Plate forming device provided with bonding lines

By installing and laying an adhesive wire device in the plate forming device, the problem that the prior art cannot produce a multi-layer board with adhesive wires between the veneers is solved, and a multi-layer board with adhesive wires is achieved, satisfying the Some usage requirements have been made.

CN222522244UActive Publication Date: 2025-02-25鄢陵县众达木业有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421788830.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-26
Publication Date
2025-02-25
Estimated Expiration
2034-07-26

AI Technical Summary

Technical Problem

Existing board molding devices cannot produce multi-layer boards with bonding wires between veneers, which cannot meet some usage requirements.

Method used

Install and lay the bonding wire device before the fabric division station of the board forming device, including bonding wire rollers and glue liquid barrels. Through the cooperation of bonding wire rollers and glue liquid barrels, the bonding wire laying on the upper surface of the veneer is realized. .

Benefits of technology

It has achieved the production of multi-layer boards with adhesive wires in the middle, which meets some usage requirements and improves the production capacity of the board forming device.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of plate production, in particular to a plate forming device provided with bonding lines, which comprises a device frame, a material distribution station is arranged behind the device frame, a conveying roller for conveying veneers forwards is arranged on the material distribution station, the material distribution station comprises a plurality of material distribution sub-stations, one veneer can be placed on each material distribution sub-station, and the bonding lines are arranged on the conveying roller. A gluing device is further arranged on the distributing sub-station, the gluing device can glue the upper surface of the veneer, a pressing station is arranged in front of the device frame, and a pressing machine for pressing the veneer is further arranged on the pressing station; a bonding wire laying device is further installed in front of the distributing sub-station and comprises a bonding wire roller installed on the device frame and a glue solution barrel below the bonding wire roller, and the glue solution barrel is provided with an upper opening and a lower bonding wire outflow hole. And the bonding wire flowing out of the bonding wire flowing-out hole falls on the upper surface of the single plate. The plate forming device has the advantages that a multi-layer plate with bonding lines in the middle can be produced, and certain production requirements are met.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of plate production, in particular to a plate forming device. Background Art

[0002] The board forming device is a device for placing multi-layer veneers, applying glue on the veneers, stacking and pressing them to form boards; the board forming device includes a device frame, behind the device frame is a feeding station, and the feeding station is provided with a conveying roller for conveying the veneers forward. Since the multi-layer board is formed by multiple veneers, the feeding station includes multiple feeding sub-stations, each of which can place a veneer, and there is also a gluing device on the feeding sub-station, and the gluing device can realize gluing on the upper surface of the veneer. During production, the veneers on it gradually increase from the back feeding sub-station to the front feeding sub-station, and the front of the device frame is a pressing station, and there is also a press for pressing the board at the pressing station; when reaching the pressing station, multiple veneers are stacked intact, and the stacked veneers can be pressed at the pressing station to produce multi-layer boards.

[0003] In the prior art, there is no provision for laying out bonding lines between single boards on the board forming device, so that multilayer boards with bonding lines between single boards cannot be produced, and some use requirements cannot be met. Summary of the invention

[0004] The purpose of the utility model is to provide a plate forming device that can produce multilayer plates with bonding lines in the middle and meet some use requirements, that is, a plate forming device with bonding lines arranged.

[0005] The technical solution of the utility model is implemented as follows: a plate forming device for laying out bonding lines comprises a device frame, a material laying station is located behind the device frame, a conveying roller for conveying a single board forward is provided on the material laying station, the material laying station comprises a plurality of material laying sub-stations, each material laying sub-station can hold a single board, a gluing device is provided on the material laying sub-station, the gluing device can realize gluing on the upper surface of the single board, a pressing station is located in front of the device frame, and a press is provided on the pressing station for applying pressure to the plate; the utility model is characterized in that a bonding line laying device is also installed in front of the material laying sub-station, the bonding line laying device comprises a bonding line roller wheel installed on the device frame and a glue barrel under the bonding line roller wheel, the glue barrel has an upper opening and a bonding line outflow hole at the bottom, and the bonding line flowing out of the bonding line outflow hole falls on the single board.

[0006] Furthermore, there are a plurality of bonding line rollers, a plurality of bonding line outflow holes, and the plurality of bonding line outflow holes are arranged in a row.

[0007] Furthermore, the glue coating device is equipped with a glue tank, a glue dipping roller installed in the glue tank, and a glue transfer roller installed on the device frame. The side of the glue transfer roller contacts the glue dipping roller and the glue coating roller respectively. The glue transfer roller can transfer the adhesive glue on the glue dipping roller to the glue coating roller. The bottom of the glue coating roller is just above the veneer to be processed and contacts the top of the veneer.

[0008] The beneficial effect of the utility model is that such a plate forming device can produce a multilayer plate with a bonding line in the middle, thereby meeting the advantages of some production requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a side structural schematic diagram of the utility model.

[0010] Figure 2 yes Figure 1 Schematic diagram of the A-A direction in .

[0011] Figure 3 yes Figure 2 Schematic diagram of the B-B direction in .

[0012] Among them: 1. device frame 2, conveying roller 3, material laying station 31, material laying sub-station 4, glue coating device 41, glue tank 42, glue dipping roller 43, oiling transfer roller 44, glue coating roller 5, press machine 6, bonding line laying device 61, bonding line roller 62, glue barrel 621, bonding line outflow hole 7, single board. DETAILED DESCRIPTION

[0013] The utility model will be further described below in conjunction with the accompanying drawings.

[0014] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0015] like Figure 1 , 2As shown in FIG. 3 , a sheet forming device for laying bonding lines comprises a device frame 1, a material laying station 3 is located behind the device frame, a conveying roller 2 for conveying a single board forward is provided on the material laying station, the material laying station comprises a plurality of material laying substations 31, each material laying substation can hold a single board, a gluing device 4 is provided on the material laying substation, the gluing device can realize gluing on the upper surface of the single board, a pressing station is located in front of the device frame, a press 5 for applying pressure to the sheet is provided on the pressing station; the feature is that a bonding line laying device 6 is also installed on the material laying substation, the bonding line laying device comprises a bonding line roller 61 installed on the device frame and a glue barrel 62 under the bonding line roller, the glue barrel has an upper opening and a bonding line outflow hole 621 under the bonding line, and the bonding line flowing out of the bonding line outflow hole falls on the single board.

[0016] The utility model is equipped with a bonding line laying device on the basis of the existing board forming device, the bonding line flowing out from the bonding line outflow hole falls on the single board, and because the bonding line passes through the glue barrel, the bonding line is coated with adhesive glue around the bonding line, and the bonding line is firmly attached to the single board. Since the single board moves forward, the bonding line is bonded to the surface of the single board, and the bonding line can continuously move downward and move forward with the single board, and the bonding line roller will continuously release the bonding line and continuously lay the bonding line on the single board.

[0017] Furthermore, there are a plurality of bonding line rollers, a plurality of bonding line outflow holes, and the plurality of bonding line outflow holes are arranged in a row.

[0018] This allows multiple bonding lines to be laid on the veneer.

[0019] Furthermore, the glue coating device is provided with a glue tank 41, a glue dipping roller 42 is installed in the glue tank, and a glue transfer roller 43 is installed on the device frame. The side surfaces of the glue transfer roller respectively contact the glue dipping roller and the glue coating roller 44. The glue transfer roller can transfer the adhesive glue on the glue dipping roller to the glue coating roller. The bottom of the glue coating roller is just above the veneer to be processed and is in contact with the top of the veneer.

[0020] The utility model is arranged in this way, which provides convenience for gluing the single board.

[0021] In the description of the present invention, it should be noted that the terms "front", "rear", "left", "right", "vertical", "horizontal", "inside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", "fourth", and "fifth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

Claims

1. A sheet forming device for laying bonding lines, comprising a device frame, a material laying station behind the device frame, a conveying roller for conveying a single board forward on the material laying station, the material laying station comprising a plurality of material laying substations, each material laying substation can place a single board, a gluing device is provided on the material laying substation, the gluing device can realize gluing on the upper surface of the single board, a pressing station is provided in front of the device frame, and a press is provided on the pressing station for pressing the sheet; the characteristics are: A bonding line laying device is also installed in front of the material laying substation, and the bonding line laying device includes a bonding line roller installed on the device frame and a glue barrel under the bonding line roller. The glue barrel has an upper opening and a bonding line outflow hole below, and the bonding line flowing out of the bonding line outflow hole falls on the single board.

2. The plate forming device for laying out bonding lines according to claim 1 is characterized in that: There are a plurality of bonding line rollers, a plurality of bonding line outflow holes, and the plurality of bonding line outflow holes are arranged in a row.

3. The sheet forming device for laying out bonding lines according to claim 1 or 2, characterized in that: The glue coating device is equipped with a glue tank, a glue dipping roller installed in the glue tank, and a glue transfer roller installed on the device frame. The side of the glue transfer roller contacts the glue dipping roller and the glue coating roller respectively. The glue transfer roller can transfer the adhesive glue on the glue dipping roller to the glue coating roller. The bottom of the glue coating roller is just above the veneer to be processed and contacts the veneer.