Optical receiving component and optical module

Abstract

The utility model discloses an optical receiving component and an optical module, and the optical receiving component comprises a backing plate, an optical receiving chip array, and a receiving assembly. The light receiving chip array is located on one side of the base plate, and the receiving assembly is located above the base plate. The receiving assembly comprises a substrate, a turning prism, a light splitting device and a lens assembly. Signal light enters the turning prism after passing through the light splitting device, enters the lens assembly after being turned by the turning prism, and is converged to the light receiving chip array by the lens assembly. The lens assembly is located in the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, the lower surface of the lens assembly is higher than the lower surface of the substrate, and damage of an external structure to the lens assembly can be avoided. According to the invention, convergence of signal light is realized through one group of lenses, which is beneficial for reducing the size of the assembly. The turning prism and the light splitting device are separately arranged, the three-dimensional position of the turning prism can be adjusted, and the optical coupling efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical receiving component and an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are one of the key components in optical communication equipment, and with the development of optical communication technology, the transmission rate of optical modules continues to increase.

[0003] In high-speed information transceiver systems, high-density optical modules are needed to replace traditional optical modules. Multi-channel optical transceiver technology can concentrate more optical emitting components and optical receiving components in a smaller space. In a limited space, improving the optical coupling efficiency of the optical receiving component helps to ensure product stability. Utility Model Content

[0004] The present application provides a light receiving component and an optical module to improve the optical coupling efficiency of the light receiving component.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] In a first aspect, an embodiment of the present application discloses a light receiving component, comprising:

[0007] Pads;

[0008] A light receiving chip array is located on one side of the pad;

[0009] A receiving assembly is located above the pad, and the receiving assembly includes:

[0010] A base plate, located above the pad;

[0011] A turning prism is located above the substrate,

[0012] A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; a lens assembly is located below the turning prism, and the lens assembly cover is arranged above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array;

[0013] The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate;

[0014] The turning prism is arranged separately from the light splitting device.

[0015] In a second aspect, an embodiment of the present application discloses an optical module, including: a circuit board;

[0016] A light receiving component is located above the circuit board, and the light receiving component includes:

[0017] Pads;

[0018] A light receiving chip array is located on one side of the pad and on the circuit board;

[0019] A receiving assembly is located above the pad, and the receiving assembly includes:

[0020] A base plate, located above the pad;

[0021] A turning prism is located above the substrate,

[0022] A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; a lens assembly is located below the turning prism, and the lens assembly cover is arranged above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array;

[0023] The lower surface of the light receiving chip array is flush with the lower surface of the pad, and the upper surface of the pad is higher than the upper surface of the light receiving chip array.

[0024] In a third aspect, an embodiment of the present application discloses an optical module, including: a circuit board;

[0025] The light receiving component comprises:

[0026] A pad, located on one side of the circuit board;

[0027] A light receiving chip array is located on one side of the pad and on the circuit board;

[0028] A receiving assembly is located above the pad, and the receiving assembly includes:

[0029] A base plate, located above the pad;

[0030] A turning prism is located above the substrate,

[0031] A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; a lens assembly is located below the turning prism, and the lens assembly cover is arranged above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array;

[0032] The thickness of the pad is greater than the sum of the thicknesses of the light receiving chip array and the circuit board.

[0033] Compared with the prior art, the present invention has the following advantages:

[0034] The present application discloses a light receiving component and an optical module, wherein the light receiving component includes: a pad, a light receiving chip array and a receiving assembly. The light receiving chip array is located on one side of the pad, and the receiving assembly is located above the pad. The receiving assembly includes: a substrate, a turning prism, a spectrometer and a lens assembly. The signal light is incident on the turning prism after passing through the spectrometer, and is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array. The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate, which can avoid damage to the lens assembly by the external structure. The present application realizes the convergence of signal light through a group of lenses, which is beneficial to reducing the size of the assembly. The turning prism is separately arranged from the spectrometer, and the three-dimensional position of the turning prism can be adjusted to improve the light coupling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0036] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0037] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0038] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0039] Figure 4 is an exploded view of an optical module according to some embodiments;

[0040] Figure 5 A schematic diagram of the structure of a light receiving component, a light emitting component and a circuit board according to some embodiments;

[0041] Figure 6 is a schematic structural diagram of a light receiving component according to some embodiments;

[0042] Figure 7 is a schematic structural diagram of a light receiving component according to some embodiments;

[0043] Figure 8 is a schematic diagram of an optical path of a light receiving component according to some embodiments;

[0044] Fig. 9 A schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments Figure 1 ;

[0045] Fig.10 A schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments Figure 2 . DETAILED DESCRIPTION

[0046] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0047] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0048] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0049] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0050] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0051] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0052] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0053] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0054] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0055] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0056] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0057] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0058] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0059] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0060] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0061] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0062] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0063] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0064] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0065] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0066] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0067] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0068] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0069] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0070] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0071] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0072] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0073] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0074] Figure 5 FIG. 1 is a schematic diagram of a structure of a light receiving component, a light emitting component and a circuit board according to some embodiments. Figure 5 As shown, in some embodiments, the light emitting component 400 may be located on the side of the circuit board 300. The light receiving component 500 may be located on the surface of the circuit board 300. The light receiving component 500 may be located on the side of the circuit board 300. Figure 5 As shown, the light receiving part 500 is located on the surface of the circuit board 300 .

[0075] Figure 6 FIG. 1 is a schematic diagram of the structure of a light receiving component according to some embodiments. Figure 6 As shown, the light receiving component 500 may include a backing plate 510 .

[0076] The light receiving component 500 may include a light receiving chip array 520 . The light receiving chip array 520 is located on one side of the pad 510 .

[0077] In some embodiments, the upper surface of the light receiving chip array 520 is lower than the surface of the pad 510. In some embodiments, the light receiving chip array 520 may include a plurality of light receiving chips arranged in parallel.

[0078] The optical receiving component 500 may include a receiving assembly 530. The receiving assembly 530 may be used to convert the receiving signal light from a direction parallel to the circuit board to a direction toward the optical receiving chip array 520, so that the optical receiving chip array 520 may receive the receiving signal light and convert the optical signal into an electrical signal.

[0079] Figure 7 FIG. 1 is a schematic diagram of the structure of a light receiving component according to some embodiments. Figure 7 As shown, in some embodiments, the receiving component 530 may include: a substrate 531. The substrate 531 may be located above the backing plate 510. A portion of the substrate 531 protrudes from the outside of the backing plate 510.

[0080] In some embodiments, the surface area of ​​the substrate 531 is greater than the surface area of ​​the pad 510, so that part of the substrate 531 protrudes outside the pad 510. The light receiving chip array 520 is located below the substrate 531. The light receiving chip array 520 is located within the projection range of the substrate 531.

[0081] In some embodiments, the receiving component 530 may include: a lens component 534. The lens component 534 is disposed above the optical receiving chip array 520. The lens component 534 can be used to achieve convergence of signal light.

[0082] The lens assembly 534 may be an integral structure with the substrate 531. The lens assembly 534 may be separated from the substrate 531.

[0083] The upper surface of the lens assembly 534 is lower than the upper surface of the substrate 531 , which can prevent the external structure from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0084] The lower surface of the lens assembly 534 is higher than the lower surface of the substrate 531 , which can prevent the external structure from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0085] The lens assembly 534 and the substrate are integrated into one design, and the photosensitive surface of the light receiving chip can be captured by the CCD, thereby achieving high-precision coaxial mounting of the lens assembly 534 and the light receiving chip, and improving optical tolerance and coupling efficiency.

[0086] In some embodiments, the substrate 531 may be provided with a glue storage tank 5311. The glue storage tank 5311 may be located on the upper surface of the substrate 531, and the lens assembly 534 may be disposed in the glue storage tank 5311. The glue storage tank 5311 may be used to fill the optical glue to reduce the overflow of the optical glue.

[0087] The substrate 531 is made of transparent material so that the received signal light can pass through the substrate 531 .

[0088] In some embodiments, the receiving component 530 may include a turning prism 532. The turning prism 532 is located above the lens component 534. The projection of the turning prism 532 covers the lens component 534, so that the signal light redirected by the turning prism is incident on the lens component 534.

[0089] In some embodiments, the projection of the substrate 531 may cover the turning prism 532. That is, the edge of the substrate 531 may protrude from the edge of the turning prism 532, and the substrate 531 may protect the turning prism 532 to avoid damage to the turning prism 532 during the installation process. In some embodiments, one side edge of the turning prism 532 may be flush with the edge of the substrate 531.

[0090] The projection of the substrate covers the turning prism, the projection of the substrate covers the lens assembly, and the projection of the substrate covers the light receiving chip array.

[0091] In some embodiments, the receiving component 530 may include: a light splitter 533. The light splitter 533 is located above the substrate 531. The light splitter 533 may be used to split the received signal light from one beam into multiple beams.

[0092] The optical splitter 533 may be an AWG chip.

[0093] In some embodiments, the receiving component 530 may include: a first gasket 5351. The first gasket 5351 may be disposed between the substrate 531 and the spectroscopic device 533. The first gasket 5351 may be used to adjust the position of the spectroscopic device 533 to improve the coupling accuracy between the spectroscopic device 533 and the turning prism 532.

[0094] The receiving component 530 may include: a second gasket 5352. The second gasket 5352 may be disposed between the substrate 531 and the light splitter 533. The second gasket 5352 may be used to adjust the position of the light splitter 533 to improve the coupling accuracy between the light splitter 533 and the turning prism 532.

[0095] The spacer can increase the thickness of the glue between the substrate 531 and the optical splitter 533 to avoid cracking of the substrate or the optical splitter 533 due to stress caused by too thin glue. The size of the spacer is smaller than that of the substrate 531, and it is easy to disassemble. After disassembly, the three-dimensional coupling of the optical splitter 533 can be achieved.

[0096] In some embodiments, the thickness of the first gasket 5351 is the same as the thickness of the second gasket 5352 to facilitate coupling between the spectrometer 533 and the turning prism 532 .

[0097] The spectrometer 533 is bonded to the substrate 531 and has a large bonding area, which can effectively absorb bonding stress and avoid cracking at the bonding site.

[0098] In some embodiments of the present application, the spectrometer 533 and the turning prism 532 are separately provided, so the turning prism 532 can be adjusted in three dimensions, which can effectively absorb the patch tolerance and improve the coupling efficiency.

[0099] Figure 8 FIG. 1 is a schematic diagram of an optical path of a light receiving component according to some embodiments. Figure 8As shown, the signal light is divergent light when it enters the turning prism 532 through the optical splitter 533, and the signal light is turned through the turning prism 532. When the signal light is emitted from the turning prism 532, it is directed toward the lens assembly 534, and the lens assembly 534 converges the signal light, and the converged signal light is incident on the optical receiving chip array 520. The optical receiving chip array 520 can convert the signal light into an electrical signal.

[0100] Fig. 9 A schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments Figure 1 . Fig.10 A schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments Figure 2 .like Fig. 9 and Fig.10 As shown, the optical receiving component 500 may include: a backing plate 510 , an optical receiving chip array 520 , and a receiving assembly 530 . The optical receiving chip array 520 is located on one side of the backing plate 510 .

[0101] The receiving component 530 can be used to convert the receiving signal light from a direction parallel to the circuit board to a direction toward the optical receiving chip array 520, so that the optical receiving chip array 520 can receive the receiving signal light and convert the optical signal into an electrical signal.

[0102] The backing plate 510 and the receiving assembly 530 may be disposed above the circuit board, and the light receiving chip array 520 is located above the circuit board. Fig. 9 As shown, the pad 510 and the receiving assembly 530 are arranged above the circuit board, and when the light receiving chip array 520 is located above the circuit board, the light receiving chip array 520 is located on one side of the pad 510. The lower surface of the light receiving chip array 520 is flush with the lower surface of the pad 510, and the upper surface of the pad 510 is higher than the upper surface of the light receiving chip array 520, so that the light receiving chip array 520 does not contact the receiving assembly 530, avoiding damage to the light receiving chip array 520.

[0103] The backing plate 510 and the receiving assembly 530 may be disposed on one side of the circuit board, and the light receiving chip array 520 is located above the circuit board. Fig.10As shown, the pad 510 and the receiving component 530 are arranged on one side of the circuit board. When the light receiving chip array 520 is located above the circuit board, the light receiving chip array 520 is located on one side of the pad 510. The lower surface of the light receiving chip array 520 is lower than the lower surface of the pad 510, and the upper surface of the pad 510 is higher than the upper surface of the light receiving chip array 520, so that the light receiving chip array 520 does not contact the receiving component 530, avoiding damage to the light receiving chip array 520. That is, the thickness of the pad 510 is greater than the sum of the thickness of the light receiving chip array 520 and the circuit board 300. So that the light receiving chip array 520 does not contact the receiving component 530, avoiding damage to the light receiving chip array 520.

[0104] In the present application, a group of lenses is used to converge the signal light, which is beneficial to reducing the size of the component.

[0105] The present application provides an optical module, including: a circuit board and a light receiving component. The light receiving component 500 includes a pad 510, a light receiving chip array 520 and a receiving assembly 530. The light receiving chip array 520 is located on one side of the pad 510. The receiving assembly 530 can be used to convert the received signal light from a direction parallel to the circuit board to a direction toward the light receiving chip array 520, so that the light receiving chip array 520 can receive the received signal light and convert the optical signal into an electrical signal. Among them, the receiving assembly 530 includes: a substrate 531, a lens assembly 534, a turning prism 532 and a spectrometer 533. The turning prism 532 and the spectrometer 533 are located on the substrate 531, and the lens assembly 534 is arranged in the substrate 531.

[0106] When the signal light enters the turning prism 532 through the optical splitter 533, it is divergent light, and the signal light is turned by the turning prism 532. When the signal light is emitted from the turning prism 532, it is directed toward the lens assembly 534, and the lens assembly 534 converges the signal light, and the converged signal light is incident on the optical receiving chip array 520. The optical receiving chip array 520 can convert the signal light into an electrical signal.

[0107] The light receiving chip array 520 is located on one side of the pad 510 and is located below the substrate 531. The light receiving chip array 520 is located within the projection range of the substrate 531.

[0108] The upper surface of the lens assembly 534 is lower than the upper surface of the substrate 531 , and the lower surface of the lens assembly 534 is higher than the lower surface of the substrate 531 , which can prevent the external structure from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0109] The spectrometer 533 and the turning prism 532 are separately arranged, and the turning prism 532 can be adjusted in three dimensions, which can effectively absorb the patch tolerance and improve the coupling efficiency.

[0110] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0111] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0112] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0113] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. A light receiving component, characterized in that: include: Pads; A light receiving chip array is located on one side of the pad; A receiving assembly is located above the pad, and the receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array; The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate; The turning prism is arranged separately from the light splitting device.

2. The light receiving element according to claim 1, characterized in that The substrate comprises a glue storage tank, the glue storage tank is located on the upper surface of the substrate, and the lens assembly is arranged in the glue storage tank.

3. The light receiving element according to claim 1, characterized in that The projection of the turning prism covers the lens assembly; the projection of the lens assembly covers the light receiving chip array.

4. The light receiving element according to claim 1, characterized in that The projection of the substrate covers the turning prism, the projection of the substrate covers the lens assembly, and the projection of the substrate covers the light receiving chip array.

5. The light receiving element according to claim 1, characterized in that The receiving component comprises: A first gasket, located between the substrate and the light splitting device; A second gasket, located between the substrate and the light splitting device; The thickness of the first gasket is the same as the thickness of the second gasket.

6. An optical module, characterized in that: include: Circuit boards; A light receiving component is located above the circuit board, and the light receiving component includes: Pads; A light receiving chip array is located on one side of the pad and on the circuit board; A receiving assembly is located above the pad, and the receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array; The lower surface of the light receiving chip array is flush with the lower surface of the pad, and the upper surface of the pad is higher than the upper surface of the light receiving chip array.

7. The optical module according to claim 6, characterized in that: The substrate comprises a glue storage tank, the glue storage tank is located on the upper surface of the substrate, and the lens assembly is arranged in the glue storage tank.

8. The optical module according to claim 6, characterized in that: The projection of the turning prism covers the lens assembly; the projection of the lens assembly covers the light receiving chip array.

9. The optical module according to claim 6, characterized in that: The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate.

10. An optical module, characterized in that: include: Circuit boards; The light receiving component comprises: A pad, located on one side of the circuit board; A light receiving chip array is located on one side of the pad and on the circuit board; A receiving assembly is located above the pad, and the receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array; The thickness of the pad is greater than the sum of the thicknesses of the light receiving chip array and the circuit board.

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