BMS circuit board installation structure

Abstract

The utility model provides a BMS circuit board installation structure including an installation mechanism, an adjusting mechanism and a heat dissipation mechanism, the adjusting mechanism includes a second guide rail, a third guide rod, an extrusion plate, an extrusion spring, a first sliding rod, a first threaded push rod and a first fixing plate, the interior of the second guide rail is fixedly connected to the two ends of the third guide rod, and the second guide rail is fixedly connected to the two ends of the third guide rod. A sliding plate slides along a first guide rail, the sliding plate is pushed to slide along a second guide rod, an adjusting spring is extruded, a BMS circuit board needing to be installed is placed between a limiting frame and an extrusion frame, and then the height between the first guide rod and an installation plate is adjusted according to the length of the BMS circuit board; and the BMS circuit board is placed in by adjusting the distance between the two extrusion plates, the BMS circuit board is clamped through the extrusion springs, clamping and positioning of the BMS circuit board are facilitated, the BMS circuit board can be rapidly fixed and adjusted through adjustment of the adjusting mechanism, and rapid installation and fixation of the BMS circuit board are facilitated.

Description

Technical Field

[0001] The utility model relates to a BMS circuit board, in particular to a BMS circuit board installation structure, belonging to the technical field of BMS circuit boards. Background Art

[0002] For electric vehicles, the battery pack is the power source of the entire vehicle, and the battery management system directly affects the management and control of the battery. A good BMS system can manage the battery more efficiently and better ensure the stability and safety of the battery. The BMS slave board carries important modules for cell voltage, module temperature collection and balancing functions, and needs to collect and control basic parameters of hundreds or even thousands of cells. Therefore, the realization of the slave board sleep function plays a vital role in maintaining the consistency of the cells in the module and the modules in the entire pack.

[0003] According to the description of a disclosed BMS control panel and its quick-installation mechanism (authorization announcement number: CN216563411U), "a BMS control panel and its quick-installation mechanism include a mounting plate, a fixing mechanism include a fixing column, the bottom end of the fixing column penetrates the mounting plate and is fixedly connected to the inner wall of the mounting plate, a spring 1 is fixedly installed on the top of the inner cavity of the fixing column, and a limiting mechanism is fixedly installed on the bottom of the spring 1; the BMS control panel and its quick-installation mechanism realize the retraction of the abutting rotating block in the fixing mechanism into the fixing column by pulling the driving mechanism, and then connect with the fixing column through the positioning plate, so as to realize the initial fixed positioning of the BMS control panel; after releasing the driving mechanism, the elastic reset mechanism cooperates with the driving mechanism to drive the fixing mechanism to reset, so as to further realize the extension of the abutting rotating block out of the fixing column and further limit and fix the part of the BMS control panel close to the fixing column, thereby realizing the installation and fixation of the BMS control panel, reducing the difficulty and complexity of the installation".

[0004] The existing BMS circuit board installation affects its heat dissipation due to the over-dense installation, and it is not convenient to quickly adjust and position the BMS circuit board according to the size of the BMS circuit board, resulting in overly complicated installation. Therefore, a BMS circuit board installation structure is proposed. Utility Model Content

[0005] In view of this, the utility model provides a BMS circuit board installation structure to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0006] The technical solution of the embodiment of the utility model is implemented as follows: a BMS circuit board installation structure, including an installation mechanism, an adjustment mechanism and a heat dissipation mechanism, the adjustment mechanism includes a second guide rail, a third guide rod, an extrusion plate, an extrusion spring, a first slide rod, a first threaded push rod and a first fixed plate, the second guide rail is fixedly connected to the two ends of the third guide rod, the outer wall of the third guide rod is slidably connected to the inner side wall of the extrusion plate, the outer wall of the extrusion plate is fixedly connected to the two ends of the extrusion spring between the inner side of the second guide rail, the bottom end of the first slide rod is fixedly connected to the top end of the first fixed plate, and the middle part of the first fixed plate is rotatably connected to the middle part of the first threaded push rod;

[0007] The heat dissipation mechanism includes a fixing frame, a heat dissipation aluminum plate and a heat absorbing pad. The outer wall of the fixing frame is fixedly connected to the top of the heat absorbing pad. The top of the heat absorbing pad and the top of the fixing frame are respectively fixedly connected to the bottom of the heat dissipation aluminum plate.

[0008] Further preferably, the heat dissipation mechanism also includes a limit frame, a second fixed plate, a second threaded push rod, a second slide rod and a cooling fan, the top end of the limit frame is slidably connected to the outer wall of the second slide rod, the bottom end of the second slide rod is fixedly connected to the top end of the second fixed plate, and the middle part of the second fixed plate is rotatably connected to the bottom end of the second threaded push rod.

[0009] Further preferably, the mounting mechanism includes a mounting plate, a first guide rail, a connecting plate, a limiting groove, a first guide rod, an extrusion frame, a second guide rod, a slide plate and an adjusting spring, the inner part of the mounting plate is slidably connected to the outer wall of the first guide rod, one end of the first guide rod is fixedly connected to the extrusion frame, the outer wall of the extrusion frame is fixedly connected to the outer wall of the cooling fan, the outer wall of the cooling fan is through-connected to the outer wall of the extrusion frame, the top end of the extrusion frame is slidably connected to the outer wall of the first sliding rod, and the middle part of the extrusion frame is threadedly connected to the outer wall of the first threaded push rod.

[0010] Further preferably, the outer wall of the extrusion frame and the outer wall of the mounting plate are respectively fixedly connected to the outer wall of the connecting plate, and limiting grooves are respectively provided on both sides of the outer wall of the mounting plate, and the outer walls of the limiting grooves are fixedly connected to the outer wall of the fixing frame by bolts.

[0011] Further preferably, the outer wall of the mounting plate is provided with a first guide rail, the outer wall of the first guide rail is fixedly connected to the two ends of the second guide rod, the outer wall of the second guide rod is slidably connected to the outer wall of the slide plate, and the bottom end of the slide plate and the inner side of the first guide rail are fixedly connected to the two ends of the adjusting spring.

[0012] Further preferably, the top end of the slide plate is fixedly connected to the bottom end of the limiting frame.

[0013] The utility model embodiment adopts the above technical solution, which has the following advantages:

[0014] 1. By sliding the slide plate along the first guide rail, pushing the slide plate to slide along the second guide rod, and squeezing the adjustment spring, the BMS circuit board to be installed is placed between the limit frame and the squeezing frame, and then the height between the first guide rod and the mounting plate is adjusted according to the length of the BMS circuit board, and the BMS circuit board is placed by adjusting the distance between the two squeezing plates, and the BMS circuit board is clamped by squeezing the spring, which is convenient for clamping and positioning the BMS circuit board. The BMS circuit board can be quickly fixed and adjusted by adjusting the adjustment mechanism, which is convenient for quickly installing and fixing the BMS circuit board;

[0015] Second, by fixing the fixing frame to the top of the mounting plate along the bolts, by arranging a heat-absorbing pad and a heat-dissipating aluminum plate on the top of the mounting plate, and by starting the heat-dissipating fan fixed on the surface of the limiting frame to dissipate heat toward the heat-dissipating aluminum plate, it is convenient to dissipate heat for the BMS circuit board and prevent the BMS circuit board from being fixed too densely, which may affect the heat dissipation of the BMS circuit board.

[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is the overall structure diagram of the utility model;

[0019] Figure 2 This is the overall rear view structure diagram of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the mounting plate of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the extrusion frame of the utility model;

[0022] Figure 5 This is a schematic diagram of the limit frame structure of the utility model;

[0023] Figure 6The utility model is a schematic diagram of the fixing frame structure.

[0024] 1. Mounting mechanism; 101. Mounting plate; 102. First guide rail; 103. Connecting plate; 104. Limiting groove; 105. First guide rod; 106. Extrusion frame; 107. Second guide rod; 108. Slide plate; 109. Adjusting spring; 2. Adjusting mechanism; 201. Second guide rail; 202. Third guide rod; 203. Extrusion plate; 204. Extrusion spring; 205. First slide bar; 206. First threaded push rod; 207. First fixed plate; 3. Heat dissipation mechanism; 301. Limiting frame; 302. Second fixed plate; 303. Second threaded push rod; 304. Second slide bar; 305. Fixed frame; 306. Heat dissipation aluminum plate; 307. Heat absorbing pad; 308. Heat dissipation fan. DETAILED DESCRIPTION

[0025] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0026] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0027] Example

[0028] like Figure 1-Figure 6 As shown, the embodiment of the utility model provides a BMS circuit board installation structure, including an installation mechanism 1, an adjustment mechanism 2 and a heat dissipation mechanism 3, the adjustment mechanism 2 includes a second guide rail 201, a third guide rod 202, an extrusion plate 203, an extrusion spring 204, a first slide bar 205, a first threaded push rod 206 and a first fixed plate 207, the second guide rail 201 is internally fixedly connected to the two ends of the third guide rod 202, the outer wall of the third guide rod 202 is slidably connected to the inner side wall of the extrusion plate 203, and the outer wall of the extrusion plate 203 and the inner side of the second guide rail 201 are respectively The first slide bar 205 is fixedly connected to both ends of the extrusion spring 204, and the bottom end of the first slide bar 205 is fixedly connected to the top end of the first fixed plate 207. The middle part of the first fixed plate 207 is rotatably connected to the middle part of the first threaded push rod 206. The BMS circuit board is placed by adjusting the distance between the two extrusion plates 203, and the BMS circuit board is clamped by the extrusion spring 204, so as to facilitate the clamping and positioning of the BMS circuit board. The first threaded push rod 206 and the second threaded rod are rotated to push the first fixed plate 207 and the second fixed plate 302 downward respectively, so as to facilitate the clamping and fixing of the BMS circuit board.

[0029] The heat dissipation mechanism 3 includes a fixing frame 305, a heat dissipation aluminum plate 306 and a heat absorbing pad 307. The outer wall of the fixing frame 305 is fixedly connected to the top of the heat absorbing pad 307. The top of the heat absorbing pad 307 and the top of the fixing frame 305 are respectively fixedly connected to the bottom of the heat dissipation aluminum plate 306. By fixing the fixing frame 305 to the top of the mounting plate 101 along bolts, by arranging the heat absorbing pad 307 and the heat dissipation aluminum plate 306 at the top of the mounting plate 101, by starting the heat dissipation fan 308 fixed on the surface of the limiting frame 301, heat is dissipated toward the heat dissipation aluminum plate 306, so as to facilitate the heat dissipation of the BMS circuit board, prevent the BMS circuit board from being fixed too densely, resulting in the heat dissipation of the BMS circuit board being affected, and the BMS circuit board can be quickly fixed and adjusted by adjusting the adjustment mechanism 2, so as to facilitate the rapid installation and fixing of the BMS circuit board.

[0030] In one embodiment, specifically, the heat dissipation mechanism 3 also includes a limit frame 301, a second fixed plate 302, a second threaded push rod 303, a second slide rod 304 and a cooling fan 308. The top end of the limit frame 301 is slidably connected to the outer wall of the second slide rod 304, the bottom end of the second slide rod 304 is fixedly connected to the top end of the second fixed plate 302, and the middle part of the second fixed plate 302 is rotatably connected to the bottom end of the second threaded push rod 303. The first threaded push rod 206 and the second threaded rod are respectively pushed downward to facilitate clamping and fixing the BMS circuit board.

[0031] In one embodiment, specifically, the mounting mechanism 1 includes a mounting plate 101, a first guide rail 102, a connecting plate 103, a limiting groove 104, a first guide rod 105, an extrusion frame 106, a second guide rod 107, a slide plate 108 and an adjusting spring 109, the inner portion of the mounting plate 101 is slidably connected to the outer wall of the first guide rod 105, one end of the first guide rod 105 is fixedly connected to the extrusion frame 106, the outer wall of the extrusion frame 106 is fixedly connected to the outer wall of the cooling fan 308, the outer wall of the cooling fan 308 is through-connected to the outer wall of the extrusion frame 106, the top end of the extrusion frame 106 is slidably connected to the outer wall of the first slide rod 205, and the middle part of the extrusion frame 106 is threadedly connected to the outer wall of the first threaded push rod 206.

[0032] In one embodiment, specifically, the outer wall of the extrusion frame 106 and the outer wall of the mounting plate 101 are respectively fixedly connected to the outer wall of the connecting plate 103, and limiting grooves 104 are respectively opened on both sides of the outer wall of the mounting plate 101. The outer wall of the limiting groove 104 is fixedly connected to the outer wall of the fixing frame 305 by bolts, so as to facilitate the rapid installation of the extrusion frame 106 and fix the connecting plate 103 inside the car.

[0033] In one embodiment, specifically, the outer wall of the mounting plate 101 is provided with a first guide rail 102, the outer wall of the first guide rail 102 is fixedly connected to the two ends of the second guide rod 107, the outer wall of the second guide rod 107 is slidably connected to the outer wall of the slide plate 108, and the bottom end of the slide plate 108 and the inner side of the first guide rail 102 are fixedly connected to the two ends of the adjusting spring 109. By sliding the slide plate 108 along the first guide rail 102, pushing the slide plate 108 to slide along the second guide rod 107, and squeezing the adjusting spring 109, the BMS circuit board to be installed is placed between the limit frame 301 and the extrusion frame 106, and then the height between the first guide rod 105 and the mounting plate 101 is adjusted according to the length of the BMS circuit board.

[0034] In one embodiment, specifically, the top end of the slide plate 108 is fixedly connected to the bottom end of the limiting frame 301 .

[0035] When the utility model is working, the slide plate 108 is slid along the first guide rail 102, and the slide plate 108 is pushed to slide along the second guide rod 107, and the spring 109 is squeezed and adjusted, and the BMS circuit board to be installed is placed between the limit frame 301 and the squeeze frame 106, and then the height between the first guide rod 105 and the mounting plate 101 is adjusted according to the length of the BMS circuit board, and the BMS circuit board is placed by adjusting the distance between the two squeeze plates 203, and the BMS circuit board is clamped by squeezing the spring 204, so as to facilitate the clamping and positioning of the BMS circuit board, and the first fixed rod 206 and the second threaded rod are respectively pushed by rotating the first threaded push rod 206 and the second threaded rod The plate 207 and the second fixing plate 302 move downward to facilitate clamping and fixing the BMS circuit board. The fixing frame 305 is fixed to the top of the mounting plate 101 along the bolts. A heat absorbing pad 307 and a heat dissipation aluminum plate 306 are provided on the top of the mounting plate 101. The heat dissipation fan 308 fixed on the surface of the limiting frame 301 is started to dissipate heat toward the heat dissipation aluminum plate 306, which facilitates the heat dissipation of the BMS circuit board and prevents the BMS circuit board from being fixed too densely, resulting in the heat dissipation of the BMS circuit board being affected. The BMS circuit board can be quickly fixed and adjusted by adjusting the adjustment mechanism 2, which facilitates the rapid installation and fixing of the BMS circuit board.

[0036] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A BMS circuit board mounting structure, comprising a mounting mechanism (1), an adjustment mechanism (2) and a heat dissipation mechanism (3), characterized in that: The adjusting mechanism (2) comprises a second guide rail (201), a third guide rod (202), an extrusion plate (203), an extrusion spring (204), a first slide rod (205), a first threaded push rod (206) and a first fixed plate (207); the second guide rail (201) is internally fixedly connected to two ends of the third guide rod (202); the outer wall of the third guide rod (202) is slidably connected to the inner wall of the extrusion plate (203); the outer wall of the extrusion plate (203) is respectively fixedly connected to two ends of the extrusion spring (204) between the inner side of the second guide rail (201); the bottom end of the first slide rod (205) is fixedly connected to the top end of the first fixed plate (207); the middle part of the first fixed plate (207) is rotatably connected to the middle part of the first threaded push rod (206); The heat dissipation mechanism (3) comprises a fixing frame (305), a heat dissipation aluminum plate (306) and a heat absorption pad (307); the outer wall of the fixing frame (305) is fixedly connected to the top of the heat absorption pad (307); the top of the heat absorption pad (307) and the top of the fixing frame (305) are respectively fixedly connected to the bottom of the heat dissipation aluminum plate (306).

2. A BMS circuit board mounting structure according to claim 1, characterized in that: The heat dissipation mechanism (3) also includes a limiting frame (301), a second fixed plate (302), a second threaded push rod (303), a second sliding rod (304) and a heat dissipation fan (308), wherein the top end of the limiting frame (301) is slidably connected to the outer wall of the second sliding rod (304), the bottom end of the second sliding rod (304) is fixedly connected to the top end of the second fixed plate (302), and the middle part of the second fixed plate (302) is rotatably connected to the bottom end of the second threaded push rod (303).

3. A BMS circuit board mounting structure according to claim 1, characterized in that: The mounting mechanism (1) comprises a mounting plate (101), a first guide rail (102), a connecting plate (103), a limiting groove (104), a first guide rod (105), an extrusion frame (106), a second guide rod (107), a slide plate (108) and an adjusting spring (109); the interior of the mounting plate (101) is slidably connected to the outer wall of the first guide rod (105); one end of the first guide rod (105) is fixedly connected to the extrusion frame (106); the outer wall of the extrusion frame (106) is fixedly connected to the outer wall of the cooling fan (308); the outer wall of the cooling fan (308) is through-connected to the outer wall of the extrusion frame (106); the top end of the extrusion frame (106) is slidably connected to the outer wall of the first sliding rod (205); the middle part of the extrusion frame (106) is threadedly connected to the outer wall of the first threaded push rod (206).

4. A BMS circuit board mounting structure according to claim 3, characterized in that: The outer wall of the extrusion frame (106) and the outer wall of the mounting plate (101) are respectively fixedly connected to the outer wall of the connecting plate (103); limiting grooves (104) are respectively provided on both sides of the outer wall of the mounting plate (101); and the outer walls of the limiting grooves (104) are fixedly connected to the outer wall of the fixing frame (305) by bolts.

5. A BMS circuit board mounting structure according to claim 3, characterized in that: The outer wall of the mounting plate (101) is provided with a first guide rail (102), the outer wall of the first guide rail (102) is fixedly connected to the two ends of a second guide rod (107), the outer wall of the second guide rod (107) is slidably connected to the outer wall of a slide plate (108), and the bottom end of the slide plate (108) and the inner side of the first guide rail (102) are fixedly connected to the two ends of an adjustment spring (109).

6. A BMS circuit board mounting structure according to claim 3, characterized in that: The top end of the slide plate (108) is fixedly connected to the bottom end of the limiting frame (301).

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