Heat dissipation structure of direct current charging pile

Abstract

The utility model relates to the technical field of direct-current charging pile heat dissipation, and discloses a heat dissipation structure of a direct-current charging pile, which comprises a charging pile host, and further comprises a cooling assembly which is arranged in a U-shaped air pipe and can reduce the air temperature; and the cooling assembly is arranged in the second cabinet body and can keep the temperature of the cooling assembly at a low temperature. Cooling liquid is cooled through the cooling assembly, the flow guide plate absorbs heat in air, the cooled air returns to the interior of the charging pile main machine again to cool electronic devices, and the cooling liquid absorbing heat in the spiral bent pipe returns to the snake-shaped bent pipe again under the action of the micro water pump, so that the cooling effect of the cooling liquid is improved. It is ensured that air entering the charging pile main machine is in a low-temperature state all the time, and efficient heat dissipation of the charging pile main machine under internal circulation is achieved; and through the heat preservation assembly, the heat exchange rate with the outside is reduced, only two ventilation openings are used for communicating with the interior of the charging pile main machine, and structural arrangement of the interior of the charging pile main machine is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of a DC charging pile, in particular to a heat dissipation structure of a DC charging pile. Background Art

[0002] A DC charging pile can be used as a charging device to replenish power for electric vehicles. It has a large charging power and a short charging time. The output voltage and current can be continuously adjusted. It is suitable for scenarios with high requirements on charging time. When the DC charging pile is working, the electronic devices inside it will generate more heat. After accumulating for a long time, this heat will cause the temperature inside the casing to rise. Therefore, a heat dissipation structure is needed to discharge this heat to ensure the stable operation of the DC charging pile.

[0003] When the existing heat dissipation structure of a DC charging pile is in use, a large number of fans are generally installed on the casing of the DC charging pile to introduce external air into the cavity, and the external air then continues to blow the heating device to take away the heat. However, a large number of fans not only occupy the internal space of the compression cavity, but also consume a lot of energy. At the same time, the heat is only dissipated by directly introducing external air into the cavity of the DC charging pile through the fan. The heat dissipation efficiency is low and the heat dissipation effect is general, which is not conducive to the long-term use of the DC charging pile. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation structure of a DC charging pile to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solutions: a heat dissipation structure of a DC charging pile, comprising a charging pile host, a first cabinet is fixedly connected to one side of the charging pile host, a second cabinet is fixedly connected to one side of the first cabinet, a second partition is fixedly connected inside the second cabinet, a liquid storage tank is fixedly installed on the top of the second partition, a U-shaped air duct is arranged inside the first cabinet, and further comprising:

[0006] A cooling component is arranged inside the U-shaped air duct to reduce the air temperature, the top and bottom of the first cabinet are both provided with an air induction component that can drive air in and out of the cooling component, and a heat preservation component is arranged between the U-shaped air duct and the first cabinet to reduce the loss of cold energy of the cooling component;

[0007] A cooling component is arranged inside the second cabinet to keep the cooling component at a low temperature. A heat dissipation component is arranged on the side of the second cabinet away from the first cabinet to discharge the working heat of the cooling component. A micro water pump is fixedly connected to one side of the liquid storage tank, and the water inlet of the micro water pump is connected to the inside of the liquid storage tank.

[0008] Preferably, the cooling component includes a spiral bend fixed inside a U-shaped air duct, a plurality of guide plates are symmetrically installed on the inner wall of the U-shaped air duct, one end of the spiral bend is connected to a second circulation pipe, one end of the second circulation pipe is connected to a liquid inlet of a liquid storage tank, the other end of the spiral bend is connected to a first circulation pipe, one end of the first circulation pipe is connected to a liquid outlet of the cooling component.

[0009] Preferably, the air induction component includes a vent arranged on one side of the first cabinet, one side of the vent is connected to the interior of the charging pile host, and a plurality of first fans are symmetrically installed inside the vent.

[0010] Preferably, the thermal insulation component comprises a foam board fixed inside the first cabinet, a thermal insulation layer is provided inside the foam board, and the thermal insulation layer is made of polystyrene foam material.

[0011] Preferably, the cooling component includes a quadrilateral frame fixed to the inside of the second cabinet, a semiconductor refrigeration plate is fixedly installed inside the quadrilateral frame, a first heat conduction plate is fixedly connected to the cold surface of the semiconductor refrigeration plate, a serpentine bend pipe is fixedly installed inside the first heat conduction plate, one end of the serpentine bend pipe is connected to the water outlet of a micro water pump, and the other end of the serpentine bend pipe is connected to the liquid inlet of the cooling component.

[0012] Preferably, the heat dissipation component includes a heat exhaust port arranged on one side of the second cabinet, a second fan is installed inside the heat exhaust port, a second heat conduction plate is provided on one side of the second fan, a plurality of heat dissipation fins are symmetrically installed on the side of the second heat conduction plate away from the cooling component, air inlets are opened on both sides of the second cabinet, and a dust filter is installed inside the air inlet.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] The utility model first cools the coolant through a cooling component, and the cooled coolant enters the spiral bend through the first circulation pipe, so that the temperature of the U-shaped air duct and the guide plate is reduced, and then the air induction component inputs the air inside the charging pile host into the U-shaped air duct, the guide plate absorbs the heat in the air, and then the cooled air returns to the charging pile host to cool down the electronic devices, and the coolant after absorbing heat in the spiral bend under the action of a micro water pump returns to the serpentine bend through the second circulation pipe, and the cycle is repeated to ensure that the air entering the charging pile host from the U-shaped air duct is always in a low temperature state, thereby achieving efficient heat dissipation of the charging pile host under the internal circulation of air; by arranging a thermal insulation component, the heat exchange rate between the U-shaped air duct and the outside is reduced, energy is saved, and at the same time, it is connected to the inside of the charging pile host only through two vents, occupies less space, and is beneficial to the structural arrangement inside the charging pile host. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the heat dissipation structure of a DC charging pile provided by the utility model;

[0016] Figure 2 A schematic diagram of the structure of the air induction component provided by the utility model;

[0017] Figure 3 A schematic diagram of the structure of the thermal insulation component provided by the utility model;

[0018] Figure 4 A schematic diagram of the heat dissipation assembly structure provided by the utility model;

[0019] Figure 5 This is a schematic diagram of the cooling component structure provided by the utility model.

[0020] In the figure: 1. Charging pile host; 2. First cabinet; 3. Second cabinet; 4. U-shaped air duct; 5. Cooling component; 51. Guide plate; 52. Spiral elbow; 53. First circulation pipe; 54. Second circulation pipe; 6. Insulation component; 61. Foam board; 62. Insulation layer; 7. Air induced component; 71. First fan; 72. Ventilation port; 8. Second partition; 9. Liquid storage tank; 10. Micro water pump; 11. Cooling component; 111. Semiconductor refrigeration sheet; 112. First heat conduction plate; 113. Serpentine elbow; 114. Quadrilateral frame; 12. Heat dissipation component; 121. Second heat conduction plate; 122. Heat dissipation fin; 123. Second fan; 124. Heat exhaust port; 125. Air inlet; 126. Dust filter. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5As shown, a heat dissipation structure of a DC charging pile comprises a charging pile host 1, a first cabinet 2 is fixedly connected to one side of the charging pile host 1, a second cabinet 3 is fixedly connected to one side of the first cabinet 2, a second partition 8 is fixedly connected inside the second cabinet 3, a liquid storage tank 9 is fixedly installed on the top of the second partition 8, a U-shaped air duct 4 is arranged inside the first cabinet 2, and also comprises: a cooling component 5 arranged inside the U-shaped air duct 4 to reduce the air temperature, by setting the cooling component 5, the air entering the U-shaped air duct 4 can be cooled, the cooled air can take away more heat from the charging pile host 1, and the heat dissipation effect is better; the top and bottom of the first cabinet 2 are both provided with an air induction component 7 that can drive air in and out of the cooling component 5, by setting the air induction component 7, the cold air inside the U-shaped air duct 4 can be introduced into the charging pile host 1, the cold air absorbs heat and returns to the U-shaped air duct 4 and is then cooled by the cooling component 5, so that the air is continuously cooled, and at the same time, the internal circulation of the air is realized, avoiding the external air Water vapor and impurities in the air enter the charging pile host 1 and cause damage to electronic devices; an insulation component 6 is provided between the U-shaped air duct 4 and the first cabinet 2 to reduce the cold loss of the cooling component 5. By setting the insulation component 6, the cold loss of cold air and cold liquid during the transportation process is reduced, saving energy; a cooling component 11 is arranged inside the second cabinet 3 to keep the cooling component 5 at a low temperature. By setting the cooling component 11, it can be ensured that the air entering the charging pile host 1 is always kept at a low temperature; a heat dissipation component 12 is provided on the side of the second cabinet 3 away from the first cabinet 2 to discharge the working heat of the cooling component 11. By setting the heat dissipation component 12, the heat generated by the cooling component 11 when working can be quickly discharged from the second cabinet 3; a micro water pump 10 is fixedly connected to one side of the liquid storage tank 9, and the water inlet of the micro water pump 10 is connected to the inside of the liquid storage tank 9. The micro water pump 10 and the liquid storage tank 9 can be used to realize the circulation of the coolant in the cooling component 11 and the heat dissipation component 12.

[0023] The cooling component 5 includes a spiral bend 52 fixed inside the U-shaped air duct 4, and a plurality of guide plates 51 are symmetrically installed on the inner wall of the U-shaped air duct 4. One end of the spiral bend 52 is connected to a second circulation pipe 54, and one end of the second circulation pipe 54 is connected to the liquid inlet of the liquid storage tank 9. The other end of the spiral bend 52 is connected to a first circulation pipe 53, and one end of the first circulation pipe 53 is connected to the liquid outlet of the cooling component 11. By setting the guide plate 51, the contact area with the air is increased without hindering the air flow. The coolant flowing through the spiral bend 52 will cool down the U-shaped air duct 4 and the guide plate 51 together, thereby reducing the temperature of the air passing between the guide plates 51.

[0024] The air induction component 7 includes a vent 72 arranged on one side of the first cabinet 2, one side of the vent 72 is connected to the interior of the charging pile host 1, and a plurality of first fans 71 are symmetrically installed inside the vent 72. By setting the first fan 71, the cold air inside the U-shaped air duct 4 can be introduced from the bottom of the charging pile host 1, and then the cold air absorbs heat and returns to the U-shaped air duct 4 from the top of the charging pile host 1 to be cooled again, and this is repeated to achieve efficient heat dissipation of the charging pile host 1. At the same time, it is connected to the interior of the charging pile host 1 only through two vents 72, occupies less space, which is beneficial to the structural arrangement inside the charging pile host 1.

[0025] The insulation component 6 includes a foam board 61 fixed inside the first cabinet 2, and an insulation layer 62 is provided inside the foam board 61. The insulation layer 62 is made of polystyrene foam material. By setting the foam board 61, the heat exchange rate between the U-shaped air duct 4 and the outside is reduced. At the same time, the insulation layer 62 is used to reduce the loss of cold air, thereby saving energy.

[0026] The cooling component 11 includes a quadrilateral frame 114 fixed to the inside of the second cabinet 3, a semiconductor refrigeration plate 111 is fixedly installed inside the quadrilateral frame 114, a first heat conducting plate 112 is fixedly connected to the cold surface of the semiconductor refrigeration plate 111, a serpentine bend 113 is fixedly installed inside the first heat conducting plate 112, one end of the serpentine bend 113 is connected to the water outlet of the micro water pump 10, and the other end of the serpentine bend 113 is connected to the liquid inlet of the cooling component 5. The micro water pump 10 is used to transport the heat-absorbing coolant to the inside of the serpentine bend 113, and then the cold surface of the semiconductor refrigeration plate 111 is used to cool the first heat conducting plate 112. The first heat conducting plate 112 then absorbs the heat of the coolant inside the serpentine bend 113, and then the coolant returns to the cooling component 5, thereby ensuring that the U-shaped air duct 4 always maintains a low temperature state.

[0027] The heat dissipation component 12 includes a heat exhaust port 124 arranged on one side of the second cabinet 3, a second fan 123 is installed inside the heat exhaust port 124, a second heat conducting plate 121 is provided on one side of the second fan 123, and a plurality of heat dissipation fins 122 are symmetrically installed on the side of the second heat conducting plate 121 away from the cooling component 11. Air inlets 125 are opened on both sides of the second cabinet 3, and a dust filter 126 is installed inside the air inlet 125. The second heat conducting plate 121 can absorb the heat of the hot surface of the semiconductor cooling plate 111 when it is working, and then the heat of the second heat conducting plate 121 can be discharged through the heat dissipation fins 122 and the second fan 123, thereby avoiding the semiconductor cooling plate 111 from being overheated and affecting its operation. At the same time, the dust filter 126 inside the air inlet 125 can prevent external dust and other impurities from entering the second cabinet 3, thereby ensuring the stable operation of the semiconductor cooling plate 111.

[0028] Working principle: first, the coolant is cooled by the cooling component 11, and the cooled coolant enters the spiral bend 52 through the first circulation pipe 53, so that the temperature of the U-shaped air duct 4 and the guide plate 51 is reduced, and then the air induced component 7 inputs the internal air of the charging pile host 1 into the U-shaped air duct 4, and the guide plate 51 will absorb the heat in the air, and then the cooled air returns to the charging pile host 1 to cool down the electronic devices, and the coolant after absorbing heat in the spiral bend 52 returns to the serpentine bend 113 through the second circulation pipe 54 under the action of the micro water pump 10, and the cycle is repeated to ensure that the air entering the charging pile host 1 from the U-shaped air duct 4 is always in a low temperature state, thereby achieving efficient heat dissipation of the charging pile host 1 under the internal circulation of the air, and by setting the insulation component 6, the heat exchange rate between the U-shaped air duct 4 and the outside is reduced, saving energy.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure of a DC charging pile, comprising a charging pile host (1), wherein one side of the charging pile host (1) is fixedly connected to a first cabinet (2), one side of the first cabinet (2) is fixedly connected to a second cabinet (3), a second partition (8) is fixedly connected inside the second cabinet (3), a liquid storage tank (9) is fixedly installed on the top of the second partition (8), and a U-shaped air duct (4) is provided inside the first cabinet (2), characterized in that: Also includes: A cooling component (5) is arranged inside the U-shaped air duct (4) and can reduce the temperature of the air; an air induction component (7) is arranged at the top and bottom of the first cabinet (2) and can drive air in and out of the cooling component (5); and a heat preservation component (6) is arranged between the U-shaped air duct (4) and the first cabinet (2) to reduce the loss of cold energy of the cooling component (5); A cooling component (11) is arranged inside the second cabinet (3) and can keep the temperature of the cooling component (5) at a low temperature. A heat dissipation component (12) is arranged on a side of the second cabinet (3) away from the first cabinet (2) and can discharge working heat of the cooling component (11). A micro water pump (10) is fixedly connected to one side of the liquid storage tank (9), and a water inlet of the micro water pump (10) is connected to the inside of the liquid storage tank (9).

2. The heat dissipation structure of a DC charging pile according to claim 1, characterized in that: The cooling component (5) comprises a spiral bend (52) fixed inside a U-shaped air duct (4); a plurality of guide plates (51) are symmetrically mounted on the inner wall of the U-shaped air duct (4); one end of the spiral bend (52) is connected to a second circulation pipe (54); one end of the second circulation pipe (54) is connected to a liquid inlet of a liquid storage tank (9); the other end of the spiral bend (52) is connected to a first circulation pipe (53); one end of the first circulation pipe (53) is connected to a liquid outlet of a cooling component (11).

3. The heat dissipation structure of a DC charging pile according to claim 1, characterized in that: The air induction component (7) comprises a vent (72) arranged on one side of the first cabinet (2); one side of the vent (72) is connected to the inside of the charging pile host (1); and a plurality of first fans (71) are symmetrically installed inside the vent (72).

4. The heat dissipation structure of a DC charging pile according to claim 1, characterized in that: The heat-insulating component (6) comprises a foam board (61) fixed inside the first cabinet (2), a heat-insulating layer (62) is provided inside the foam board (61), and the heat-insulating layer (62) is made of polystyrene foam material.

5. The heat dissipation structure of a DC charging pile according to claim 1, characterized in that: The cooling component (11) comprises a quadrilateral frame (114) fixed inside the second cabinet (3), a semiconductor refrigeration plate (111) is fixedly installed inside the quadrilateral frame (114), a first heat conduction plate (112) is fixedly connected to the cold surface of the semiconductor refrigeration plate (111), a serpentine bend (113) is fixedly installed inside the first heat conduction plate (112), one end of the serpentine bend (113) is connected to the water outlet of the micro water pump (10), and the other end of the serpentine bend (113) is connected to the liquid inlet of the cooling component (5).

6. The heat dissipation structure of a DC charging pile according to claim 1, characterized in that: The heat dissipation component (12) comprises a heat dissipation port (124) arranged on one side of the second cabinet (3), a second fan (123) is installed inside the heat dissipation port (124), a second heat conduction plate (121) is provided on one side of the second fan (123), a plurality of heat dissipation fins (122) are symmetrically installed on the side of the second heat conduction plate (121) away from the cooling component (11), air inlets (125) are provided on both sides of the second cabinet (3), and a dust filter (126) is installed inside the air inlet (125).

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