Hardware-in-loop testing device

Abstract

The utility model relates to the technical field of in-loop testing, and discloses a hardware-in-loop testing device which comprises a case, a host assembly, a power supply assembly, an expansion assembly, a plugging assembly and a heat dissipation assembly, the case is provided with an installation cavity, the host assembly is arranged in the installation cavity and located at the bottom of the case, and the power supply assembly is arranged in the installation cavity and located above the host assembly. The power supply assembly is electrically connected with the host assembly, the expansion assembly is arranged in the mounting cavity and located above the power supply assembly, the expansion assembly is electrically connected with the host assembly, the plugging assembly is arranged in the mounting cavity and located above the power supply assembly, the plugging assembly is fixedly connected with the expansion assembly and electrically connected with the host assembly, and the heat dissipation assembly is arranged in the mounting cavity. According to the hardware-in-the-loop testing device, the host assembly, the power supply assembly, the expansion assembly, the plug-in assembly and the heat dissipation assembly are arranged in the case in a three-dimensional mode, so that the hardware-in-the-loop testing device is more compact in structure and small in occupied space.

Description

Technical Field

[0001] The utility model relates to the technical field of in-loop testing, in particular to a hardware in-loop testing device. Background Art

[0002] In-the-loop testing is used to perform simulation tests and fault injection tests on virtual objects in the laboratory. Taking automobile development as an example, the purpose of hardware-in-the-loop (HIL) testing is to test the controller before it is applied to the actual vehicle to verify its function, so as to reduce the actual vehicle development cycle and cost, and to perform simulation tests and fault injection tests on real objects in the actual vehicle to verify whether the safety mechanism of the controller is well prepared, that is, after a fault occurs, whether the fault response of the controller is consistent with expectations, and whether the response of the controller meets safety requirements.

[0003] In order to realize the hardware-in-the-loop testing function of the vehicle, it is necessary to set up a real-time simulation platform to run the model of the controlled object, that is, it is necessary to set up a processor with a real-time operating system to run the virtual vehicle in the virtual environment, as well as a board and power supply to communicate with the real-time simulation platform.

[0004] The test device in the prior art connects the module units of various functions with complex wiring harnesses. Each unit needs to be separately partitioned due to the planar layout, which makes the actual layout of the equipment very large. On the one hand, in the case of indoor testing, a separate area is required for testing. On the other hand, the huge equipment cannot be placed in the car for testing, resulting in a limited scope of use of the device. Utility Model Content

[0005] In view of this, the utility model provides a hardware-in-the-loop testing device to solve the problem in the prior art that the testing device divides each unit into separate partitions, occupies a large space, and cannot be placed in a vehicle for testing.

[0006] The utility model provides a hardware-in-the-loop testing device, comprising a chassis, a host component, a power component, an extension component, a plug-in component and a heat dissipation component, wherein the chassis is provided with an installation cavity, the host component is arranged in the installation cavity and is located at the bottom of the chassis, the power component is arranged in the installation cavity and is located above the host component, the power component is electrically connected to the host component, the extension component is arranged in the installation cavity and is located above the power component, the extension component is electrically connected to the host component, the plug-in component is arranged in the installation cavity and is located above the power component, the plug-in component is fixedly connected to the extension component and is electrically connected to the host component, the heat dissipation component is arranged in the installation cavity and is located above the extension component, and the heat dissipation component is electrically connected to the host component.

[0007] Beneficial effects: The utility model makes the structure of the hardware-in-the-loop test device more compact by arranging the host component, power supply component, expansion component, plug-in component and heat dissipation component in a three-dimensional manner in the chassis. It can not only test the virtual vehicle, but also be placed in a physical vehicle for testing, thereby improving the scope of application of the test device and having the advantages of small size, small space occupation and easy handling and operation.

[0008] In an optional embodiment, the chassis includes a top cover assembly, a bottom cover assembly and two frames, the top cover assembly is fixedly connected to the top of the frame, the bottom cover assembly is connected to the bottom of the frame, and the host assembly, power supply assembly, expansion assembly, connector assembly and heat dissipation assembly are fixedly connected to the frame.

[0009] Beneficial effects: The utility model sets a frame in the chassis to form a three-dimensional installation cavity between the frame and the top cover assembly and the bottom cover assembly. The frame not only supports the chassis, but also serves as a fixed connection for various components, so that the host assembly, power supply assembly, expansion assembly, plug-in assembly and heat dissipation assembly can be set three-dimensionally in the chassis, making the structure of the hardware-in-the-loop test device more compact, which can not only realize the testing of virtual vehicles, but also facilitate the testing of vehicles by placing them in physical vehicles, thereby improving the scope of application of the test device.

[0010] In an optional embodiment, the frame includes columns, connecting plates, a center beam, side plates, modular plates and a fixed support assembly, wherein two columns are symmetrically arranged vertically, two ends of the two connecting plates are respectively connected to the columns, the center beam is vertically connected to the two connecting plates, the side plates are fixedly connected to the connecting plates, four modular plates are respectively fixedly connected to the columns, and the fixed support assembly is fixedly connected to the center beam and the modular plates.

[0011] Beneficial effects: The utility model sets columns in the frame, and a three-dimensional installation cavity is formed between the four columns and the top cover assembly and the bottom cover assembly. The connecting plate has a pulling effect on the two columns to make the frame more stable. The modular board can be used to fix the various components so that the various components are located at different positions in the chassis, thereby realizing the three-dimensional arrangement of the various components in the chassis. The fixed support assembly can support and fix the power supply assembly, so that the power supply assembly can be installed more stably in the chassis.

[0012] In an optional implementation, the host assembly includes an implementation host and a first hanging ear, the real-time host is arranged above the bottom cover assembly, the real-time host is suitable for processing the running system, and the first hanging ear is fixedly installed on both sides of the real-time host.

[0013] Beneficial effects: The utility model sets a real-time host, and can realize simulation test and fault injection test of virtual vehicle in the running system of the real-time host, thereby reducing the development cycle and cost of real vehicle. The real-time host can also be connected to the real vehicle to perform simulation test and fault injection test on the real vehicle to verify whether the safety mechanism of the real vehicle controller is perfect, that is, after a fault occurs, whether the fault response of the real vehicle controller is consistent with the expectation, whether the response of the controller meets the safety requirements, etc., thereby improving the application scope of the hardware-in-the-loop test device; the first hanging ear set on the real-time host is convenient for the operator to use it as a handle to take the real-time host out of the chassis for maintenance and repair, as well as to update the internal system.

[0014] In an optional embodiment, the power supply assembly includes a programmable power supply and a conditioning power supply, the programmable power supply is connected to the fixed support assembly, the conditioning power supply is electrically connected to the programmable power supply, the conditioning power supply includes a second hanging ear, a power supply box, a mesh plate, a switch button, an output panel and an adapter block, the second hanging ear is installed on the side of the programmable power supply and the conditioning power supply, the power supply box is fixedly connected to the conditioning power supply, the mesh plate is arranged on the top of the power supply box, the switch button is arranged on the side of the power supply box, the output panel is arranged on the side of the power supply box, a plurality of power output ports are arranged on the output panel, and the adapter block is fixedly connected to the power supply box and the mesh plate.

[0015] Beneficial effect: The utility model can output different voltages to supply power to different components in the test device by setting a program-controlled power supply and a conditioning power supply.

[0016] In an optional embodiment, the connector assembly includes a crossbeam, a threaded bar, a fixed panel, an adapter plate, a connector and a power switching board, the two crossbeams are arranged horizontally, the two threaded bars are respectively connected to the crossbeams, the fixed panel is connected to the threaded bar, a plurality of openings are provided on the fixed panel, the adapter plate is fixedly connected to the fixed panel, the adapter plate is electrically connected to the real-time host assembly, the connector is fixedly mounted on the adapter plate, one end of the power switching board is fixedly connected to the fixed panel, and the other end is connected to the fixed support assembly.

[0017] Beneficial effect: The utility model provides a connector in the connector assembly to facilitate electrical connection with an external controller, and transmits the signal to the real-time host after conversion by the adapter board, thereby realizing in-loop testing of the external controller. Not only can in-loop testing of the virtual vehicle controller be realized, but also in-loop testing of the external real controller can be performed, thereby increasing the scope of application.

[0018] In an optional embodiment, the expansion component includes a first crossbeam, a second crossbeam, two third crossbeams and a baffle, the two baffles are fixedly connected to the two ends of the first crossbeam, the second crossbeam and the third crossbeam respectively, and the baffles, the first crossbeam, the second crossbeam and the third crossbeam enclose a accommodating cavity.

[0019] Beneficial effects: The utility model encloses a receiving cavity between the baffle, the first crossbeam, the second crossbeam and the third crossbeam, which can be used to place accessories such as IO boards, communication boards and fault injection boards, thereby increasing the expansion capability of the hardware-in-the-loop test device, thereby increasing the test content of the vehicle and reducing the actual vehicle development cycle and cost.

[0020] In an optional embodiment, the heat dissipation assembly includes a mounting plate, a radiator and a connector, a plurality of radiators are mounted on the mounting plate, the radiator is electrically connected to the host assembly, and the connector connects the mounting plate and the connecting plate.

[0021] Beneficial effect: The utility model can improve the air exchange between the inside and outside of the chassis by arranging multiple radiators in the chassis, and exchange the heat generated by each heating component in the chassis with the external cold air, thereby reducing the temperature in the chassis to ensure the normal operation of each component in the chassis.

[0022] In an optional embodiment, the hardware-in-the-loop testing device also includes a board assembly, which includes a mounting plate and clips, the mounting plate is fixedly connected to the center beam and the modular board, and a plurality of clips are fixedly mounted on the mounting plate.

[0023] Beneficial effect: The utility model provides a plurality of buckles on the installation scraper, thereby facilitating the fixed installation of each board and making it more stable in the chassis, and facilitating the three-dimensional setting of the space in the chassis, making the structure of the hardware-in-the-loop test device more compact.

[0024] In an optional embodiment, the hardware-in-the-loop testing device also includes a decorative panel, a ventilation component and a connection power supply component, the decorative panel is detachably connected to the first hanging ear and the second hanging ear, the ventilation component is connected to the column and the top cover component, the ventilation component is provided with heat dissipation holes, the connection power supply component is connected to the column, the bottom cover assembly and the ventilation component, and is electrically connected to the host assembly, the power supply assembly, the expansion assembly, the plug-in assembly and the heat dissipation assembly.

[0025] Beneficial effects: The utility model can dissipate heat and ventilate the entire chassis by setting up a ventilation component to reduce the temperature inside the chassis. The power supply connection component is set to facilitate power supply and communication for the host component, power supply component, expansion component, plug-in component and heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of a hardware-in-the-loop test device according to an embodiment of the utility model;

[0028] Figure 2 An exploded diagram of a hardware-in-the-loop test device according to an embodiment of the utility model;

[0029] Figure 3 An exploded view of a top cover assembly in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0030] Figure 4 An exploded view of a bottom cover assembly in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0031] Figure 5 It is a structural schematic diagram of a framework in a hardware-in-the-loop testing device according to an embodiment of the utility model;

[0032] Figure 6 A schematic diagram of the structure of a column in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0033] Figure 7 It is a structural schematic diagram of a first analog-to-digital board in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0034] Figure 8 It is a structural schematic diagram of a second analog-to-digital board in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0035] Fig. 9 It is a structural schematic diagram of a middle beam in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0036] Fig.10 It is a structural schematic diagram of a side plate in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0037] Fig.11 It is a structural schematic diagram of a host component in a hardware-in-the-loop testing device according to an embodiment of the utility model;

[0038] Fig.12 It is a structural schematic diagram of a host magnet fixing plate in a hardware-in-the-loop testing device according to an embodiment of the utility model;

[0039] Fig.13 It is a structural schematic diagram of a power supply component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0040] Fig.14 A schematic diagram of a structure for conditioning power supply in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0041] Fig.15It is a structural schematic diagram of a switching block in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0042] Fig.16 An exploded diagram of a plug-in component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0043] Fig.17 It is a structural schematic diagram of an expansion component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0044] Fig.18 It is a structural schematic diagram of a heat dissipation component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0045] Fig.19 It is a structural schematic diagram of a board component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0046] Fig. 20 It is a structural schematic diagram of a ventilation component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0047] Fig.21 This is a schematic diagram of the structure of a device connection and power supply component in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0048] Fig. 22 It is a front view and a top view of a decorative plate in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0049] Fig.23 A schematic diagram of the direction of external airflow movement in a hardware-in-the-loop test device according to an embodiment of the utility model;

[0050] Fig.24 A schematic diagram of the airflow movement direction at a host component in a hardware-in-the-loop testing device according to an embodiment of the utility model;

[0051] Fig.25 The present invention is a schematic diagram of the airflow movement direction at a heat dissipation component in a hardware-in-the-loop testing device according to an embodiment of the present invention.

[0052] Description of reference numerals:

[0053] 1000, chassis;

[0054] 1100, top cover assembly; 1110, top cover; 1120, light-transmitting sign board; 1130, light belt; 1140, light belt cover plate; 1150, cover plate fixing plate; 1160, dustproof cotton;

[0055] 1200, frame; 1210, column; 1220, first module board; 1230, second module board; 1240, first connecting plate; 1250, second connecting plate; 1260, middle beam; 1270, side plate; 1280, power supply component support bracket; 1290, power supply switching board fixing device; 1291, first fixing bracket; 1292, second fixing bracket;

[0056] 1300, bottom cover assembly; 1310, bottom cover; 1320, foot pad; 1330, bottom pad;

[0057] 1400, plug-in assembly; 1410, third hanging ear; 1411, adapter box hanging ear; 1412, adapter box magnet fixing plate; 1413, annular magnet; 1420, crossbeam; 1430, threaded strip; 1440, fixed panel; 1450, connector; 1460, adapter board; 1470, power switching board; 1471, single-chip computer board; 1472, switching board; 1473, wiring board;

[0058] 1500, heat dissipation assembly; 1510, connector; 1520, mounting plate; 1530, radiator;

[0059] 1600, power supply assembly; 1610, program-controlled power supply; 1620, second mounting ear; 1630, conditioning power supply; 1631, power supply box; 1632, mesh board; 1633, switch button; 1634, output panel; 1635, adapter block;

[0060] 1700, host assembly; 1710, real-time host; 1720, first hanging ear; 1721, host hanging ear; 1722, host magnet fixing plate; 1723, host pull ring;

[0061] 1800, board assembly; 1810, mounting plate; 1820, buckle;

[0062] 1900, decorative panels;

[0063] 2000, ventilation components;

[0064] 2100, connecting the power supply assembly; 2110, connecting the assembly fixing plate; 2120, the movable baffle;

[0065] 2200, extension component; 2210, first crossbeam; 2220, second crossbeam; 2230, third crossbeam; 2240, first baffle; 2250, second baffle; 2260, cushion block. DETAILED DESCRIPTION

[0066] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0067] Combine the following Figures 1 to 25 , describing an embodiment of the utility model.

[0068] According to the embodiments of the present utility model, Figure 1 and Figure 2 As shown, a hardware-in-the-loop testing device is provided, including a chassis 1000, a host component 1700, a power component 1600, an extension component 2200, a plug-in component 1400 and a heat dissipation component 1500. The chassis 1000 is provided with an installation cavity, the host component 1700 is arranged in the installation cavity, located at the bottom of the chassis 1000, the power component 1600 is arranged in the installation cavity, located above the host component 1700, the power component 1600 is electrically connected to the host component 1700, the extension component 2200 is arranged in the installation cavity, located above the power component 1600, the extension component 2200 is electrically connected to the host component 1700, the plug-in component 1400 is arranged in the installation cavity, located above the power component 1600, the plug-in component 1400 is fixedly connected to the extension component 2200, and is electrically connected to the host component 1700, the heat dissipation component 1500 is arranged in the installation cavity, located above the extension component 2200, and the heat dissipation component 1500 is electrically connected to the host component 1700.

[0069] Specifically, in this embodiment, the chassis 1000 is not specifically limited. To meet the actual situation, the chassis 1000 is set as a cubic structure, and the interior and side thereof are provided with installation cavities. The chassis 1000 can be made of five-series aluminum alloy material, which has low density, high strength, and excellent corrosion resistance and welding performance. When the chassis 1000 is manufactured, the overall coating process is first chemically conductively oxidized and then externally sprayed, so that the interior of the chassis 1000 is conductive and the exterior is not conductive, which is conducive to the grounding of the internal components. The chassis 1000 is provided with a plurality of heat dissipation holes for dissipating heat from the internal components. In some other embodiments, the chassis 1000 can be set as a cylindrical structure or other shapes according to actual needs, and can also be made of other materials such as stainless steel or polymer materials.

[0070] In this embodiment, Figure 2As shown, the host component 1700 is placed at the bottom of the chassis 1000 and is fixedly connected to the chassis 1000 by screws and nuts, making its installation more stable. The host component 1700 has a real-time simulation platform for running the controlled object model, which is used to run a virtual vehicle in a virtual environment. At the same time, the host component 1700 is also used to control the coordinated operation of various components.

[0071] The power supply assembly 1600 is placed above the host assembly 1700 and fixedly connected to the chassis 1000 via screws and nuts. It is used to supply power to the entire hardware-in-the-loop test device and to simulate the vehicle power supply. At the same time, it can supply power to different electrical components in the hardware-in-the-loop test device as needed.

[0072] The expansion component 2200 is placed above the power supply component 1600 and is fixedly connected to the chassis 1000 by screws and nuts. It is used to expand the installation of different boards and modules to communicate with the real-time simulation platform, and to provide different simulation scenarios to simulate vehicle failures during use.

[0073] The connector component 1400 is placed above the power component 1600, on the same layer as the expansion component 2200, and is fixedly connected to the chassis 1000 by screws and nuts. It serves as a transfer station for the real electrical interface between the external real controller and the virtual object in the host component 1700, and is responsible for internal and external electrical connections.

[0074] The heat dissipation component 1500 is placed above the expansion component 2200 and is fixedly connected to the chassis 1000 by screws and nuts, so as to increase the air circulation inside and outside the chassis 1000 and facilitate the heat generated by various components in the chassis 1000 to be discharged to the external environment.

[0075] The utility model makes the structure of the hardware-in-the-loop test device more compact by three-dimensionally arranging the host component 1700, the power component 1600, the expansion component 2200, the connector component 1400 and the heat dissipation component 1500 in a chassis 1000. It can not only test the virtual vehicle, but also be placed in a physical vehicle for testing, thereby improving the application scope of the test device and having the advantages of small size, small space occupation and easy transportation and operation.

[0076] In one embodiment, Figure 2 As shown, the chassis 1000 includes a top cover assembly 1100, a bottom cover assembly 1300 and two frames 1200. The two frames 1200 are symmetrically arranged, the top cover assembly 1100 is fixedly connected to the top of the frame 1200, the bottom cover assembly 1300 is connected to the bottom of the frame 1200, and the host assembly 1700, the power supply assembly 1600, the expansion assembly 2200, the connector assembly 1400 and the heat dissipation assembly 1500 are fixedly connected to the frame 1200.

[0077] Specifically, Figure 3 As shown, in this embodiment, the top cover assembly 1100 is located at the top of the chassis 1000, and the top cover assembly 1100 includes a top cover 1110, a translucent sign plate 1120, a light strip 1130, a light strip cover plate 1140, a cover plate fixing plate 1150, and a dustproof cotton 1160. The top cover 1110 is made of lightweight 5052-H34 aluminum alloy with high thermal conductivity. Limited position surfaces and fixed surfaces are set at the four corners. The fixing surfaces are provided with conical countersunk holes, and a plurality of long grooves are opened on the lower part of the side wall for limiting the positioning blocks of the side plates 1270. The setting of the four conical countersunk holes on the top also makes the installation of the top cover 1110 self-centering. As the four flat head screws on the top are tightened, the four columns 1210 of the frame 1200 are tightened, so that the dimensions of each part of the test device can be controlled and the gaps between the components can be uniformed. The logo position on the top cover 1110 is processed into a hollow logo by laser / water cutting / machining center milling, and the corresponding logo is engraved on the transparent logo plate 1120 of the polymer material by engraving, wherein the light transmittance range of the transparent logo plate 1120 is 10% to 60%, which can be adjusted according to the situation of the light belt 1130. A light belt cover plate 1140 is arranged behind the transparent logo plate 1120, and a light belt 1130 is arranged in the cover plate. The light belt 1130 is arranged in a ring and passes through It is fixed to the light strip cover plate 1140 by gluing, and threaded holes are set on the light strip cover plate 1140. Studs are set at corresponding positions on the inner side of the top cover assembly 1100, which pass through the cover plate fixing plate 1150 and are fixed by nuts, external threaded columns and screw threaded holes. The light emitted by the light strip 1130 can illuminate the position of the light-transmitting mark. Four groups of heat dissipation holes are set on the side of the top cover 1110, and dust-proof cotton 1160 is set inside by gluing to prevent dust in the external environment from entering the interior of the chassis 1000.

[0078] like Figure 4As shown, in this embodiment, the bottom cover assembly 1300 is located at the bottom of the chassis 1000. The bottom cover assembly 1300 is the bottom base of the chassis 1000. The bottom cover assembly 1300 includes a bottom cover 1310, a foot pad 1320, and a bottom pad 1330. The four corners of the bottom cover 1310 are provided with limited surfaces, and the limited surfaces are provided with round holes for fixing. The bottom cover 1310 is made of lightweight 5052-H34 aluminum alloy with high thermal conductivity, so that the test device has a downward radiating heat dissipation function, and the upper part of the bottom cover 1310 is provided with a plurality of long grooves for fixing the side panels 1270. The bottom of the foot pad 1320 is made of columnar polymer material, four foot pads 1320 are vertically arranged at the bottom of the bottom cover 1310, and a bottom pad 1330 is arranged at the bottom of the foot pad 1320. The bottom pad 1330 is O-shaped and can be made of polytetrafluoroethylene. It is fixed to the bottom of the foot pad 1320 by bonding to reduce shock and protect the bottom of the foot pad 1320. A countersunk hole is arranged inside the foot pad 1320, which is fixedly connected to the bottom cover 1310 by screws and nuts. The bottom cover assembly 1300 serves as the foundation of the entire equipment, taking into account the bottom support and basic positioning functions.

[0079] In this embodiment, Figures 5 to 10 As shown, two frames 1200 are arranged symmetrically and serve as side walls on opposite sides of the chassis 1000. The top of the frame 1200 is connected to the top cover assembly 1100, and the bottom is connected to the bottom cover assembly 1300, so that the chassis 1000 is enclosed into a structure with a top, bottom and two closed sides, and the other two sides are open installation cavities, which are used to fix the host assembly 1700, the power supply assembly 1600, the expansion assembly 2200, the connector assembly 1400 and the heat dissipation assembly 1500 to the frame 1200.

[0080] The utility model provides a frame 1200 in the chassis 1000, and a three-dimensional installation cavity is formed between the two frames 1200 and the top cover assembly 1100 and the bottom cover assembly 1300. The frame 1200 not only supports the chassis 1000, but also serves as a fixed connection for each component, so that the host component 1700, the power supply component 1600, the expansion component 2200, the plug-in component 1400 and the heat dissipation component 1500 are conveniently arranged in the chassis 1000 in a three-dimensional manner, making the structure of the hardware-in-the-loop test device more compact, which can not only realize the testing of virtual vehicles, but also facilitate the testing of vehicles by placing them in physical vehicles, thereby improving the scope of application of the test device.

[0081] In one embodiment, Figures 5 to 10As shown, the frame 1200 includes columns 1210, connecting plates, a center beam 1260, side plates 1270, modular plates and fixed support components. The two columns 1210 are symmetrically arranged vertically, the two ends of the two connecting plates are respectively connected to the columns 1210, the center beam 1260 is vertically connected to the two connecting plates, the side plates 1270 are fixedly connected to the connecting plates, the four modular plates are respectively fixedly connected to the columns 1210, and the fixed support components are fixedly connected to the center beam 1260 and the modular plates.

[0082] Specifically, Figure 6 As shown, in this embodiment, the column 1210 is an arc column 1210, and the material of the column 1210 is 6061-T6 aluminum alloy, and the material of the other parts of the frame 1200 is 5052-H34 aluminum alloy, all of which are high thermal conductivity materials. The side of the column 1210 facing the outer side of the chassis 1000 is a 1 / 4 circle shape, and the circular holes arranged above and below the column 1210 are arranged with threaded sleeves for fixing the top cover 1110 and the bottom cover 1310. The other two sides of the column 1210 are provided with a slide groove surface, and the slide groove surface is provided with a slide groove, and the two slide grooves are arranged vertically. In some other embodiments, the column 1210 can also adopt a square column structure, and the two sides of the column 1210 are also provided with a slide groove surface, and the slide groove surface is provided with a slide groove, and the two slide grooves are arranged vertically.

[0083] like Figure 5 As shown, in this embodiment, the modular board includes a first modular board 1220 and a second modular board 1230, two of each of the first modular board 1220 and the second modular board 1230 are provided, and are respectively installed on two opposite columns 1210, wherein one first modular board 1220 and one second modular board 1230 are arranged on the frame 1200 on one side, and another first modular board 1220 and another second modular board 1230 are arranged on the frame 1200 on the other side, and a threaded hole is provided on the slide groove surface of the column 1210 for embedded adjustment arrangement of the first modular board 1220 on the column 1210, as shown in FIG. Figure 7 As shown, the first modular board 1220 is an L-shaped structure, one side is provided with a standard square hole for fixing and installing various components, and the other side is provided with a long slot hole, which is fixedly connected to the column 1210 through a screw threaded hole; Figure 8 As shown, the second modular plate 1230 is an L-shaped structure, with a conical countersunk hole on one side for fixing and installing the fixed support component, and a round hole on the other side for fixing to the column 1210 by screws and nuts.

[0084] The connecting plate includes a first connecting plate 1240 and a second connecting plate 1250. The first connecting plate 1240 is an L-shaped structure, with a short side being a reinforcing rib and a long side running through the entire interior of the device. A plurality of rivet nuts are arranged on the first connecting plate 1240 according to a fixed spacing, and are fixed to the second modular plates 1230 at both ends through screw threaded holes. The circular holes arranged on the first connecting plate 1240 are fixing holes of the heat dissipation component 1500. In particular, a long slot process hole is arranged on the first connecting plate 1240, which is used to facilitate the insertion of tools to tighten the fixing screws on the power switching board 1470 in the connector 1400 during assembly. The second connecting plate 1250 is a gate-shaped structure, with a plurality of rivet nuts arranged on the long side according to the installation size, and are fixed to the second modular plate 1230 through screw threaded holes. A plurality of rivet nuts are arranged on the short side at the bottom of the second connecting plate 1250 according to the installation size, and are fixed to the bottom cover 1310 through screw threaded holes.

[0085] like Fig. 9 As shown, the middle beam 1260 is in a "J"-shaped structure, and two short sides are provided with conical countersunk holes, which are fixed to the first connecting plate 1240 and the second connecting plate 1250 through screw threaded holes; Fig.10 As shown, two positioning blocks are respectively provided at the top and the bottom of the side panel 1270. During assembly, the positioning blocks are positioned and snapped into place through the positioning grooves provided on the bottom cover 1310 and the top cover 1110, and the side panel 1270 is pressed and fixed through the fixed connection between the top cover 1110 and the bottom cover 1310 and the column 1210. In addition, a handle is provided on the outside of the side panel 1270 for carrying the entire test device.

[0086] like Figure 5 As shown, the fixed support component includes a power component support bracket 1280, a power switching board fixing device 1290, a first fixed bracket 1291 and a second fixed bracket 1292. The power component support brackets 1280 are arranged in pairs inside for supporting the power component 1600. The power component support brackets 1280 are arranged with rivet nuts, which are fixed to the middle beam 1260 and the second modular board 1230 through screw threaded holes; the power switching board fixing device 1290 is composed of a first fixed bracket 1291 and a second fixed bracket 1292. Both brackets are "J"-shaped structures, which are arranged according to the vertical spacing of the corresponding long slot holes on the brackets. The short sides of the brackets are provided with rivet nuts, which are fixed to the middle beam 1260 and the second modular board 1230 through screw threaded holes. The long slot holes on the brackets are used to fix to the power switching board 1470. The frame 1200 is the skeleton of the entire device, and all components are arranged inside the chassis 1000 based on its skeleton structure.

[0087] The utility model sets columns 1210 in the frame 1200, and forms a three-dimensional installation cavity between the four columns 1210 and the top cover assembly 1100 and the bottom cover assembly 1300. The connecting plate pulls the two columns 1210 to make the frame 1200 more stable. The modular board can be used to fix the various components so that the various components are located at different positions in the chassis 1000, thereby realizing the three-dimensional arrangement of the various components in the chassis 1000. The fixed support assembly can support and fix the power supply assembly 1600 to make the power supply assembly 1600 more stable when installed in the chassis 1000.

[0088] In one embodiment, Fig.11 As shown, the host component 1700 includes an implementation host and a first hanging ear 1720 . The real-time host 1710 is arranged above the bottom cover component 1300 . The real-time host 1710 is suitable for processing the running system. The first hanging ear 1720 is fixedly installed on both sides of the real-time host 1710 .

[0089] Specifically, in this embodiment, the host assembly 1700 includes a real-time host 1710 and two first hanging ears 1720, the first hanging ear 1720 includes a host hanging ear 1721, a host magnet fixing plate 1722, a host pull ring 1723 and an annular magnet 1413, and the host assembly 1700 is arranged at the bottom of the entire device. In order to facilitate pulling out the real-time host 1710, the two host hanging ears 1721 are respectively installed on both sides of the real-time host 1710, and the host hanging ear 1721 is provided with a host magnet fixing plate 1722, a host pull ring 1723 and annular magnet 1413. The host magnet fixing plate 1722 is made of austenitic stainless steel SUS304 with low ferromagnetic content and is processed into a "J"-shaped structure so that it has low ferromagnetism, such as Fig.12 As shown, a threaded hole is provided on the host magnet fixing plate 1722, which is fixed to the host hanging ear 1721 through the screw threaded hole. The host pull ring 1723 is made of SUS304 and is movably placed in the "J"-shaped groove of the host magnet fixing plate 1722. In particular, an arc groove corresponding to the arc of the host pull ring 1723 is provided on the upper outer side of the host magnet fixing plate 1722, which is used for storing and placing the host pull ring 1723; a conical countersunk hole is provided inside the annular magnet 1413, which is fixed by screws and the threaded hole in the middle of the host magnet fixing plate 1722.

[0090] In this embodiment, a processor is provided in the real-time host 1710. The processor has a real-time simulation platform for running a controlled object model, which is used to run a virtual vehicle in a virtual environment. At the same time, the real-time host 1710 can also be used to control the coordinated operation of various components.

[0091] The utility model sets a real-time host 1710, and can implement simulation testing and fault injection testing of a virtual vehicle in the operating system of the real-time host 1710, thereby reducing the development cycle and cost of a real vehicle. The real-time host 1710 can also be connected to a real vehicle to perform simulation testing and fault injection testing on the real vehicle to verify whether the safety mechanism of the real vehicle controller is complete, that is, after a fault occurs, whether the fault response of the real vehicle controller is consistent with expectations, whether the response of the controller meets safety requirements, etc., thereby improving the application scope of the hardware-in-the-loop testing device. The first hanging ear 1720 set on the real-time host 1710 is convenient for the operator to use it as a handle to remove the real-time host 1710 from the chassis 1000 for maintenance and repair, as well as to update the internal system.

[0092] In one embodiment, Figures 13 to 15 As shown, the power supply assembly 1600 includes a programmable power supply 1610 and a conditioning power supply 1630. The programmable power supply 1610 is connected to the fixed support assembly, and the conditioning power supply 1630 is electrically connected to the programmable power supply 1610. The conditioning power supply 1630 includes a second hanging ear 1620, a power supply box 1631, a mesh plate 1632, a switch button 1633, an output panel 1634 and a transfer block 1635. The second hanging ear 1620 is installed on the side of the programmable power supply 1610 and the conditioning power supply 1630, the power supply box 1631 is fixedly connected to the conditioning power supply 1630, the mesh plate 1632 is arranged on the top of the power supply box 1631, the switch button 1633 is arranged on the side of the power supply box 1631, the output panel 1634 is arranged on the side of the power supply box 1631, and a plurality of power output ports are arranged on the output panel 1634. The transfer block 1635 is fixedly connected to the power supply box 1631 and the mesh plate 1632.

[0093] Specifically, in the power supply assembly 1600 of this embodiment, the programmable power supply 1610 and the conditioning power supply 1630 are integrated into one device. All components of the conditioning power supply 1630 are made of high thermal conductivity material 5052-H32 aluminum alloy. A plurality of switching power supplies are configured inside the power supply box 1631 for powering boards and the like in the test device. A switch button 1633 is provided on the front of the power supply box 1631, which is responsible for starting and powering off the entire power supply assembly 1600. An integrated process hole is provided on the side of the power supply box 1631. A power input port is provided on the side of the power supply box 1631 near the end for connecting to an external power supply.

[0094] The threaded holes on the power output panel 1634 and the conical countersunk holes on the power box are fixed by screw threaded holes. A plurality of power output ports are provided on the power output panel 1634 for outputting currents of different voltages. The planar adapter block 1635 is provided with rivet nuts arranged in pairs, one end of which is fixed by a screw threaded hole and a conical countersunk hole on the power box 1631, and the other end is fixed by a screw threaded hole and a conical countersunk hole on the top mesh plate 1632. The provision of the top mesh plate 1632 not only increases the protection for the power supply assembly 1600, but also provides a good heat dissipation condition for the power supply assembly 1600 due to its porous structure.

[0095] The utility model can output different voltages to supply power to different components in the test device by providing a program-controlled power supply 1610 and a conditioning power supply 1630 .

[0096] In one embodiment, Fig.16 As shown, the connector assembly 1400 includes a crossbeam 1420, a threaded bar 1430, a fixed panel 1440, an adapter plate 1460, a connector 1450 and a power switching plate 1470. The two crossbeams 1420 are arranged horizontally, the two threaded bars 1430 are respectively connected to the crossbeams 1420, the fixed panel 1440 is connected to the threaded bar 1430, the fixed panel 1440 is provided with a plurality of openings, the adapter plate 1460 is fixedly connected to the fixed panel 1440, the adapter plate 1460 is electrically connected to the real-time host 1710, the connector 1450 is fixedly installed on the adapter plate 1460, and one end of the power switching plate 1470 is fixedly connected to the fixed panel 1440, and the other end is connected to the fixed support assembly.

[0097] Specifically, the connector assembly 1400 in this embodiment includes a third hanging ear 1410, a crossbeam 1420, a threaded bar 1430, a fixed panel 1440, an external connector 1450, an adapter board 1460 and a power switching board 1470, wherein the third hanging ear 1410 includes an adapter box hanging ear 1411, an adapter box magnet fixing plate 1412, and an annular magnet 1413; the power switching board 1470 includes a single-chip computer board 1471, a switching board 1472, and a terminal board 1473.

[0098] The connector assembly 1400 serves as a transfer station between the real electrical interface of the external real controller and the virtual object in the real-time host 1710, and is responsible for the internal and external connections. The material setting of the third hanging ear 1410 is consistent with the host hanging ear 1721 device. The transfer box magnet fixing plate 1412 is provided with a through hole, and the through hole set on the transfer box hanging ear 1411 is fixed by a screw threaded hole. The annular magnet 1413 is provided with a conical countersunk hole inside, which is fixed by screws and the threaded hole in the middle of the transfer box magnet fixing plate 1412. The transfer box magnet fixing plate 1412 is provided with multiple annular magnet 1413 installation positions; the connector assembly 1400 is set in a fixed position through the upper and lower beams 1420 and the threaded strips 1430 set in the beams 1420, and the fixing panel 1440 is fixed by screw threaded holes. Between the two beams 1420, according to the connector 1450 set in the connector assembly 1400, corresponding connector 1450 openings are set on the fixed panel 1440. The setting of the connector 1450 adopts a less-to-more method. When the point position remains unchanged, a multi-point connector 1450 is used to connect to the external controller, and is transferred and spread to multiple connectors 1450 that are consistent with the boards set on the expansion component 2200 through the internal connector 1450 adapter board 1460. The power switching board 1470 uses a PCB board fixing block to fix the connector 1450 fixing panel 1440 through screw threaded holes.

[0099] The utility model sets a connector 1450 in the connector assembly 1400 to facilitate electrical connection with an external controller, and transmits the signal to the real-time host 1710 after conversion by the adapter plate 1460, thereby realizing in-loop testing of the external controller. Not only can in-loop testing of the virtual vehicle controller be realized, but also in-loop testing of the external real controller can be performed, thereby increasing the scope of application.

[0100] In one embodiment, Fig.17 As shown, the extension component 2200 includes a first beam 2210, a second beam 2220, two third beams 2230 and a baffle, and the two baffles are fixedly connected to the two ends of the first beam 2210, the second beam 2220 and the third beam 2230 respectively, and the baffle, the first beam 2210, the second beam 2220 and the third beam 2230 enclose a accommodating cavity.

[0101] Specifically, in this embodiment, the expansion component 2200 is used to place the IO board, the communication board and the fault injection board. In the expansion component 2200, the first beam 2210 is a long-edge beam, the second beam 2220 is a short-edge beam, and the third beam 2230 is a flush-edge beam. The first beam 2210, the second beam 2220 and the third beam 2230 are all provided with card slots, and the threaded strips 1430 are all provided in the card slots. In particular, the two baffles are respectively the first baffle 2240 and the The second baffle plate 2250 and the first baffle plate 2240 are provided with through holes corresponding to the fixing positions of the power switching board 1470, and are fixed through screw threaded holes by studs configured on the power switching board 1470. At the other end of the power switching board 1470, the power switching board 1470 is fixedly connected to the power switching board fixing device 1290 of the frame 1200 by means of a screw internal threaded column. A pad block 2260 is provided on the second baffle plate 2250 for abutting and transitioning with the power supply assembly 1600.

[0102] The utility model encloses a receiving cavity between the baffle plate, the first crossbeam 2210, the second crossbeam 2220 and the third crossbeam 2230, which can be used to place accessories such as IO boards, communication boards and fault injection boards, thereby increasing the expansion capability of the hardware-in-the-loop test device, thereby increasing the test content of the vehicle and reducing the actual vehicle development cycle and cost.

[0103] In one embodiment, Fig.18 As shown, the heat dissipation assembly 1500 includes a mounting plate 1520, a heat sink 1530 and a connector 1510, a plurality of heat sinks 1530 are mounted on the mounting plate 1520, the heat sink 1530 is electrically connected to the host assembly 1700, and the connector 1510 connects the mounting plate 1520 and the connecting plate.

[0104] Specifically, in this embodiment, the heat dissipation component 1500 is arranged at the upper end of the expansion component 2200, and is used for heat dissipation of the board on the one hand, and for diffusion of the hot air flow inside the test device on the other hand. The heat sink 1530 is installed on the mounting plate 1520, and is offset according to the position of the expansion component 2200. The mounting plate 1520 is fixedly connected to the mounting position of the heat sink 1530 through the screw threaded hole by the rivet nut set on the mounting plate 1520. Heat dissipation hanging plates are installed on both sides of the mounting plate 1520. The heat dissipation hanging plates are set in an L shape. Through the rivet nut set on the heat dissipation scraper, one end is fixed to the mounting plate 1520 through the screw threaded hole, and the other end is fixedly connected to the first connecting plate 1240 in the frame 1200 through the screw threaded hole.

[0105] The utility model can improve the air exchange between the inside and outside of the chassis 1000 by arranging multiple radiators 1530 in the chassis 1000, and exchange the heat generated by each heating component in the chassis 1000 with the external cold air, thereby reducing the temperature in the chassis 1000 to ensure the normal operation of each component in the chassis 1000.

[0106] In one embodiment, Fig.19 As shown, the hardware-in-the-loop testing device also includes a board assembly 1800 , which includes a mounting plate 1810 and a clip 1820 . The mounting plate 1810 is fixedly connected to the center beam 1260 and the modular board, and a plurality of clips 1820 are fixedly mounted on the mounting plate 1810 .

[0107] Specifically, in this embodiment, the mounting plate 1810 is made of 5052-H34 aluminum alloy, a material with high thermal conductivity, and the buckle 1820 is made of 6061-T6 aluminum alloy, a material with high thermal conductivity. The buckle 1820 is provided with a slide groove and a through threaded hole. The slide groove corresponds to the thickness of the mounting plate 1810. The buckle 1820 is arranged at different positions on the mounting plate 1810 according to the shapes of different boards and cards, and the boards and cards are pressed and fixed through the interaction between the buckles 1820. The buckle 1820 is fixedly connected to the mounting plate 1810 through screw threaded holes.

[0108] The utility model provides a plurality of buckles 1820 on the installation scraper, so as to facilitate the fixed installation of each board and card, making it more stable in the chassis 1000, and facilitates the three-dimensional setting of the space in the chassis 1000, so that the structure of the hardware-in-the-loop test device is more compact.

[0109] In one embodiment, Figure 20 to Figure 22 As shown, the hardware-in-the-loop test device also includes a decorative panel 1900, a ventilation component 2000 and a connecting power supply component 2100. The decorative panel 1900 is detachably connected to the first hanging ear 1720 and the second hanging ear 1620. The ventilation component 2000 is connected to the column 1210 and the top cover component 1100. The ventilation component 2000 is provided with heat dissipation holes. The connecting power supply component 2100 is connected to the column 1210, the bottom cover component 1300 and the ventilation component 2000, and is electrically connected to the host component 1700, the power supply component 1600, the expansion component 2200, the plug-in component 1400 and the heat dissipation component 1500.

[0110] Specifically, Fig.21 and Fig. 22As shown, the decorative plate 1900 in this embodiment is a "door"-shaped non-equilateral structure, and the long side is inserted into the groove caused by the height difference between the first modular plate 1220 of the frame 1200 and the first and second hanging ears 1720 and 1620, and the long side is placed on the first and second hanging ears 1720 and 1620. The material of the decorative plate 1900 is Q235 with high ferromagnetism, and it is fixed by attraction by the annular magnets 1413 set on the first and second hanging ears 1720 and 1620.

[0111] In this embodiment, Figure 2 , Fig. 20 , Fig.23 As shown, between the two frames 1200 of the chassis 1000, a ventilation component 2000 is arranged on the back of the main unit component 1700. The ventilation component 2000 is made of 5052-H34 aluminum alloy with high thermal conductivity and is used for ventilation in the entire test device. Heat dissipation holes are opened on the ventilation component 2000, and dustproof cotton 1160 is adhered inside the ventilation component 2000 to prevent dust from entering the inside of the chassis 1000.

[0112] In this embodiment, Fig.24 As shown, the real-time host 1710 is provided with a fan on the side facing the outside of the chassis 1000 , and the fan airflow is directed from the outside to the inside, so that the external air is circulated with the air inside the chassis 1000 for heat dissipation inside the real-time host 1710 .

[0113] In this embodiment, Fig.23 As shown, a ventilation component 2000 is provided at the back of the chassis 1000 located at the real-time host 1710 for ventilation inside the device, and ventilation surfaces are also provided at the side walls at the four corners of the top cover 1110 for dissipating hot air.

[0114] In this embodiment, part of the air blown out by the real-time host 1710 passes through the ventilation component 2000 and is directed to the outside of the device, and the other part follows the airflow into the heat dissipation component 1500 at the top of the extension component 2200 and further enters the circulation.

[0115] In this embodiment, Fig.25As shown, three cooling fans are arranged below the heat dissipation assembly 1500 arranged on the top of the extension assembly 2200, which guide air from top to bottom to the heating part below. The hot air blown out flows to the middle part of the extension assembly 2200 and the plug assembly 1400 and diffuses to the top cover 1110, directing the heat to the top cover 1110 and dissipating through the heat dissipation holes arranged on the top cover 1110. Since a large number of structures of the test device in this embodiment use high thermal conductivity materials, it is equivalent to a large heat sink 1530. Such an arrangement scheme also reduces the heat generated in the device. Most of the heat generated is discharged, and on the other hand, it passes through the heating parts of the board in the expansion component 2200 and then blows to the switching power supply in the power supply component 1600. Since a mesh plate with heat dissipation holes is arranged on the upper part of the switching power supply in the power supply component 1600, the blown air dissipates the heat for the switching power supply, and then blows to the middle of the expansion component 2200 and the connector component 1400 through the mesh plate, and enters the middle circulation to be guided to the top cover 1110, thereby realizing circulating ventilation inside the test device, reducing the temperature inside the chassis 1000, and ensuring the normal operation of each component.

[0116] In this embodiment, Fig.21 As shown, the connecting power supply component 2100 includes a connecting component fixing plate 2110 and a movable baffle 2120, which are installed between the two frames 1200 of the box, on the back of the main unit component 1700, and below the ventilation component 2000. It is made of 5052-H34 aluminum alloy with high thermal conductivity. The connecting component fixing plate 2110 is provided with a power input port and multiple communication interfaces for connecting with external devices and controllers. A plurality of evenly distributed movable baffles 2120 are provided on one side of the connecting component fixing plate 2110. The movable baffle 2120 is connected to the connecting component fixing plate 2110 through a thin block, which can be disassembled and removed when in use, and the connectors 1450 are arranged according to the position distribution relationship.

[0117] The utility model can dissipate heat and ventilate the entire chassis 1000 by setting a ventilation component 2000 to reduce the temperature inside the chassis 1000, and set a connecting power supply component 2100 to facilitate power supply and communication with the host component 1700, the power supply component 1600, the expansion component 2200, the plug-in component 1400 and the heat dissipation component 1500.

[0118] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A hardware-in-the-loop testing device, characterized in that: include: A chassis (1000), wherein the chassis (1000) is provided with a mounting cavity; A host assembly (1700), the host assembly (1700) being arranged in the installation cavity and located at the bottom of the chassis (1000); A power supply component (1600), the power supply component (1600) being arranged in the installation cavity and located above the host component (1700), the power supply component (1600) being electrically connected to the host component (1700); an extension component (2200), the extension component (2200) being arranged in the installation cavity and located above the power supply component (1600), the extension component (2200) being electrically connected to the host component (1700); a plug-in assembly (1400), the plug-in assembly (1400) being arranged in the installation cavity and located above the power supply assembly (1600), the plug-in assembly (1400) being fixedly connected to the expansion assembly (2200) and being electrically connected to the host assembly (1700); A heat dissipation component (1500), the heat dissipation component (1500) is arranged in the installation cavity and is located above the extension component (2200), and the heat dissipation component (1500) is electrically connected to the host component (1700).

2. The hardware-in-the-loop testing device according to claim 1, characterized in that: The chassis (1000) comprises: Top cover assembly (1100); Bottom cover assembly (1300); Two frames (1200), the top cover assembly (1100) is fixedly connected to the top of the frame (1200), the bottom cover assembly (1300) is connected to the bottom of the frame (1200), and the host assembly (1700), the power supply assembly (1600), the expansion assembly (2200), the connector assembly (1400) and the heat dissipation assembly (1500) are fixedly connected to the frame (1200).

3. The hardware-in-the-loop testing device according to claim 2, characterized in that: The framework (1200) comprises: Two upright posts (1210) are symmetrically arranged vertically; two connecting plates, both ends of which are respectively connected to the upright posts (1210); A middle beam (1260) vertically connected to the two connecting plates; A side plate (1270), wherein the side plate (1270) is fixedly connected to the connecting plate; Four modular plates, each of which is fixedly connected to the columns (1210); A fixed support assembly is fixedly connected to the center beam (1260) and the modular plate.

4. The hardware-in-the-loop testing device according to claim 3, characterized in that: The host component (1700) comprises: A real-time host (1710), the real-time host (1710) is arranged above the bottom cover component (1300), the real-time host (1710) is suitable for processing the running system, and the power supply component (1600), the expansion component (2200), the plug component (1400) and the heat dissipation component (1500) are electrically connected to the real-time host (1710); The first hanging ears (1720) are fixedly installed on both sides of the real-time host (1710).

5. The hardware-in-the-loop test device according to claim 4, characterized in that: The power supply assembly (1600) comprises: A programmable power supply (1610), the programmable power supply (1610) is connected to the fixed support assembly, and the programmable power supply (1610) is electrically connected to the real-time host (1710); A conditioning power supply (1630), the conditioning power supply (1630) is electrically connected to the programmable power supply (1610), and the conditioning power supply (1630) comprises: A second hanging ear (1620) is installed on the side of the programmable power supply (1610) and the conditioning power supply (1630); A power supply box (1631) is fixedly connected to the conditioning power supply (1630); A mesh plate (1632) is arranged on the top of the power supply box (1631); A switch button (1633) is arranged on the side of the power supply box (1631); An output panel (1634) is arranged on the side of the power supply box (1631), and a plurality of power supply output ports are arranged on the output panel (1634); The adapter block (1635) is fixedly connected to the power supply box (1631) and the mesh plate (1632).

6. The hardware-in-the-loop testing device according to claim 5, characterized in that: The connector assembly (1400) comprises: Two cross beams (1420), wherein the cross beams (1420) are arranged horizontally; Two threaded strips (1430) are respectively connected to the crossbeam (1420); A fixed panel (1440) connected to the threaded strip (1430), wherein a plurality of openings are provided on the fixed panel (1440); An adapter plate (1460) is fixedly connected to the fixed panel (1440), and the adapter plate (1460) is electrically connected to the real-time host (1710); A connector (1450) fixedly mounted on the adapter plate (1460); A power switching board (1470) has one end fixedly connected to the fixed panel (1440) and the other end connected to the fixed support assembly.

7. The hardware-in-the-loop testing device according to claim 6, characterized in that: The expansion component (2200) comprises: a first crossbeam (2210); a second crossbeam (2220); two third cross beams (2230); Two baffles are fixedly connected to the two ends of the first crossbeam (2210), the second crossbeam (2220) and the third crossbeam (2230), respectively; and a receiving cavity is enclosed between the baffles, the first crossbeam (2210), the second crossbeam (2220) and the third crossbeam (2230).

8. The hardware-in-the-loop testing device according to claim 7, characterized in that: The heat dissipation component (1500) comprises: Mounting plate (1520); A plurality of heat sinks (1530) are mounted on the mounting plate (1520), and the heat sinks (1530) are electrically connected to the host assembly (1700); A connecting member (1510), wherein the connecting member (1510) connects the mounting plate (1520) and the connecting plate.

9. The hardware-in-the-loop testing device according to claim 8, characterized in that: Also includes: A board and card assembly (1800), the board and card assembly (1800) comprising a mounting plate (1810) and buckles (1820), the mounting plate (1810) being fixedly connected to the center beam (1260) and the modular board, and a plurality of buckles (1820) being fixedly mounted on the mounting plate (1810).

10. The hardware-in-the-loop testing device according to claim 9, characterized in that: Also includes: A decorative plate (1900) detachably connected to the first hanging ear (1720) and the second hanging ear (1620); A ventilation component (2000) is connected to the column (1210) and the top cover component (1100), and a heat dissipation hole is provided on the ventilation component (2000); The power supply assembly (2100) is connected to the column (1210), the bottom cover assembly (1300) and the ventilation assembly (2000), and is electrically connected to the host assembly (1700), the power supply assembly (1600), the expansion assembly (2200), the connector assembly (1400) and the heat dissipation assembly (1500).

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