Server chip cooling heat dissipation structure

Abstract

The utility model relates to a server chip cooling heat dissipation structure which comprises a circulation shell, a cavity is formed in the circulation shell, and the server chip cooling heat dissipation structure further comprises two pump bodies which are connected to the two sides of the circulation shell respectively and are a water outlet pump and a water inlet pump respectively. And the cooling and heat dissipation mechanism is communicated with one sides of the two pump bodies, the cooling and heat dissipation mechanism comprises a concave pipe, the concave pipe is communicated with one sides of the pump bodies, and one end, far away from the pump bodies, of the concave pipe is communicated with a cooling shell. In addition, in the circulation process of the cooling liquid, the cooling liquid passes through the cooling shell, due to the fact that the cooling shell is attached to the substrate, heat of the substrate can be taken away through the cooling shell, and cooling and heat dissipation are conducted on the substrate and the server chip at the same time.

Description

Technical Field

[0001] The utility model relates to the field of chip heat dissipation, in particular to a server chip cooling and heat dissipation structure. Background Art

[0002] For servers, the motherboard becomes its high-performance carrier, and for server motherboards, the chip constitutes the main structure of the server motherboard. As an important part of electronic equipment, the performance and stability of the chip directly affect the performance of the entire electronic equipment. Since the chip generates a lot of heat during operation, how to effectively dissipate this heat to ensure the stable operation of the equipment and increase the service life of the equipment.

[0003] According to the disclosed patent 202322773841.3, a server chip cooling and heat dissipation structure includes a packaged chip and a cooling and heat dissipation structure, and the cooling and heat dissipation structure includes a liquid-cooled cooling component and an air-cooled cooling component. The utility model is provided with an air-cooled heat dissipation component and a liquid-cooled cooling component to dissipate the heat generated by the packaged chip itself, and can also dissipate the heat carried in the surrounding air; the heat conduction plate is provided with a heat conduction inclined surface and an air guide slot, and the wind close to the heat conduction inclined surface will flow upward under the action of the arc-shaped slot surface, separating the wind with heat from the wind without heat, and the wind without heat will continue to blow to the rear heat conduction vertical plate; the partition plate layers the coolant flowing in the liquid-cooled microchannel, that is, it can separate the liquid part that has undergone heat exchange from the liquid part that has not undergone heat exchange, thereby avoiding liquid mixing of the coolant. In the process of realizing the utility model, the inventor found that at least the following problems in the prior art have not been solved. Although by setting a wind The cold heat dissipation component and the liquid cooling component use an air cooling component to dissipate heat on the top of the packaged chip, and use a liquid cooling component to dissipate heat on the bottom of the packaged chip. This can not only dissipate the heat generated by the packaged chip itself, but also dissipate the heat carried in the surrounding air to improve the heat dissipation effect. This solves the problem that if only coolant is used for heat dissipation, the surrounding environment where the chip is located cannot be cooled and dissipated. Therefore, when the surrounding temperature is high, the chip will be more likely to heat up. However, during use, the traditional server chip cooling and heat dissipation structure only dissipates heat for the server chip, and does not effectively dissipate heat for the substrate. Since the substrate and the server chip are installed together, when there is a lot of heat in the substrate, the temperature of the server chip will rise. Therefore, it is necessary to dissipate heat for the substrate and the server chip together. Moreover, in the process of circulating the coolant using the liquid cooling component, the temperature of the coolant will continue to rise, affecting the cooling and heat dissipation effect. For this reason, it is necessary to design a new technical solution to solve it. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art, meet actual needs, and provide a server chip cooling and heat dissipation structure to solve the problem that the current traditional server chip cooling and heat dissipation structure only dissipates heat for the server chip but does not effectively dissipate heat for the substrate. Since the substrate and the server chip are installed together, when there is a large amount of heat in the substrate, the temperature of the server chip will rise. Therefore, it is necessary to dissipate heat for the substrate and the server chip together. Moreover, in the process of circulating the coolant using a liquid cooling component, the temperature of the coolant will continue to rise, affecting the technical problem of the cooling and heat dissipation effect.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a server chip cooling and heat dissipation structure, including a circulation shell, a cavity is opened inside the circulation shell, and also includes:

[0006] Two pump bodies are connected to both sides of the circulation shell, and the two pump bodies are a water outlet pump and a water inlet pump respectively;

[0007] A cooling and heat dissipation mechanism is connected to one side of the two pump bodies, and the cooling and heat dissipation mechanism includes a concave tube, the concave tube is connected to one side of the pump body, and one end of the concave tube away from the pump body is connected to a cooling shell;

[0008] A plurality of heat-conducting fins are fixed to the rear side of the circulation housing, and a chip body is attached to the rear side of the heat-conducting fins.

[0009] Preferably, a substrate is installed on the rear side of the chip body, and a cooling shell is attached to the rear side of the substrate.

[0010] Preferably, a semiconductor refrigeration plate is installed in the middle of the front end of the circulation shell, and the cold end of the semiconductor refrigeration plate is in contact with the front end of the circulation shell.

[0011] Preferably, square holes are provided at both upper and lower ends of the front end of the circulation shell, and partition nets are installed at both front and rear ends of the square hole.

[0012] Preferably, one end of a fixing rod is fixed on both sides of the inside of the square hole, a micro motor is fixed on the other end of the fixing rod, a motor shaft is connected to the rear end of the micro motor, and a blower blade is installed on the rear side of the motor shaft.

[0013] Preferably, there are mounting holes on both sides of the upper and lower ends of the cavity, and a waterproof breathable membrane is installed inside the mounting holes.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model, through the combination of a circulation shell, a pump body and a concave tube, can not only utilize the coolant to circulate in the cavity of the circulation shell to dissipate heat for the server chip, but also, in the process of the circulation of the coolant, it will pass through the cooling shell. Since the cooling shell is in contact with the substrate, the heat of the substrate can be taken away through the cooling shell, thereby cooling the substrate and the server chip at the same time, solving the technical problem that the traditional server chip cooling and heat dissipation structure only dissipates heat for the server chip but does not effectively dissipate heat for the substrate. Since the substrate and the server chip are installed together, when there is a lot of heat in the substrate, the temperature of the server chip will rise, so it is necessary to dissipate heat for the substrate and the server chip together.

[0016] 2. The utility model, through the combination of semiconductor refrigeration sheets, motors and blowing fan blades, can not only utilize the semiconductor refrigeration sheets to cool the circulation shell, thereby cooling the coolant in the circulation shell, thereby avoiding the gradual increase in temperature of the coolant during the circulation cooling process, but also, through the motor and blowing fan blades inside the square hole, wind can be blown to the server chip, thereby assisting in cooling the server chip. A waterproof and breathable membrane is arranged in the cavity, which can allow cold air to enter the square hole and blow the cold air to the server chip through the blowing fan blades, further enhancing the cooling and heat dissipation effect, and solving the technical problem that in the process of using a liquid cooling component to circulate the coolant, the temperature of the coolant will continue to rise, affecting the cooling and heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the internal structure of the circulation shell of the utility model.

[0019] In the figure: 1. substrate; 2. chip body; 201. heat-conducting fins; 202. circulation shell; 203. pump body; 204. concave tube; 205. cooling shell; 206. semiconductor refrigeration plate; 207. cavity; 208. mounting hole; 209. waterproof breathable membrane; 3. square hole; 301. partition net; 302. motor shaft; 303. fixing rod; 304. micro motor; 305. fan blades. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0021] Example 1: A server chip cooling and heat dissipation structure, see Figure 1 to Figure 2, including a circulation shell 202, a cavity 207 is opened inside the circulation shell 202, and also includes: two pump bodies 203, respectively connected to the two sides of the circulation shell 202, the two pump bodies 203 are a water outlet pump and a water inlet pump respectively; a cooling and heat dissipation mechanism, connected to one side of the two pump bodies 203, the cooling and heat dissipation mechanism includes a concave tube 204, the concave tube 204 is connected to one side of the pump body 203, and the end of the concave tube 204 away from the pump body 203 is connected to a cooling shell 205; a plurality of heat-conducting fins 201 are fixed to the rear side of the circulation shell 202, and the chip body 2 is attached to the rear side of the heat-conducting fins 201. First, turn on the water inlet pump and the water outlet pump, use the water outlet pump to extract the coolant in the cavity 207, and input it into the cooling shell 205, and the cooling liquid in the cooling shell 205 is pumped into the cooling shell 205 through the water inlet pump. The liquid is extracted and re-input into the circulation shell 202 to circulate the coolant. Since a plurality of heat-conducting fins 201 are fixed on the rear side of the circulation shell 202, the heat-conducting fins 201 that export heat can be quickly cooled down, thereby reducing the heat of the server chip. Since the cooling shell 205 is attached to the substrate 1, the heat of the substrate 1 can be taken away through the cooling shell 205, thereby cooling the substrate 1 and the server chip at the same time, solving the technical problem of the traditional server chip cooling and heat dissipation structure that only dissipates the server chip but does not effectively dissipate the substrate 1. Since the substrate 1 and the server chip are installed together, when there is a large amount of heat in the substrate 1, the temperature of the server chip will rise, so it is necessary to dissipate the heat of the substrate 1 and the server chip together.

[0022] For details, see Figure 1 A substrate 1 is installed on the rear side of the chip body 2, and a cooling shell 205 is attached to the rear side of the substrate 1.

[0023] For further information, see Figure 1 A semiconductor refrigeration sheet 206 is installed in the middle of the front end of the circulation shell 202, and the cold end of the semiconductor refrigeration sheet 206 is in contact with the front end of the circulation shell 202. The semiconductor refrigeration sheet 206 can not only be used to cool the circulation shell 202, but also to cool the coolant in the circulation shell 202, thereby avoiding the gradual increase in temperature of the coolant during the circulation cooling process.

[0024] It is worth noting that see Figure 1 A square hole 3 is provided at both the upper and lower ends of the front end of the circulation shell 202, and a partition net 301 is installed at both the front and rear ends of the square hole 3.

[0025] It is worth noting that see Figure 2One end of a fixing rod 303 is fixed on both sides of the inside of the square hole 3, and a micro motor 304 is fixed on the other end of the fixing rod 303. The rear end of the micro motor 304 is connected to a motor shaft 302, and a blowing fan blade 305 is installed on the rear side of the motor shaft 302. By opening the motor inside the square hole 3, the blowing fan blade 305 is driven by the motor to rotate, and the wind can be blown to the server chip, thereby assisting in cooling the server chip. A waterproof and breathable membrane 209 is arranged in the cavity 207, which can allow cold air to enter the inside of the square hole 3 and blow the cold air to the server chip through the blowing fan blade 305, further improving the cooling and heat dissipation effect, and solving the technical problem that the temperature of the coolant will continue to rise and affect the cooling and heat dissipation effect during the circulation of the coolant using the liquid cooling component.

[0026] It is worth mentioning that see Figure 2 There are mounting holes 208 on both sides of the upper and lower ends of the cavity 207, and a waterproof breathable membrane 209 is installed inside the mounting hole 208.

[0027] When using a server chip cooling and heat dissipation structure, first turn on the water inlet pump and the water outlet pump, use the water outlet pump to extract the coolant in the cavity 207, and input it into the cooling shell 205, and then extract the coolant in the cooling shell 205 through the water inlet pump, and input it into the circulation shell 202 again, so that the coolant circulates. Since a plurality of heat-conducting fins 201 are fixed on the rear side of the circulation shell 202, the heat-conducting fins 201 that conduct heat can be quickly cooled down, thereby reducing the heat of the server chip. Since the cooling shell 205 is attached to the substrate 1, the heat of the substrate 1 can be taken away through the cooling shell 205, thereby simultaneously cooling the substrate 1 and the server chip. To cool and dissipate heat from the server chip, the semiconductor refrigeration sheet 206 can be used to cool the circulation shell 202, thereby cooling the coolant in the circulation shell 202, thereby preventing the coolant from gradually increasing in temperature during the circulation cooling process. By opening the motor inside the square hole 3 and using the motor to drive the fan blades 305 to rotate, the wind can be blown toward the server chip, thereby assisting in cooling the server chip. A waterproof and breathable membrane 209 is provided in the cavity 207, which allows cold air to enter the square hole 3 and blow the cold air toward the server chip through the fan blades 305, further improving the cooling and heat dissipation effect.

[0028] In addition, the components designed in the present invention are all universal standard parts or components known to technical personnel in the field. Their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods. They can be fully implemented by technical personnel in the field, and there is no need to elaborate. The content protected by the present invention does not involve improvements to internal structures and methods.

[0029] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A server chip cooling and heat dissipation structure, comprising a circulation shell (202), wherein a cavity (207) is provided inside the circulation shell (202), characterized in that: Also includes: Two pump bodies (203) are respectively connected to two sides of the circulation shell (202), and the two pump bodies (203) are respectively a water outlet pump and a water inlet pump; A cooling and heat dissipation mechanism is connected to one side of the two pump bodies (203), the cooling and heat dissipation mechanism comprises a concave tube (204), the concave tube (204) is connected to one side of the pump body (203), and one end of the concave tube (204) away from the pump body (203) is connected to a cooling shell (205); A plurality of heat-conducting fins (201) are fixed to the rear side of the circulation housing (202), and a chip body (2) is attached to the rear side of the heat-conducting fins (201).

2. A server chip cooling and heat dissipation structure as claimed in claim 1, characterized in that: A substrate (1) is installed on the rear side of the chip body (2), and a cooling shell (205) is attached to the rear side of the substrate (1).

3. A server chip cooling and heat dissipation structure as claimed in claim 1, characterized in that: A semiconductor refrigeration sheet (206) is installed in the middle of the front end of the circulation shell (202), and the cold end of the semiconductor refrigeration sheet (206) is in contact with the front end of the circulation shell (202).

4. A server chip cooling and heat dissipation structure as claimed in claim 1, characterized in that: The circulation shell (202) is provided with square holes (3) at both upper and lower ends of the front end, and partition nets (301) are installed at both front and rear ends of the square hole (3).

5. A server chip cooling and heat dissipation structure as claimed in claim 4, characterized in that: One end of a fixing rod (303) is fixed to both sides of the inside of the square hole (3), a micro motor (304) is fixed to the other end of the fixing rod (303), a motor shaft (302) is connected to the rear end of the micro motor (304), and a blower blade (305) is installed on the rear side of the motor shaft (302).

6. A server chip cooling and heat dissipation structure as claimed in claim 1, characterized in that: The cavity (207) has mounting holes (208) at both upper and lower ends, and a waterproof breathable membrane (209) is installed inside the mounting hole (208).

Images