portions 4 are protruded on the inner side surface of the clamping frame 2, and limiting grooves are formed between adjacent limiting portions 4, the shell of the chip to be tested 3 is inserted into the positioning frame 10, and the pins on the chip to be tested 3 are inserted into the limiting grooves, and a pressing plate 5 for clamping and positioning the chip to be tested 3 is provided on the other side of the wiring solder joint of the PCB test board 1.

[0021] In this embodiment, a mounting hole is provided on the PCB test board 1, and a sealed bearing is installed in the mounting hole. A shaft rod 9 is installed in the inner ring of the sealed bearing. One end of the shaft rod 9 is installed on the bottom surface of the pressure plate 5. The pressure plate 5 protrudes toward one side of the positioning frame 10 to form an extrusion portion 6. The bottom surface of the extrusion portion 6 forms a guide portion. A grip rod 7 is installed on the top surface of the pressure plate 5. The guide portion can better enable the extrusion portion to move to the top of the clamping frame and press the clamping frame downward.

[0022] In this embodiment, a support block 11 is installed on the top surface of the PCB test board 1 on one side of the hinge, and one side of the support block 11 forms a placement portion with an inclined structure. The outer side surface of the positioning frame 10 leans against the placement portion, and the opening degree of the positioning frame can be limited by the support block.

[0023] In this embodiment, the length and width of the inner cavity of the positioning frame 10 match the length and width of the upper shell of the chip to be tested 3, and the outer side surface of the upper shell of the chip to be tested 3 is set to abut against the inner side surface of the positioning frame 10, which can frictionally position the inserted chip to be tested and avoid the chip to be tested from falling off during the process of lifting or covering the positioning frame.

[0024] In this embodiment, a test socket 8 for connecting a test device is installed at one end of the PCB test board 1, and a test plug can be inserted into the test socket to complete the test.

[0025] In this embodiment, the pressing frame 2 and the positioning frame 10 are both made of insulating plastic material, which prevents the pins from being connected to the positioning frame and the pressing frame, thereby preventing a short circuit.

[0026] During the test, the shell on the chip to be tested can be inserted into the positioning frame, and the inserted chip to be tested can be positioned by the friction between the positioning frame and the positioning frame, and the pins on the chip to be tested can be inserted into the limiting grooves, and the limiting blocks can separate the pins independently, and also make the pins in a straight state, avoiding bending and affecting the contact with the wiring solder joints;

[0027] After the above is completed, the pressing frame and the positioning frame can be covered downward with the hinge as the center, so that the pins on the chip to be tested are in contact with the wiring solder joints on the PCB test board, and the pressing plate can be rotated by the grip rod, so that the pressing plate rotates with the shaft rod as the center, until the extrusion part is pressed on the positioning frame through the guide part, and the extrusion force can act on the pins, so that the pins can be firmly in contact with the wiring solder joints to ensure the stability of the contact;

[0028] On the contrary, after the pressing plate is rotated in the opposite direction, the positioning frame can be lifted up again and the chip to be tested can be pushed outward, which greatly facilitates installation and disassembly without the need for welding operations.

[0029] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A PCB test board for chip testing, characterized in that: The invention comprises a PCB test board (1) and a chip to be tested (3); a clamping frame (2) is installed on one side of the PCB test board (1) located at a wiring soldering point through a hinge; a positioning frame (10) is installed on the outer side of the clamping frame (2); a plurality of limiting parts (4) are protruded on the inner side of the clamping frame (2); limiting grooves are formed between adjacent limiting parts (4); a shell of the chip to be tested (3) is inserted into the positioning frame (10); pins on the chip to be tested (3) are inserted into the limiting grooves; and a pressing plate (5) for clamping and positioning the chip to be tested (3) is installed on the other side of the PCB test board (1) located at the wiring soldering point.

2. The PCB test board for chip testing according to claim 1, characterized in that: A mounting hole is provided on the PCB test board (1), a sealed bearing is installed in the mounting hole, a shaft (9) is installed in the inner ring of the sealed bearing, one end of the shaft (9) is installed on the bottom surface of the pressure plate (5), the pressure plate (5) protrudes toward one side of the positioning frame (10) to form an extrusion portion (6), the bottom surface of the extrusion portion (6) forms a guide portion, and a gripping rod (7) is installed on the top surface of the pressure plate (5).

3. The PCB test board for chip testing according to claim 1, characterized in that: A support block (11) is installed on the top surface of the PCB test board (1) at one side of the hinge, and one side of the support block (11) forms a placement portion with an inclined structure, and the outer side surface of the positioning frame (10) leans against the placement portion.

4. The PCB test board for chip testing according to claim 1, characterized in that: The length and width of the inner cavity of the positioning frame (10) match the length and width of the upper shell of the chip to be tested (3), and the outer side surface of the upper shell of the chip to be tested (3) is arranged to abut against the inner side surface of the positioning frame (10).

5. The PCB test board for chip testing according to claim 1, characterized in that: A test socket (8) for connecting to a test device is installed at one end of the PCB test board (1).

6. The PCB test board for chip testing according to claim 1, characterized in that: The pressing frame (2) and the positioning frame (10) are both made of insulating plastic material.