Heat dissipation device, single board and communication equipment
By designing a heat dissipation device containing a fin set, the problem of the heat dissipation device occupying the upper space of the veneer is solved, and efficient heat dissipation and cost reduction are achieved.
Patent Information
- Application Number
- CN202420080581.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-12
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-01-12
AI Technical Summary
In the prior art, the heat dissipation device occupies the layout space of the upper part of the veneer, affecting the layout of the veneer and the heat dissipation design of the chip. Especially in a highly restricted veneer environment, it is difficult to achieve efficient heat dissipation.
A heat dissipation device is designed, including a first substrate and a first heat dissipation module. The first heat dissipation module is composed of a first fin set and a second fin set, and the fin sets are arranged at intervals on the first plate surface to form an accommodating space. , place the device to be heat dissipated, thereby reducing the space occupied by the heat dissipation device and improving the heat dissipation efficiency.
This design reduces the space occupied by the heat dissipation device on the upper part of the board, improves the heat dissipation efficiency of the device to be heat dissipated, reduces equipment costs, and avoids the need for custom optical module housing and heat transfer using heat pipes.
Smart Images
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Abstract
Description
Technical Field
[0001] The present application belongs to the field of communication technology, and specifically relates to a heat dissipation device, a single board and communication equipment. Background Art
[0002] At present, in the communications industry, with the popularization of 5G, the optical module rate requirements are getting higher and higher, and at the same time, the demand for miniaturization of equipment is becoming more and more obvious. Therefore, the heat dissipation of high-speed and long-distance optical modules in a limited space has become a bottleneck in many product designs. The general solution is to customize the size of the optical module shell and increase the upper space. In addition, due to the high power consumption of the optical module, it is necessary to use a heat pipe to import the heat to the back of the single board for heat dissipation.
[0003] However, the above solution occupies most of the layout space on the upper part of the single board, thereby affecting the heat dissipation and design of the chip on the upper part of the single board, making the layout of the single board more difficult. Utility Model Content
[0004] The purpose of the embodiments of the present application is to provide a heat dissipation device, a single board and a communication device, which can solve the problem that the current heat dissipation method occupies the upper layout space of the single board.
[0005] In order to solve the above technical problems, this application is implemented as follows:
[0006] The embodiment of the present application provides a heat dissipation device, comprising: a first substrate and a first heat dissipation module;
[0007] The first substrate comprises a first panel surface;
[0008] The first heat dissipation module comprises a first fin group and a second fin group, the first fin group and the second fin group are respectively arranged on the first plate surface and spaced apart in a first direction, and the first direction is perpendicular to the normal direction of the first plate surface;
[0009] An accommodation space for placing a device to be cooled is formed between the first plate surface, the first fin group and the second fin group.
[0010] The embodiment of the present application redesigns the heat dissipation device so that the heat dissipation device can be formed with a accommodating space, and at least a portion of the device to be cooled can be located in the accommodating space. On the one hand, the layout space on the upper part of the single board occupied by the heat dissipation device can be reduced, and on the other hand, it can also play a cooling role on both sides of the device to be cooled, thereby solving the problem of efficient heat dissipation in the case of a single board with limited height; and, since the upper occupied space is reduced, there is no need to customize the optical module housing, and there is no need to use heat pipes for heat transfer, thereby reducing the equipment cost while ensuring the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a front view of a single board in the related art;
[0012] Figure 2 It is a front view of a single board in the related art;
[0013] Figure 3 A front view of a single board disclosed in an embodiment of the present application;
[0014] Figure 4 A front view of a single board disclosed in an embodiment of the present application;
[0015] Figure 5 It is a front view of a single board without side panels disclosed in an embodiment of the present application;
[0016] Figure 6 A first structural diagram of a heat dissipation device disclosed in an embodiment of the present application;
[0017] Figure 7 A second structural diagram of the heat dissipation device disclosed in an embodiment of the present application;
[0018] Figure 8 This is a third structural diagram of the heat dissipation device disclosed in an embodiment of the present application.
[0019] Description of reference numerals:
[0020] 01- single board; 02- heat pipe radiator; 03- optical module;
[0021] 10- heat dissipation device;
[0022] 100 - first substrate; 110 - first board surface; 120 - second board surface;
[0023] 200 - first heat dissipation module; 210 - first fin group; 211 - first fin; 220 - second fin group;
[0024] 300 - second heat dissipation module; 311 - second fin;
[0025] 400 - third heat dissipation module; 411 - third fin;
[0026] 20- second substrate; 201- third board surface;
[0027] 30-device to be cooled;
[0028] 40-side plate; 401-avoidance slot; 402-air hole;
[0029] M-accommodation space. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0031] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.
[0032] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.
[0033] The single board in the related technology is as follows Figure 1 and Figure 2 As shown, the space requirement is increased by changing the size of the optical module housing through customization, and a heat pipe radiator 02 is used for heat transfer, and the heat on the optical module 03 is transferred to the single board 01 through the heat pipe radiator 02 for heat dissipation. However, the heat pipe radiator 02 is located above the optical module, thereby occupying the upper space of the single board 01, affecting the upper layout space of the single board 01.
[0034] Based on the above situation, the embodiment of the present application discloses a heat dissipation device 10, which is used to dissipate heat from a device 30 to be dissipated, so as to ensure that the temperature of the device 30 to be dissipated is not too high and to ensure its normal operation. Exemplarily, the device 30 to be dissipated can be a communication device, such as an optical module, etc. Of course, it can also be other devices, which are not specifically limited here. Figures 3 to 8 The disclosed heat dissipation device 10 includes a first substrate 100 and a first heat dissipation module 200 .
[0035] The first substrate 100 is a basic installation component, which can provide an installation foundation for components such as the first heat dissipation module 200. Specifically, the first substrate 100 includes a first board surface 110, which is arranged facing the device to be cooled 30, and the first heat dissipation module 200 can be arranged on the first board surface 110 to dissipate heat from the device to be cooled 30.
[0036] refer to Figure 7The first heat dissipation module 200 includes a first fin group 210 and a second fin group 220, and the first fin group 210 and the second fin group 220 are respectively arranged on the first board surface 110 and spaced apart in a first direction, wherein the first direction is perpendicular to the normal direction of the first board surface 110. Exemplarily, the first substrate 100 may be a polygonal plate, such as a rectangular plate, a square plate, etc., and the first direction may be parallel to the extension direction of the side length of the polygonal plate.
[0037] Based on the above arrangement, an accommodating space M can be enclosed between the first plate surface 110, the first fin group 210 and the second fin group 220, and the accommodating space M is used to place the device 30 to be cooled. In this way, the first fin group 210 and the second fin group 220 can be located around the device 30 to be cooled, thereby increasing the area for heat transfer between the device 30 to be cooled and improving the cooling efficiency, and reducing the upper space occupied by the device 30 to be cooled.
[0038] The embodiment of the present application redesigns the heat dissipation device 10 so that the heat dissipation device 10 can be formed with a accommodating space M, and at least a portion of the device 30 to be cooled can be located in the accommodating space M. On the one hand, the layout space on the upper part of the single board occupied by the heat dissipation device 10 can be reduced, and the heat dissipation on both sides of the device 30 to be cooled can be played, thereby solving the problem of efficient heat dissipation in the case of a single board with limited height; and, since the upper occupied space is reduced, there is no need to customize the optical module housing, and there is no need to use a heat pipe for heat transfer, thereby reducing the equipment cost while ensuring the heat dissipation effect.
[0039] Continue to refer Figure 7 In some embodiments, the first fin group 210 and the second fin group 220 each include at least one first fin 211 extending along a second direction, wherein the second direction is perpendicular to the first direction and the normal direction of the first plate surface 110 .
[0040] For example, when the first substrate 100 is a rectangular plate, the first direction may be a width direction of the rectangular plate, and the second direction may be a length direction of the rectangular plate.
[0041] Optionally, the first fin 211 may be a long piece, and its specific size may be designed according to the external dimensions of the heat dissipation device 30 to be cooled, so as to increase the heat transfer area and thus improve the heat dissipation efficiency. In addition, the first fin 211 may be fixed to the first plate surface 110 by welding to ensure the firmness and stability of the connection. Exemplarily, the height of the first fin 211 on the first plate surface 110 may be 7.8 mm, the distance between two adjacent first fins 211 may be 2.0 mm, and the thickness of each first fin 211 may be 0.2 mm.
[0042] When the first fin group 210 includes multiple first fins 211, the multiple first fins 211 are arranged in the first direction, and there is a gap between two adjacent first fins 211. Thus, an air flow channel is jointly formed between the two adjacent first fins 211 and the first plate surface 110. The gas can flow along the air flow channel and take away the heat on the first fins 211, thereby achieving a heat dissipation effect on the first fins 211, so that the heat dissipation device 30 can transfer more heat to the first fins 211.
[0043] Similarly, the second fin group 220 may also include a plurality of first fins 211 to improve the heat dissipation effect.
[0044] In a more specific embodiment, the first fin group 210 and the second fin group 220 each include the same number of first fins 211, and are symmetrically arranged in the first direction, that is, in the first direction, the number and arrangement of the first fins 211 located on both sides of the accommodating space M are the same, so that the heat dissipation effect on both sides of the heat dissipation device 30 is basically consistent, thereby effectively alleviating the problem of local high temperature caused by poor local heat dissipation of the heat dissipation device 30.
[0045] Exemplarily, the first fin group 210 may include four first fins 211 , and the second fin group 220 may include four first fins 211 . Of course, each may also include other numbers of first fins 211 , which is not specifically limited here.
[0046] In addition, the first fin 211 in the first fin group 210 that is closest to the device 30 to be cooled and the first fin 211 in the second fin group 220 that is closest to the device 30 to be cooled may each have a gap with the device 30 to be cooled, so that gas can flow between the first fin 211 and the device 30 to be cooled, thereby taking away a portion of the heat dissipated by the device 30 to be cooled, which is beneficial to improving the heat dissipation efficiency.
[0047] To further improve the heat dissipation efficiency, the heat dissipation device 10 may further include a second heat dissipation module 300, such as Figures 4 to 6 , the second heat dissipation module 300 is arranged on the first board surface 110, and in the second direction, the third heat dissipation module 400 is located at one end of the first heat dissipation module 200. Based on this arrangement, the first fin group 210 and the second fin group 220 in the first heat dissipation module 200, the third heat dissipation module 400 and the first board surface 110 together form a receiving space M with three side walls, so that the heat dissipation device 30 in the receiving space M can be cooled from the cooling direction, thereby increasing the heat transfer area and improving the heat dissipation efficiency.
[0048] refer to Figure 6 and Figure 7, the second heat dissipation module 300 may include a plurality of second fins 311, the plurality of second fins 311 are arranged along the second direction, and each second fin 311 extends along the first direction. Exemplarily, the second fin 311 may be a long piece, and its specific size may be designed according to the external dimensions of the device 30 to be dissipated, so as to increase the heat transfer area and thus improve the heat dissipation efficiency. In addition, the second fin 311 may be fixed to the first board surface 110 by welding to ensure the firmness and stability of the connection. Among them, the height of the second fin 311 on the first board surface 110 may be 7.8 mm, the spacing between two adjacent second fins 311 may be 2.0 mm, and the thickness of each second fin 311 may be 0.2 mm; in addition, the second heat dissipation module 300 may include 7 second fins 311, and of course, it may be other numbers, which are not specifically limited here.
[0049] Optionally, there is a gap between two adjacent second fins 311, so that the two adjacent second fins 311 and the first plate surface 110 together form an air flow channel, and the gas can flow along the air flow channel and take away the heat on the second fins 311, thereby achieving a heat dissipation effect on the second fins 311, so that the heat dissipation device 30 can transfer more heat to the second fins 311.
[0050] Further, in the second direction, the surface of the second fin 311 closest to the first heat dissipation module 200 is spaced apart from the end surface of the first heat dissipation module 200 to form an air flow channel.
[0051] Specifically, there may be a gap between the second fin 311 closest to the device 30 to be cooled in the second heat dissipation module 300 and the device 30 to be cooled, so that gas can flow between the second fin 311 and the device 30 to be cooled, thereby taking away part of the heat dissipated by the device 30 to be cooled, which is beneficial to improving the heat dissipation efficiency.
[0052] It should be noted here that the gap between the second fin 311 closest to the device 30 to be cooled and the device 30 to be cooled, and the gap between the first fin 211 closest to the device 30 to be cooled and the device 30 to be cooled in each of the first fin group 210 and the second fin group 220 together constitute an airflow channel to guide the cooling gas.
[0053] The heat dissipation device 10 in the embodiment of the present application may further include a third heat dissipation module 400, such as Figure 6As shown, the third heat dissipation module 400 is disposed on the second board surface 120 included in the first substrate 100, and the second board surface 120 is disposed opposite to the first board surface 110. Based on this arrangement, the heat transmitted to the first substrate 100 by the first heat dissipation module 200, the second heat dissipation module 300 and the device to be dissipated 30 can be quickly dissipated through the third heat dissipation module 400, thereby improving the heat dissipation efficiency of the first substrate 100, so that the first substrate 100 can absorb more heat, which is beneficial to improving the heat dissipation efficiency of the device to be dissipated 30.
[0054] refer to Figure 6 and Figure 8 In some embodiments, the third heat dissipation module 400 may include a plurality of third fins 411, and the plurality of third fins 411 are arranged along the first direction and / or the second direction. For example, the third fins 411 may be long pieces, and the specific number, the interval between two adjacent third fins 411, and the specific size may be designed according to the actual heat dissipation requirements, and are not specifically limited here. In addition, the third fins 411 may be fixed to the second board surface 120 by welding to ensure the firmness and stability of the connection.
[0055] In some embodiments, a plurality of third fins 411 may be arranged along the first direction, and each third fin 411 extends along the second direction.
[0056] In some other embodiments, a plurality of third fins 411 may be arranged along the second direction, and each third fin 411 extends along the first direction.
[0057] In some further embodiments, among the plurality of third fins 411 , a portion of the third fins 411 are arranged along the first direction and each third fin 411 extends along the second direction, and another portion of the third fins 411 are arranged along the second direction and each third fin 411 extends along the first direction.
[0058] In the embodiment of the present application, the specific arrangement of the plurality of third fins 411 can be selected according to actual heat dissipation requirements.
[0059] The heat dissipation device 10 in the embodiment of the present application can be applied to communication equipment. Based on the heat dissipation device 10, the embodiment of the present application discloses a single board, referring to Figures 3 to 8 The disclosed single board includes: a second substrate 20, a device to be cooled 30 and the above-mentioned cooling device 10.
[0060] Among them, the second substrate 20 may include a third board surface 201, the heat dissipation device 10 is arranged on the third board surface 201, and the first heat dissipation module 200 is arranged facing the third board surface 201. In this way, a receiving space M can be formed by the third board surface 201, the first board surface 110, the first fin group 210 and the second fin group 220, and the heat dissipation device 30 can be arranged in the receiving space M for heat dissipation.
[0061] Optionally, the heat dissipation device 30 can be an optical module, which is arranged on the third board surface 201 and is located between the first board surface 110, the third board surface 201, the first fin group 210 and the second fin group 220, that is, located in the accommodating space M surrounded by the above four.
[0062] Based on the above settings, the heat generated during the operation of the optical module can be transmitted to the first fin group 210, the second fin group 220, the first substrate 100 and the second substrate 20 respectively, so that multi-path heat dissipation can be achieved to improve the heat dissipation efficiency; and the heat dissipation device 10 and the optical module can be installed through the second substrate 20 to ensure the stability of the heat dissipation device 10 and the optical module.
[0063] In order to meet the high-density layout requirements of the single board, the first fin group 210 and the second fin group 220 are each spaced apart from the third board surface 201, so that space can be provided for the patch chip, thereby ensuring the application requirements of this part of the patch chip. Exemplarily, a spacing of about 3 mm can be left between the first fin group 210 and the second fin group 220 and the third board surface 201, of course, other spacings can also be used, which are not specifically limited here.
[0064] refer to Figure 4 In some embodiments, the single board may further include a side panel 40, which is disposed at one end of the second substrate 20 and is perpendicular to the second substrate 20. To facilitate the installation of the optical module, the side panel 40 may be provided with an avoidance groove 401, and the optical module is inserted into the avoidance groove 401 and passes through the avoidance groove 401 into the accommodation space M surrounded by the first board surface 110, the third board surface 201, the first fin group 210 and the second fin group 220, so as to facilitate heat dissipation.
[0065] In addition, in order to allow gas to enter the accommodating space M, the side panel 40 may be provided with an air hole 402, which is connected to the accommodating space M so as to blow air into the accommodating space M through the air hole 402, thereby promoting the flow of gas in the accommodating space M, increasing the heat carried away by the gas, and thereby improving the heat dissipation efficiency.
[0066] In a more specific embodiment, the outer dimensions of the heat sink 10 may be 50 mm*84 mm*9.5 mm, wherein the thickness of the first substrate 100 may be 0.9 mm; in addition, the height dimension of the third fin 411 on the second board surface 120 may be 0.8 mm, the spacing between two adjacent third fins 411 may be 2.0 mm, and the thickness of each third fin 411 may be 0.2 mm. The design of this part is adapted to the optical module.
[0067] Based on the above-mentioned single board, an embodiment of the present application further discloses a communication device, and the disclosed communication device includes the above-mentioned single board.
[0068] To sum up, the heat dissipation device 10 in the embodiment of the present application has a better heat dissipation effect, and the heat dissipation fins are located around the device 30 to be cooled, which can reduce the space occupied by the heat dissipation device 10 on the upper part of the single board, and is not subject to height restrictions. There is no need to customize the optical module housing, and there is no need to use heat pipes for heat transfer, thereby reducing the equipment cost while ensuring the heat dissipation effect.
[0069] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.
Claims
1. A heat dissipation device, characterized in that: include: A first substrate (100) and a first heat dissipation module (200); The first substrate (100) comprises a first plate surface (110); The first heat dissipation module (200) comprises a first fin group (210) and a second fin group (220), the first fin group (210) and the second fin group (220) being respectively arranged on the first plate surface (110) and spaced apart in a first direction, the first direction being perpendicular to the normal direction of the first plate surface (110); The first plate surface (110), the first fin group (210) and the second fin group (220) form a receiving space (M) for accommodating a device (30) to be cooled.
2. The heat dissipation device according to claim 1, characterized in that: The first fin group (210) and the second fin group (220) each include at least one first fin (211), wherein the first fin (211) extends along a second direction, wherein the second direction is perpendicular to the first direction and the normal direction respectively.
3. The heat dissipation device according to claim 2, characterized in that: The first fin group (210) and the second fin group (220) each include the same number of first fins (211), which are symmetrically arranged in the first direction.
4. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device (10) further comprises a second heat dissipation module (300), wherein the second heat dissipation module (300) is arranged on the first plate surface (110); In a second direction, the second heat dissipation module (300) is located at one end of the first heat dissipation module (200), wherein the second direction is perpendicular to the first direction and the normal direction respectively.
5. The heat dissipation device according to claim 4, characterized in that: The second heat dissipation module (300) comprises a plurality of second fins (311), the plurality of second fins (311) are arranged along the second direction, and each second fin (311) extends along the first direction.
6. The heat dissipation device according to claim 5, characterized in that: In the second direction, the surface of the second fin (311) closest to the first heat dissipation module (200) is spaced apart from the end surface of the first heat dissipation module (200).
7. The heat dissipation device according to claim 1, characterized in that: The first substrate (100) further comprises a second board surface (120) disposed opposite to the first board surface (110); The heat dissipation device (10) further comprises a third heat dissipation module (400), wherein the third heat dissipation module (400) is arranged on the second plate surface (120).
8. The heat dissipation device according to claim 7, characterized in that: The third heat dissipation module (400) comprises a plurality of third fins (411), and the plurality of third fins (411) are arranged along the first direction and / or the second direction, wherein the second direction is respectively perpendicular to the first direction and the normal direction.
9. A single board, characterized in that: include: A second substrate (20), a device to be cooled (30), and a heat dissipation device (10) according to any one of claims 1 to 8; The second substrate (20) comprises a third board surface (201), the heat dissipation device (10) is arranged on the third board surface (201), and the first heat dissipation module (200) is arranged facing the third board surface (201); The heat dissipation device (30) is an optical module, which is arranged on the third board surface (201) and located between the first board surface (110), the third board surface (201), the first fin group (210) and the second fin group (220).
10. The single board according to claim 9, characterized in that The first fin group (210) and the second fin group (220) are each arranged at a distance from the third plate surface (201).
11. The single board according to claim 9, characterized in that The single board further comprises a side plate (40), wherein the side plate (40) is arranged at one end of the second base plate (20) and is perpendicular to the second base plate (20); The side plate (40) is provided with an avoidance groove (401), and the optical module is inserted into the avoidance groove (401), and / or the side plate (40) is provided with an air hole (402), and the air hole (402) is connected to the accommodating space (M).
12. A communication device, characterized in that: A single board comprising any one of claims 9 to 11.