Wafer carrier quality monitoring device

Abstract

The utility model discloses a wafer carrier quality monitoring device, which is suitable for detecting the inside of a wafer carrier placed on a bearing platform and comprises a gas injection module, a gas extraction module and a gas analysis unit. The gas injection module is used for providing gas into the wafer carrier. The air extraction module is used for extracting air in the wafer carrier. The gas analysis unit is communicated with the gas extraction module and is used for analyzing the gas transmitted by the gas extraction module to obtain analysis result information.

Description

Technical Field

[0001] The utility model relates to a monitoring device, in particular to a wafer carrier quality monitoring device. Background Art

[0002] Wafers are the main substrate in the semiconductor manufacturing process. During the transportation of wafers, a wafer carrier (foup) is required to protect the wafers to prevent the wafers from being broken and contaminated.

[0003] In order to ensure that the wafers in each process on the production line are contaminant-free, for effective monitoring, a detection process is often added before the process begins to monitor the internal conditions of the wafer carrier. Since the current micro-contaminant detection requires a dedicated detection platform, the wafer carrier needs to be transported to the dedicated detection platform. The time for the back-and-forth transportation process will extend the overall working hours, and in order to ensure the transportation process, additional conveying mechanisms need to be designed, which will also increase the overall manufacturing cost; it will also occupy the dust-free space. Utility Model Content

[0004] The utility model aims to provide a wafer carrier quality monitoring device, so as to monitor the internal condition of the wafer carrier in real time.

[0005] The utility model provides a wafer carrier quality monitoring device, which is suitable for detecting the inside of a wafer carrier placed on a carrying platform, and the wafer carrier quality monitoring device includes an injection module, an exhaust module and a gas analysis unit. The injection module is used to provide a gas to the inside of the wafer carrier. The exhaust module is used to extract the gas inside the wafer carrier. The gas analysis unit is connected to the exhaust module, and the gas analysis unit is used to analyze the gas transmitted by the exhaust module to obtain an analysis result information.

[0006] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes a control system whose signal is connected to the gas analysis unit. The control system determines whether a specific gas exists inside the wafer carrier according to the analysis result information.

[0007] In one embodiment of the present invention, the wafer carrier quality monitoring system further includes a diverter connected between the exhaust module and the gas analysis unit, wherein the exhaust module can be connected to the wafer carrier via the diverter.

[0008] In one embodiment of the present invention, the control system signal is connected to the jet module and the exhaust module, and can control the jet module to provide gas and the exhaust module to extract gas respectively.

[0009] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes a switch and a cleaning module. The gas analysis unit is connected to the diverter through the switch. The cleaning module signal is connected to the control system, and the cleaning module is connected to the switch.

[0010] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes an automatic transfer system electrically connected to the control system. The automatic transfer system can transfer or place the wafer carrier relative to the carrying platform.

[0011] Another embodiment of the utility model provides a wafer carrier quality monitoring device, which is suitable for detecting the interior of a plurality of wafer carriers, wherein these wafer carriers are respectively placed on a corresponding carrying platform, and the wafer carrier quality monitoring device includes at least one jet module, at least one exhaust module, a diverter, and a gas analysis unit. At least one jet module is used to provide a gas to the inside of the wafer carrier to which it corresponds. At least one exhaust module is used to extract the gas inside the wafer carrier to which it corresponds. The diverter is connected to each exhaust module. The gas analysis unit is connected to the diverter, and is connected to one of the wafer carriers through the diverter, and analyzes the gas transmitted by at least one exhaust module to obtain an analysis result information.

[0012] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes a control system whose signal is connected to the gas analysis unit. The control system determines whether a specific gas exists inside the wafer carriers according to the analysis result information.

[0013] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes at least one diverter, wherein each exhaust module can be connected to the wafer carrier via the corresponding diverter, and each diverter is respectively connected to the corresponding diverter, and the control system signal is connected to at least one jet module and at least one exhaust module, and can respectively control the jet module to provide gas and the exhaust module to extract gas, and the control system can respectively control at least one jet module to provide gas and at least one exhaust module to extract gas based on the analysis result information.

[0014] In one embodiment of the present invention, the wafer carrier quality monitoring device further includes at least one switch and at least one cleaning module. Each diverter is connected to the diverter through at least one switch. At least one cleaning module is respectively connected to the control system by signal, and each cleaning module is connected to the corresponding switch.

[0015] Based on the above, the wafer carrier quality monitoring device of the utility model does not need to transport the wafer carrier to a special testing platform. During the process of extracting gas from the wafer carrier, the gas inside the wafer carrier can be analyzed to achieve the purpose of monitoring the quality of the wafer carrier, and can reduce the overall working hours. There is no need to set up an additional conveying mechanism, which can also reduce the overall manufacturing cost.

[0016] Furthermore, the present invention monitors the quality of the wafer carrier to ensure that there is no residual hazardous gas inside the wafer carrier before transferring the wafer carrier to the process equipment to avoid the specific gas inside the wafer carrier from contaminating the process equipment, thereby reducing or lowering the chance of process contamination.

[0017] In order to make the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 4 is a schematic diagram of an embodiment of a wafer carrier quality monitoring device according to the present invention.

[0019] Figure 2 It is a schematic diagram of a wafer carrier and a process equipment according to an embodiment of the present invention.

[0020] Figure 3 FIG. 4 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention.

[0021] Figure 4 FIG. 4 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention.

[0022] Figure 5 FIG. 4 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention.

[0023] Figure 6 It is a schematic diagram of a wafer carrier quality monitoring device according to the present invention monitoring a single wafer carrier.

[0024] Figure 7 It is a schematic diagram of a cleaning state of a wafer carrier quality monitoring device according to an embodiment of the present invention.

[0025] Figure 8 It is a schematic diagram of a wafer carrier quality monitoring device according to the present invention monitoring a plurality of wafer carriers.

[0026] Fig. 9 FIG. 4 is a schematic diagram of another embodiment of the cleaning state of the wafer carrier quality monitoring device according to the present invention.

[0027] Description of reference numerals: 50-wafer carrier; 50A-injection pipe; 50B-exhaust pipe; 51A-wafer carrier No. 1; 51B-wafer carrier No. 2; 51C-wafer carrier No. 3; 52-wafer; 60-carrying platform; 70-process equipment; 100, 200, 300, 400, 500-wafer carrier quality monitoring device; 110-injection module; 120-exhaust module; 130-gas analysis unit; 240-control system; 35 0-automatic transfer system; 460-cleaning module; 470-diverter; 480-switch; 490-switch; 500A-first group of wafer carrier quality monitoring devices; 500B-second group of wafer carrier quality monitoring devices; 5020-diverter; AR-analysis result information; L-vertical direction; L1-first turning direction; L2-second turning direction; GA-gas; GC-clean gas; P1-injection end; P2-exhaust end; PA-hazardous gas. DETAILED DESCRIPTION

[0028] The following examples are listed and described in detail with the accompanying drawings, but the examples provided are not intended to limit the scope of the present invention. In addition, the drawings are for illustration purposes only and are not drawn to their original size. For ease of understanding, the same elements will be described with the same symbols in the following description.

[0029] The terms "including", "comprising", "having" and the like mentioned in the present invention are all open terms, that is, meaning "including but not limited to".

[0030] In the description of each embodiment, when elements are described with terms such as “first,” “second,” “third,” “fourth,” etc., it is only used to distinguish these elements from each other, and does not limit the order or importance of these elements.

[0031] In the description of each embodiment, the so-called "coupling" or "connection" may refer to two or more elements making direct physical or electrical contact with each other, or making indirect physical or electrical contact with each other, and "coupling" or "connection" may also refer to the mutual operation or action of two or more elements.

[0032] Figure 1 FIG. 1 is a schematic diagram of an embodiment of a wafer carrier quality monitoring device according to the present invention. Figure 1 The wafer carrier quality monitoring device 100 of the present invention is suitable for detecting the inside of a wafer carrier 50 placed on a carrying platform 60 . The wafer carrier quality monitoring device 100 includes an air injection module 110 , an exhaust module 120 and a gas analysis unit 130 .

[0033] The injection module 110, for example, includes a pipeline to be connected to the carrying platform 60 and communicated with the bottom of the wafer carrier 50. The injection module 110 is used to provide a gas GA into the wafer carrier 50. The gas GA may include (for example but not limited to) one or more of nitrogen, clean dry air (CDA) and ultra-clean dry air (XCDA), or a clean gas of an inert gas, so as to inject and fill the clean gas into the wafer carrier 50, so that the gas GA is mixed with the existing gas in the wafer carrier 50, or even replaces the existing gas in the wafer carrier 50.

[0034] The exhaust module 120 includes, for example, a pipeline, a gas nozzle or a fixing element, which is connected to the carrying platform 60 and communicated with the bottom of the wafer carrier 50. The exhaust module 120 is used to extract the gas GA in the wafer carrier 50. Here, the gas GA is mixed with the existing gas in the wafer carrier 50, and the existing gas may be clean gas or may contain unclean gas.

[0035] The gas analysis unit 130 is connected to the exhaust module 120. The gas analysis unit 130 may include a physical circuit, a software program executed in the physical circuit, or a cloud computer. The physical circuit is, for example, a computer, and a sensor, which can convert a specific gas into an electrical signal by a sensing mechanism to detect the gas GA. In one embodiment, the exhaust module 120 and the gas analysis unit 130 may be in two different locations, so that the exhaust module 120 extracts the gas GA in the wafer carrier 50 and transmits it to the gas analysis unit 130. In other embodiments, the exhaust module 120 and the gas analysis unit 130 may be in the same location or arranged together, and the exhaust module 120 is used to extract the gas GA in the wafer carrier 50 and shunt it to the gas analysis unit 130. The gas analysis unit 130 is used to analyze the gas GA shunt transmitted by the exhaust module 120 to obtain an analysis result information AR, and the internal condition of the wafer carrier 50 is monitored by the analysis result information AR.

[0036] It can be seen that the wafer carrier quality monitoring device 100 of the utility model does not need to transport the wafer carrier 50 to a special inspection platform. In the process of injecting and extracting gas GA into the wafer carrier 50, the gas GA inside the wafer carrier 50 can be analyzed to achieve the purpose of monitoring the quality of the wafer carrier 50, and the overall working hours can be reduced. There is no need to set up an additional conveying mechanism, which can also reduce the overall manufacturing cost and save clean room space. Of course, reducing the chance of transporting the wafer carrier 50 can also reduce the chance of fragmentation.

[0037] For example, Figure 2As shown, the wafer carrier 50 contains a plurality of wafers 52 stacked in sequence. A jet pipe 50A and a vacuum pipe 50B are provided at the bottom of the wafer carrier 50. The jet pipe 50A serves as a jet end P1 and is connected to the wafer carrier 50A. Figure 1 The gas injection module 110 is used to introduce the gas GA into the wafer carrier 50; the exhaust pipe 50B serves as an exhaust port P2, which is connected to the Figure 1 The exhaust module 120 is used to extract the gas GA and the hazardous gas PA in the wafer carrier 50. The wafer carrier 50 is adjacent to the process equipment 70. Figure 1 The wafer carrier quality monitoring device 100 monitors the quality of the wafer carrier 50 and ensures that there is no residual hazardous gas PA inside the wafer carrier 50. Then, the wafer carrier 50 is opened and the wafer 52 inside is transferred to the process equipment 70. In other words, before opening the wafer carrier 50, it is ensured that there is no specific gas inside it to prevent the specific gas inside the wafer carrier 50 from diffusing and contaminating the process equipment 70, thereby reducing or lowering the chance of process contamination, thereby improving equipment utilization rate and production yield.

[0038] Figure 3 FIG. 1 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention. Figure 3 The wafer carrier quality monitoring device 200 of the utility model is Figure 1 The difference between the wafer carrier quality monitoring device 100 and the wafer carrier quality monitoring device 200 is that the wafer carrier quality monitoring device 200 further includes a control system 240 .

[0039] The control system 240 may be a physical circuit, a software program executed in a physical circuit, or a cloud computer. The physical circuit may be, for example, a computer. The control system 240 is connected to the gas analysis unit 130 by signals, for example, by transmitting information to each other through a network connection or the cloud. The control system 240 determines whether a specific gas exists inside the wafer carrier 50 based on the analysis result information AR. The specific gas may be Figure 2 If any specific gas remains, the control system 240 will notify the on-site staff and remove the wafer carrier 50 containing the specific gas to prevent the wafer carrier 50 containing the specific gas from being opened and the wafers 52 therein from being transferred to subsequent process equipment for processing. This can avoid problems in subsequent processes and reduce the probability of downtime due to cleaning.

[0040] In one embodiment, the control system 240 signal is connected to the injection module 110 and the exhaust module 120, for example, by transmitting information to each other through a network connection or the cloud, so as to control whether the injection module 110 performs the gas supply action to provide gas GA, and whether the exhaust module 120 performs the gas extraction action to extract gas GA.

[0041] Figure 4 FIG. 1 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention. Figure 4 The wafer carrier quality monitoring device 300 of the utility model is Figure 3 The difference between the wafer carrier quality monitoring device 200 and the wafer carrier quality monitoring device 300 is that the wafer carrier quality monitoring device 300 further includes an automatic transfer system 350. In addition, in this embodiment, three wafer carriers, namely, a first wafer carrier 51A, a second wafer carrier 51B, and a third wafer carrier 51C, are taken as examples.

[0042] The automatic transfer system 350 is electrically connected to the control system 240. The control system 240 issues a command to enable the automatic transfer system 350 to clamp the wafer carrier 51A No. 1 to move the wafer carrier 51A No. 1 relative to the carrier platform 60 along the vertical direction L, so as to place the wafer carrier 51A No. 1 on the carrier platform 60 and correspond to the position of the injection module 110 and the exhaust module 120 to perform the above-mentioned Figure 1 , Figure 3 After monitoring wafer carrier 51A No. 1, the automatic transfer system 350 can then transfer wafer carrier No. 2 51B and wafer carrier No. 3 51C, and sequentially place them on the carrier platform 60 corresponding to the positions connecting the injection module 110 and the exhaust module 120, so as to monitor different wafer carriers in sequence. In one embodiment, the automatic transfer system 350 can be an overhead hoist transfer (OHT), a multi-axis robot or a similar machine capable of performing automatic transfer.

[0043] Further, if the control system 240 determines that there is no specific gas inside the wafer carrier 51A according to the analysis result information AR, the control system 240 can issue a command to the automatic transfer system 350 to move the wafer carrier 51A from the carrying platform 60 and transfer the wafer 52 in the wafer carrier 51A into the wafer carrier 51A. Figure 2 Next, the automatic transfer system 350 places the second wafer carrier 51B on the position of the carrier platform 60 corresponding to the position connecting the injection module 110 and the exhaust module 120, and can issue a command based on the analysis result information AR to allow the automatic transfer system 350 to transfer the wafer 52 of the second wafer carrier 51B to the position as shown in FIG. Figure 2 The process equipment 70, or according to the analysis result information AR, it is determined that there is a specific gas inside the second wafer carrier 51B, so the control system 240 can issue a command to allow the automatic transfer system 350 not to transfer the wafer 52 of the second wafer carrier 51B to such a Figure 2 In another embodiment, the structure is similar to Figure 4 ; However, the second wafer carrier 51B and the third wafer carrier 51C on the carrying platform 60 also each have their corresponding connected but not drawn jet modules 110 and exhaust modules 120; and each exhaust module 120 is further connected to the gas analysis unit 130; in this way, after each wafer carrier (the first wafer carrier 51A, the second wafer carrier 51B, and the third wafer carrier 51C) is placed on the carrying platform 60, each can perform monitoring operations, thereby saving the waiting time for monitoring operations.

[0044] Figure 5 FIG. 1 is a schematic diagram of another embodiment of a wafer carrier quality monitoring device according to the present invention. Figure 5 The wafer carrier quality monitoring device 400 of the utility model is Figure 4 The difference between the wafer carrier quality monitoring device 300 and the wafer carrier quality monitoring device 400 is that the wafer carrier quality monitoring device 400 further includes a cleaning module 460 , a diverter 470 , a switch 480 and a switch 490 .

[0045] The cleaning module 460 may be a cleaning machine or a mechanism that can provide a cleaning fluid (including gas, liquid, or gas-liquid two-phase flow). The cleaning module 460 signal is connected to the control system 240. The control system 240 determines that there is a specific gas inside the wafer carrier 50 based on the analysis result information AR. In addition to removing the wafer carrier 50 containing the specific gas through the automatic transfer system 350, since the specific gas is also present in the gas analysis unit 130 and the exhaust module 120, the cleaning module 460 is used to provide a cleaning fluid to remove the specific gas in the gas analysis unit 130 and the exhaust module 120 to maintain and ensure the cleanliness of the gas analysis unit 130 and the exhaust module 120, so that the wafer carrier quality monitoring device 400 of the utility model has a self-cleaning function.

[0046] In one embodiment, during the process of cleaning the gas analysis unit 130 by the cleaning module 460, the gas analysis unit 130 also analyzes the gas therein to obtain analysis result information AR, until the control system 240 determines that no specific gas exists inside the gas analysis unit 130 based on the analysis result information AR, and then the control system 240 issues a command to stop the operation of the cleaning module 460.

[0047] In other embodiments, during the process of the cleaning module 460 cleaning the exhaust module 120, the exhaust module 120 may also transmit the gas transmitted by the exhaust module 120 to the gas analysis unit 130 for analysis, until the control system 240 determines that no specific gas exists inside the exhaust module 120 based on the analysis result information AR, and then the control system 240 issues a command to stop the operation of the cleaning module 460.

[0048] It should be noted that the cleaning module 460 can clean the gas analysis unit 130 and the exhaust module 120 simultaneously, or sequentially, or only one of the gas analysis unit 130 or the exhaust module 120, which can be selected according to actual conditions.

[0049] In addition, when the cleaning module 460 is stopped, the control system 240 further issues instructions to control the automatic transfer system 350 to move the wafer carrier 50 to be placed on the carrying platform 60, and controls the injection module 110 to provide gas GA to the wafer carrier 50, and the exhaust module 120 to extract gas from the inside of the wafer carrier 50.

[0050] In a specific embodiment, the flow divider 470 is used as a distribution element for fluid (including gas, liquid or gas-liquid two-phase flow). The flow divider 470 is connected between the exhaust module 120 and the gas analysis unit 130, and the exhaust module 120 is connected to the wafer carrier 50 through the flow divider 470, that is, the exhaust module 120, the flow divider 470 and the wafer carrier 50 are connected through the pipeline, and the flow divider 470 is also connected to the gas analysis unit 130 through the pipeline. In this way, the gas flowing out of the wafer carrier 50 is divided into the gas analysis unit 130 and the exhaust module 120 through the flow divider 470.

[0051] In one embodiment, the utility model can make the gas flowing out of the wafer carrier 50 be diverted and directed to the gas analysis unit 130 through the diverter 470, instead of being diverted to the exhaust module 120. Of course, in a specific embodiment, the switch 480 pipeline is connected and arranged between the diverter 470 and the exhaust module 120. The switch 480 can be opened to connect the diverter 470 and the exhaust module 120, so that the gas flowing out of the wafer carrier 50 is transmitted to the gas analysis unit 130 and the exhaust module 120 through the diverter 470, or the gas flowing out of the wafer carrier 50 is transmitted to either the gas analysis unit 130 or the exhaust module 120 through the setting of the diverter 470.

[0052] In another embodiment, the utility model can turn off the switch 480 to close and disconnect the diverter 470 and the exhaust module 120; if the switch 480 is turned off, the diverter 470 and the exhaust module 120 are not connected, so that the gas flowing out of the wafer carrier 50 is transmitted to the gas analysis unit 130 through the diverter 470, and does not flow to the exhaust module 120.

[0053] It should be noted that the above-mentioned diverter 470 and switch 480 can be controlled manually or automatically, for example, by Figure 5The control system 240 is remotely connected to the control system 240, or the control system 240 includes control of the diverter 470 and the switch 480 in the control instructions of the exhaust module 120, or even more so, the diverter 470 and the switch 480 are provided with control elements, which can be adjusted according to actual conditions.

[0054] In a specific embodiment, the present invention may be provided with a switch 490, and the switch 490 is connected between the cleaning module 460, the gas analysis unit 130 and the diverter 470. Through the switch 490, the gas analysis unit 130 is selected to be connected to the diverter 470 or to be connected to the cleaning module 460 through the switch 490. In other words, the switch 490 may be used to select the diverter 470 to be connected to the gas analysis unit 130 while the cleaning module 460 is not connected to the gas analysis unit 130, so that the wafer carrier quality monitoring device 400 of the present invention performs the state of monitoring the wafer carrier 50; or the cleaning module 460 is connected to the gas analysis unit 130 while the diverter 470 is not connected to the gas analysis unit 130, so that the wafer carrier quality monitoring device 400 of the present invention performs the state of cleaning.

[0055] The following Figure 6 Introducing the monitoring status of a single wafer carrier 50 and Figure 7 The cleaning state of a single wafer carrier 50 after being removed is described.

[0056] Please read first Figure 6 , which is to turn on the switch 480, so that the diverter 470 is connected between the exhaust module 120 and the gas analysis unit 130, and the gas analysis unit 130 is connected to the diverter 470 through the switch 490, so that the gas GA provided by the jet module 110 to the wafer carrier 50 is diverted to the exhaust module 120 and the gas analysis unit 130 through the diverter 470. The gas analysis unit 130 is used to analyze the gas GA and obtain the analysis result information AR, and the internal condition of the wafer carrier 50 is monitored by the analysis result information AR.

[0057] In other embodiments, the switch 480 may be closed so that the diverter 470 provides the gas GA provided in the wafer carrier 50 to the gas analysis unit 130 for analysis.

[0058] Next, please refer to Figure 7 , the gas analysis unit 130 is connected to the cleaning module 460 via the switch 490 , so that the cleaning module 460 can provide a cleaning fluid to remove and clean the specific gas in the gas analysis unit 130 , so as to maintain and ensure the cleanliness of the gas analysis unit 130 .

[0059] In one embodiment, the cleaning module 460 can also be connected to the diverter 470 via the switch 490, and the switch 480 can be turned on, so that the cleaning module 460 can provide a cleaning fluid through the switch 490, the diverter 470, and the switch 480 to the exhaust module 120 to remove and clean specific gases in the exhaust module 120 to maintain and ensure the cleanliness of the exhaust module 120.

[0060] In another embodiment, at this time, since the automatic transfer system 350 removes the wafer carrier 50, there is no wafer carrier 50 on the carrying platform 60, and at this time, the clean gas GC in the factory (such as the clean room) can be extracted and transported to the exhaust module 120 through the diversion of the diverter 470 and the opening of the switch 480, and the specific gas in the exhaust module 120 can also be cleaned. In another embodiment, the same as Figure 6 However, the wafer carrier 50 is a clean and empty wafer carrier 50 without a wafer 52, so that the jet module 110 can be operated to inject gas GA into the wafer carrier 50, thereby providing gas GA to the exhaust pipe 50B ( Figure 2 ) and the subsequent connecting pipes or equipment components for cleaning.

[0061] Some of the above embodiments are directed to monitoring and cleaning a single wafer carrier, but the present invention is not limited thereto. Figure 8 and Fig. 9 The implementation modes of monitoring and cleaning multiple wafer carriers are introduced respectively. It should be noted that in order to make the diagram clearer and emphasize the key points of this embodiment, the following are omitted. Figures 4 to 7 The connection and actuation of the automatic transfer system 350 can be referred to above (eg Figures 4 to 7 ) is not described, and only the control system 240 signal is shown to be connected to the gas analysis unit 130, while the control system 240 is connected to the remaining components (such as the jet module 110, the exhaust module 120, the automatic transfer system 350, and the cleaning module 460). The connection method and operation method thereof can refer to the aforementioned (such as Figures 3 to 7 ) for the description.

[0062] The connection and operation modes of the control system and the automatic transfer system can be referred to above (such as Figures 1 to 7 ) for the description.

[0063] Please refer to Figure 8The wafer carrier quality monitoring device 500 includes a first set of wafer carrier quality monitoring devices 500A and a second set of wafer carrier quality monitoring devices 500B to monitor the first wafer carrier 51A and the second wafer carrier 51B respectively, wherein the first wafer carrier 51A and the second wafer carrier 51B are respectively placed on the corresponding carrying platform 60. In other embodiments, a plurality of wafer carriers can be designed to be tested simultaneously or sequentially according to actual conditions.

[0064] In addition, this embodiment is divided into two groups, namely, a first group of wafer carrier quality monitoring devices 500A and a second group of wafer carrier quality monitoring devices 500B, for separate inspections. Figure 4 or Figure 6 The wafer carrier quality monitoring device 500 of this embodiment is used to detect multiple wafer carriers by sequentially shifting positions. Figure 6 The difference between the wafer carrier quality monitoring device 400 and the wafer carrier quality monitoring device 500 is that the wafer carrier quality monitoring device 500 further includes a diverter 5020 .

[0065] The diverter 5020 is connected to the two exhaust modules 120 through pipelines, and the gas analysis unit 130 is connected to the diverter 5020 through pipelines, and is connected to one of the wafer carriers (wafer carrier No. 1 51A, wafer carrier No. 2 51B) through the diverter 5020. That is, the first group of wafer carrier quality monitoring devices 500A and the second group of wafer carrier quality monitoring devices 500B are connected together through the diverter 5020, so that the gas analysis unit 130 can be connected to the wafer carrier No. 1 51A or the wafer carrier No. 2 51B to analyze the gas extracted from the wafer carrier No. 1 51A or the wafer carrier No. 2 51B by the exhaust module 120, and the corresponding analysis result information AR can be obtained. Figure 8 For example, at this time, the diverter 5020 selects the first diverting direction L1, so that the gas analysis unit 130 is connected to the wafer carrier No. 1 51A through the diverter 5020, and the gas analysis unit 130 monitors the wafer carrier No. 1 51A.

[0066] Specifically, each exhaust module 120 can be connected to the corresponding wafer carrier 51A and the corresponding wafer carrier 51B via the corresponding diverter 470, and each diverter 470 is connected to the corresponding diverter 5020. Of course, in another embodiment, Figure 5 As shown, a switch 480 may be further provided to be connected to the pipeline and disposed between the diverter 470 and the exhaust module 120, and a switch 490 may be further provided to connect the cleaning module 460, the gas analysis unit 130 and the diverter 470, wherein the gas analysis unit 130 is connected to the diverter 5020 via each switch 490. Figure 8As shown, the switches 490 of the first group of wafer carrier quality monitoring devices 500A and the second group of wafer carrier quality monitoring devices 500B are turned on respectively, so that the diverter 470 is connected to the diverter 5020 through the switch 490, and the gas extracted from the wafer carrier No. 1 51A or the wafer carrier No. 2 51B is selected by the diverter 5020 to be conducted to the gas analysis unit 130.

[0067] like Figure 8 In the example, the control system 240 determines that there is no specific gas inside the wafer carrier 50 according to the analysis result information AR, and then opens the wafer carrier 51A No. 1 and moves the wafer 52 inside it into the wafer carrier 51A No. 1. Figure 2 The process equipment 70 performs the process, and at the same time, the diverter 5020 can be switched to select the second diverting direction L2 (indicated by the dotted line), so that the gas analysis unit 130 is connected to the second wafer carrier 51B through the diverter 5020, allowing the gas analysis unit 130 to monitor the second wafer carrier 51B.

[0068] On the contrary, if the control system 240 determines that the specific gas exists inside the wafer carrier 51A No. 1 according to the analysis result information AR, the control system 240 does not need to transfer the wafer 52 in the wafer carrier 51A No. 1 to the wafer carrier 51A No. 1 except issuing a command. Figure 2 Outside the process equipment 70, such as Fig. 9 As shown, at this time, the diverter 5020 still selects the first diverting direction L1 (indicated by the solid line), and the cleaning module 460 is used to provide a cleaning fluid to remove the specific gas in the gas analysis unit 130 and the exhaust module 120, or the clean gas GC can be transported to the exhaust module 120, and the specific gas in the exhaust module 120 can also be cleaned. The description of the relevant cleaning module 460 can be referred to Figure 7 In this way, the cleanliness of the gas analysis unit 130 and the exhaust module 120 is maintained and ensured first, and then the diverter 5020 is switched to select the second diverting direction L2 (indicated by the dotted line) to monitor the second wafer carrier 51B; of course, Figure 8 The wafer carrier 51A and the wafer carrier 51B shown in FIG. 1 correspond to different process equipment 70 . In addition, in one embodiment, the structures thereof are similar. Figure 8 However, the carrying platform 60 is relatively large and can simultaneously hold a plurality of wafer carriers 50, so that each wafer carrier 50 corresponds to the same process equipment 70. In addition, the gas analysis unit 130 described in the above embodiment can determine whether the analysis result information AR contains a specific gas, and transmit the determination result to the control system 240.

[0069] In summary, the wafer carrier quality monitoring device of the utility model does not need to transport the wafer carrier to a special testing platform. During the process of extracting gas from the wafer carrier, the gas inside the wafer carrier can be analyzed to achieve the purpose of monitoring the quality of the wafer carrier, and can reduce the overall working hours. There is no need to set up an additional conveying mechanism, which can also reduce the overall manufacturing cost.

[0070] Furthermore, the present invention monitors the quality of the wafer carrier to ensure that there is no residual hazardous gas inside the wafer carrier, and then transfers the wafer carrier to the process equipment to avoid the specific gas inside the wafer carrier from contaminating the process equipment, thereby reducing or lowering the chance of process contamination; of course, the specific gas mentioned is, for example: ammonia, arsine, borane, etc., but is not limited to this.

[0071] Although the present invention has been disclosed in the above embodiments, they are not intended to limit the present invention. Any person skilled in the art with common knowledge in the relevant technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the attached claims.

Claims

1. A wafer carrier quality monitoring device, suitable for detecting the interior of a wafer carrier placed on a carrying platform, characterized in that: The wafer carrier quality monitoring device comprises: an air injection module connected to the bottom of the wafer carrier to provide a gas into the wafer carrier; an exhaust module connected to the bottom of the wafer carrier to extract the gas in the wafer carrier; and A gas analysis unit is connected to the gas extraction module, and is used for analyzing the gas transmitted by the gas extraction module to obtain analysis result information.

2. The wafer carrier quality monitoring device according to claim 1, wherein: Also includes: A control system, whose signal is connected to the gas analysis unit, is used to determine whether a specific gas exists inside the wafer carrier according to the analysis result information.

3. The wafer carrier quality monitoring device according to claim 2, wherein: Also includes: A flow divider is connected between the gas extraction module and the gas analysis unit, wherein the gas extraction module can be connected to the wafer carrier via the flow divider.

4. The wafer carrier quality monitoring device according to claim 3, wherein: The control system signal is connected to the jet module and the air extraction module, so as to respectively control the jet module to provide the gas and the air extraction module to extract the gas.

5. The wafer carrier quality monitoring device according to claim 4, wherein: Also includes: a switch, wherein the gas analysis unit is connected to the diverter via the switch; as well as A cleaning module is connected to the control system by signal, and the cleaning module is connected to the switch.

6. The wafer carrier quality monitoring device according to claim 5, wherein: Also includes: An automatic transfer system is electrically connected to the control system, and the automatic transfer system can transfer or place the wafer carrier relative to the carrying platform.

7. A wafer carrier quality monitoring device, suitable for detecting the interior of a plurality of wafer carriers, characterized in that: The plurality of wafer carriers are respectively placed on a corresponding carrying platform, and the wafer carrier quality monitoring device includes: At least one jetting module is connected to the bottom of at least one wafer carrier to provide a gas to the corresponding wafer carrier; At least one exhaust module is connected to the bottom of at least one wafer carrier to extract the gas in the corresponding wafer carrier; A diverter connected to each of the air extraction modules; and A gas analysis unit is connected to the diverter and connected to one of the plurality of wafer carriers through the diverter, and is used for analyzing the gas transmitted by the at least one exhaust module to obtain analysis result information.

8. The wafer carrier quality monitoring device according to claim 7, wherein: Also includes: A control system, whose signal is connected to the gas analysis unit, is used to determine whether a specific gas exists inside the plurality of wafer carriers according to the analysis result information.

9. The wafer carrier quality monitoring device according to claim 8, wherein: Also includes: At least one diverter, wherein each of the exhaust modules can be connected to the wafer carrier via the corresponding diverter, and each of the diverters is respectively connected to the corresponding diverter, the control system signal is connected to the at least one jet module and the at least one exhaust module, so as to be able to respectively control the at least one jet module to provide the gas and the at least one exhaust module to extract the gas, and the control system is used to respectively control the at least one jet module to provide the gas and the at least one exhaust module to extract the gas based on the analysis result information.

10. The wafer carrier quality monitoring device according to claim 9, wherein: Also includes: At least one switch, wherein each of the diverters is connected to the diverter via the at least one switch; as well as At least one cleaning module is respectively connected to the control system via signals, and each cleaning module is connected to the corresponding switch.

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