Semiconductor packaging assembly

Abstract

The utility model provides a semiconductor packaging assembly, and belongs to the technical field of semiconductor packaging. The packaging structure comprises a packaging cover plate, a substrate and a semiconductor chip, the substrate is provided with a limiting groove and a mounting groove, the packaging cover plate is provided with a plurality of vent holes, the inner wall of the packaging cover plate is provided with a mounting cavity corresponding to the semiconductor chip, a dustproof film is adhered in the mounting cavity, and the lower side wall of the packaging cover plate is provided with a plurality of packaging modules. The packaging module comprises a limiting column fixedly connected with the lower side wall of the packaging cover plate. When the packaging cover plate and the substrate are buckled, the extrusion column extrudes the sealant in the liquid storage cavity, and the sealant is sprayed to the connecting cavity and the nozzle from the notch of the sealing film under the action of air pressure, so that automatic sealing of the semiconductor chip is realized, and extra glue injection treatment is not needed; the porous structure of the dustproof film allows air and some gas molecules to pass through, but prevents dust and most particles from entering the packaging cavity, and dust prevention and heat dissipation are both considered.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a semiconductor packaging component. Background Art

[0002] Semiconductor is the fastest-advancing material technology among the current existing technologies. Materials between conductors and insulators can be simply called semiconductors, while semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements.

[0003] At present, the existing semiconductor packaging components still have some shortcomings. First, under the premise of ensuring heat dissipation, it is impossible to effectively block dust. Dust entering the packaging cavity from the outside will accumulate on the outer wall of the chip, affecting the normal operation of the chip and increasing the heat dissipation pressure of the chip; second, the existing packaging structure often uses a snap-fit ​​method to superimpose the heat dissipation cover and the chip in a flat manner. The connection between the chip and the heat dissipation cover is not strong enough, and additional glue injection is required to achieve internal sealing, which is more troublesome.

[0004] How to invent a semiconductor packaging component to improve these problems has become an urgent problem to be solved by technicians in this field. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a semiconductor packaging assembly, aiming to improve the problems mentioned in the above background.

[0006] The utility model is achieved in this way:

[0007] The utility model provides a semiconductor packaging component, including a packaging cover plate, a substrate and a semiconductor chip, wherein the substrate is provided with a limit groove and a mounting groove, the packaging cover plate is provided with a plurality of ventilation holes, the inner wall of the packaging cover plate is provided with a mounting cavity corresponding to the semiconductor chip, a dustproof film is adhered and arranged in the mounting cavity, a plurality of packaging modules are arranged on the lower side wall of the packaging cover plate, the packaging module includes a limit column fixedly connected to the lower side wall of the packaging cover plate, a liquid storage cavity is fixedly arranged in the limit column, a plurality of connecting cavities are arranged inside the limit column, the outer side wall of the limit column passes through the connecting cavity and is provided with a nozzle, the inner wall of the liquid storage cavity is fixedly connected with a connecting spring, an extrusion column is slidably arranged at the lower end outlet of the liquid storage cavity, and the upper end side wall of the extrusion column is fixedly connected to the lower end of the connecting spring.

[0008] Preferably, the liquid storage chamber and the connecting chamber are connected to each other, and a sealing film is provided at the connection between the liquid storage chamber and the connecting chamber.

[0009] Preferably, the sealing film is made of a silicone rubber material with prefabricated cutouts, and the dustproof film is made of a porous polytetrafluoroethylene material.

[0010] Preferably, a limit ring is provided at the upper end of the extrusion column, the height of the liquid storage cavity is greater than the height of the extrusion column, a seal is provided between the liquid storage cavity and the extrusion column, and a sealant is provided inside the liquid storage cavity.

[0011] Preferably, the cross section of the liquid storage chamber is T-shaped, and the plurality of nozzles are equidistantly distributed in a circular shape around the center of the limiting column.

[0012] Preferably, the mounting groove is adapted to the semiconductor chip, and the length of the limiting column is equal to the depth of the limiting groove.

[0013] The beneficial effects of the utility model are:

[0014] When the package cover plate is buckled with the substrate, the extrusion column will squeeze the sealant in the liquid storage cavity, and the sealant will be sprayed from the cut of the sealing film to the connection cavity and the nozzle under the action of air pressure, thus realizing the automatic sealing of the semiconductor chip, enhancing the connection stability and preventing the corrosion of the internal circuit of the chip by impurities in the air and causing the degradation of electrical performance. No additional glue injection is required, which is more convenient.

[0015] Through the multiple ventilation holes located on the package cover, the heat generated by the semiconductor chip during operation can be effectively conducted and dissipated by thermal convection, keeping the temperature of the semiconductor chip stable. The dust-proof film installed in the installation cavity on the inner wall of the package cover is made of porous polytetrafluoroethylene material. Its porous structure allows air and certain gas molecules to pass through, but prevents dust and most particles from entering the package cavity, protecting the semiconductor chip from contamination while having good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of a semiconductor packaging assembly provided by an embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of an exploded structure of a semiconductor package assembly provided by an embodiment of the utility model;

[0019] Figure 3It is a schematic diagram of a cross-sectional structure of a semiconductor packaging assembly packaging cover provided by an embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of the enlarged structure of a semiconductor packaging component A provided by an embodiment of the utility model;

[0021] Figure 5 It is a schematic diagram of the cross-sectional structure of a packaging module when a semiconductor packaging component is installed, provided by an embodiment of the utility model.

[0022] In the figure: 1. packaging cover; 101. ventilation hole; 2. substrate; 201. limiting groove; 3. semiconductor chip; 4. dustproof film; 5. limiting column; 501. connecting cavity; 502. nozzle; 503. sealing film; 6. extrusion column; 601. connecting spring; 7. liquid storage cavity. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example

[0025] Reference Figure 1-Figure 3 A semiconductor packaging component comprises a packaging cover plate 1, a substrate 2 and a semiconductor chip 3, wherein the substrate 2 is provided with a limiting groove 201 and a mounting groove, the packaging cover plate 1 is provided with a plurality of ventilation holes 101 for heat dissipation, the inner wall of the packaging cover plate 1 is provided with a mounting cavity corresponding to the semiconductor chip 3, a dustproof film 4 is adhered and arranged in the mounting cavity, and is used to prevent external dust from entering the packaging cavity, a plurality of packaging modules are arranged on the lower side wall of the packaging cover plate 1, the packaging module comprises a limiting column 5 fixedly connected to the lower side wall of the packaging cover plate 1, a liquid storage cavity 7 is fixedly arranged in the limiting column 5, a plurality of connecting cavities 501 are arranged inside the limiting column 5, the outer side wall of the limiting column 5 passes through the connecting cavity 501 and is provided with a nozzle 502, a connecting spring 601 is fixedly connected to the inner wall of the liquid storage cavity 7, an extrusion column 6 is slidably arranged at the lower end outlet of the liquid storage cavity 7, and the upper end side wall of the extrusion column 6 is fixedly connected to the lower end of the connecting spring 601;

[0026] It should be noted that: the liquid storage chamber 7 and the connecting chamber 501 are connected, and a sealing membrane 503 is provided at the connection between the liquid storage chamber 7 and the connecting chamber 501. The sealing membrane 503 is made of silicone rubber material with a prefabricated incision. When the pressure in the liquid storage chamber 7 reaches a certain level, the incision on the sealing membrane 503 will open and form a passage, so that the sealant can be sprayed out through the connecting chamber 501 and the nozzle 502 to achieve a sealing connection function. The dustproof membrane 4 is made of porous polytetrafluoroethylene (PTFE) material. The porous structure allows it to retain a certain air permeability, which can pass through air and other gas molecules. Due to the small pore size, dust and most particles are difficult to penetrate, achieving the effect of dust isolation and filtration. PTFE itself has a very high thermal conductivity, and heat can effectively pass through the porous membrane. At the same time, the hydrophobicity, chemical inertness and anti-stickiness of the dustproof membrane 4 can adapt well to the working environment and give it the ability of anti-seepage and anti-drum.

[0027] Reference Figure 3-Figure 5 A limiting ring is provided at the upper end of the extrusion column 6 to prevent the extrusion column 6 from detaching. The height of the liquid storage cavity 7 is greater than the height of the extrusion column 6. The liquid storage cavity 7 and the extrusion column 6 are sealed. A sealant is provided inside the liquid storage cavity 7 to perform glue injection sealing between the limiting column 5 and the limiting groove 201, thereby increasing the reliability of the packaging and also strengthening the airtightness inside the packaging cavity.

[0028] It should be noted that the cross-section of the liquid storage chamber 7 is T-shaped, and multiple nozzles 502 are equidistantly distributed in a ring shape around the center of the limiting column 5, which ensures the connection stability between the limiting column 5 and the limiting groove 201. The mounting groove is adapted to the semiconductor chip 3, and the length of the limiting column 5 is equal to the depth of the limiting groove 201, which ensures the sealing of the semiconductor chip 3 and avoids the corrosion of the internal circuit of the semiconductor chip 3 by impurities in the air, thereby causing a decrease in electrical performance.

[0029] The working principle of the semiconductor packaging assembly is as follows: the injection-molded substrate 2 is fixed on the packaging table, and the semiconductor chip 3 is placed inside the mounting groove on the substrate 2 by a mechanical suction cup. Subsequently, the packaging cover plate 1 is buckled on the substrate 2. Since the length of the limiting column 5 is equal to the depth of the limiting groove 201, the sealing of the semiconductor chip 3 is ensured, and the corrosion of the internal circuit of the semiconductor chip 3 by impurities in the air is prevented, which causes the electrical performance to deteriorate.

[0030] When the packaging cover plate 1 is buckled on the substrate 2, the bottom of the limiting groove 201 will squeeze the extrusion column 6. At this time, the extrusion column 6 will slide inside the liquid storage chamber 7, and the internal air pressure inside the liquid storage chamber 7 will increase accordingly. When the internal pressure of the liquid storage chamber 7 increases to a certain extent, the sealing film 503 set by the pre-cut silicone rubber material will open and form a passage, so that the sealant can be sprayed out through the connecting cavity 501 and the nozzle 502, and the limiting column 5 and the limiting groove 201 can be sealed by glue injection, which increases the packaging reliability and strengthens the airtightness inside the packaging cavity. The T-shaped cross-section of the liquid storage chamber 7 and the annular equidistantly distributed nozzles 502 jointly ensure the uniform injection of the sealant, improve the connection stability and packaging effect, and ensure the firm connection between the components through the installation groove and the limiting column 5 and the semiconductor chip 3 and the limiting groove 201. At the same time, the airtightness and stability of the entire packaging structure are enhanced by glue injection packaging;

[0031] Through the multiple ventilation holes 101 located on the packaging cover 1, the heat generated by the semiconductor chip 3 during operation can be effectively conducted and dissipated by thermal convection, thereby keeping the temperature of the semiconductor chip 3 stable. The dust-proof film 4 installed in the installation cavity on the inner wall of the packaging cover 1 is made of porous polytetrafluoroethylene (PTFE) material. Its porous structure allows air and certain gas molecules to pass through, but prevents dust and most particles from entering the packaging cavity, thereby protecting the semiconductor chip 3 from contamination. PTFE itself has a very high thermal conductivity, and heat can effectively pass through the porous film. At the same time, the hydrophobic, chemically inert and anti-stick properties of the dust-proof film 4 can adapt well to the working environment and provide anti-seepage and anti-bulging capabilities.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0034] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor packaging assembly, comprising a packaging cover plate (1), a substrate (2) and a semiconductor chip (3), characterized in that: The substrate (2) is provided with a limit groove (201) and a mounting groove, the packaging cover plate (1) is provided with a plurality of ventilation holes (101), the inner wall of the packaging cover plate (1) is provided with a mounting cavity corresponding to the semiconductor chip (3), a dustproof film (4) is adhered and arranged in the mounting cavity, a plurality of packaging modules are arranged on the lower side wall of the packaging cover plate (1), the packaging module comprises a limit column (5) fixedly connected to the lower side wall of the packaging cover plate (1), a liquid storage cavity (7) is fixedly arranged in the limit column (5), a plurality of connecting cavities (501) are arranged inside the limit column (5), the outer side wall of the limit column (5) passes through the connecting cavity (501) and is provided with a nozzle (502), the inner wall of the liquid storage cavity (7) is fixedly connected with a connecting spring (601), an extrusion column (6) is slidably arranged at the lower end outlet of the liquid storage cavity (7), and the upper end side wall of the extrusion column (6) is fixedly connected to the lower end of the connecting spring (601).

2. A semiconductor package assembly according to claim 1, characterized in that: The liquid storage chamber (7) and the connecting chamber (501) are connected to each other, and a sealing film (503) is provided at the connection between the liquid storage chamber (7) and the connecting chamber (501).

3. A semiconductor package assembly according to claim 2, characterized in that: The sealing film (503) is made of a silicone rubber material with a prefabricated cutout, and the dustproof film (4) is made of a porous polytetrafluoroethylene material.

4. The semiconductor package assembly according to claim 1, characterized in that: A limit ring is provided at the upper end of the extrusion column (6); the height of the liquid storage cavity (7) is greater than the height of the extrusion column (6); a seal is provided between the liquid storage cavity (7) and the extrusion column (6); and a sealant is provided inside the liquid storage cavity (7).

5. The semiconductor package assembly according to claim 1, characterized in that: The cross section of the liquid storage chamber (7) is T-shaped, and the plurality of nozzles (502) are distributed in an annular manner and at equal distances around the center of the limiting column (5).

6. The semiconductor package assembly according to claim 1, characterized in that: The mounting groove is adapted to the semiconductor chip (3), and the length of the limiting column (5) is equal to the depth of the limiting groove (201).

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