Heat dissipation device for LED lamp of clean room

Abstract

The utility model is applicable to the technical field of LED (light-emitting diode) lamps, and provides a radiating device for an LED lamp in a clean room, which comprises an aluminum substrate for radiating a plurality of LED light-emitting lamp strips, the plurality of LED light-emitting lamp strips are respectively connected with the aluminum substrate through heat-conducting connecting strips, and a radiating component for accelerating the radiating speed is arranged at the top end of the aluminum substrate. By arranging the heat conduction connecting strip and the heat dissipation assembly, heat generated by the LED light-emitting lamp strip is conducted to the aluminum substrate through the heat conduction connecting strip, the cold end of the semiconductor chilling plate cools the heat dissipation connecting base, and the heat dissipation connecting base cools the aluminum substrate, so that the aluminum substrate continuously absorbs the heat generated by the LED light-emitting lamp strip; and meanwhile, the heat dissipation fin plates conduct heat dissipation on the hot ends of the multiple semiconductor chilling plates, and rapid heat dissipation of the LED light-emitting lamp strip is achieved through mutual cooperative use of the parts.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lamps, and in particular relates to a heat dissipation device for a clean room LED lamp. Background Art

[0002] A clean room refers to a well-enclosed space in which parameters such as air cleanliness, temperature, humidity, pressure, and noise are controlled as required. The development of clean rooms is closely linked to modern industry and cutting-edge technology. The environmental requirements of the precision machinery industry (such as gyroscopes, micro-bearings, etc.) and the semiconductor industry (such as large-scale integrated circuit production) have promoted the development of clean room technology. Domestic statistics have shown that the qualified rate of MOS circuit cores produced in an environment without clean level requirements is only 10% to 15%, and that of 64-bit storage is only 2%. Currently, the application of clean rooms in industries such as precision machinery, semiconductors, aerospace, and atomic energy is quite common.

[0003] LED lamps used in clean rooms are generally pasted on an aluminum substrate inside a light box, with low heat dissipation efficiency and very limited heat dissipation capacity. Under high load and long-term use in a clean room, LED light strips are very easy to be damaged, which greatly reduces their service life. In order to improve the heat dissipation efficiency, a heat dissipation device for clean room LED lamps is proposed. Utility Model Content

[0004] The utility model provides a heat dissipation device for a clean room LED lamp, aiming to solve the problem of poor heat dissipation mentioned in the above background technology.

[0005] The utility model is implemented as follows: a heat dissipation device for clean room LED lamps, comprising an aluminum substrate, used to dissipate heat for a plurality of LED light strips, wherein the plurality of LED light strips are respectively connected to the aluminum substrate through heat-conducting connecting strips, and a heat dissipation component for accelerating heat dissipation is arranged on the top of the aluminum substrate;

[0006] The heat dissipation assembly includes a heat dissipation fin plate, a plurality of heat dissipation connection seats, and a semiconductor cooling sheet;

[0007] A plurality of heat dissipation connection seats are fixed on the top of the aluminum substrate, and the plurality of heat dissipation connection seats are respectively connected to the heat dissipation fins through semiconductor refrigeration sheets, the cold ends of the semiconductor refrigeration sheets are in contact with the heat dissipation connection seats, and the hot ends of the heat dissipation fins are in contact with the heat dissipation fins.

[0008] Preferably, a plurality of heat-conducting fins are formed at the bottom end of the aluminum substrate, and the plurality of heat-conducting fins are arranged in parallel with a plurality of heat-conducting connecting strips, and the heat-conducting fins are used to absorb the heat emitted by the LED light strip.

[0009] Preferably, several heat dissipation fins are formed at the top of the heat dissipation fin plate. The heat dissipation fin plate has a "day" - shaped structure. Thermal conductive silicone grease is applied at the joints of the semiconductor refrigeration sheet with the heat dissipation connection seat and the heat dissipation fin plate.

[0010] Preferably, two fixing plates are symmetrically installed at the top of the aluminum substrate. The fixing plates have a "C" - shaped structure. The aluminum substrate is connected to the light box through the two fixing plates.

[0011] Preferably, multiple heat conduction connection strips are connected to the aluminum substrate by an integral molding process. An upper groove is formed at the bottom end of the heat conduction connection strip. The LED light - emitting strip is pasted inside the upper groove.

[0012] Preferably, a plurality of air - permeable grooves are formed inside the heat dissipation connection seat, and the plurality of air - permeable grooves are arranged evenly and equidistantly.

[0013] Preferably, a light - transmitting plate is fixed at the bottom end of the light box.

[0014] Preferably, the light - transmitting plate is connected to the light box through two connecting plates.

[0015] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:

[0016] In the present utility model, by setting the heat conduction connection strip and the heat dissipation component, the heat generated by the LED light - emitting strip is conducted to the aluminum substrate through the heat conduction connection strip. The cold end of the semiconductor refrigeration sheet cools the heat dissipation connection seat, and the heat dissipation connection seat cools the aluminum substrate, so that the aluminum substrate continuously absorbs the heat generated by the LED light - emitting strip, achieving the effect of rapid heat dissipation. At the same time, the heat dissipation fin plate dissipates the heat of the hot ends of multiple semiconductor refrigeration sheets. Through the mutual cooperation of the above parts, rapid heat dissipation of the LED light - emitting strip is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the structural schematic diagram provided by the present utility model;

[0018] Figure 2 is the connection schematic diagram of the aluminum substrate and the heat dissipation component provided by the present utility model;

[0019] Figure 3 is provided by the present utility model Figure 3 the enlarged view of part A in;

[0020] Figure 4 is the connection schematic diagram of the aluminum substrate and the heat dissipation component from another angle provided by the present utility model;

[0021] Figure 5 is provided by the present utility model Figure 4 the enlarged view of part B in.

[0022] In the figure: 1. Aluminum substrate; 2. LED light strip; 3. Thermal conductive connecting strip; 4. Heat dissipation component; 401. Heat dissipation connecting seat; 402. Semiconductor cooling sheet; 403. Heat dissipation fin plate; 5. Thermal conductive fin; 6. Fixing plate; 7. Light box; 8. Translucent plate; 9. Connecting plate. DETAILED DESCRIPTION

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] The utility model provides a heat dissipation device for a clean room LED lamp, such as Figure 1-Figure 5 As shown, it includes an aluminum substrate 1, which is used to dissipate heat for a plurality of LED light strips 2. The plurality of LED light strips 2 are respectively connected to the aluminum substrate 1 through heat-conducting connecting strips 3. A heat dissipation component 4 for accelerating the heat dissipation speed is arranged at the top of the aluminum substrate 1; the heat dissipation component 4 includes a heat dissipation fin 403 and a plurality of heat dissipation connecting seats 401, and a semiconductor cooling sheet 402; a plurality of heat dissipation connecting seats 401 are fixed to the top of the aluminum substrate 1, and a plurality of heat dissipation connecting seats 401 are respectively connected to the heat dissipation fin 403 through the semiconductor cooling sheet 402, the cold end of the semiconductor cooling sheet 402 is in contact with the heat dissipation connecting seat 401, and the hot end of the heat dissipation fin 403 is in contact with the heat dissipation fin 403, and a plurality of air permeable grooves are opened inside the heat dissipation connecting seat 401, and the plurality of air permeable grooves are evenly and equidistantly arranged.

[0026] In this embodiment, the heat generated by the LED light-emitting strip 2 is conducted to the aluminum substrate 1 through the heat-conducting connecting strip 3. The cold end of the semiconductor refrigeration sheet 402 cools the heat-dissipating connecting seat 401, and the heat-dissipating connecting seat 401 cools the aluminum substrate 1, so that the aluminum substrate 1 continuously absorbs the heat generated by the LED light-emitting strip 2, achieving the effect of rapid heat dissipation. At the same time, the heat-dissipating fin 403 dissipates the heat of the hot ends of multiple semiconductor refrigeration sheets 402. Through the coordinated use of the above parts, rapid heat dissipation of the LED light-emitting strip 2 is achieved.

[0027] In a further preferred embodiment of the present utility model, as Figure 2 , Figure 4 and Figure 5 shown, a plurality of heat-conducting fins 5 are formed at the bottom end of the aluminum substrate 1. The plurality of heat-conducting fins 5 are arranged in parallel with the plurality of heat-conducting connecting strips 3. The heat-conducting fins 5 are used to absorb the heat dissipated by the LED light-emitting strip 2.

[0028] In this embodiment, during use, the heat dissipated by the LED light-emitting strip 2 is conducted to the aluminum substrate 1 again through the heat-conducting fins 5. The cold end of the semiconductor refrigeration sheet 402 cools the heat-dissipating connecting seat 401, and the heat-dissipating connecting seat 401 cools the aluminum substrate 1.

[0029] In a further preferred embodiment of the present utility model, as Figure 2-Figure 3 shown, a plurality of heat-dissipating fins are formed at the top end of the heat-dissipating fin plate 403. The heat-dissipating fin plate 403 has a "day" - shaped structure. Thermal conductive silicone grease is applied at the connection points of the semiconductor refrigeration sheet 402 with the heat-dissipating connecting seat 401 and the heat-dissipating fin plate 403.

[0030] In this embodiment, it should be noted that when two surfaces that are very smooth come into contact with each other, there will be gaps. The air in these gaps is a poor conductor of heat and will hinder the conduction of heat to the heat sink. Thermal conductive silicone grease is a material that can fill these gaps and make the conduction of heat smoother and faster, so that the semiconductor refrigeration sheet 402 can conveniently conduct cold to the heat-dissipating connecting seat 401. At the same time, it also facilitates the semiconductor refrigeration sheet 402 to conduct heat to the heat-dissipating fin plate 403.

[0031] In a further preferred embodiment of the present utility model, as Figure 1 , Figure 2 shown, two fixing plates 6 are symmetrically installed at the top end of the aluminum substrate 1. The fixing plates 6 have a "C" - shaped structure. The aluminum substrate 1 is connected to the light box 7 through the two fixing plates 6. A light - transmitting plate 8 is fixed at the bottom end of the light box 7. The light - transmitting plate 8 is connected to the light box 7 through two connecting plates 9.

[0032] In this embodiment, it is worth mentioning that the light box 7 is generally fixed on the suspended ceiling of the clean room. When in use, after the aluminum substrate 1 is connected to the light box 7 through two fixing plates 6, the two connecting plates 9 of the light-transmitting plate 8 are then attached to the inner wall of the light box 7, and screws are used to connect and fix the light-transmitting plate 8 and the light box 7.

[0033] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the described action sequence, because according to the utility model, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the utility model.

[0034] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of the above-mentioned units. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0035] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0036] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A heat dissipation device for a clean room LED lamp, comprising an aluminum substrate (1) for dissipating heat for a plurality of LED light strips (2), characterized in that: A plurality of the LED light-emitting strips (2) are respectively connected to the aluminum substrate (1) through heat-conducting connection bars (3), and a heat-dissipating component (4) for accelerating the heat dissipation speed is arranged at the top end of the aluminum substrate (1); The heat-dissipating component (4) includes heat-dissipating fins (403), a plurality of heat-dissipating connection seats (401), and a semiconductor refrigeration sheet (402); A plurality of the heat-dissipating connection seats (401) are fixed to the top end of the aluminum substrate (1), and a plurality of the heat-dissipating connection seats (401) are respectively connected to the heat-dissipating fins (403) through the semiconductor refrigeration sheets (402). The cold end of the semiconductor refrigeration sheet (402) is attached to the heat-dissipating connection seat (401), and the hot end of the heat-dissipating fin (403) is attached to the heat-dissipating fin (403).

2. A heat dissipation device for a clean room LED lamp as claimed in claim 1, characterized in that: A plurality of heat-conducting fins (5) are formed at the bottom end of the aluminum substrate (1), and the plurality of heat-conducting fins (5) are arranged in parallel with the plurality of heat-conducting connection bars (3). The heat-conducting fins (5) are used for absorbing the heat dissipated by the LED light-emitting strip (2).

3. A heat dissipation device for a clean room LED lamp as claimed in claim 1, characterized in that: A plurality of heat-dissipating fin pieces are formed at the top end of the heat-dissipating fin (403). The heat-dissipating fin (403) has a "day"-shaped structure. Thermal conductive silicone grease is applied to the connection parts of the semiconductor refrigeration sheet (402) with the heat-dissipating connection seat (401) and the heat-dissipating fin (403).

4. The heat dissipation device for clean room LED lamps according to claim 1, characterized in that: Two fixing plates (6) are symmetrically installed at the top end of the aluminum substrate (1). The fixing plates (6) have a "C"-shaped structure. The aluminum substrate (1) is connected to the light box (7) through the two fixing plates (6).

5. The heat dissipation device for clean room LED lamps according to claim 1, characterized in that: The plurality of heat-conducting connection bars (3) are connected to the aluminum substrate (1) through an integral molding process. An upper groove is formed at the bottom end of the heat-conducting connection bar (3). The LED light-emitting strip (2) is pasted inside the upper groove.

6. The heat dissipation device for clean room LED lamps according to claim 1, characterized in that: A plurality of air-permeable grooves are formed inside the heat-dissipating connection seat (401), and the plurality of air-permeable grooves are arranged evenly and equidistantly.

7. A heat dissipation device for a clean room LED lamp as claimed in claim 4, characterized in that: A light-transmitting plate (8) is fixed to the bottom end of the light box (7).

8. A heat dissipation device for a clean room LED lamp as claimed in claim 7, characterized in that: The light-transmitting plate (8) is connected to the light box (7) through two connecting plates (9).

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