Light emitting diode packaging piece

Abstract

The utility model relates to the technical field of LED packaging, and discloses a light-emitting diode packaging piece, which comprises an LED chip and a first reflecting layer, and the non-substrate side of the LED chip is completely wrapped by the first reflecting layer; the upper surface of the first reflecting layer is not lower than the substrate side of the LED chip, the substrate side of the LED chip and the upper surface of the first reflecting layer are covered with a packaging layer, and the upper surface of the second reflecting layer is provided with a plurality of patterned convex structures. According to the utility model, the projection structure is manufactured on the packaging layer of the CSP-level light-emitting diode packaging piece, and the structure can enable more photon incident angles to be smaller than critical angles through an interface generated by the projection, thereby effectively reducing the total reflection phenomenon of photons from light density to light sparseness, and improving the light extraction efficiency of the packaging piece.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a light emitting diode packaging component. Background Art

[0002] The full name of CSP is Chip Scale Package, which is a chip-level packaging device. CSP is the latest generation of memory chip packaging technology. Its technicality is mainly reflected in the ratio of chip area to package area exceeding 1:1.14, which is quite close to the ideal 1:1. Relative to the LED industry, CSP packaging is based on flip-chip technology. CSP devices refer to devices that control the package volume to the same as the flip-chip volume or the package volume is no more than 20% of the flip-chip volume. In the lighting industry, CSP will be more and more widely used because of its small size and high flexibility.

[0003] According to Snell's law, some light with an incident angle less than the critical angle θ can be emitted into the air, but light with an incident angle greater than θ will be totally reflected when it hits the interface. The existing CSP packages with fluorescent film structures mostly have a flat surface, which means that there are many large-angle light rays in the light they emit, and these light rays cannot be emitted into the air due to total reflection, resulting in a decrease in the luminous efficiency of the CSP package. Utility Model Content

[0004] Purpose of the utility model: In view of the problems existing in the prior art, the utility model provides a light-emitting diode package, which provides a plurality of graphic protrusion structures on the surface of the diaphragm and utilizes the interface generated by the protrusion structures to make the incident angle of more photons smaller than the critical angle, thereby effectively reducing the total reflection phenomenon of photons from dense light to sparse light, thereby improving the light extraction efficiency.

[0005] Technical solution: The utility model provides a light-emitting diode package, including an LED chip, a first reflective layer and a packaging layer, characterized in that: the first reflective layer covers the LED chip and exposes the light-emitting surface of the LED chip and part of the LED chip electrode; the packaging layer is arranged on the light-emitting surface of the LED chip, and the upper surface of the packaging layer is spaced apart by a plurality of graphic protrusion structures; the ratio of the height to the width of the protrusion structure a:b=1 / 10~1, and the spacing c between the protrusion structures is 1~100μm.

[0006] Furthermore, the height a of the protruding structure is 5-20 μm; the width b of the protruding structure is 20-150 μm; and the spacing c between two protruding structures is 2-15 μm.

[0007] Furthermore, the thickness d of the encapsulation layer is 50-300 μm; and the ratio of the height to the width of the protruding structure a:b=1 / 8~1 / 4.

[0008] Furthermore, the encapsulation layer is a fluorescent film layer containing fluorescent powder;

[0009] Alternatively, the encapsulation layer is a transparent silica gel layer without phosphor.

[0010] Furthermore, a KSF fluorescent film layer is provided between the packaging layer and the LED chip, and the packaging layer and / or the first reflective layer covers the upper surface and surrounding side walls of the KSF fluorescent film layer.

[0011] Furthermore, the upper surface of the KSF fluorescent film layer and the upper surface of the first reflective layer are located in the same plane, and the width of the KSF fluorescent film layer is greater than the width of the LED chip.

[0012] Furthermore, the first reflective layer is highly reflective white glue.

[0013] Furthermore, a bowl-cup structure is provided between the first reflective layer and the LED chip, and the bowl-cup structure is provided on the side wall of the LED chip; the bowl-cup structure is made of transparent silicone material.

[0014] Furthermore, a first pad is provided under the LED chip, and the first pad includes a pad A electrically connected to the N electrode of the LED chip and a pad B electrically connected to the P electrode of the LED chip, and the pad A and the pad B are insulated from each other.

[0015] Furthermore, a second pad is arranged under the first pad, and the second pad includes a pad C electrically connected to pad A and a pad D electrically connected to pad B respectively, pad C and pad D are insulated from each other and the distance between the two is greater than the distance between pad A and pad B.

[0016] Preferably, the shape of the protrusion structure is any one or more combinations of arc, cone, triangle, polygon or frustum;

[0017] Alternatively, the shape of the protruding structure is any one or more combinations of an arc shape, a triangle, or a polygon with a flat top.

[0018] Beneficial effects: The utility model manufactures a protruding structure on the fluorescent film layer of the CSP-level light-emitting diode package. The structure can make more photon incident angles smaller than the critical angle through the interface generated by the protrusions, effectively reducing the total reflection phenomenon of photons from dense light to sparse light, thereby improving the light extraction efficiency of the package. In addition, the utility model sets the spacing of the protruding structure, effectively reducing the reciprocating reflection of light between the protrusions, further improving the light extraction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a structural diagram of a light emitting diode package prepared in Embodiment 1;

[0020] Figure 2 The shape of the raised structure in the utility model;

[0021] Figure 3 is a structural diagram of a light emitting diode package prepared in Embodiment 2;

[0022] Figure 4 is a structural diagram of a light emitting diode package prepared in Embodiment 3;

[0023] Figure 5 is a structural diagram of a light emitting diode package prepared in Embodiment 4;

[0024] Figure 6 is a structural diagram of a light emitting diode package prepared in Embodiment 5;

[0025] Figure 7 is a structural diagram of a light emitting diode package prepared in Embodiment 6;

[0026] The accompanying drawings are marked with: 1. LED chip; 2. First reflective layer; 3. Packaging layer; 4. Protruding structure; 5. KSF fluorescent film layer; 6. Bowl structure; 7. Electrode; 8. First soldering pad; 801. soldering pad A; 802. soldering pad B; 9. Second soldering pad; 901. soldering pad C; 902. soldering pad D; 10. Second reflective layer. DETAILED DESCRIPTION

[0027] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0029] Implementation 1:

[0030] This embodiment provides a light emitting diode package, the length e of the light emitting diode package is 400-3000 μm; the width f is 400-3000 μm, and its specific structure is as follows Figure 1 As shown: it includes an LED chip 1, a first reflective layer 2 and a packaging layer 3; the first reflective layer 2 covers the LED chip 1 and exposes the light-emitting surface of the LED chip 1 and part of the LED chip electrode 7, and the upper surface of the first reflective layer 2 is located on the same horizontal plane as the upper surface of the LED chip 1; the packaging layer 3 is arranged on the light-emitting surface of the LED chip 1, and a plurality of graphic protrusion structures 4 are distributed at intervals on its upper surface.

[0031] The ratio of the height and width of the above-mentioned protruding structure 4 is a:b=1 / 10-1, preferably a:b=1 / 8~1 / 4; wherein, the height a of the protruding structure 4 is preferably 5-20μm; the width b of the protruding structure 4 is preferably 20-150μm; the spacing c between the protruding structures 4 is 1-100μm, preferably c is 2-15μm.

[0032] It should be noted that the specific shape of the protruding structure 4 can be adjusted according to actual needs, and can be any one or more combinations of arc, cone, triangle, polygon or truncated cone; it can also be any one or more combinations of arc, triangle or polygon with a flat top, etc., which are not limited here. The protruding structure 4 in the present utility model shows some optional shapes, such as Figure 2 shown.

[0033] The thickness d of the encapsulation layer 3 is 50-300 μm. The encapsulation layer can be a fluorescent film layer containing fluorescent powder or a transparent silica gel layer without fluorescent powder.

[0034] The first reflective layer 2 is made of highly reflective white glue.

[0035] Because the above-mentioned light-emitting diode package has a specific protrusion structure 4 prepared on the encapsulation layer 3, the interface generated by the protrusion makes more photon incident angles smaller than the critical angle, which can effectively reduce the total reflection phenomenon of photons from dense light to sparse light, thereby improving the light extraction efficiency of the light-emitting diode package. In addition, by setting the spacing of the protrusion structure, the reciprocating reflection of light between the protrusions is effectively reduced, further improving the light extraction efficiency.

[0036] The preparation method of the light emitting diode package in this embodiment is as follows: placing the LED chip on the sticky blue film, using a laminator to press the fluorescent film on the LED chip, and heating and baking after lamination to cure the film, so that the fluorescent film and the flip chip are better combined, and bubbles are eliminated at the same time, so as to obtain a CSP chip-level package. The mold of the laminator has a specially made patterned depression, so that the fluorescent film has a number of patterned convex structures after lamination.

[0037] Implementation 2:

[0038] This embodiment is substantially the same as Embodiment 1, except that the specific structure of a light emitting diode package provided in this embodiment is as follows: Figure 3 As shown, a bowl-cup structure 6 is further provided between the first reflective layer 2 and the LED chip 1. The bowl-cup structure 6 is provided on the side wall of the LED chip 1. The bowl-cup structure 6 is a transparent reflective cavity, preferably made of transparent silicone.

[0039] Compared with Implementation 1, this implementation improves the reflection efficiency of the side light of the LED chip by setting a bowl-cup structure, effectively utilizes the light emitted from the side of the LED chip, improves the light output rate of the LED chip, and further improves the light output angle.

[0040] Apart from this, this embodiment is completely the same as Embodiment 1 and will not be described in detail here.

[0041] Implementation 3:

[0042] This embodiment is substantially the same as Embodiment 1, except that the specific structure of a light emitting diode package provided in this embodiment is as follows: Figure 4 As shown, the upper surface of the first reflective layer 2 is higher than the upper surface of the LED chip 1, and a KSF fluorescent film layer 5 is further provided between the packaging layer 3 and the LED chip 1: the packaging layer 3 and the first reflective layer 2 cover the upper surface and surrounding side walls of the KSF fluorescent film layer, the upper surface of the KSF fluorescent film layer 5 and the upper surface of the first reflective layer 2 are located in the same plane, and the width of the KSF fluorescent film layer 5 is greater than the width of the LED chip 1.

[0043] Compared with Embodiment 1, this embodiment is provided with a KSF fluorescent film layer 5 between the encapsulation layer 3 and the LED chip 1. The encapsulation layer 3 completely wraps the KSF fluorescent film layer 5 inside the encapsulation body, has a good light transmission effect, can effectively isolate water vapor, achieve high reliability, and thus can use the KSF fluorescent film layer 5 that is susceptible to moisture to achieve a high color gamut. The high color gamut is achieved by exciting the KSF fluorescent film layer 5.

[0044] Apart from this, this embodiment is completely the same as Embodiment 1 and will not be described in detail here.

[0045] Implementation 4:

[0046] This embodiment is substantially the same as Embodiment 3, except that the specific structure of a light emitting diode package provided in this embodiment is as follows: Figure 5 As shown, a bowl-cup structure 6 is further provided between the first reflective layer 2 and the LED chip 1. The bowl-cup structure 6 is provided on the side wall of the LED chip 1. The upper surface of the bowl-cup structure 6 and the upper surface of the LED chip 1 are located in the same plane. The bowl-cup structure 6 is a transparent reflective cavity, preferably made of transparent silicone.

[0047] Compared with Implementation 3, this implementation improves the reflection efficiency of the side light of the LED chip by setting a bowl-cup structure, effectively utilizes the light emitted from the side of the LED chip, improves the light output rate of the LED chip, and further improves the light output angle.

[0048] Apart from this, this embodiment is exactly the same as Embodiment 3 and will not be described in detail here.

[0049] Implementation 5:

[0050] This embodiment is substantially the same as Embodiment 4, except that the specific structure of a light emitting diode package provided in this embodiment is as follows: Figure 6 As shown, a first solder pad 8 is arranged below the electrode 7 of the LED chip 1, the width of the first solder pad 8 is greater than the width of the electrode 7, the two side ends of the first solder pad 8 closer to the inside of the package are aligned with the two side ends of the electrode 7 closer to the inside of the package, the first solder pad 8 includes a solder pad A801 ​​and a solder pad B802, the solder pad A801 ​​and the solder pad B802 are symmetrically arranged, the N electrode of the LED chip 1 is electrically connected to the solder pad A801, the P electrode of the LED chip 1 is electrically connected to the solder pad B802, and a second reflective layer 10 is arranged on both side ends of the first solder pad 8.

[0051] Compared with Implementation 4, this implementation mode expands the contact area between the chip and the conductive substrate and increases the placement tolerance by setting a first solder pad and growing a larger solder pad structure under a small-sized chip electrode, thereby enabling direct use of the CSP without introducing a bracket, improving the patch yield, and increasing the thermal conductivity area and adhesion.

[0052] Apart from this, this embodiment is exactly the same as embodiment 4 and will not be described in detail here.

[0053] Implementation 6:

[0054] This embodiment is substantially the same as Embodiment 5, except that the specific structure of a light emitting diode package provided in this embodiment is as follows: Figure 7As shown, a first solder pad 8 and a second solder pad 9 are arranged below the electrode 7 of the LED chip 1, the width of the first solder pad 8> the width of the second solder pad 9> the width of the electrode 7, the two side ends of the first solder pad 8 closer to the inside of the package are aligned with the two side ends of the electrode 7 closer to the inside of the package, the two side ends of the first solder pad 8 closer to the outside of the package are aligned with the two side ends of the second solder pad 9 closer to the outside of the package, the first solder pad 8 includes a solder pad A801 ​​and a solder pad B802, and the second solder pad 9 includes a solder pad C901 and pad D902, pad A801 ​​and pad B802 are symmetrically arranged, pad C901 and pad D902 are symmetrically arranged, the N electrode of LED chip 1 is electrically connected to pad A801, the P electrode of LED chip 1 is electrically connected to pad B802, pad A801 ​​is electrically connected to pad C901, pad B802 is electrically connected to pad D902, and second reflective layers 10 are arranged on both side ends of the first pad 8 and the second pad 9.

[0055] Compared with Embodiment 5, this embodiment adds a second pad 9 to widen the pad spacing, achieve a safe mounting spacing, prevent short circuits, and improve the patch yield.

[0056] Apart from this, this embodiment is exactly the same as embodiment 4 and will not be described in detail here.

[0057] The above implementation is only to illustrate the technical concept and features of the utility model, and its purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly, and it cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A light emitting diode package, comprising an LED chip (1), a first reflective layer (2) and a packaging layer (3), characterized in that: The first reflective layer (2) covers the LED chip (1) and exposes the light-emitting surface of the LED chip (1) and a portion of the LED chip electrode (7); the encapsulation layer (3) is arranged on the light-emitting surface of the LED chip (1), and a plurality of patterned protruding structures (4) are spaced apart on the upper surface of the encapsulation layer (3); the ratio of the height to the width of the protruding structures (4) is a:b=1 / 10~1, and the spacing c between two of the protruding structures (4) is 1~100 μm.

2. The light emitting diode package according to claim 1, characterized in that: The height a of the protruding structure (4) is 5-20 μm; the width b of the protruding structure (4) is 20-150 μm; and the spacing c between two protruding structures (4) is 2-15 μm.

3. The light emitting diode package according to claim 1, wherein: The thickness d of the encapsulation layer (3) is 50-300 μm; the ratio of the height to the width of the protruding structure (4) is a:b=1 / 8-1 / 4.

4. The light emitting diode package according to claim 1, wherein: The encapsulation layer (3) is a fluorescent film layer containing fluorescent powder; Alternatively, the encapsulation layer (3) is a transparent silica gel layer that does not contain fluorescent powder.

5. The light emitting diode package according to claim 1, wherein: A KSF fluorescent film layer (5) is provided between the packaging layer (3) and the LED chip (1), and the packaging layer (3) and / or the first reflective layer (2) cover the upper surface and surrounding side walls of the KSF fluorescent film layer (5).

6. The light emitting diode package according to claim 5, characterized in that: The upper surface of the KSF fluorescent film layer (5) and the upper surface of the first reflective layer (2) are located in the same plane, and the width of the KSF fluorescent film layer (5) is greater than the width of the LED chip (1).

7. The light emitting diode package according to claim 1, characterized in that: A bowl-cup structure (6) is provided between the first reflective layer (2) and the LED chip (1); the bowl-cup structure (6) is provided on the side wall of the LED chip (1); and the bowl-cup structure (6) is made of transparent silicone material.

8. The light emitting diode package according to claim 1, wherein: A first solder pad (8) is provided below the LED chip (1), the first solder pad (8) comprising a solder pad A (801) electrically connected to the N electrode of the LED chip (1) and a solder pad B (802) electrically connected to the P electrode of the LED chip, respectively, the solder pad A (801) and the solder pad B (802) being insulated from each other.

9. The light emitting diode package according to claim 8, characterized in that: A second pad (9) is disposed below the first pad (8), the second pad (9) comprising a pad C (901) electrically connected to the pad A (801) and a pad D (902) electrically connected to the pad B (802), the pad C (901) and the pad D (902) being insulated from each other and a distance between the pads C (901) and D (902) being greater than a distance between the pads A (801) and B (802).

10. The light emitting diode package according to any one of claims 1 to 9, characterized in that: The shape of the protrusion structure (4) is any one or more combinations of arc, cone, triangle, polygon or frustum; Alternatively, the shape of the protruding structure (4) is any one or more combinations of an arc shape with a flat top, a triangle, or a polygon.

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