Computer CPU radiator

Abstract

The utility model discloses a computer CPU radiator which comprises a fan frame, a fan, radiating fins, a radiating base and a heat pipe, the fan is movably arranged in the fan frame, one side of the fan frame is fixedly connected with the radiating base, the radiating fins are fixedly arranged on the side, close to the fan, of the radiating base, and the heat pipe is fixedly arranged on the side, away from the fan, of the radiating base. Compared with the prior art, the LED lamp has the advantages that the LED lamp is high in heat dissipation performance, the radiator combines the advantages of the heat dissipation fins, the heat pipe and the fan, and a high-efficiency heat dissipation system is formed. And the heat dissipation area and the heat dissipation efficiency are effectively improved. And the heat pipe is made of a high-heat-conductivity material, so that heat generated by the CPU can be quickly conducted to the heat dissipation fins. And the temperature stability of the CPU is ensured. The design is flexible, and the layout and installation requirements of different computer mainboards can be met. Cleaning and maintenance are convenient, and long-term stable operation is guaranteed. The noise is low, and installation and replacement are easy.

Description

Technical Field

[0001] The utility model relates to the field of computer radiators, in particular to a computer CPU radiator. Background Art

[0002] With the rapid development of information technology, the performance of computers has been greatly improved. As the core component of computers, the power and integration of CPUs are also growing. However, high-performance CPUs are often accompanied by high power consumption, which causes the CPU to generate a lot of heat during operation. If this heat cannot be dissipated in a timely and effective manner, the CPU temperature will rise, which will in turn affect its performance stability and service life. Traditional computer CPU cooling methods mainly include air cooling and water cooling. Air-cooled radiators generate airflow through fans to take away the heat generated by the CPU. They have the advantages of simple structure and low cost, but the heat dissipation effect is limited under high load conditions. Water-cooled radiators use liquid circulation to dissipate the heat generated by the CPU into the air through a heat exchanger. The heat dissipation effect is relatively good, but the cost is high and the structure is complex. In recent years, with the continuous development of heat pipe technology, heat pipe radiators have been widely used in the field of computer CPU heat dissipation. Heat pipe radiators use the evaporation and condensation of liquid inside the heat pipe to transfer heat, and have the advantages of high efficiency, reliability, and stability. However, traditional heat pipe radiators still have some shortcomings, such as the large thermal resistance between the heat pipe and the heat dissipation fins, and the heat dissipation efficiency needs to be further improved.

[0003] However, there are few computer CPU heat sinks on the market, or the existing related technologies have certain defects, such as low heat dissipation performance, inflexible design, difficult maintenance, loud noise, and poor compatibility. Utility Model Content

[0004] The purpose of the utility model is to overcome the above technical defects and provide a computer CPU radiator to solve the problems of low heat dissipation performance, inflexible design, difficult maintenance, high noise and poor compatibility.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: a computer CPU radiator, comprising a fan frame, a fan, a heat sink fin, a heat sink base, and a heat pipe, wherein a fan is movably arranged inside the fan frame, a heat sink base is fixedly connected to one side of the fan frame, a heat sink fin is fixedly arranged on the side of the heat sink close to the fan, and a heat pipe is fixedly arranged on the side of the heat sink away from the fan; a plurality of heat pipes are arranged, which are made of high thermal conductivity materials and filled with low boiling point liquid.

[0006] Furthermore, fixing holes are arranged around the fan frame.

[0007] Furthermore, a motor is fixedly arranged in the middle of the fan, and fan blades are arranged around it, and there are a plurality of fan blades.

[0008] Furthermore, a plurality of heat sink fins are provided, gaps are provided between the heat sink fins, the heat sink fins are made of copper material, and a nano coating is provided on the surface.

[0009] Furthermore, the heat dissipation base is made of aluminum material and the surface is coated with thermal silicone grease.

[0010] Compared with the prior art, the utility model has the following advantages: High-efficiency heat dissipation performance: The radiator combines the advantages of heat dissipation fins, heat pipes and fans to form an efficient heat dissipation system. The heat dissipation fins are made of copper material and are coated with nano-coatings, which effectively improve the heat dissipation area and heat dissipation efficiency. The heat pipe is made of high thermal conductivity material and is filled with low boiling point liquid, which can quickly transfer the heat generated by the CPU to the heat dissipation fins. The fan quickly takes away the heat on the fins by generating wind flow, thereby ensuring the stability of the CPU temperature.

[0011] Design flexibility: The fan frame is available in any shape and has fixing holes all around, which allows the radiator to adapt to the layout and installation requirements of different computer motherboards. In addition, the connections between the various components of the radiator are tight and stable, ensuring that it can remain stable during use.

[0012] Easy to maintain: Since the heat sink fins and fans are detachable, users can easily clean and maintain the radiator to ensure long-term stable operation. In addition, the surface of the heat sink base is coated with thermal grease, which is easy to replace and re-apply to ensure good thermal conductivity.

[0013] Good noise control: The fan is driven by a motor and the fan blades are reasonably designed, which can provide sufficient air volume while maintaining a low noise level, providing users with a quiet working environment.

[0014] Strong compatibility: The radiator is designed to be suitable for various types of CPUs and can meet the performance requirements of different computers. At the same time, due to the use of standardized interfaces and connection methods, the radiator is easy to install and replace. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model is a schematic diagram of the overall structure of a computer CPU radiator.

[0016] Figure 2 The utility model is a fan structure schematic diagram of a computer CPU radiator.

[0017] Figure 3 The utility model is a schematic diagram of the structure of a heat dissipation base of a computer CPU heat sink.

[0018] Figure 4 The utility model is a schematic diagram of the heat pipe distribution structure of a computer CPU radiator. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] In the description of the embodiments of the present utility model, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0021] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0022] In the description of the embodiments of the present invention, "multiple" means at least 2.

[0023] In the description of the embodiments of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0024] Example:

[0025] A computer CPU radiator comprises a fan frame 1, a fan 2, heat dissipation fins 3, a heat dissipation base 4, and a heat pipe 5. The fan frame 1 is movably provided with the fan 2 inside, the heat dissipation base 4 is fixedly connected to one side of the fan frame 1, the heat dissipation fins 3 are fixedly provided on the side of the heat dissipation base 4 close to the fan 2, and the heat pipe 5 is fixedly provided on the side of the heat dissipation base 4 away from the fan 2.

[0026] The fan frame 1 may be of any shape and is provided with fixing holes 6 around it.

[0027] The fan 2 has a motor fixedly disposed in the middle thereof, and has blades 7 disposed around it, wherein a plurality of blades 7 are provided.

[0028] There are a plurality of heat sink fins 3 , gaps are provided between the heat sink fins 3 , which are made of copper material and have a nano coating on the surface.

[0029] The heat dissipation base 4 is made of aluminum material, and the surface is coated with thermal silicone grease.

[0030] There are multiple heat pipes 5, which are made of high thermal conductivity materials and filled with low boiling point liquid.

[0031] When the utility model is implemented, first, the radiator is installed on the computer CPU. During installation, the heat dissipation base 4 is closely attached to the CPU, and the contact surface between the heat dissipation base 4 and the CPU is evenly coated with thermal conductive silicone grease to better conduct heat.

[0032] Next, connect the power supply of the fan 2. The motor of the fan 2 starts to work, driving the fan blades 7 to rotate and generate wind flow.

[0033] When the fan 2 is started, the heat generated by the CPU is quickly transferred to the heat pipe 5 through the heat dissipation base 4. The low boiling point liquid filled in the heat pipe 5 evaporates quickly after being heated, and brings the heat to the other end of the heat pipe 5, that is, near the heat dissipation fins 3.

[0034] At this time, the wind flow generated by the fan 2 blows through the heat dissipation fins 3, taking away the heat on the fins 3. The heat dissipation fins 3 are made of copper material, which has good thermal conductivity, and the surface has a nano coating, which enhances the heat dissipation effect. Gaps are set between the fins 3 to help the wind flow pass smoothly and improve the heat dissipation efficiency.

[0035] Finally, the entire radiator can be fixed on the mainboard of the computer through the fixing holes 6 around the fan frame 1, ensuring that the radiator remains stable during use.

[0036] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A computer CPU radiator, comprising a fan frame (1), a fan (2), a heat sink (3), a heat sink base (4), and a heat pipe (5), characterized in that: The fan frame (1) has a fan (2) movably arranged inside it, a heat dissipation base (4) is fixedly connected to one side of the fan frame (1), a heat dissipation fin (3) is fixedly arranged on the side of the heat dissipation base (4) close to the fan (2), and a heat pipe (5) is fixedly arranged on the side of the heat dissipation base (4) away from the fan (2); The heat pipe (5) is provided in plurality and is made of a high thermal conductivity material and filled with a low boiling point liquid.

2. A computer CPU radiator according to claim 1, characterized in that: The fan frame (1) is provided with fixing holes (6) around its periphery.

3. A computer CPU radiator according to claim 1, characterized in that: The fan (2) has a motor fixedly arranged in the middle thereof, and is surrounded by fan blades (7), wherein a plurality of fan blades (7) are arranged.

4. A computer CPU radiator according to claim 1, characterized in that: A plurality of the heat dissipation fins (3) are provided, gaps are provided between the heat dissipation fins (3), and the heat dissipation fins (3) are made of copper material, and a nano coating is provided on the surface.

5. A computer CPU radiator according to claim 1, characterized in that: The heat dissipation base (4) is made of aluminum material and the surface is coated with thermal silicone grease.

Images