Multi-station testing device for integrated circuit board

Abstract

The utility model discloses a multi-station testing device for an integrated circuit board, which comprises an operating platform, four testing grooves are formed in the bottom of an inner cavity of the operating platform, two sliding grooves are formed in two sides of the inner wall of each testing groove, a square groove is formed in the bottom of the front surface of the operating platform, and two hydraulic telescopic rods are arranged at the bottom of an inner cavity of the square groove at equal intervals. Connecting rods are arranged on the right sides of the output ends of the two hydraulic telescopic rods, and supporting plates are arranged at the output ends of the hydraulic telescopic rods and the tops of the connecting rods. When an integrated circuit board is subjected to a high-temperature environment test, the heating device is turned on through the control switch, external gas is sucked into the heating device through the air suction hopper, internal gas is heated by the three heating wires, and after the internal gas is heated into high-temperature gas, the high-temperature gas is pumped into the gas feeding pipe through the gas pump connected with the gas outlet pipe; and high-temperature gas is blown into the operation table through the gas inlet groove by the plurality of gas spraying hoppers, so that the integrated circuit board is tested in a high-temperature environment, and the diversity of equipment is improved.

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