Cooling device and server

Abstract

The utility model relates to a cooling device and a server. The cooling device comprises a cooling part, a radiator, a liquid return pipe assembly and a liquid outlet pipe assembly, the cooling part comprises a shell, a cooling cavity is formed in the shell, a liquid return hole and a liquid outlet hole are formed in the shell, the liquid return hole is communicated with the cooling cavity and one end of a liquid return channel of the liquid return pipe assembly, and the liquid outlet hole is communicated with the cooling cavity and one end of a liquid outlet channel of the liquid outlet pipe assembly. The other end of the liquid return channel and the other end of the liquid outlet channel communicate with the radiator, the horizontal height of the radiator is larger than that of the cooling piece, and at least the cooling cavity is internally provided with a phase change working medium. The horizontal height of the liquid outlet hole is larger than that of the liquid return hole, the end, close to the liquid return hole, of the liquid return channel comprises an auxiliary channel, and the horizontal height of the auxiliary channel is gradually increased in the direction from the liquid return hole to the liquid return channel. Therefore, according to the cooling device and the server provided by the invention, the energy consumption of the cooling device and the server can be reduced.

Description

Technical Field

[0001] The present application relates to the field of cooling technology, and in particular to a cooling device and a server. Background Art

[0002] With the development of artificial intelligence and big data, the amount of computing in data centers has increased dramatically, and the power consumption of heat-generating components such as the central processing unit (CPU), graphics processing unit (GPU), and hard disk in the server has also increased, which has made the traditional air cooling capacity insufficient. Based on this situation, liquid cooling has gradually become the development trend of server cooling.

[0003] In the related art, one of the liquid cooling technologies is to use a liquid cooling plate to cool the heat generating device. The principle is to allow the cooling medium to flow through the channel in the liquid cooling plate, thereby taking away the heat from the surface of the heat generating device. A circulating pump can usually be used as the power source of the cooling medium.

[0004] However, the energy consumption of the above-mentioned circulation pump is relatively high. Summary of the invention

[0005] Based on this, it is necessary to provide a cooling device and a server, which can reduce the energy consumption of the cooling device and the server.

[0006] In a first aspect, an embodiment of the present application provides a cooling device, the cooling device comprising: a cooling element, a radiator and a pipeline assembly, the pipeline assembly comprising a liquid return pipe assembly provided with a liquid return channel and a liquid outlet pipe assembly provided with a liquid outlet channel, the cooling element comprising a shell, a cooling cavity provided in the shell, a liquid return hole and a liquid outlet hole provided on the shell, the liquid return hole connecting the cooling cavity and one end of the liquid return channel, the liquid outlet hole connecting the cooling cavity and one end of the liquid outlet channel, the other end of the liquid return channel and the other end of the liquid outlet channel are both connected to the radiator, the horizontal height of the radiator is greater than the horizontal height of the cooling element, and at least a phase change working medium is provided in the cooling cavity;

[0007] The horizontal height of the liquid outlet hole is greater than that of the liquid return hole. The end of the liquid return channel close to the liquid return hole includes an auxiliary channel. The horizontal height of the auxiliary channel gradually increases from the liquid return hole to the liquid return channel.

[0008] The cooling device provided by the embodiment of the present application has a horizontal height of the radiator greater than the horizontal height of the cooling element, a phase change medium is provided in at least the cooling chamber, and the horizontal height of the liquid outlet is greater than the horizontal height of the liquid return hole, so that the pressure at the liquid outlet is greater than the pressure at the liquid return hole, so that the phase change medium can be spontaneously discharged from the cooling chamber through the liquid outlet, and the phase change medium can spontaneously return to the cooling chamber through the liquid return hole, thereby realizing the self-drive of the phase change medium, thereby eliminating the need to set up a circulating pump, thereby reducing the energy consumption of the cooling device, and reducing the cost and difficulty of maintaining the circulation of the phase change medium. In addition, the liquid return channel includes an auxiliary channel at one end close to the liquid return hole, and the horizontal height of the auxiliary channel gradually increases in the direction from the liquid return hole to the liquid return channel, thereby expanding the horizontal height difference between the liquid return hole and the liquid outlet, thereby better realizing the self-drive of the phase change medium.

[0009] In one of the embodiments, an end of the auxiliary channel close to the liquid return hole is inclined toward the direction of gravity relative to an end of the auxiliary channel away from the liquid return hole.

[0010] Such arrangement makes the arrangement of the auxiliary channel relatively simple, which is conducive to reducing the difficulty of arrangement of the auxiliary channel. For example, the auxiliary channel can be a straight channel.

[0011] In one embodiment, in the same pipeline assembly, the pipeline assembly includes a pipe body and a joint, the joint is arranged at at least one end of the corresponding pipe body in the extension direction, the joint is provided with a first channel, and the pipe body is provided with a second channel;

[0012] In the return liquid pipe assembly, the first channel of the connector and the second channel of the tube body are interconnected and together form a return liquid channel; in the outlet liquid pipe assembly, the first channel of the connector and the second channel of the tube body are interconnected and together form a outlet liquid channel.

[0013] In one of the embodiments, in the liquid return pipe assembly, the joint includes a first joint, the first joint is located between the pipe body and the cooling element, and at least a portion of the first channel of the first joint forms an auxiliary channel.

[0014] Such a setting can expand the horizontal height difference between the return liquid hole and the liquid outlet hole, better realize the self-driving of the phase change working fluid, and also make the total thickness of the end of the return liquid pipe assembly close to the cooling element and the end of the liquid outlet pipe assembly close to the cooling element smaller, which is beneficial to reducing the volume of the cooling device.

[0015] In one of the embodiments, in the same pipeline assembly, the pipeline assembly includes a seal, the joint includes a first extension portion, the seal is arranged around the outside of the first extension portion, the seal and the first extension portion are both inserted into the second channel of the tube body, the seal abuts against the inner surface of the second channel of the tube body, and the size of at least part of the seal gradually decreases along the direction in which the first extension portion is inserted into the tube body.

[0016] Such an arrangement makes it easier to insert the sealing member into the second channel of the tube body and also makes it difficult for the tube body to be separated from the sealing member, thereby facilitating improving the connection stability between the first extension portion and the tube body.

[0017] In one of the embodiments, in the same pipeline assembly, the pipeline assembly includes a first fastener and a second fastener, the joint includes a second extension portion connected to the first extension portion, the second extension portion is located on a side of the first extension portion away from the tube body, the first fastener is arranged on the outer surface of the second extension portion, the size of the first fastener is larger than the size of the seal, a fastening hole is arranged in the second fastener, the fastening holes include a first fastening hole and a second fastening hole that are connected, and the inner surface of the first fastening hole abuts against the tube body outside the seal.

[0018] With such an arrangement, the tube body can be compressed and fixed between the inner surface of the first fastening hole and the sealing member, further preventing the tube body from being separated from the first extension portion, and further improving the connection stability between the tube body and the first extension portion.

[0019] In one embodiment, the fastening holes include a third fastening hole, the third fastening hole is arranged between the first fastening hole and the second fastening hole, and the opening size of the third fastening hole gradually increases along the direction from the first fastening hole to the second fastening hole.

[0020] Such an arrangement enables the inner surface of the third fastening hole to have a guiding function, which is beneficial for the sealing member to enter the first fastening hole through the third fastening hole.

[0021] In one embodiment, the tube body includes a first tube body and a second tube body, the first tube body is sleeved on the outside of the second tube body, and the second channel is located in the second tube body; the rigidity of the first tube body is greater than the rigidity of the second tube body; and / or the second tube body and the phase change working medium are chemically compatible;

[0022] Such an arrangement can extend the service life of the second tube body.

[0023] and / or, the opening size of the liquid outlet hole is larger than the opening size of the liquid return hole;

[0024] and / or, the ratio of the opening size of the liquid outlet hole to the opening size of the liquid return hole is greater than or equal to 3 / 2;

[0025] Such an arrangement makes the opening size of the liquid outlet hole larger, which helps to reduce the resistance of the liquid outlet hole to the gaseous phase change medium when it flows out of the liquid outlet hole, thereby facilitating the self-driving of the phase change medium. In addition, the opening size of the return liquid hole can also be made smaller, thereby providing more setting space for the horizontal height difference between the return liquid hole and the liquid outlet hole, which is conducive to expanding the horizontal height difference between the return liquid hole and the liquid outlet hole, thereby further facilitating the self-driving of the phase change medium.

[0026] And / or, the shell includes a first shell wall and a second shell wall arranged opposite to each other in the direction of gravity, the first shell wall is located on the side of the second shell wall facing the direction of gravity, a plurality of heat sinking fins are arranged in the cooling cavity, one end of the plurality of heat sinking fins are connected to the second shell wall, and the other end of the plurality of heat sinking fins have a gap with the first shell wall; a device bearing surface is formed on the outer surface of the second shell wall; and / or, the ratio of the thickness of the heat sinking fins along the direction from the first shell wall to the second shell wall to the gap is in the range of 8-10.

[0027] With such arrangement, the heat dissipation fins can increase the heat dissipation efficiency of the second shell wall, thereby better dissipating the heat of the heating device on the second shell wall.

[0028] In one embodiment, a connecting channel and a plurality of heat dissipation channels are provided in the radiator, the plurality of heat dissipation channels are arranged along a first direction and extend along a second direction, the plurality of heat dissipation channels include a plurality of first heat dissipation channels and a plurality of second heat dissipation channels, one end of the plurality of first heat dissipation channels are connected to a liquid outlet channel, one end of the plurality of second heat dissipation channels are connected to a liquid return channel, the other end of the plurality of first heat dissipation channels and the other end of the plurality of second heat dissipation channels are connected to the connecting channel, and the first direction and the second direction are different;

[0029] The total volume of the plurality of first heat dissipation channels is greater than the total volume of the plurality of second heat dissipation channels;

[0030] Such an arrangement can make the total volume of the plurality of first heat dissipation channels larger, so that the plurality of first heat dissipation channels can accommodate more gaseous phase-change working fluids (due to the larger volume of the gaseous phase-change working fluids).

[0031] And / or, a liquid injection hole is provided on the radiator, and the orifices at both ends of the liquid injection hole include a first orifice and a second orifice, the first orifice is located on the outer surface of the radiator, and the second orifice is connected to at least one of the heat dissipation channel and the connecting channel, the cooling device includes a control component, and a one-way valve and a pressure sensor are provided at the liquid injection hole, the one-way valve and the pressure sensor are both electrically connected to the control component, the pressure sensor is used to detect the pressure in the radiator, and the control component is configured to open the one-way valve when the pressure value obtained by the pressure sensor is greater than a preset pressure.

[0032] With such an arrangement, when the pressure of the cooling device is too high, the control component can open the one-way valve to discharge the gas, thereby solving the problem of excessive pressure in a small cavity and achieving self-regulation of pressure.

[0033] In a second aspect, an embodiment of the present application provides a server, comprising a heat generating device and the cooling device of the first aspect, wherein the heat generating device is in thermal contact with a cooling element of the cooling device.

[0034] The server provided in the embodiment of the present application includes a cooling device, wherein the horizontal height of the radiator is greater than the horizontal height of the cooling element, a phase change medium is provided in at least the cooling chamber, and the horizontal height of the liquid outlet is greater than the horizontal height of the liquid return hole, so that the pressure at the liquid outlet is greater than the pressure at the liquid return hole, so that the phase change medium can be spontaneously discharged from the cooling chamber through the liquid outlet, and the phase change medium can spontaneously return to the cooling chamber through the liquid return hole, thereby realizing the self-driving of the phase change medium, thereby eliminating the need to set up a circulating pump, thereby reducing the energy consumption of the cooling device, and reducing the cost and difficulty of maintaining the circulation of the phase change medium. In addition, the liquid return channel includes an auxiliary channel at one end close to the liquid return hole, and the horizontal height of the auxiliary channel gradually increases in the direction from the liquid return hole to the liquid return channel, thereby expanding the horizontal height difference between the liquid return hole and the liquid outlet, thereby better realizing the self-driving of the phase change medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of a cooling device provided in an embodiment of the present application.

[0036] Figure 2 Another schematic diagram of the structure of the cooling device provided in an embodiment of the present application.

[0037] Figure 3 Another schematic diagram of the structure of the cooling device provided in an embodiment of the present application.

[0038] Figure 4 A cross-sectional view of a cooling element, a circuit board, a heating element, and a protective ring provided in an embodiment of the present application.

[0039] Figure 5 A schematic diagram of the structure of the cooling component and circuit board provided in the embodiment of the present application.

[0040] Figure 6 A schematic diagram of the structure of a cooling element and a portion of a piping assembly provided in an embodiment of the present application.

[0041] Figure 7 Another schematic diagram of the structure of the cooling element and a part of the piping assembly provided in an embodiment of the present application.

[0042] Figure 8 for Figure 7 A partial enlarged schematic diagram of .

[0043] Fig. 9 A cross-sectional view of a cooling element and a portion of a piping assembly provided in an embodiment of the present application.

[0044] Fig.10 Another cross-sectional view of a cooling element and a portion of a piping assembly provided in an embodiment of the present application.

[0045] Fig.11 A cross-sectional view of a portion of a tube body provided in an embodiment of the present application.

[0046] Description of reference numerals: 100, cooling device; 101, cooling element; 110, housing; 111, first housing wall; 112, second housing wall; 113, third housing wall; 114, cooling chamber; 115, liquid return hole; 116, liquid outlet hole; 120, radiator; 121, first heat dissipation part; 122, second heat dissipation part; 123, third heat dissipation part; 124, liquid injection hole; 130, pipeline assembly; 131, liquid return pipe assembly; 1311, liquid return channel; 1312, auxiliary channel; 132, liquid outlet pipe assembly; 1321, liquid outlet channel; 133, pipe body; 1331, first pipe body; 133 2. Second tube body; 135. Joint; 1351. First extension portion; 1352. Second extension portion; 135a. First joint; 1361. First channel; 1362. Second channel; 137. Sealing member; 1381. First fastener; 1382. Second fastener; 1383. Fastening hole; 1383a. First fastening hole; 1383b. Second fastening hole; 1383c. Third fastening hole; 141. First heat sink fin; 150. Protective shell; 160. Fan; 170. Heat conductor; 210. Heat generating device; 220. Circuit board; 230. Connector; 240. Protective ring. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0049] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0053] In the related art, the cooling device may include a liquid cooling plate and a GPU chip, and the GPU chip and the liquid cooling plate are in thermal contact. The liquid cooling plate is a single-phase liquid cooling plate. Since the single-phase liquid cooling cannot provide a return pressure difference, the cooling medium cannot be self-driven and cannot generate heat exchange. A circulating pump needs to be set to provide power for the cooling medium so that the cooling medium flows and takes away the heat on the liquid cooling plate, thereby achieving heat dissipation for the GPU chip.

[0054] However, single-phase liquid cooling has a problem of accumulation, and the circulating pump usually supplies liquid based on the working condition that all servers are running at full load, which makes the circulating pump run at a higher power for a long time and consumes more energy. In addition, the application scenario of workstations cannot provide a large infrastructure (such as cooling distribution devices) for liquid supply, resulting in high costs and difficulties in ensuring liquid flow.

[0055] In order to solve the above problems, the embodiment of the present application provides a cooling device and a server, wherein the horizontal height of the radiator is greater than the horizontal height of the cooling element, a phase change medium is provided in at least the cooling chamber, and the horizontal height of the liquid outlet is greater than the horizontal height of the liquid return hole, so that the pressure at the liquid outlet is greater than the pressure at the liquid return hole, so that the phase change medium can be spontaneously discharged from the cooling chamber through the liquid outlet, and the phase change medium can spontaneously return to the cooling chamber through the liquid return hole, thereby realizing the self-driving of the phase change medium, thereby eliminating the need to set up a circulating pump, thereby reducing the energy consumption of the cooling device, and reducing the cost and difficulty of maintaining the circulation of the phase change medium. In addition, the liquid return channel includes an auxiliary channel at one end close to the liquid return hole, and the horizontal height of the auxiliary channel gradually increases in the direction from the liquid return hole to the liquid return channel, thereby expanding the horizontal height difference between the liquid return hole and the liquid outlet, thereby better realizing the self-driving of the phase change medium.

[0056] The following will be combined Figure 1-Figure 11 The server provided in the embodiment of the present application is described.

[0057] The present application embodiment provides a server, see Figure 1 and Figure 4 The server may include a heating device 210 and a cooling device 100 . The heating device 210 is in thermal contact with a cooling member 101 of the cooling device 100 . The cooling member 101 may take away the heat of the heating device 210 , thereby achieving heat dissipation of the heating device 210 .

[0058] Exemplarily, the heating device 210 may include a hard disk or a chip, etc. The chip may include a CPU chip, a GPU chip, etc. The embodiment of the present application is described by taking a GPU chip as an example.

[0059] For example, see Figure 4 and Figure 5 The server may include a circuit board 220, the circuit board 220 may be disposed on a side of the GPU chip away from the cooling element 101, and the GPU chip may be electrically connected to the circuit board 220. For example, a connector 230 may be disposed between the circuit board 220 and the cooling element 101, and the circuit board 220 and the cooling element 101 are connected through the connector 230. For example, the connector 230 may be a screw or a rivet. For example, the number of the connectors 230 may be multiple.

[0060] For example, see Figure 4The server may include a protective ring 240 , which may be disposed around the outer periphery of the heating device 210 , and the protective ring 240 may be connected to the circuit board 220 , and the protective ring 240 may alleviate deformation of the heating device 210 caused by heat.

[0061] The cooling device 100 provided in an embodiment of the present application is described below.

[0062] See also Figure 4 and Figure 6 An embodiment of the present application provides a cooling device 100, which may include a cooling element 101. The cooling element 101 includes a shell 110, in which a cooling chamber 114 is provided. The shell 110 is provided with a return liquid hole 115 and a liquid outlet hole 116. At least a phase change medium is provided in the cooling chamber 114. The liquid outlet hole 116 is used to supply the phase change medium to discharge from the cooling chamber 114, and the return liquid hole 115 is used to supply the phase change medium to input into the cooling chamber 114.

[0063] Exemplarily, the heat of the heating device 210 is transferred to the cooling element 101, so that the phase change medium in the cooling cavity 114 absorbs heat and then vaporizes, thereby causing part of the liquid phase change medium to be converted into a gas phase change medium. Due to the difference in molecular lift caused by the density difference between the gas phase change medium and the liquid phase change medium, the level of the gas phase change medium will be greater than the level of the liquid phase change medium. The pressure of the cooling cavity 114 at the gas phase change medium is greater than the pressure of the cooling cavity 114 at the liquid phase change medium, and the outlet hole 116 is The horizontal height is set to be greater than the horizontal height of the liquid return hole 115, which is conducive to the pressure at the liquid outlet hole 116 being greater than the pressure at the liquid return hole 115, so that the high-pressure gas phase change medium can be discharged from the cooling chamber 114 through the liquid outlet hole 116, and the liquid phase change medium can be input into the cooling chamber 114 through the liquid return hole 115, so as to realize the self-driving of the phase change medium, thereby eliminating the need to set a circulating pump, so as to reduce the energy consumption of the cooling device 100, reduce the cost and difficulty of maintaining the circulation flow of the phase change medium, and also reduce the noise of the cooling device 100. For example, the cooling device 100 can be applied to the GPU double-width form application scenario, and solve the height difference problem between the liquid outlet hole 116 and the liquid return hole 115 in the GPU double-width form. Among them, the heating device 210 transfers heat to the phase change medium in the cooling chamber 114, so that the phase change medium in the cooling chamber 114 vaporizes and produces a pressure reaction, which can play a role in pressurization.

[0064] Exemplarily, the phase change working fluid may include fluorinated liquid or other materials.

[0065] The cooling element 101 provided in the embodiment of the present application is described below.

[0066] In some embodiments, see Figure 4 and Figure 7The housing 110 may include a first housing wall 111 and a second housing wall 112 that are arranged opposite to each other in the direction of gravity, and the first housing wall 111 is located on the side of the second housing wall 112 that faces the direction of gravity. The third housing wall 113 is located between the first housing wall 111 and the second housing wall 112. For example, a device bearing surface may be formed on the outer surface of the second housing wall 112, and the device bearing surface may be used to set a heating device 210, and the device bearing surface may be used to directly or indirectly thermally contact the heating device 210. At this time, the heating device 210 is arranged on the top surface of the cooling member 101, which is convenient for observing, maintaining, and other operations on the heating device 210. For example, the device bearing surface may be in indirect thermal contact with the heating device 210 through the heat conducting member 170. Alternatively, a device bearing surface may be formed on the outer surface of the first housing wall 111, and at this time, the heating device 210 is arranged on the bottom surface of the cooling member 101.

[0067] In the embodiment where the outer surface of the second shell wall 112 is formed with a device bearing surface, a plurality of first heat sink fins 141 may be provided in the cooling cavity 114, one end of each of the plurality of first heat sink fins 141 is connected to the second shell wall 112, and the other end of each of the plurality of first heat sink fins 141 has a first gap with the first shell wall 111, and the first heat sink fins 141 may increase the heat dissipation efficiency of the second shell wall 112, thereby better dissipating the heat of the heating device 210 on the second shell wall 112. At this time, the entire GPU card processes the inverse gravity state, but due to the horizontal height difference between the liquid outlet 116 and the liquid return hole 115, the first heat sink fins 141 are provided to ensure the continuity of the liquid return, so that the temperature of the GPU chip can be quickly taken away.

[0068] Exemplarily, the ratio of the thickness of the first heat sink fin 141 along the direction from the first shell wall 111 to the second shell wall 112 to the first gap can be in the range of 8-10, so as to avoid the ratio being too small so that the first heat sink fin 141 is not easy to contact with the liquid phase change medium, and to avoid the ratio being too large so that the first gap is too small, so as to avoid the first heat sink fin 141 from generating a large flow resistance to the liquid phase change medium, so as to ensure the continuity of the flow of the phase change medium. For example, the ratio can be 8, 8.5, 9, 9.5, 10 or any value between 8 and 10.

[0069] In an embodiment in which a device bearing surface is formed on the outer surface of the first shell wall 111, a plurality of first heat sink fins 141 may be provided in the cooling cavity 114, one end of each of the plurality of first heat sink fins 141 may be connected to the first shell wall 111, and the other end of each of the plurality of first heat sink fins 141 may have a second gap with the second shell wall 112. The first heat sink fins 141 may increase the heat dissipation efficiency of the first shell wall 111, thereby better dissipating the heat of the heating device 210 on the first shell wall 111.

[0070] Exemplarily, the material of at least one of the first shell wall 111 and the second shell wall 112 may include metal materials such as copper and aluminum. In an embodiment in which a device bearing surface is formed on the outer surface of the first shell wall 111, the first shell wall 111 may be a solid plate (such as a copper plate), or the first shell wall 111 may be a temperature averaging plate. In an embodiment in which a device bearing surface is formed on the outer surface of the second shell wall 112, the second shell wall 112 may be a solid plate (such as a copper plate), or the second shell wall 112 may be a temperature averaging plate, which may further improve the heat dissipation effect of the cooling element 101.

[0071] Exemplarily, the opening size of the liquid outlet hole 116 can be larger than the opening size of the liquid return hole 115, so that the opening size of the liquid outlet hole 116 is larger, which helps to reduce the resistance of the liquid outlet hole 116 to the gaseous phase change medium flowing out of the liquid outlet hole 116, thereby facilitating the self-driving of the phase change medium. In addition, the opening size of the liquid return hole 115 can also be made smaller, thereby providing more setting space for the horizontal height difference between the liquid return hole 115 and the liquid outlet hole 116, which is conducive to expanding the horizontal height difference between the liquid return hole 115 and the liquid outlet hole 116, thereby further facilitating the self-driving of the phase change medium.

[0072] Exemplarily, the ratio of the opening size of the liquid outlet hole 116 to the opening size of the liquid return hole 115 may be greater than or equal to 3 / 2, so as to better reduce the resistance of the liquid outlet hole 116 to the gas phase change medium flowing out of the liquid outlet hole 116, and better expand the horizontal height difference between the liquid return hole 115 and the liquid outlet hole 116. For example, the ratio may be 3 / 2, 2, 3, or any value greater than 3 / 2.

[0073] Exemplarily, at least one of the liquid return hole 115 and the liquid inlet hole may be in a circular, elliptical, polygonal, semicircular or other shapes. For example, the liquid outlet hole 116 may be circular, and the liquid return hole 115 may be semicircular.

[0074] In some embodiments, see Figure 2 and Figure 3 The cooling device 100 may include a radiator 120 and two pipe assemblies 130. The two pipe assemblies 130 may be a liquid return pipe assembly 131 and a liquid outlet pipe assembly 132. The liquid return pipe assembly 131 is provided with a liquid return channel 1311 ( Fig.10 ), the liquid outlet pipe assembly 132 is provided with a liquid outlet channel 1321 ( Fig. 9 ), the liquid return hole 115 connects the cooling chamber 114 with one end of the liquid return channel 1311, the liquid outlet hole 116 connects the cooling chamber 114 with one end of the liquid outlet channel 1321, the other end of the liquid return channel 1311 and the other end of the liquid outlet channel 1321 are both connected to the radiator 120, and the phase change working medium in the cooling chamber 114 can be sequentially connected through the liquid outlet hole 116 ( Figure 6), the liquid outlet pipe assembly 132, the radiator 120, the liquid return pipe assembly 131 and the liquid return hole 115 ( Figure 6 ) returns to the cooling chamber 114, realizing the self-circulating flow of the phase-change working medium in the cooling device 100.

[0075] Exemplarily, the horizontal height of the radiator 120 may be greater than the horizontal height of the cooling element 101 , thereby facilitating the phase-change medium to return from the radiator 120 to the cooling chamber 114 through the liquid return pipe assembly 131 and the liquid return hole 115 under the action of gravity.

[0076] For example, see Fig.10 The end of the return liquid channel 1311 close to the return liquid hole 115 includes an auxiliary channel 1312, and the horizontal height of the auxiliary channel 1312 gradually increases from the return liquid hole 115 to the return liquid channel 1311, thereby expanding the horizontal height difference between the return liquid hole 115 and the liquid outlet hole 116, and better realizing the self-driving of the phase change working fluid.

[0077] Exemplarily, one end of the auxiliary channel 1312 close to the liquid return hole 115 is tilted toward the gravity direction relative to the end of the auxiliary channel 1312 away from the liquid return hole 115, so that the auxiliary channel 1312 is arranged in a simpler manner, which is conducive to reducing the difficulty of setting the auxiliary channel 1312. For example, the auxiliary channel 1312 can be a linear channel.

[0078] In other examples, the auxiliary channel 1312 may be an arc-shaped channel.

[0079] The heat sink 120 provided in the embodiment of the present application is described below.

[0080] In some embodiments, see Figure 3 The radiator 120 includes a first heat dissipation portion 121, a second heat dissipation portion 122 and a third heat dissipation portion 123. The first heat dissipation portion 121 and the second heat dissipation portion 122 are arranged adjacent to each other, and the third heat dissipation portion 123 is located on the same side of the first heat dissipation portion 121 and the second heat dissipation portion 122. A connecting channel and a plurality of heat dissipation channels are provided in the radiator 120. The plurality of heat dissipation channels are arranged along a first direction, and the plurality of heat dissipation channels all extend along a second direction. The first direction and the second direction are different. For example, the first direction and the second direction may be perpendicular to each other. The plurality of heat dissipation channels include a plurality of first heat dissipation channels arranged in the first heat dissipation portion 121, the plurality of heat dissipation channels include a plurality of second heat dissipation channels arranged in the second heat dissipation portion 122, and the connecting channel is arranged in the third heat dissipation portion 123. One end of each of the plurality of first heat dissipation channels is connected to the liquid outlet channel 1321 ( Fig. 9) is connected, the gas phase change medium enters the first heat dissipation channel through the liquid outlet channel 1321, and performs heat exchange with the first heat dissipation channel to reduce the temperature of the phase change medium. One end of each of the multiple second heat dissipation channels is connected to the return liquid channel 1311, and the other ends of the multiple first heat dissipation channels and the other ends of the multiple second heat dissipation channels are connected to the connecting channel. The phase change medium enters the second heat dissipation channel from the first heat dissipation channel through the connecting channel, and continuously reduces the temperature and liquefies into a liquid phase change medium. The liquid phase change medium passes through the return liquid channel 1311 ( Fig.10 ) and then returns to the cooling chamber 114, thereby realizing self-driving of the phase change medium to achieve self-circulating flow.

[0081] For example, the first direction may be the length direction of the heat sink 120, and the second direction may be the width direction of the heat sink 120. The length, width, and thickness in the embodiments of the present application are only for the convenience of description and do not mean any limitation on the size. For example, the width may be greater than, equal to, or less than the length. For example, at least one of the first direction and the second direction may be parallel to the horizontal direction.

[0082] For example, see Figure 3 and Figure 4 The heat dissipation process of the GPU chip can be as follows: the heat of the GPU chip is transferred to the cooling element 101 through the heat conducting element 170 under the joint action of the connecting element 230, the circuit board 220 and the heat conducting element 170, and then the heat is transferred to the first heat dissipation fin 141, the phase change medium in the cooling cavity 114 reaches the phase change point (e.g., boiling), part of the phase change medium undergoes a liquid-gas change, and the gas phase change medium is subjected to the lift caused by the density difference, and the gas phase change medium is discharged through the liquid outlet 116 ( Figure 6 ) escapes, and at the same time drives the heated phase-change medium to flow. The heated phase-change medium overcomes gravity and flows through the liquid outlet pipe assembly 132, and then sequentially passes through the first heat dissipation channel and the second heat dissipation channel for heat exchange. The phase-change medium undergoes sufficient heat exchange at the radiator 120, and the heat of the second heat dissipation fin after being evenly heated is dissipated under the action of natural convection. The fully cooled phase-change medium is driven by gravity and pressure to pass through the return liquid pipe assembly 131 and reach the cooling element 101. The cooled phase-change medium is used for boiling and circulating medium replenishment in the cooling chamber 114, and this cycle repeats. Heat always passes through the first heat dissipation channel and the second heat dissipation channel. The phase-change medium that has passed through the radiator 120 exchanges heat through the heat dissipation channel and the second heat dissipation fins arranged between two adjacent heat dissipation channels.

[0083] For example, since the gas phase change medium in the first heat dissipation channel is larger than that in the second heat dissipation channel, the total volume of the multiple first heat dissipation channels can be set to be larger than the total volume of the multiple second heat dissipation channels, so that the total volume of the multiple first heat dissipation channels can be larger, so that the multiple first heat dissipation channels can accommodate more gas phase change medium (due to the larger volume of the gas phase change medium). In addition, the total volume of the multiple second heat dissipation channels can be smaller, which can better meet the volume requirements of the liquid phase change medium, which is conducive to reducing the volume of the radiator 120, thereby helping to reduce the weight and cost of the radiator 120. At this time, the volume of the first heat dissipation portion 121 can be larger than the volume of the second heat dissipation portion 122.

[0084] For example, see Figure 1 The radiator 120 may be provided with a liquid injection hole 124, which may be used to replenish the phase-change working fluid. For example, when the phase-change working fluid is reduced due to a long-term micro-leakage problem, the phase-change working fluid may be replenished through the liquid injection hole 124. The orifices at both ends of the liquid injection hole 124 include a first orifice and a second orifice. The first orifice is located on the outer surface of the radiator 120, and the first orifice is communicated with the external environment. The second orifice is communicated with at least one of the heat dissipation channel and the connection channel, so that the phase-change working fluid can be replenished in the radiator 120 through the liquid injection hole 124.

[0085] Exemplarily, the cooling device 100 includes a control component, and a one-way valve and a pressure sensor may be provided at the injection hole 124. The one-way valve and the pressure sensor are both electrically connected to the control component. The pressure sensor is used to detect the pressure of the heat dissipation channel and / or the connecting channel in the radiator 120. The control component is configured to control the one-way valve to open when the pressure value obtained by the pressure sensor is greater than the preset pressure, so that the one-way valve discharges the gas in the radiator 120, thereby reducing the pressure in the radiator 120, so that the injection hole 124 can have the function of regulating the system pressure. When the system pressure is too high, the control component can open the one-way valve to discharge the gas, solve the problem of excessive pressure under a small cavity, and realize self-regulation of pressure. In addition, the one-way valve allows the gas to be discharged from the injection hole 124 of the radiator 120, and does not allow the gas from the external environment to enter the radiator 120 from the injection hole 124, thereby solving the problem of air mixing during exhaust. The pressure in the radiator 120 can be greater than the pressure of the external environment, thereby further preventing the problem of air mixing during exhaust.

[0086] For example, see Figure 1The outer surface of the radiator 120 may be provided with a fan 160, and the wind flow provided by the fan 160 may take away the heat on the radiator 120, thereby accelerating the cooling of the phase change medium in the radiator 120. For example, the length and width of the fan 160 may be 120 mm, and the thickness may be 25 mm. For example, the fan 160 may be provided on the top surface or the bottom surface of the radiator 120, so that convection heat exchange may be performed. For example, the fan 160 may be a low-noise fan.

[0087] Exemplarily, the size of the heat sink 120 can be adjusted according to the heat of the GPU chip. For example, the size of the heat sink 120 can be defined as 50 W / L.

[0088] The pipeline assembly 130 provided in the embodiment of the present application is described below.

[0089] In some embodiments, see Fig. 9 and Fig.10 In the same pipeline assembly 130, the pipeline assembly 130 includes a pipe body 133 and a joint 135, the joint 135 is arranged at at least one end of the extension direction of the pipe body 133, the joint 135 is provided with a first channel 1361, and the pipe body 133 is provided with a second channel 1362. Fig.10 In the liquid return pipe assembly 131, the first channel 1361 of the joint 135 and the second channel 1362 of the pipe body 133 are connected to each other and together form a liquid return channel 1311. Fig. 9 In the liquid outlet pipe assembly 132 , the first channel 1361 of the joint 135 and the second channel 1362 of the tube body 133 are connected to each other and together form a liquid outlet channel 1321 .

[0090] For example, see Fig. 9 and Fig.10 In the same pipe assembly 130, the pipe body 133 can be connected to the cooling member 101 through the joint 135, thereby reducing the difficulty of connecting the pipe body 133 to the cooling member 101. Alternatively, the pipe body 133 can be connected to the radiator 120 through the joint 135, thereby reducing the difficulty of connecting the pipe body 133 to the radiator 120. Alternatively, the pipe body 133 can be connected to the cooling member 101 through one joint 135, and the pipe body 133 can be connected to the radiator 120 through another joint 135.

[0091] In some embodiments, see Fig.10In the liquid return pipe assembly 131, the joint 135 includes a first joint 135a, and the first joint 135a is located between the tube body 133 and the cooling element 101. The tube body 133 and the cooling element 101 are connected through the first joint 135a. In addition, the joint 135 may include a second joint, and the radiator 120 and the tube body 133 are connected through the second joint. At least one of the first joint 135a and the second joint may be set in the liquid return pipe assembly 131.

[0092] For example, see Fig.10 In the liquid return pipe assembly 131, at least part of the first channel 1361 of the first joint 135a can form an auxiliary channel 1312, thereby expanding the horizontal height difference between the liquid return hole 115 and the liquid outlet hole 116, better realizing the self-driving of the phase change working medium, and also making the total thickness of the end of the liquid return pipe assembly 131 close to the cooling element 101 and the end of the liquid outlet pipe assembly 132 close to the cooling element 101 smaller, which is beneficial to reducing the volume of the cooling device 100.

[0093] In some embodiments, in the liquid outlet pipe assembly 132, the joint 135 includes a third joint, the third joint is located between the tube body 133 and the cooling member 101, and the tube body 133 and the cooling member 101 are connected via the third joint. In addition, the joint 135 may include a fourth joint, and the radiator 120 and the tube body 133 are connected via the fourth joint. At least one of the third joint and the fourth joint may be set in the liquid outlet pipe assembly 132.

[0094] In some embodiments, see Fig. 9 and Fig.10 In the same pipeline assembly 130, the pipeline assembly 130 may include a seal 137, and the joint 135 may include a first extension portion 1351. The seal 137 is arranged on the outside of the first extension portion 1351. The seal 137 and the first extension portion 1351 are both inserted into the second channel 1362 of the tube body 133. The seal 137 abuts against the inner surface of the second channel 1362 of the tube body 133 (i.e., interference fit). The seal 137 can seal between the first extension portion 1351 and the tube body 133, thereby preventing leakage of the phase change working fluid.

[0095] For example, in the same pipeline assembly 130, see Fig. 9 and Fig.10 , at least part of the sealing member 137 has a size along the direction in which the first extension portion 1351 is inserted into the tube body 133 (i.e. Fig. 9The direction A) in the figure gradually decreases, so that the sealing member 137 is easier to insert into the second channel 1362 of the tube body 133, and the tube body 133 is not easily separated from the sealing member 137, which is beneficial to improve the connection stability between the first extension portion 1351 and the tube body 133. For example, under the action of the sealing member 137, the tube body 133 can be expanded, so that the abutment between the tube body 133 and the sealing member 137 is tighter.

[0096] Exemplarily, in the same pipeline assembly 130, the number of seals 137 can be at least one. When the number of seals 137 is multiple, the multiple seals 137 can be arranged at intervals along the direction in which the first extension portion 1351 is inserted into the tube body 133. In this way, the sealing effect and the anti-separation effect of the multiple seals 137 are better.

[0097] It can be understood that a seal 137 may be provided on the outer surface of at least one of the first joint 135 a , the second joint, the third joint, and the fourth joint.

[0098] In some embodiments, see Figure 8 and Fig. 9 In the same pipeline assembly 130, the pipeline assembly 130 may include a first fastener 1381 and a second fastener 1382, the joint 135 may include a second extension 1352, the second extension 1352 may be connected to the first extension 1351, the second extension 1352 may be located on a side of the first extension 1351 away from the tube body 133, the first fastener 1381 may be disposed on an outer surface of the second extension 1352, the size of the first fastener 1381 may be larger than the size of the seal 137, and the second A fastening hole 1383 is provided in the fastener 1382, and the fastening hole 1383 includes a first fastening hole 1383a and a second fastening hole 1383b that are connected. The inner surface of the first fastening hole 1383a abuts against the tube body 133 outside the sealing member 137, so that the tube body 133 can be pressed and fixed between the inner surface of the first fastening hole 1383a and the sealing member 137, further preventing the tube body 133 from separating from the first extension portion 1351, and further improving the connection stability between the tube body 133 and the first extension portion 1351. The inner surface of the second fastening hole 1383b may be provided with an internal thread, and the outer surface of the first fastener 1381 may be provided with an external thread, and the internal thread and the external thread are connected, so that the second fastener 1382 can be detachably connected to the joint 135, thereby reducing the difficulty of disassembly and assembly of the second fastener 1382, and facilitating the maintenance and replacement of the pipeline assembly 130. In addition, through the cooperation of the seal 137 and the second fastener 1382, double leakage protection of the tube body 133 can be achieved.

[0099] It can be understood that the outer surface of at least one of the first joint 135a, the second joint, the third joint and the fourth joint can be provided with a first fastener 1381 and a second fastener 1382.

[0100] In some embodiments, see Fig. 9 In the same pipeline assembly 130, the fastening hole 1383 may include a third fastening hole 1383c, and the third fastening hole 1383c may be arranged between the first fastening hole 1383a and the second fastening hole 1383b. The opening size of the third fastening hole 1383c gradually increases along the direction from the first fastening hole 1383a to the second fastening hole 1383b, so that the inner surface of the third fastening hole 1383c can have a guiding effect, which is conducive to allowing the seal 137 to enter the first fastening hole 1383a through the third fastening hole 1383c.

[0101] For example, see Fig.10 The joint 135 may further include a third extension portion 1353, and the third extension portion 1353 is located on a side of the second extension portion 1352 away from the first extension portion 1351. For example, the auxiliary channel 1312 may be provided in the third extension portion 1353 of the first joint 135a.

[0102] In some embodiments, see Fig.11 The tube body 133 may include a first tube body 1331 and a second tube body 1332. The first tube body 1331 and the second tube body 1332 extend in the same direction, and the first tube body 1331 is sleeved on the outer side of the second tube body 1332. The first tube body 1331 is an outer tube body, the second tube body 1332 is an inner tube body, and the second channel 1362 may be located in the second tube body 1332. The rigidity of the first tube body 1331 may be greater than the rigidity of the second tube body 1332. In this way, the rigidity of the first tube body 1331 is large, so that the tube body 133 can be better protected. The rigidity of the second tube body 1332 is small, which is conducive to increasing the deformation of the second tube body 1332 under the contact of the seal 137, so that the contact between the second tube body 1332 and the seal 137 is tighter, and the sealing effect of the seal 137 is better improved.

[0103] Exemplarily, the second tube 1332 and the phase change medium may have chemical compatibility. When the second tube 1332 is in contact with the phase change medium, if the elements of the two do not change, they are considered to be compatible, and if the substances undergo physical or chemical changes (for example, the phase change medium corrodes the second tube 1332), they are considered to be chemically incompatible. Therefore, when the second tube 1332 and the phase change medium have chemical compatibility, the service life of the second tube 1332 can be extended. For example, the material of the second tube 1332 can be a polymer material.

[0104] Exemplarily, the first tube body 1331 and the second tube body 1332 may be formed of a transparent material, so as to facilitate observation of the phase-change medium.

[0105] In some embodiments, see Figure 1 and Figure 4 The cooling device 100 may include a protective shell 150 having an accommodating cavity, and the cooling element 101, the heating element 210, a portion of the liquid outlet pipe assembly 132, a portion of the liquid return pipe assembly 131, the circuit board 220, the connecting element 230, the protective ring 240 and the heat conducting element 170 may all be arranged in the accommodating cavity.

[0106] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A cooling device, characterized in that: The cooling device comprises: a cooling element, a radiator and a pipeline assembly, the pipeline assembly comprises a liquid return pipe assembly provided with a liquid return channel and a liquid outlet pipe assembly provided with a liquid outlet channel, the cooling element comprises a shell, a cooling cavity is provided in the shell, a liquid return hole and a liquid outlet hole are provided on the shell, the liquid return hole is connected to the cooling cavity and one end of the liquid return channel, the liquid outlet hole is connected to the cooling cavity and one end of the liquid outlet channel, the other end of the liquid return channel and the other end of the liquid outlet channel are both connected to the radiator, the horizontal height of the radiator is greater than the horizontal height of the cooling element, and at least a phase change working medium is provided in the cooling cavity; The horizontal height of the liquid outlet hole is greater than that of the liquid return hole. The liquid return channel includes an auxiliary channel at one end close to the liquid return hole. The horizontal height of the auxiliary channel gradually increases from the liquid return hole to the liquid return channel.

2. The cooling device according to claim 1, characterized in that: An end of the auxiliary channel close to the liquid return hole is inclined toward the direction of gravity relative to an end of the auxiliary channel away from the liquid return hole.

3. The cooling device according to claim 1 or 2, characterized in that: In the same pipeline assembly, the pipeline assembly includes a pipe body and a joint, the joint is arranged at at least one end of the corresponding pipe body in the extension direction, the joint is provided with a first channel, and the pipe body is provided with a second channel; In the liquid return pipe assembly, the first channel of the connector and the second channel of the tube body are interconnected and together form the liquid return channel; in the liquid outlet pipe assembly, the first channel of the connector and the second channel of the tube body are interconnected and together form the liquid outlet channel.

4. The cooling device according to claim 3, characterized in that: In the liquid return pipe assembly, the joint includes a first joint, the first joint is located between the pipe body and the cooling element, and at least a portion of the first channel of the first joint forms the auxiliary channel.

5. The cooling device according to claim 3, characterized in that: In the same pipeline assembly, the pipeline assembly includes a seal, the joint includes a first extension portion, the seal is arranged around the outside of the first extension portion, the seal and the first extension portion are both inserted into the second channel of the tube body, the seal abuts against the inner surface of the second channel of the tube body, and the size of at least part of the seal gradually decreases along the direction in which the first extension portion is inserted into the tube body.

6. The cooling device according to claim 5, characterized in that: In the same pipeline assembly, the pipeline assembly includes a first fastener and a second fastener, the joint includes a second extension portion connected to the first extension portion, the second extension portion is located on a side of the first extension portion away from the tube body, the first fastener is arranged on the outer surface of the second extension portion, the size of the first fastener is larger than the size of the seal, a fastening hole is arranged in the second fastener, the fastening hole includes a first fastening hole and a second fastening hole that are connected, and the inner surface of the first fastening hole abuts against the tube body outside the seal.

7. The cooling device according to claim 6, characterized in that: The fastening holes include a third fastening hole, the third fastening hole is arranged between the first fastening hole and the second fastening hole, and an opening size of the third fastening hole gradually increases along a direction from the first fastening hole to the second fastening hole.

8. The cooling device according to claim 3, characterized in that: The tube body comprises a first tube body and a second tube body, the first tube body is sleeved on the outside of the second tube body, and the second channel is located in the second tube body; the rigidity of the first tube body is greater than the rigidity of the second tube body; and / or the second tube body and the phase change working medium are chemically compatible; And / or, the opening size of the liquid outlet hole is larger than the opening size of the liquid return hole; and / or, the ratio of the opening size of the liquid outlet hole to the opening size of the liquid return hole is greater than or equal to 3 / 2; And / or, the shell includes a first shell wall and a second shell wall arranged opposite to each other in the direction of gravity, the first shell wall is located on the side of the second shell wall facing the direction of gravity, a plurality of heat dissipation fins are arranged in the cooling cavity, one end of the plurality of heat dissipation fins are connected to the second shell wall, and the other end of the plurality of heat dissipation fins have a gap with the first shell wall; a device bearing surface is formed on the outer surface of the second shell wall; and / or, the ratio of the thickness of the heat dissipation fins along the direction from the first shell wall to the second shell wall to the gap is in the range of 8-10.

9. The cooling device according to claim 1 or 2, characterized in that: The radiator is provided with a connecting channel and a plurality of heat dissipation channels, the plurality of heat dissipation channels are arranged along a first direction and extend along a second direction, the plurality of heat dissipation channels include a plurality of first heat dissipation channels and a plurality of second heat dissipation channels, one end of the plurality of first heat dissipation channels are communicated with the liquid outlet channel, one end of the plurality of second heat dissipation channels are communicated with the liquid return channel, the other end of the plurality of first heat dissipation channels and the other end of the plurality of second heat dissipation channels are communicated with the connecting channel, and the first direction and the second direction are different; The total volume of the multiple first heat dissipation channels is greater than the total volume of the multiple second heat dissipation channels; and / or, the radiator is provided with an injection hole, and the orifices at both ends of the injection hole include a first orifice and a second orifice, the first orifice is located on the outer surface of the radiator, and the second orifice is connected to at least one of the heat dissipation channel and the connecting channel, the cooling device includes a control component, and a one-way valve and a pressure sensor are provided at the injection hole, the one-way valve and the pressure sensor are both electrically connected to the control component, the pressure sensor is used to detect the pressure in the radiator, and the control component is configured to open the one-way valve when the pressure value obtained by the pressure sensor is greater than a preset pressure.

10. A server, characterized in that: It comprises a heat generating device and a cooling device as claimed in any one of claims 1 to 9, wherein the heat generating device is in thermal contact with a cooling element of the cooling device.

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