Chip capacitor processing and shaping equipment
By designing an automatic sliding slide rail and slider mechanism, the automatic replacement of the lower mold of the chip capacitor processing equipment is achieved, solving the problem of existing equipment being demolded and then shaped, and improving production efficiency.
Patent Information
- Application Number
- CN202421030901.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-05-13
AI Technical Summary
The existing chip capacitor processing and shaping equipment is fixed on the base because the lower mold is fixed to the base, which requires demolding and then shaping after processing, which wastes time and reduces production efficiency.
A patch capacitor processing and shaping device including a base, a support frame, a clamping assembly, a support assembly and a moving assembly is designed. Through the sliding mechanism of the slide rail and the slider, the automatic replacement of the lower mold is achieved to avoid the mold release process.
It realizes efficient shaping and processing of chip capacitors, saves time, improves production efficiency, and meets the needs of mass production.
Smart Images

Figure CN222507361U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip capacitor processing, in particular to a chip capacitor processing and shaping device. Background Art
[0002] Chip capacitors are a type of capacitor material, the full name is multilayer ceramic capacitors, also known as chip capacitors. There are two ways to express chip capacitors, one is expressed in inches and the other is expressed in millimeters. Chip capacitors are widely used in the fields of power electronics and communications. They can store charges and provide temporary power in circuits, thereby playing an important role in filtering, voltage stabilization, decoupling, and resetting.
[0003] The existing patent CN210614945U discloses a chip capacitor processing and shaping device, including a base, a symmetrically arranged vertical pole fixedly connected to the base surface of the base, and a lower mold fixedly connected, a first push plate and a second push plate slidingly connected to the outer wall of the vertical pole from bottom to top in sequence, and a cross plate fixedly connected to the top, a first hydraulic cylinder and a second hydraulic cylinder fixedly arranged on the base surface of the cross plate, a groove is provided at the bottom of the upper mold, a second fixed rod is fixedly connected to the bottom of the first push plate, an upper receiving groove of the chip capacitor is provided at the bottom of the pressure plate, a boss is provided at the lower mold, and a lower receiving groove of the chip capacitor is provided on the base surface of the boss. The utility model relates to the field of chip capacitor technology. The utility model solves the problem that the pin bending of the existing chip capacitor needs to be manually bent individually, the processing efficiency is very low, and manual bending will produce a lot of waste, the quality of the chip capacitor cannot be guaranteed, and the demand for mass production cannot be met.
[0004] However, when using the existing patented chip capacitor processing and shaping equipment, since the lower mold is fixed on the base, after the chip capacitor processing, it is necessary to demold it before the next batch of chip capacitors can be shaped. The whole process wastes time, thereby reducing production efficiency. Utility Model Content
[0005] The purpose of the utility model is to provide a chip capacitor processing and shaping equipment, which solves the above-mentioned problem that in the process of using the chip capacitor processing and shaping equipment, since the lower mold is fixed on the base, after the chip capacitor is processed, it is necessary to demold it before the next batch of chip capacitors can be shaped, and the whole process wastes time, thereby reducing production efficiency.
[0006] To achieve the above-mentioned purpose, the utility model provides a chip capacitor processing and shaping equipment, including a base, a support frame, a clamping assembly, a support assembly and a moving assembly, the support frame is fixedly installed on the base, the clamping assembly is installed on the support frame, the support assembly is installed on the base, the moving assembly includes a slide rail, a slider, a lower mold, a protrusion and a rotating member, the slide rail is fixedly installed on the base, the slider is installed on the slide rail, the slider is slidably connected to the slide rail, the slider has a limiting groove, the lower mold is installed in the limiting groove, the protrusion is fixedly installed on the lower mold, the protrusion has a placement groove, the chip capacitor is placed in the placement groove, and the rotating member is installed on the base.
[0007] Wherein, the rotating component includes a fixed plate, a bearing, a threaded rod and a driving component, the fixed plate is fixedly mounted on the base; the bearing is fixedly mounted on the fixed plate; one end of the threaded rod is mounted on the bearing, the threaded rod is rotatably connected to the bearing, the other end of the threaded rod passes through the slider and is mounted on the driving component, the threaded rod is threadedly connected to the slider; the driving component is mounted on the base.
[0008] Wherein, the driving component includes a driving motor and a driving shaft, the driving motor is fixedly mounted on the base; one end of the driving shaft is fixedly connected to the output shaft of the driving motor, and the other end of the driving shaft is fixedly connected to the threaded rod.
[0009] Among them, the clamping assembly includes an electric cylinder, a driving shaft, a clamping plate, a rubber pad and a pressing member, the electric cylinder is fixedly installed on the support frame; one end of the driving shaft is fixedly connected to the output shaft of the electric cylinder, and the other end of the driving shaft is installed with the clamping plate; the rubber pad is fixedly installed on the clamping plate; the pressing member is installed on the support frame.
[0010] Wherein, the pressing member comprises a pressing plate and a pressing block, wherein the pressing plate is fixedly mounted on the driving shaft and is located at one end of the driving shaft close to the clamping plate; and the pressing block is fixedly mounted on the pressing plate.
[0011] Wherein, the support assembly includes a support column and a fixing seat, the support column is fixedly mounted on the base and is located on a side of the base away from the support frame; the fixing seat is fixedly mounted on the support column.
[0012] The utility model discloses a chip capacitor processing and shaping equipment, wherein the slide rail is fixedly mounted on the base, the slider is mounted on the slide rail, the lower mold is mounted on the slider, the convex block is fixedly mounted on the lower mold, the chip capacitor is placed in the placement groove, and then the lower mold is placed in the limit groove, the drive motor is started, the drive shaft is driven, the threaded rod is rotated on the bearing, the slider is driven to automatically slide on the slide rail, slide to the support frame and stop, and then the electric cylinder is started to push the push shaft so that the clamping plate The pressing plate moves downward at the same time, so that the rubber pad abuts against the surface of the chip capacitor, and the pressing block abuts against the pin of the chip capacitor, and the pin of the chip capacitor is bent and shaped. After completion, the driving motor is started again to move the slider on the slide rail again, and stop after moving to a position away from the support frame. The lower mold is directly removed from the slider, and a new lower mold is replaced to repeat the above operation, thereby directly replacing the lower mold, and there is no need to demold and then perform shaping processing on the next batch of the chip capacitors, which saves time and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.
[0014] Figure 1 It is a schematic diagram of the overall structure of the chip capacitor processing and shaping equipment of the first embodiment of the utility model.
[0015] Figure 2 It is a schematic diagram of the installation structure of the limiting groove of the first embodiment of the utility model.
[0016] Figure 3 It is a schematic diagram of the installation structure of the chip capacitor of the first embodiment of the utility model.
[0017] Figure 4 It is a schematic diagram of the installation structure of the placement slot of the first embodiment of the utility model.
[0018] Figure 5 It is a schematic diagram of the installation structure of the support column of the second embodiment of the utility model.
[0019] In the figure: 101-base, 102-support frame, 103-slide rail, 104-slider, 105-lower mold, 106-bump, 107-limiting groove, 108-placing groove, 109-chip capacitor, 110-fixed plate, 111-bearing, 112-threaded rod, 113-drive motor, 114-drive shaft, 115-electric cylinder, 116-propelling shaft, 117-clamping plate, 118-rubber pad, 119-pressing plate, 120-pressing block, 201-support column, 202-fixed seat. DETAILED DESCRIPTION
[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.
[0021] The first embodiment of the present application is:
[0022] See also Figures 1 to 4 ,in Figure 1 This is a schematic diagram of the overall structure of the chip capacitor processing and shaping equipment of the first embodiment of the utility model; Figure 2 It is a schematic diagram of the installation structure of the limiting groove of the first embodiment of the utility model; Figure 3 This is a schematic diagram of the installation structure of the chip capacitor of the first embodiment of the utility model; Figure 4 It is a schematic diagram of the installation structure of the placement slot of the first embodiment of the utility model.
[0023] The utility model provides a chip capacitor processing and shaping equipment: including a base 101, a support frame 102, a clamping assembly, a supporting assembly and a moving assembly, the moving assembly includes a slide rail 103, a slider 104, a lower die 105, a convex block 106 and a rotating member, the rotating member includes a fixed plate 110, a bearing 111, a threaded rod 112 and a driving component, the driving component includes a driving motor 113 and a driving shaft 114, the clamping assembly includes an electric cylinder 115, a driving shaft 116, a clamping plate 117, a rubber pad 118 and a pressing member, the pressing member includes a pressing plate 119 and a pressing block 120. The above-mentioned solution solves the problem that in the process of using the chip capacitor processing and shaping equipment, since the lower die is fixed on the base, after the chip capacitor is processed, it is necessary to demould before the next batch of chip capacitors are shaped, and the whole process wastes time, thereby reducing production efficiency. It can be understood that the above-mentioned solution can be used in the scene of chip capacitor processing, and can also be used to solve the problem of equipment fixing.
[0024] In this embodiment, the support frame 102 is fixedly mounted on the base 101, the clamping assembly is mounted on the support frame 102, the supporting assembly is mounted on the base 101, and the movable assembly is mounted on the base 101, so that the lower mold 105 can be directly replaced, and there is no need to demold and then perform shaping processing on the next batch of the chip capacitors, which saves time and improves production efficiency.
[0025] Among them, the slide rail 103 is fixedly installed on the base 101, the slider 104 is installed on the slide rail 103, the slider 104 is slidably connected to the slide rail 103, the slider 104 has a limiting groove 107, the lower mold 105 is installed in the limiting groove 107, the protrusion 106 is fixedly installed on the lower mold 105, the protrusion 106 has a placement groove 108, the chip capacitor 109 is placed in the placement groove 108, and the rotating member is installed on the base 101. The slide rail 103 is made of stainless steel, and the slide rail 103 supports the sliding of the slider 104; the slider 104 is provided with the limiting groove 107, and the limiting groove 107 limits the lower mold 105 to prevent the lower mold 105 from changing its position during the movement of the slider 104; the protrusion 106 is provided with five placement grooves 108, which can place five chip capacitors 109 at one time and perform plastic processing on the five chip capacitors 109 at the same time; the rotating member drives the slider 104 to slide on the slide rail 103; the five chip capacitors 109 are placed in the placement grooves 108 The lower mold 105 is then installed in the limiting groove 107, and the slider 104 is made to slide on the slide rail 103 through the rotating member, and slides to the support frame 102 to stop, and then is reshaped through the clamping assembly. After processing, the slider 104 is made to slide on the slide rail 103 to a position away from the support frame 102, and the lower mold 105 is removed from the slider 104, and a new lower mold 105 is replaced to repeat the above operation, thereby directly replacing the lower mold 105, and there is no need to demold and then perform the shaping process of the next batch of the chip capacitors 109, which saves time and improves production efficiency.
[0026] Secondly, the fixing plate 110 is fixedly mounted on the base 101; the bearing 111 is fixedly mounted on the fixing plate 110; one end of the threaded rod 112 is mounted on the bearing 111, the threaded rod 112 is rotatably connected to the bearing 111, the other end of the threaded rod 112 passes through the slider 104 and is mounted on the driving component, the threaded rod 112 is threadedly connected to the slider 104; the driving component is mounted on the base 101. The fixing plate 110 is made of stainless steel, and the fixing plate 110 supports the bearing 111; the bearing 111 supports the threaded rod 112 to rotate; the threaded rod 112 is threadedly connected to the slider 104, and when the threaded rod 112 rotates on the bearing 111, the slider 104 moves horizontally under the action of the threaded rod 112 and can automatically slide on the slide rail 103; the driving component drives the threaded rod 112 to rotate; through the driving component, the threaded rod 112 is rotated on the bearing 111, thereby driving the slider 104 to move horizontally and automatically slide on the slide rail 103.
[0027] Again, the driving motor 113 is fixedly mounted on the base 101; one end of the driving shaft 114 is fixedly connected to the output shaft of the driving motor 113, and the other end of the driving shaft 114 is fixedly connected to the threaded rod 112. The driving motor 113 drives the driving shaft 114; the driving shaft 114 is made of stainless steel, and the driving shaft 114 connects the driving motor 113 and the threaded rod 112 to drive the threaded rod 112 to rotate; the driving motor 113 is started to drive the driving shaft 114, thereby rotating the threaded rod 112.
[0028] Secondly, the electric cylinder 115 is fixedly mounted on the support frame 102; one end of the driving shaft 116 is fixedly connected to the output shaft of the electric cylinder 115, and the other end of the driving shaft 116 is installed with the clamping plate 117; the rubber pad 118 is fixedly mounted on the clamping plate 117; and the pressing member is mounted on the support frame 102. The electric cylinder 115 drives the pushing shaft 116; the pushing shaft 116 is made of stainless steel, and the pushing shaft 116 pushes the clamping plate 117 and the pressing member to move the clamping plate 117 and the pressing member downward; the rubber pad 118 is made of rubber, and the rubber pad 118 abuts against the surface of the chip capacitor 109 to avoid scratches on the surface of the chip capacitor 109; the pressing member bends and shapes the two pins of the chip capacitor 109; the electric cylinder 115 is started to drive the pushing shaft 116 to move the clamping plate 117 and the pressing member downward, so that the rubber pad 118 abuts against the surface of the chip capacitor 109, thereby avoiding movement during bending and shaping.
[0029] Then, the pressing plate 119 is fixedly mounted on the driving shaft 116 and is located at one end of the driving shaft 116 close to the clamping plate 117; the pressing block 120 is fixedly mounted on the pressing plate 119. The pressing plate 119 supports the pressing block 120 and drives the pressing block 120 to move downward; there are ten pressing blocks 120, five on each side, corresponding to the pins of the patch capacitor 109, and the pins of the patch capacitor 109 are bent and shaped; the clamping plate 117 and the pressing plate 119 move downward under the action of the driving shaft 116, so that the rubber pad 118 abuts against the surface of the patch capacitor 109, and at the same time, the pressing block 120 abuts against the pins of the patch capacitor 109, thereby bending the pins of the patch capacitor 109.
[0030] When the chip capacitor processing and shaping equipment of this embodiment is used, five chip capacitors 109 are placed in the placement groove 108, and then the lower mold 105 is installed in the limiting groove 107, and the driving motor 113 is started to drive the driving shaft 114 to make the threaded rod 112 rotate on the bearing 111, so as to drive the slider 104 to automatically slide on the slide rail 103, slide to the support frame 102 and stop, and then start the electric cylinder 115 to push the driving shaft 116, so that the clamping plate 117 and the pressing plate 119 move downward at the same time, so that the rubber pad 118 is aligned with the support frame 102. The surface of the chip capacitor 109 is abutted, and the pressing block 120 is abutted against the pins of the chip capacitor 109, and the pins of the chip capacitor 109 are bent and shaped. After completion, the driving motor 113 is started again to make the slider 104 move on the slide rail 103 again, and stop after moving to a position away from the support frame 102, and the lower mold 105 is directly removed from the slider 104, and a new lower mold 105 is replaced to repeat the above operation, thereby directly replacing the lower mold 105, and there is no need to demold and then perform shaping processing on the next batch of the chip capacitors 109, which saves time and improves production efficiency.
[0031] The second embodiment of the present application is:
[0032] See also Figure 5 ,in Figure 5 It is a schematic diagram of the installation structure of the support column of the second embodiment of the utility model.
[0033] The support assembly provided by the utility model includes a support column 201 and a fixing seat 202 .
[0034] The support column 201 is fixedly mounted on the base 101 and is located on a side of the base 101 away from the support frame 102; the fixing seat 202 is fixedly mounted on the support column 201. There are four support columns 201, which are respectively mounted on the four corners of the base 101 to support the base 101; the side of the fixing seat 202 close to the ground is made of rubber material, and the fixing seat 202 increases the friction with the ground to prevent the support column 201 from being easily moved on the ground by external force.
[0035] When the chip capacitor processing and shaping device of this embodiment is in use, the support column 201 supports the base 101, and the fixing seat 202 increases the friction between the support column 201 and the ground, thereby preventing the support column 201 from being easily moved on the ground by external forces.
[0036] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.
Claims
1. A chip capacitor processing and shaping device, comprising a base, a support frame, a clamping assembly and a support assembly, wherein the support frame is fixedly mounted on the base, the clamping assembly is mounted on the support frame, and the support assembly is mounted on the base, characterized in that: Also includes mobile components; The moving assembly includes a slide rail, a slider, a lower mold, a protrusion and a rotating member. The slide rail is fixedly mounted on the base, the slider is mounted on the slide rail, the slider is slidably connected to the slide rail, the slider has a limiting groove, the lower mold is mounted in the limiting groove, the protrusion is fixedly mounted on the lower mold, the protrusion has a placement groove, the chip capacitor is placed in the placement groove, and the rotating member is mounted on the base.
2. A chip capacitor processing and shaping device as claimed in claim 1, characterized in that: The rotating component includes a fixed plate, a bearing, a threaded rod and a driving component, wherein the fixed plate is fixedly mounted on the base; the bearing is fixedly mounted on the fixed plate; one end of the threaded rod is mounted on the bearing, and the threaded rod is rotatably connected to the bearing, and the other end of the threaded rod passes through the slider and is mounted on the driving component, and the threaded rod is threadedly connected to the slider; the driving component is mounted on the base.
3. A chip capacitor processing and shaping device as claimed in claim 2, characterized in that: The driving component includes a driving motor and a driving shaft. The driving motor is fixedly mounted on the base. One end of the driving shaft is fixedly connected to the output shaft of the driving motor, and the other end of the driving shaft is fixedly connected to the threaded rod.
4. The chip capacitor processing and shaping equipment according to claim 1, characterized in that: The clamping assembly includes an electric cylinder, a driving shaft, a clamping plate, a rubber pad and a pressing member. The electric cylinder is fixedly mounted on the support frame; one end of the driving shaft is fixedly connected to the output shaft of the electric cylinder, and the other end of the driving shaft is mounted with the clamping plate; the rubber pad is fixedly mounted on the clamping plate; and the pressing member is mounted on the support frame.
5. A chip capacitor processing and shaping device as claimed in claim 4, characterized in that: The pressing member comprises a pressing plate and a pressing block. The pressing plate is fixedly mounted on the driving shaft and is located at one end of the driving shaft close to the clamping plate. The pressing block is fixedly mounted on the pressing plate.
6. The chip capacitor processing and shaping equipment according to claim 1, characterized in that: The support assembly comprises a support column and a fixing seat. The support column is fixedly mounted on the base and is located on a side of the base away from the support frame. The fixing seat is fixedly mounted on the support column.
Citation Information
Cited By
Chip capacitor processing and shaping equipment
CN224288037U