Graphene silica gel patch

Abstract

The utility model provides a graphene silica gel patch, which comprises a pasting structure, a connecting structure is compounded above the pasting structure, a graphene radiating fin is fixed in the connecting structure, and the graphene radiating fin is connected by utilizing the pasting structure and the connecting structure, so that the graphene radiating fin can be directly adhered to an electronic element. And the heat generated by the electronic component is quickly transferred to the graphene cooling fin for heat dissipation through the pasting structure, so that the use is more convenient and quick.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation materials, in particular to a graphene silicone patch. Background Art

[0002] Graphene is an allotrope of carbon, with carbon atoms bonded in sp2 hybridization to form a single-layer hexagonal honeycomb lattice graphene. Fullerenes, graphene quantum dots, carbon nanotubes, nanobelts, multi-walled carbon nanotubes and nanohorns can be constructed using this crystal structure. Stacked graphene layers form graphite, which is held together by van der Waals forces, with a crystal plane spacing of 0.335 nanometers.

[0003] Since graphene has good heat transfer properties, it is often used in electronic products for heat dissipation. However, since graphene is difficult to adhere directly to the surface of electronic components, it is difficult to make graphene heat sinks in the form of patches.

[0004] Therefore, there is an urgent need for a graphene silicone patch that can solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a graphene silicone patch to solve the problems existing in the above-mentioned prior art.

[0006] To achieve the above purpose, the utility model provides the following solutions:

[0007] The utility model provides a graphene silicone patch, comprising a pasting structure, a connecting structure is compounded on the top of the pasting structure, and a graphene heat sink is fixed in the connecting structure.

[0008] Preferably, the adhesive structure comprises a silicone heat-conducting layer, an upper surface of the silicone heat-conducting layer is provided with a T-shaped strip, and a lower surface of the silicone heat-conducting layer is provided with an adhesive layer.

[0009] Preferably, the connection structure comprises a fixing frame, the fixing frame is provided with limiting edges around it, a connecting groove is provided at the bottom of the fixing frame, a strip hole is provided in the connecting groove, and the strip hole cooperates with the T-bar.

[0010] Preferably, a socket is provided on the side of the limiting edge.

[0011] Compared with the prior art, the utility model has achieved the following beneficial technical effects:

[0012] The utility model provides a graphene silicone patch, comprising an adhesive structure, a connecting structure is compounded on the top of the adhesive structure, a graphene heat sink is fixed in the connecting structure, the graphene heat sink is connected by using the adhesive structure and the connecting structure, so that it can be directly adhered to the electronic component, and the heat generated by the electronic component is quickly transferred to the graphene heat sink through the adhesive structure for heat dissipation, which is more convenient and quick to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0014] Figure 1 The present invention provides a schematic diagram of the structure of a graphene silicone patch. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] The utility model aims to provide a graphene silicone patch to solve the problems existing in the prior art.

[0017] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0018] Embodiment 1:

[0019] This embodiment provides a graphene silicone patch, such as Figure 1 As shown, it includes a pasting structure 1, a connection structure 2 is compounded on the top of the pasting structure 1, and a graphene heat sink 3 is fixed in the connection structure 2.

[0020] Specifically, the pasting structure 1 includes a silicone heat-conducting layer 11 , a T-shaped strip 12 is provided on the upper surface of the silicone heat-conducting layer 11 , and an adhesive layer 13 is provided on the lower surface of the silicone heat-conducting layer 11 .

[0021] Furthermore, the connecting structure 2 includes a fixed frame 21, which is provided with limiting edges 22 around it, and a connecting groove 23 is provided at the bottom of the fixed frame 21. A strip hole 24 is provided in the connecting groove 23, and the strip hole 24 cooperates with the T-shaped bar 12, so that the adhesive structure 1 can be connected to the connecting structure 2, and then the graphene heat sink 3 is connected.

[0022] Furthermore, a socket 25 is provided on the side of the limiting edge 22 to facilitate the insertion of the graphene heat sink 3 therein.

[0023] The utility model provides a graphene silicone patch, which utilizes an adhesive structure and a connecting structure to connect a graphene heat sink, so that it can be directly adhered to an electronic component, and the heat generated by the electronic component can be quickly transferred to the graphene heat sink through the adhesive structure for heat dissipation, which is more convenient and quick to use.

[0024] The utility model uses specific examples to illustrate the principle and implementation of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A graphene silicone patch, characterized in that: It comprises a pasting structure, a connecting structure is compounded on the top of the pasting structure, and a graphene heat sink is fixed in the connecting structure; The adhesive structure comprises a silicone heat-conducting layer, the upper surface of the silicone heat-conducting layer is provided with a T-shaped strip, and the lower surface of the silicone heat-conducting layer is provided with an adhesive layer; The connection structure comprises a fixing frame, the fixing frame is provided with limiting edges around it, the fixing frame is provided with a connecting groove at the bottom, a strip hole is provided in the connecting groove, and the strip hole matches with the T-shaped bar.

2. The graphene silicone patch according to claim 1, characterized in that: The side of the limiting edge is provided with a socket.

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