Silicon wafer conveying device and silicon wafer transfer system
By designing a silicon wafer conveyor device including a slip carrier plate, a support member and a gas-floating member, the problem of easy imprinting and damage in the prior art is solved, and efficient and accurate silicon wafer conveyor is achieved. Improves the quality and production efficiency of the battery cells.
Patent Information
- Application Number
- CN202421162013.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2034-05-23
AI Technical Summary
The existing silicon wafer conveyor belt transfer method can easily lead to large-area imprints or damage on the silicon wafer, affecting the quality and production efficiency of the battery cells.
A silicon wafer conveying device is designed, including a base frame, a sliding carrier plate, a support member and a gas-floating member. The sliding carrier plate is driven to move horizontally, the support member contacts the edge of the silicon wafer for support, and the air-floating member supports the silicon wafer through the airflow to avoid imprinting and damage.
It effectively avoids large-area sliding imprinting and damage of the silicon wafer during the transportation process, improves the accuracy of subsequent processes and the quality of the battery cells, and improves production efficiency.
Smart Images
Figure CN222514897U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solar cell chip processing equipment, in particular to a silicon chip conveying device and a silicon chip transfer system. Background Art
[0002] In the photovoltaic industry, the production process of solar cells refers to the process of producing silicon wafers into solar cells that can realize photoelectric conversion. The photoelectric conversion efficiency of the cell is a key indicator reflecting the technical level of the solar power generation system. Therefore, this production process plays a vital role in key indicators such as the performance and cost of photovoltaic downstream application products.
[0003] In the existing production of solar cells, after a certain process step is completed, it is often necessary to use a basket to store silicon wafers so as to facilitate transfer to the next process step. When silicon wafers are taken out of or put into the basket, conveyor belts and material-picking robots are usually used for transmission and transfer. For example, when taking silicon wafers out of the basket, the conveyor belt takes the silicon wafers out of the basket and transports them to a specific position, and then the material-picking robot picks up the silicon wafers and places them at the starting position for the next process step; when putting silicon wafers into the basket, the material-picking robot picks up the silicon wafers from the end position of the current process and places them on the conveyor belt, and then transports them to the basket.
[0004] In the above-mentioned silicon wafer transfer process, a large area of belt marks often appear during the transportation of silicon wafers by the conveyor belt, resulting in a low yield in the subsequent process. For example, in the CVD coating process, belt marks will cause substrate deposition and poor coating. Moreover, when the material handling robot picks up and places the wafer, the continuously moving conveyor belt and the instantaneous suspension of the material handling robot in contact with the silicon wafer will cause local stress changes in the silicon wafer, thereby causing scratches or other damages on the silicon wafer, and then producing downgraded or scrapped wafers, affecting the quality of the battery cell. Utility Model Content
[0005] In view of this, the utility model provides a silicon wafer conveying device and a silicon wafer transfer system to solve the problem that the existing silicon wafer conveyor belt transfer method is easy to form large-area imprints on the silicon wafer or easily damage the silicon wafer when transferring the silicon wafer, affecting the quality of the battery cell and production efficiency.
[0006] In a first aspect, the utility model provides a silicon wafer conveying device, which is suitable for being arranged between a silicon wafer storage structure and a silicon wafer output structure, and comprises a base frame and a sliding assembly and a buffer assembly installed on the base frame;
[0007] The sliding assembly includes a sliding carrier and a supporting member arranged on the upper part thereof for receiving the silicon wafer; the sliding carrier is driven to move in the horizontal direction of the base frame, and is used to support the silicon wafer for transfer, and the supporting member is in contact with part of the silicon wafer; the cache assembly includes a supporting structure located on both sides of the movement direction of the sliding carrier and an air flotation structure arranged on the supporting structure, and the air flotation member includes an air flotation structure with exhaust holes, which is suitable for spraying air flow onto the surface of the silicon wafer to lift the silicon wafer.
[0008] Beneficial effect: In the silicon wafer conveying device of the utility model, during the movement of the silicon wafer, the supporting member of the sliding assembly partially contacts with the silicon wafer for support, so as to avoid the relative sliding marks of the silicon wafer during the movement of the sliding carrier, and improve the accuracy of the subsequent process; after the silicon wafer moves to a determined position, the silicon wafer is supported by the supporting structure of the buffer assembly, that is, the air floating member floats and supports the silicon wafer, so as to avoid the formation of large-area marks and damages, and when the silicon wafer leaves the plane where the supporting member is located, the supporting member will not stop instantly, and the silicon wafer and the supporting member will not slide relative to each other, so as to avoid the damage to the surface of the silicon wafer when the supporting member moves, and the support member can also continuously take the wafer, and the outward transfer of the silicon wafer does not need to be suspended by the support member. Therefore, whether in the conveying process or in the completed state, no large-area sliding marks and damages will be caused to the silicon wafer, so as to avoid the influence on the subsequent process of silicon wafer production, ensure the quality of the battery cell, and realize the outward transfer of the silicon wafer without pausing the taking of the wafer, which is helpful to further improve the production efficiency of the battery cell, and take into account the quality and production efficiency of the battery cell.
[0009] In an optional embodiment, the supporting member includes: a first supporting bar and a second supporting bar arranged on the sliding carrier at intervals along the movement direction of the sliding carrier, the first supporting bar and the second supporting bar respectively supporting a group of opposite edges of the silicon wafer; or an annular supporting bar arranged on the sliding carrier, suitable for supporting the four edges of the silicon wafer.
[0010] In the utility model, the edge support method is used to support the silicon wafer instead of supporting the entire silicon wafer surface, thereby avoiding the formation of large-area marks on the silicon wafer surface and reducing damage to the silicon wafer surface.
[0011] In an optional embodiment, the first supporting bar and the second supporting bar on the side facing away from each other, or the annular supporting bar on the outer side, respectively protrude upward to form a limiting portion, and the limiting portion is suitable for abutting against the edge of the silicon wafer to clamp and limit the movement of the silicon wafer in the horizontal direction of the sliding carrier.
[0012] In the utility model, the limiting part can further prevent the silicon wafer from sliding relative to the sliding carrier during the sliding transportation process, thereby ensuring the integrity and yield rate of the silicon wafer, and at the same time can play a positioning role, making it convenient for the sliding component to receive the silicon wafer from the silicon wafer storage structure, or to facilitate the sliding component to load the silicon wafer to the silicon wafer storage structure.
[0013] In an optional embodiment, the supporting component also includes: a lifting ball and a ball fixing seat and a detection member, the lifting ball and the ball fixing seat are installed on the sliding carrier and are located between the first supporting bar and the second supporting bar, the lifting ball fixing seat is provided with mounting grooves on both sides close to the air floating structure, and the ball is rotatably installed in the mounting groove; the detection member is arranged on the sliding carrier between the first supporting bar and the second supporting bar, and is suitable for being electrically connected to the terminal device, and is used to detect whether a silicon wafer is placed on the first supporting bar or between the second supporting bar, or on the annular supporting bar.
[0014] In the utility model, the lifting ball is arranged at the center of the silicon wafer. When the silicon wafer is supported on all sides, the lifting ball in the center can further support the silicon wafer, and the lifting ball support can reduce the damage to the surface of the silicon wafer, thereby ensuring the quality of the silicon wafer; the detection component is used to detect whether the silicon wafer is placed on the supporting component, thereby ensuring that the sliding assembly can effectively take the wafer. When the silicon wafer is not detected, the detection component transmits a signal to the terminal device, and the terminal device controls the sliding assembly to stop, repair the fault or replace a new silicon wafer storage structure.
[0015] In an optional embodiment, the sliding assembly also includes a guide structure, which is arranged between the sliding carrier and the base frame, and the guide structure includes: a first guide member, which is fixedly arranged on the base frame; a second guide member, which is fixedly arranged on the sliding carrier; between the first guide member and the second guide member, one of them is a slide groove, and the other of them is a slide rail, and the slide rail can be slidably installed in the slide groove to guide the relative sliding of the sliding carrier and the base frame.
[0016] In the utility model, the guide structure can realize the stable sliding of the sliding carrier relative to the base frame, complete the change of the position of the silicon wafer, and ensure the stability and reliability of the sliding of the device.
[0017] In an optional embodiment, the sliding assembly further includes a first driving structure, one end of which is fixed to the base frame, and the other end of which is connected to the sliding carrier, and is suitable for driving the sliding carrier to extend and retract in the horizontal direction of the base frame;
[0018] The air floating component further comprises a second driving structure, one end of which is fixed on the base frame, and the other end of which is suitable for connecting with the supporting structure to drive the supporting structure to rise and fall in the vertical direction of the base frame.
[0019] In the utility model, the first driving structure provides support for the stable and reliable sliding of the sliding carrier, ensuring the continuous operation of the device. The second driving structure realizes the relative height difference between the sliding component and the buffer component in the vertical direction, ensuring that the supporting device of the device will not damage the silicon wafer during the sliding process or the determined position after moving into place, thereby improving the yield rate of the battery cell.
[0020] In an optional embodiment, the air-floating component also includes: a positioning structure, which is installed on the supporting structure and is located on the side of the air-floating structure away from the sliding carrier, and the positioning structure is suitable for pushing the silicon wafer placed on the air-floating structure towards each other to ensure that a set of opposite sides of the silicon wafer are parallel to the movement direction of the sliding carrier.
[0021] In the utility model, the positioning structure can push the silicon wafer dropped between the two air-floating structures toward each other, so that the silicon wafer is located at the center as much as possible, which is convenient for subsequent process steps.
[0022] In an optional embodiment, along the movement direction of the sliding carrier, the sliding carrier is provided with a first supporting member and a second supporting member at intervals, and the cache assembly includes a first air-floating member and a second air-floating member arranged at intervals; when the sliding carrier approaches the silicon wafer storage structure, the first supporting member extends into the silicon wafer storage structure, and the second supporting member corresponds to the first air-floating member; when the sliding carrier retreats away from the silicon wafer storage structure, the first supporting member corresponds to the first air-floating member, and the second supporting member corresponds to the second air-floating member; the silicon wafer storage structure is suitable for moving in a vertical direction, and the moving distance is the spacing between adjacent silicon wafers in the silicon wafer storage structure.
[0023] In the utility model, there are two groups of supporting components on the sliding carrier, and the corresponding cache components include two groups of air floating components. Each group of air floating components includes a group of air floating structure groups and a group of positioning structure groups. Each group of air floating structure groups includes two air floating structures arranged on both sides of the supporting components, and each group of positioning structure groups includes two positioning structures arranged on the outside of the air floating structures, so as to achieve the effect of taking two silicon wafers at a time and improve the efficiency of battery cell transportation and transfer.
[0024] In the second aspect, the utility model provides a silicon wafer transfer system, comprising the above-mentioned silicon wafer conveying device, silicon wafer storage structure, silicon wafer storage output structure and silicon wafer transfer structure, wherein, along the movement direction of the sliding carrier, the silicon wafer storage structure and the silicon wafer output structure are respectively arranged on both sides of the silicon wafer conveying device, the silicon wafer storage structure has a horizontal accommodating groove suitable for accommodating a plurality of silicon wafers, and the silicon wafer storage structure can be moved in the vertical direction to keep the silicon wafer to be taken at the same height position relative to the supporting member of the silicon wafer conveying device; the silicon wafer transfer structure can be slidably arranged between the silicon wafer conveying device and the silicon wafer output structure, and is located above the silicon wafer conveying device, suitable for sucking the silicon wafer and driving the silicon wafer to move between the air floating member and the silicon wafer output structure.
[0025] In an optional embodiment, the silicon wafer transfer structure includes: at least two suction structures, which are suitable for synchronously sucking at least two silicon wafers and synchronously moving the silicon wafers between the silicon wafer conveying device and the silicon wafer output structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1 A top view of a silicon wafer conveying device provided in an embodiment of the utility model;
[0028] Figure 2 A front view of a silicon wafer conveying device provided in an embodiment of the utility model;
[0029] Figure 3 A three-dimensional diagram of a silicon wafer conveying device provided in an embodiment of the utility model;
[0030] Description of reference numerals:
[0031] 1. Base frame;
[0032] 21. sliding carrier; 22. first driving structure; 221. first rotating driving member; 222. first transmission assembly; 2221. coupling; 2222. first synchronous pulley; 2223. first synchronous belt; 2224. fixing block; 23. supporting member; 231. first supporting bar; 232. second supporting bar; 233. lifting ball; 234. ball fixing seat; 235. detection member; 2301. first supporting member; 2302. second supporting member; 24. guide structure; 241. first guide member; 242. second guide member;
[0033] 31. Support structure; 32. Air-floating component; 321. Air-floating structure; 322. Positioning structure; 3221. First sliding drive component; 3222. Positioning component; 3201. First air-floating component; 3201a. First air-floating structure group; 3201b. First positioning structure group; 3202. Second air-floating component; 3202a. Second air-floating structure group; 3202b. Second positioning structure group; 33. Second drive structure; 331. Second rotating drive component; 332. Second transmission assembly; 3321. Second synchronous pulley; 3322. Second synchronous belt; 3323. Transmission shaft; 3324. Eccentric wheel; 3325. Eccentric wheel fixing seat; 3326. Lifting shaft. DETAILED DESCRIPTION
[0034] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0035] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0036] Example 1
[0037] Combination Figures 1 to 3 The present embodiment provides a silicon wafer conveying device, which is suitable for being arranged between a silicon wafer storage structure and a silicon wafer output structure, and includes a base frame 1 and a sliding assembly and a cache assembly installed on the base frame 1; wherein the sliding assembly includes a sliding carrier 21 and a supporting member 23 arranged on the upper part thereof for receiving the silicon wafer; the sliding carrier 21 is driven to move in the horizontal direction of the base frame 1, and is used to support the silicon wafer for transfer, and the supporting member 23 is in contact with part of the silicon wafer; the cache assembly includes a supporting structure 31 located on both sides of the movement direction of the sliding carrier 21 and an air floating member 32 arranged on the supporting structure 31, and the air floating member includes an air floating structure 321 with an exhaust hole, which is suitable for spraying air flow to the surface of the silicon wafer to lift the silicon wafer.
[0038] In the above-mentioned silicon wafer conveying device, the silicon wafer storage structure can be a flower basket, and the silicon wafer output structure can be a carrier for the next process. The sliding assembly moves between the silicon wafer storage structure and the silicon wafer output structure to realize the conveyance of the silicon wafer between the silicon wafer storage structure and the silicon wafer output structure, that is, it can be to move the silicon wafer on the silicon wafer output structure to the silicon wafer storage structure, or it can be to move the silicon wafer at the silicon wafer storage structure to the silicon wafer output structure. Of course, it is not limited to the silicon wafer storage structure and the silicon wafer output structure, and it can also be the conveyance of silicon wafers or battery cells between two other structures. In the process of silicon wafer movement, the supporting member 23 of the sliding assembly supports the silicon wafer, and supports the silicon wafer at the edge of the silicon wafer to avoid large-area imprints of relative sliding of the silicon wafer during the movement of the sliding carrier 21, thereby improving the quality of subsequent processes; after the silicon wafer moves to a determined position, the silicon wafer is received by the supporting structure 31 of the buffer assembly, and the air-floating structure in the air-floating member 32 floats and supports the silicon wafer to avoid the formation of large-area imprints. In summary, the above-mentioned silicon wafer conveying device will not cause large-area sliding marks on the silicon wafers either during the conveying process or in the completed state, thus avoiding the impact on the subsequent processes of silicon wafer production, and helping to further improve the production efficiency of battery cells and ensure the quality of battery cells.
[0039] Specifically, conventional silicon wafers are square wafers, and the supporting member 23 includes: a first supporting bar 231 and a second supporting bar 232 arranged on the sliding carrier 21 at intervals along the moving direction of the sliding carrier 21, and the first supporting bar 231 and the second supporting bar 232 respectively support the edges of a group of opposite sides of the silicon wafer; or the supporting member 23 includes an annular supporting bar arranged on the sliding carrier 21, which is suitable for supporting the edges of the four sides of the silicon wafer, and the annular supporting bar can be square, circular or other shapes, without specific limitation, as long as it can meet the requirements of partially supporting and supporting the silicon wafer. This embodiment takes a group of opposite supporting bars as an example, and the first supporting bar 231 and the second supporting bar 232 of the supporting member 23 are in contact with a group of opposite sides of the silicon wafer during the sliding conveying process to support the silicon wafer; after the conveying is completed, the sliding carrier 21 is withdrawn from the silicon wafer storage structure, and the supporting member 23 corresponds to the air floating member 32, and the two air floating structures 321 of the air floating member 32 realize floating support for another group of opposite sides of the silicon wafer. During the overall transportation of silicon wafers, the silicon wafers and the structures that support them are in contact at the edges of the silicon wafers. When the process is finally completed and ready for the next step, the silicon wafers are lifted by air floatation, which further avoids damage to the silicon wafers due to uneven contact force, ensuring the quality of the silicon wafers while helping to improve the production efficiency of the battery cells.
[0040] The first supporting bar 231 and the second supporting bar 232 are respectively protruded upward on the side away from each other to form a limiting part, and the two limiting parts are suitable for abutting against the outer edges of a group of opposite sides of the silicon wafer to clamp and limit the movement of the silicon wafer in the extension direction of the sliding carrier 21. The limiting part can further prevent the silicon wafer from sliding relative to the sliding carrier 21 during the sliding conveying process, ensure the integrity and yield of the silicon wafer, and at the same time play a positioning role, so as to facilitate the sliding component to receive the silicon wafer from the silicon wafer storage structure or to facilitate the sliding component to load the silicon wafer storage structure. Of course, this embodiment does not specifically limit whether the first supporting bar 231 and the second supporting bar 232 are provided with a limiting part on the side away from each other. In other embodiments, the first supporting bar 231 and the second supporting bar 232 are not provided with the above-mentioned protrusion on the side away from each other.
[0041] As a preferred embodiment, Figure 1 As shown, the supporting member 23 in this embodiment also includes: a lifting ball 233, a ball fixing seat 234 and a detection member 235, which are installed on the sliding carrier 21 and located between the first supporting bar 231 and the second supporting bar 232. The ball fixing seat 234 is provided with mounting grooves on both sides close to the air floating structure 321. The lifting ball 233 is rotatably installed in the mounting groove, and the lifting ball 233 is equidistant from the first supporting bar 231 and the second supporting bar 232. The lifting ball 233 is suitable for being arranged at the center of the silicon wafer. When the silicon wafer is supported on all sides, the lifting ball 233 in the center can further support the silicon wafer, and the support of the lifting ball 233 can reduce the damage to the surface of the silicon wafer, thereby ensuring the quality of the silicon wafer. Of course, this embodiment does not specifically limit the specific structure of the supporting member 23. In other embodiments, the supporting member 23 includes a lifting ball 233 and a ball fixing seat 234, so that the lifting ball 233 can further support the silicon wafer.
[0042] The detection member 235 is disposed on the sliding carrier 21 between the first supporting bar 231 and the second supporting bar 232, and is suitable for being electrically connected to the terminal device. The detection member 235 of this embodiment is a sensing sensor, which is used to detect whether a silicon wafer is placed on the first supporting bar 231 or between the second supporting bar 232, or on the annular supporting bar, that is, the detection member 235 can detect whether a silicon wafer is placed on the supporting member 23, and transmit the detected information to the terminal device, which receives the information and immediately feeds back to the silicon wafer conveying device, indicating the next step to start or pause, thereby improving the working efficiency of the silicon wafer conveying device.
[0043] In the above-mentioned silicon wafer conveying device, the sliding assembly further includes a guide structure 24, which is arranged between the sliding carrier 21 and the base frame 1. The guide structure 24 includes: a first guide member 241 fixedly arranged on the base frame 1 and a second guide member 242 fixedly arranged on the sliding carrier 21. In this embodiment, Figure 2 and Figure 3 As shown, the first guide member 241 is a slide rail, and the second guide member 242 is a slide groove. The slide rail can be slidably installed in the slide groove to facilitate the sliding of the sliding carrier 21 relative to the base frame 1, thereby achieving stable sliding of the sliding carrier 21 relative to the base frame 1, completing the change of the silicon wafer position, and ensuring the stability and reliability of the sliding of the device.
[0044] In another alternative embodiment, the first guide member 241 is a slide groove and the second guide member 242 is a slide rail, which can also realize the horizontal sliding of the sliding carrier 21 relative to the base frame 1. The specific structure is not limited and can be selected according to the specific structure of the base frame 1 and the sliding carrier 21.
[0045] like Figure 2 and Figure 3 As shown, the sliding assembly of this embodiment also includes a first driving structure 22, which is fixedly mounted on the base frame 1, and its driving end is connected to the sliding carrier 21, and is suitable for driving the sliding carrier 21 to extend and retract in the horizontal direction of the base frame 1; the first driving structure 22 includes: a first rotating driving member 221 and a first transmission assembly 222, the mounting end of the first rotating driving member 221 is fixed on the base frame 1, one end of the first transmission assembly 222 is connected to the output end of the first rotating driving member 221, and the other end is connected to the sliding carrier 21. In this embodiment, the first rotating driving member 221 is a servo motor, and the first transmission assembly 222 is a synchronous pulley assembly. The first transmission assembly includes: a coupling 2221, a first synchronous pulley 2222, a first synchronous belt 2223 and a fixed block 2224; the rotation of the servo motor links the rotation of the first synchronous pulley 2222 through the coupling 2221, thereby driving the first synchronous belt 2223 to move in the horizontal direction, and the fixed block 2224 is fixedly connected to the first synchronous belt 2223 and the sliding carrier 21, thereby finally driving the sliding carrier 21 to move relative to the base frame 1, thereby realizing the sliding movement of the sliding assembly.
[0046] In addition, if Figure 2 and Figure 3As shown, the silicon wafer conveying device of this embodiment also includes: a second driving structure 33, the second driving structure 33 is fixedly mounted on the base frame 1, and its driving end is suitable for connecting with the support structure 31 to drive the support structure 31 and the air-floating member 32 to rise and fall vertically; the second driving structure 33 includes: a second rotating driving member 331 and a second transmission assembly 332, the mounting end of the second rotating driving member 331 is fixed on the base frame 1, one end of the second transmission assembly 332 is connected to the output end of the second rotating driving member 331, and the other end is connected to the support structure 31.
[0047] The buffer component has a vertical displacement change relative to the sliding component, which ensures that the buffer component can take over the silicon wafer after the sliding transportation is completed.
[0048] like Figure 1 As shown, the air-floating component 32 of this embodiment also includes: a positioning structure 322, which is installed on the supporting structure 31 and is located on the side of the air-floating structure 321 away from the sliding carrier 21, the positioning structure 322 is suitable for pushing the silicon wafer placed on the air-floating structure 321 towards each other to ensure that a group of opposite sides of the silicon wafer are parallel to the movement direction of the sliding carrier 21, to avoid the silicon wafer and the movement direction of the sliding carrier 21 from being offset, and then the silicon wafer transfer structure absorbs and deviates the silicon wafer, resulting in the risk of damage to the silicon wafer due to uneven force, and aligning the silicon wafer facilitates the absorption and placement of the silicon wafer by the silicon wafer transfer structure along the sliding carrier 21, thereby ensuring the quality of the silicon wafer; any positioning structure 322 includes: a first sliding drive member 3221 and a positioning member 3222, the mounting end of the first sliding drive member 3221 is fixed on the supporting structure 31, the positioning member 3222 is connected to the output end of the first sliding drive member 3221, and the positioning member 3222 is suitable for sliding toward the air-floating structure 321 driven by the first sliding drive member 3221. The first sliding driving member 3221 is a cylinder structure, which pushes the positioning member 3222 to move toward the silicon wafer. The two positioning structures 322 move toward each other synchronously to push the silicon wafer, thereby positioning the silicon wafer in the direction in which the two air-floating structures 321 are spaced apart.
[0049] like Figures 1 to 3As shown, in this embodiment, along the movement direction of the sliding carrier 21, the first supporting member 2301 and the second supporting member 2302 are spaced apart on the sliding carrier 21, and the cache assembly includes a first air-floating member 3201 and a second air-floating member 3202 spaced apart; the first air-floating member 3201 includes a corresponding first air-floating structure group 3201a and a first positioning structure group 3201b, and the first positioning structure group 3201b is suitable for positioning the silicon wafer on the first air-floating structure group 3201a, and the second air-floating member 3202 includes a corresponding second air-floating structure group 3202a and a second positioning structure group 3202b, and the second positioning structure group 3202b is suitable for positioning the silicon wafer on the second air-floating structure group 3202a. That is, the two positioning structures in the first positioning structure group 3201b are respectively located on the side relatively far away from the two air-floating structures in the first air-floating structure group 3201a. Similarly, the two positioning structures in the second positioning structure group 3202b are respectively located on the side relatively far away from the two air-floating structures in the second air-floating structure group 3202a.
[0050] When the sliding carrier 21 extends close to the silicon wafer storage structure, the first supporting member 2301 extends into the silicon wafer storage structure, and the second supporting member 2302 corresponds to the first air-floating member 3201; when the sliding carrier 21 retreats away from the silicon wafer storage structure, the first supporting member 2301 corresponds to the first air-floating member 3201, and the second supporting member 2302 corresponds to the second air-floating member 3202.
[0051] That is, in this embodiment, there are two groups of supporting members 23 on the sliding carrier 21, and correspondingly, the cache assembly includes two groups of air-floating members 32, each group of air-floating members includes a group of air-floating structure groups and a group of positioning structure groups, each group of air-floating structure groups includes two air-floating structures 321 arranged on both sides of the supporting member 23, and each group of positioning structure groups includes two positioning structures 322 arranged on the outside of the air-floating structure 321, thereby achieving the effect of taking two silicon wafers at a time.
[0052] Of course, it is also possible to set up only one group of supporting components 23 and one group of air floating components 32, and the silicon wafer conveying device can realize the conveyance of one silicon wafer; or to set up three or more groups of supporting components 23 and air floating components 32, and the silicon wafer conveying device can realize the effect of conveying three or more silicon wafers, or even more than 10. The length of the silicon wafer conveying device and the number of each structure can be adjusted according to the conveying requirements.
[0053] The following is an explanation of transporting two silicon wafers from a silicon wafer storage structure to a silicon wafer output structure:
[0054] Driven by the first driving structure 22, the sliding carrier 21 has an extended state in which it moves toward the silicon wafer storage structure to place the silicon wafer into the silicon wafer storage structure, and a retracted state in which it moves away from the silicon wafer storage structure to take out the silicon wafer. The sliding carrier 21 switches between the extended state and the retracted state; the cache component has a first state in which the support structure 31 is raised to allow the air floating member 32 to lift the silicon wafer away from the supporting member 23 and a second state in which the support structure 31 is lowered to place the silicon wafer on the supporting member 23 under the drive of the second driving structure 33.
[0055] Among them, when the sliding carrier 21 is close to the silicon wafer storage structure and is in an extended state, the first supporting member 2301 extends into the silicon wafer storage structure, the second supporting member 2302 corresponds to the first air-floating member 3201, and the two positioning structures in the first positioning structure group 3201b and the two positioning structures in the second positioning structure group 3202b are both in a relatively distant loose state, and the cache component is in the first raised state; when the sliding carrier 21 is away from the silicon wafer storage structure and is in a retracted state, the first supporting member 2301 corresponds to the first air-floating member 3201, the second supporting member 2302 corresponds to the second air-floating member 3202, and the two positioning structures in the first positioning structure group 3201b The two positioning structures in the positioning structure and the second positioning structure group 3202b are both in a relatively close clamping positioning state, and the cache component is in the second state; when the sliding carrier 21 switches from the retracted state to the extended state, the second driving structure 33 drives the supporting structure 31 to rise so that the air-floating component 32 lifts the silicon wafer on the supporting component 23 to avoid displacement of the silicon wafer that has been taken out; when the sliding carrier 21 switches from the extended state to the retracted state, the second driving structure 33 drives the supporting structure 31 to descend so that the silicon wafer lifted by the air-floating component 32 falls onto the supporting component 23, so that both groups of supporting components 23 have silicon wafers, which is convenient for the subsequent structure to take away two groups of silicon wafers at one time, thereby improving work efficiency.
[0056] like Figure 2 and Figure 3As shown, in order to realize the synchronous lifting of two groups of air-floating components, in the cache assembly of this embodiment, the second driving structure 33 includes: a second rotating driving member 331 and a second transmission assembly 332, the second rotating driving member 331 is arranged at the middle position of the base frame 1, and the second transmission assembly 332 includes: a second synchronous pulley 3321, a second synchronous belt 3322, a transmission shaft 3323, two groups of eccentric wheels 3324, two groups of eccentric wheel fixing seats 3325 and four groups of lifting shafts 3326, wherein the first The second synchronous pulley 3321 is connected to the second rotating driving member 331 through the second synchronous belt 3322, and the second synchronous pulley 3321 is connected to the transmission shaft 3323. The two ends of the transmission shaft 3323 are respectively connected to two sets of eccentric wheels 3324, and the eccentric wheels 3324 are installed on the eccentric wheel fixing seat 3325. Each set of eccentric wheel fixing seat 3325 is fixedly connected to one end of two sets of lifting shafts 3326, and the other ends of the two sets of lifting shafts 3326 are fixedly connected to one set of supporting structures 31. The output power of the second rotating driving member 331 is transmitted to the two sets of supporting structures 31 through the second transmission assembly 332, so as to realize the vertical lifting of the supporting structure 31.
[0057] Of course, the number of lifting shafts 426 connected to each supporting structure 31 can be one, or three or more, which is determined according to the overall specifications of the supporting structure 31 or the silicon wafer conveying device to ensure sufficient transmission stability.
[0058] In this embodiment, each time the sliding carrier 21 extends into the wafer storage structure, the wafer storage structure will drop one step to drop the wafer onto the supporting member 23. The distance that the wafer storage structure drops one step is determined according to the number of wafers to be stored in the wafer storage structure. In this embodiment, the wafer storage structure drops about 3 cm one step, and the cache assembly rises about 2.5 cm at a time, which can avoid collision between the cache assembly and the wafer storage structure and affect the quality of the wafers.
[0059] Example 2
[0060] The present embodiment provides a silicon wafer transfer system, comprising: the silicon wafer conveying device, silicon wafer storage structure, silicon wafer storage output structure and silicon wafer transfer structure in Embodiment 1, wherein, along the movement direction of the sliding carrier 21, the silicon wafer storage structure and the silicon wafer output structure are respectively arranged on both sides of the silicon wafer conveying device, the silicon wafer storage structure has a horizontal accommodating groove suitable for accommodating a plurality of silicon wafers, and the silicon wafer storage structure can be moved in the vertical direction to keep the silicon wafer to be taken at the same height position relative to the supporting member 23 of the silicon wafer conveying device; the silicon wafer transfer structure can be slidably arranged between the silicon wafer conveying device and the silicon wafer output structure, and is located above the silicon wafer conveying device, suitable for sucking the silicon wafer and driving the silicon wafer to move between the air floating member 32 and the silicon wafer output structure.
[0061] The contact between the silicon wafer transfer structure and the silicon wafer is point-to-surface contact. The air-floating member 32 provides floating static support under the silicon wafer. There is no dynamic friction between the upper and lower surfaces of the silicon wafer, which can efficiently transfer the silicon wafer while avoiding large-area imprints and damage on the surface of the silicon wafer.
[0062] When the supporting member 23 takes a wafer, the first supporting bar 231 and the second supporting bar 232 support the edges of one group of opposite sides of the silicon wafer. When the supporting member 23 takes a wafer again, the two air-floating structures 321 in the air-floating member 32 support the edges of the other group of opposite sides of the silicon wafer, avoiding large-area imprints on the silicon wafer and affecting the quality of the battery. More importantly, when the supporting member 23 takes a wafer for the second time, the air-floating member 32 provides floating support for the silicon wafer taken out for the first time, avoiding friction damage to the silicon wafer taken out for the first time when the supporting member 23 moves again to take a wafer, and at the same time, the transfer structure transfers the silicon wafer taken out for the first time. The supporting member 23 takes a wafer and the silicon wafer transfer structure moves out the silicon wafer at the same time, so the processing is continuous and the production efficiency is high.
[0063] In one embodiment, the silicon wafer transfer structure includes at least two suction structures slidably arranged on the same sliding support rod, which are suitable for synchronously sucking at least two silicon wafers and synchronously moving the silicon wafers between the silicon wafer conveying device and the silicon wafer output structure, thereby realizing synchronous suction and transfer of two or more silicon wafers, improving efficiency, and being able to align and place two or more silicon wafers at one time, thereby improving process accuracy.
[0064] Specifically in this embodiment, the following is a specific process of transporting the silicon wafer from the silicon wafer storage structure to the silicon wafer output structure:
[0065] S1: In the initial state, the cache assembly and the sliding assembly are roughly in the same horizontal plane, the upper surface of the supporting member 23 for supporting the silicon wafer is slightly higher than the upper surface of the air floating structure 321 in the air floating member 32, and the two sets of positioning structures 322 are in a loose state away from each other.
[0066] S2: The sliding carrier 21 is extended, the silicon wafer storage structure is lowered one step, and the first supporting member 2301 receives the first silicon wafer from the silicon wafer storage structure.
[0067] S3: The sliding carrier 21 is retracted, and the cache assembly rises. The two positioning structures 322 in each positioning structure group are moved closer to each other, and the first silicon wafer is placed on the first air-floating structure group 3201a.
[0068] S4: The sliding carrier 21 is extended again, and the silicon wafer storage structure continues to descend one step. The first supporting member 2301 receives the second silicon wafer from the silicon wafer storage structure. At this time, the two positioning structures in the first positioning structure group 3201b move away from each other and release, the cache assembly descends, and the first silicon wafer falls on the second supporting member 2302.
[0069] S5: The sliding carrier 21 retracts again, synchronously driving the second silicon wafer on the first supporting member 2301 and the first silicon wafer on the second supporting member 2302 to move. When the sliding carrier 21 is in the retracted state, the cache assembly rises, the first silicon wafer is placed on the second air-floating structure group 3202a, and the second silicon wafer is placed on the first air-floating structure group 3201a. The two positioning structures of the positioning structure group corresponding to the air-floating structure group in each air-floating member push the silicon wafer towards each other.
[0070] S6: The silicon wafer transfer structure synchronously transfers the first silicon wafer and the second silicon wafer to the silicon wafer output structure for subsequent steps. During this process, the cache component is in a raised state, and the sliding carrier 21 can move continuously and uninterruptedly to drive the supporting member 23 to take the wafer again.
[0071] Then, the above steps S2 to S6 are repeated until all silicon wafers on the silicon wafer storage structure are transferred.
[0072] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A silicon wafer conveying device, suitable for being arranged between a silicon wafer storage structure and a silicon wafer output structure, characterized in that: It comprises a base frame (1) and the following components installed on the base frame (1): The sliding assembly comprises a sliding carrier (21) and a supporting member (23) arranged on the upper part thereof for supporting the silicon wafer; the sliding carrier (21) is driven to move in the horizontal direction of the base frame (1) for supporting the silicon wafer for transfer, and the supporting member (23) is in contact with part of the silicon wafer; The cache assembly comprises a support structure (31) located on both sides of the moving direction of the sliding carrier (21) and an air flotation component (32) arranged on the support structure (31); the air flotation component (32) comprises an air flotation structure (321) with exhaust holes, which is suitable for spraying air flow toward the surface of the silicon wafer to lift the silicon wafer.
2. The silicon wafer conveying device according to claim 1, characterized in that: The supporting member (23) comprises: a first supporting bar (231) and a second supporting bar (232) arranged on the sliding carrier (21) at intervals along the movement direction of the sliding carrier (21), the first supporting bar (231) and the second supporting bar (232) respectively supporting a group of opposite edges of the silicon wafer; or an annular supporting bar arranged on the sliding carrier (21) suitable for supporting the edges of the four sides of the silicon wafer.
3. The silicon wafer conveying device according to claim 2, characterized in that: The first supporting bar (231) and the second supporting bar (232) are on the side facing away from each other, or the annular supporting bar is protruded upward at the outer edge to form a limiting portion, and the limiting portion is suitable for abutting against the outer edge of the silicon wafer to clamp and limit the movement of the silicon wafer in the horizontal direction of the sliding carrier (21).
4. The silicon wafer conveying device according to claim 3, characterized in that: The supporting member (23) further comprises: A lifting ball (233) and a ball fixing seat (234) are mounted on the sliding carrier (21) and located between the first supporting bar (231) and the second supporting bar (232); the ball fixing seat (234) is provided with mounting grooves on both sides close to the air floating structure (321); the lifting ball (233) is rotatably mounted in the mounting grooves; A detection member (235) is arranged on the sliding carrier (21) between the first supporting bar (231) and the second supporting bar (232), and is suitable for being electrically connected to a terminal device, and is used to detect whether a silicon wafer is placed between the first supporting bar (231) and the second supporting bar (232), or on the annular supporting bar.
5. The silicon wafer conveying device according to claim 1, characterized in that: The sliding assembly comprises a guide structure (24) arranged between the sliding carrier plate (21) and the base frame (1), and the guide structure (24) comprises: A first guide member (241) is fixedly arranged on the base frame (1); A second guide member (242) is fixedly disposed on the sliding carrier plate (21); Between the first guide member (241) and the second guide member (242), one of them is a slide groove and the other of them is a slide rail, and the slide rail can be slidably installed in the slide groove to guide the relative sliding of the sliding carrier plate (21) and the base frame (1).
6. The silicon wafer conveying device according to claim 5, characterized in that: The sliding assembly further comprises a first driving structure (22), the first driving structure (22) being fixedly mounted on the base frame (1), the driving end of the first driving structure (22) being connected to the sliding carrier (21), and being suitable for driving the sliding carrier (21) to move in a horizontal direction of the base frame (1); The cache assembly also includes a second driving structure (33), which is fixedly mounted on the base frame (1), and a driving end of which is suitable for connecting with the supporting structure (31) to drive the supporting structure (31) to rise and fall in the vertical direction of the base frame (1).
7. The silicon wafer conveying device according to claim 1, characterized in that: The air-floating component (32) comprises: a positioning structure (322), the positioning structure (322) being mounted on the supporting structure (31) and being located on a side of the air-floating structure (321) away from the sliding carrier (21), the positioning structure (322) being suitable for pushing a silicon wafer placed on the air-floating structure (321) towards each other to ensure that a set of opposite sides of the silicon wafer are parallel to a movement direction of the sliding carrier (21).
8. The silicon wafer conveying device according to any one of claims 1 to 7, characterized in that: Along the movement direction of the sliding carrier (21), a first supporting member (2301) and a second supporting member (2302) are arranged at intervals on the sliding carrier (21), and the cache assembly comprises a first air-floating member (3201) and a second air-floating member (3202) arranged at intervals; When the sliding carrier (21) is extended close to the silicon wafer storage structure, the first supporting member (2301) extends into the silicon wafer storage structure, and the second supporting member (2302) corresponds to the first air-floating member (3201); when the sliding carrier (21) is retracted away from the silicon wafer storage structure, the first supporting member (2301) corresponds to the first air-floating member (3201), and the second supporting member (2302) corresponds to the second air-floating member (3202).
9. A silicon wafer transfer system, characterized in that: include: The silicon wafer conveying device according to any one of claims 1 to 8; A silicon wafer storage structure and a silicon wafer output structure are respectively arranged on both sides of the silicon wafer conveying device along the movement direction of the sliding carrier (21), the silicon wafer storage structure and the silicon wafer output structure having a horizontal accommodating groove suitable for accommodating a plurality of silicon wafers, and the silicon wafer storage structure can move in a vertical direction to keep the silicon wafer to be taken at the same height relative to the supporting member (23) of the silicon wafer conveying device; A silicon wafer transfer structure is slidably arranged between the silicon wafer conveying device and the silicon wafer output structure and is located above the silicon wafer conveying device, and is suitable for sucking silicon wafers and driving the silicon wafers to move between the air floating member (32) and the silicon wafer output structure.
10. The silicon wafer transfer system according to claim 9, characterized in that: The silicon wafer transfer structure comprises: At least two suction structures are suitable for synchronously sucking at least two silicon wafers and synchronously moving the silicon wafers between the silicon wafer conveying device and the silicon wafer output structure.