Clamping support for installing computer chip

Abstract

The utility model discloses a clamping support for installing a computer chip, which comprises a computer mainboard, two fixing supports and the computer chip, the computer chip is arranged at the top of the computer mainboard through the two fixing supports, a fixing frame is arranged at the bottoms of the two fixing supports, radiating fins are arranged in the fixing frame at equal intervals, and the radiating fins are arranged in the computer mainboard. The fixing support comprises a mounting top frame and a mounting bottom frame, and the cooling fins comprise first-stage cooling fins, second-stage cooling fins and third-stage cooling fins. According to the device, through the arrangement of the fixing support and the fixing frame, a computer chip can be better mounted and dismounted, the convenience during maintenance of the computer chip is improved, through the arrangement of the heat dissipation fins and the heat dissipation grooves, the heat dissipation fins are designed to be of a three-section type V-shaped structure, the heat dissipation area of the heat dissipation fins is increased, and the heat dissipation efficiency of the computer chip is improved. Therefore, heat generated by the computer chip can be discharged, and the heat dissipation performance of the computer chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer chips, in particular to a clamping bracket for installing computer chips. Background Art

[0002] A computer chip is a thin sheet made of silicon. A chip is composed of hundreds of microcircuits connected together. It is small in size and is covered with microcircuits that generate pulse current. The circuits inside a computer chip are very small and the current it uses is also very small, so the chip is also called a microelectronic device.

[0003] Existing computer chips have the following defects:

[0004] Existing computer chips are usually fixed on the computer motherboard by welding, which makes it inconvenient to disassemble and assemble the computer chips. At the same time, when the computer chips work for a long time, if the heat generated by them cannot be dissipated in time and effectively, the computer chips are prone to have certain effects on the microcircuit when the temperature is too high, making the computer chips unable to work normally and unable to meet the needs of users. Therefore, a solution is needed. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies of the prior art, the utility model provides a clamping bracket for installing a computer chip to solve the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above purpose, the utility model is implemented through the following technical solutions: a card bracket for installing a computer chip, comprising a computer motherboard, a fixing bracket and a computer chip, wherein the computer chip is arranged on the top of the computer motherboard through two fixing brackets, a fixing frame is arranged at the bottom of the two fixing brackets, and heat dissipation fins are arranged equidistantly in the fixing frame;

[0009] The fixing bracket comprises a mounting top frame and a mounting bottom frame, wherein the mounting bottom frame is arranged at two ends of the bottom of the mounting top frame, and both ends of the bottom of the mounting top frame are provided with a first mounting groove, and both ends of the top of the mounting bottom frame are provided with a second mounting groove, and a movable rod is arranged between the first mounting groove and the second mounting groove, and both ends of the surface of the movable rod are sleeved with compression springs;

[0010] The heat dissipation fins include a primary heat dissipation fin, a secondary heat dissipation fin and a tertiary heat dissipation fin, wherein the primary heat dissipation fin and the tertiary heat dissipation fin are symmetrically arranged at both ends of the secondary heat dissipation fin, and the primary heat dissipation fin, the secondary heat dissipation fin and the tertiary heat dissipation fin are all in a V-shaped structure, and the surfaces of the primary heat dissipation fin and the tertiary heat dissipation fin are provided with V-shaped heat dissipation grooves, and the surface of the secondary heat dissipation fin is provided with a cross-shaped heat dissipation groove, and the primary heat dissipation fin, the secondary heat dissipation fin and the tertiary heat dissipation fin are in a smooth transition and integrally formed structure.

[0011] Preferably, a protective pad is provided at the bottom of the fixing frame, and the protective pad is made of rubber material.

[0012] Preferably, the inner side wall of the mounting base is provided with reinforcing ribs, and the reinforcing ribs are in a triangular structure.

[0013] (III) Beneficial effects

[0014] The utility model provides a card-joint bracket for installing a computer chip, which has the following beneficial effects:

[0015] The clamping bracket for installing a computer chip facilitates better installation and removal of the computer chip by arranging a fixed bracket and a fixed frame, thereby improving the convenience of computer chip maintenance. The heat dissipation area of ​​the heat dissipation fins is increased by arranging heat dissipation fins and heat dissipation grooves, and designing the heat dissipation fins into a three-stage V-shaped structure, thereby being able to discharge the heat generated by the computer chip and improving the heat dissipation performance of the computer chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the fixing bracket of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the fixing frame and the heat dissipation fins of the utility model;

[0019] Figure 4 It is a schematic structural diagram of the heat dissipation fin plane of the utility model.

[0020] In the figure, 1. computer motherboard; 2. computer chip; 3. fixing bracket; 31. mounting top frame; 32. mounting bottom frame; 33. first mounting slot; 34. second mounting slot; 35. movable rod; 36. compression spring; 37. reinforcing rib; 4. fixing frame; 5. heat sink fin; 51. primary heat sink; 52. secondary heat sink; 53. tertiary heat sink; 54. V-shaped heat sink; 55. cross-shaped heat sink; 6. protective pad. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The embodiment of the utility model provides a technical solution: a card bracket for installing a computer chip, comprising a computer motherboard 1, a fixing bracket 3 and a computer chip 2, the computer chip 2 is arranged on the top of the computer motherboard 1 through two fixing brackets 3, a fixing frame 4 is arranged at the bottom of the two fixing brackets 3, and heat dissipation fins 5 are equidistantly arranged in the fixing frame 4.

[0023] Furthermore, the fixed bracket 3 includes an installation top frame 31 and an installation bottom frame 32. The installation bottom frame 32 is arranged at the two ends of the bottom of the installation top frame 31. The two ends of the bottom of the installation top frame 31 are both provided with a first installation groove 33, and the two ends of the top of the installation bottom frame 32 are both provided with a second installation groove 34. A movable rod 35 is arranged between the first installation groove 33 and the second installation groove 34. Compression springs 36 are sleeved at both ends of the surface of the movable rod 35. The computer chip 2 is installed and removed through the fixed bracket 3.

[0024] The core of the heat sink 5 includes a primary heat sink 51, a secondary heat sink 52 and a tertiary heat sink 53. The primary heat sink 51 and the tertiary heat sink 53 are symmetrically arranged at both ends of the secondary heat sink 52. The primary heat sink 51, the secondary heat sink 52 and the tertiary heat sink 53 are all in a V-shaped structure. V-shaped heat sink grooves 54 are provided on the surfaces of the primary heat sink 51 and the tertiary heat sink 53. Cross-shaped heat sink grooves 55 are provided on the surface of the secondary heat sink 52. The primary heat sink 51, the secondary heat sink 52 and the tertiary heat sink 53 are in a smooth transition and integrally formed structure. The core of this part is to improve the structure of the heat sink fin 5 body by design, and design the heat sink fin 5 body into a three-stage V-shaped structure, thereby increasing the heat dissipation area of ​​the heat sink fin 5, and then being able to discharge the heat generated by the computer chip 2, thereby improving the heat dissipation performance of the computer chip 2.

[0025] Furthermore, a protective pad 6 is provided at the bottom of the fixing frame 4 . The protective pad 6 is made of rubber. The protective pad 6 is provided to prevent the computer chip 2 from being crushed by the fixing frame 4 .

[0026] Furthermore, the inner side wall of the mounting base 32 is provided with reinforcing ribs 37 , which are in a triangular structure. The provision of the reinforcing ribs 37 serves to reinforce the mounting base 32 .

[0027] Working principle: When in use, the staff first places the computer chip 2 on the top of the computer motherboard 1, and then fixes the fixing bracket 3 to the computer motherboard 1 by bolts, thereby completing the installation and fixation of the computer chip 2. The operation is simple and convenient. The heat dissipation fins 5 are set, and the heat dissipation fins 5 are designed into a three-stage V-shaped structure, thereby increasing the heat dissipation area of ​​the heat dissipation fins 5, and then being able to discharge the heat generated by the computer chip 2, thereby improving the heat dissipation performance of the computer chip 2.

[0028] The components of the utility model include 1. computer mainboard; 2. computer chip; 3. fixing bracket; 31. mounting top frame; 32. mounting bottom frame; 33. first mounting slot; 34. second mounting slot; 35. movable rod; 36. compression spring; 37. reinforcing rib; 4. fixing frame; 5. heat dissipation fin; 51. primary heat dissipation fin; 52. secondary heat dissipation fin; 53. tertiary heat dissipation fin; 54. V-shaped heat dissipation groove; 55. cross-shaped heat dissipation groove; 6. protective pad, and all the components are universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0029] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0030] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A card bracket for mounting a computer chip, characterized in that: The invention comprises a computer mainboard (1), a fixing bracket (3) and a computer chip (2), wherein the computer chip (2) is arranged on the top of the computer mainboard (1) via two fixing brackets (3), a fixing frame (4) is arranged at the bottom of the two fixing brackets (3), and heat dissipation fins (5) are arranged at equal intervals in the fixing frame (4); The fixed bracket (3) comprises a mounting top frame (31) and a mounting bottom frame (32), wherein the mounting bottom frame (32) is arranged at two ends of the bottom of the mounting top frame (31), and first mounting grooves (33) are provided at both ends of the bottom of the mounting top frame (31), and second mounting grooves (34) are provided at both ends of the top of the mounting bottom frame (32), and a movable rod (35) is arranged between the first mounting groove (33) and the second mounting groove (34), and compression springs (36) are sleeved at both ends of the surface of the movable rod (35); The heat dissipation fins (5) comprise a primary heat dissipation fin (51), a secondary heat dissipation fin (52) and a tertiary heat dissipation fin (53); the primary heat dissipation fin (51) and the tertiary heat dissipation fin (53) are symmetrically arranged at two ends of the secondary heat dissipation fin (52); the primary heat dissipation fin (51), the secondary heat dissipation fin (52) and the tertiary heat dissipation fin (53) are all in a V-shaped structure; the surfaces of the primary heat dissipation fin (51) and the tertiary heat dissipation fin (53) are provided with V-shaped heat dissipation grooves (54); the surfaces of the secondary heat dissipation fin (52) are provided with cross-shaped heat dissipation grooves (55); the primary heat dissipation fin (51), the secondary heat dissipation fin (52) and the tertiary heat dissipation fin (53) are in a smooth transition and integrally formed structure.

2. A card-joint bracket for mounting a computer chip according to claim 1, characterized in that: A protective pad (6) is provided at the bottom of the fixing frame (4), and the protective pad (6) is made of rubber material.

3. A card bracket for mounting a computer chip according to claim 1, characterized in that: The inner side wall of the mounting base (32) is provided with a reinforcing rib (37), and the reinforcing rib (37) is in a triangular structure.

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