High-efficiency cooling device for semiconductor wafer
By using a fan and a duct system in the semiconductor chip cutting device for cooling, and combining the vacuum cleaner and recycling box system to recover debris, the problem of untimely heat dissipation and inconvenient debris during the cutting process is solved, and efficient cooling and cleaning is achieved.
Patent Information
- Application Number
- CN202421248912.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-03
AI Technical Summary
During the cutting process of semiconductor wafers, if the heat generated cannot be dissipated effectively in time and in an effective manner, it will cause chip damage and equipment failure.
A semiconductor wafer high-efficiency cooling device is designed, including a cutting device body, a wafer body and a cutting blade. The fan and the duct system are used to blow the wind to the contact point between the cutting blade and the wafer body, bringing out the generated heat, and at the same time, the cut debris is recovered through the vacuum chamber and the recycling box system.
It effectively solves the problem of untimely heat dissipation during the cutting process, prevents chip damage and equipment failure, and cleans up debris generated during the cutting process, keeping the cutting environment clean.
Smart Images
Figure CN222546313U_ABST
Abstract
Description
Technical Field
[0001] The utility model application relates to the technical field of cooling devices, in particular to a high-efficiency cooling device for semiconductor wafers. Background Art
[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. Matter exists in various forms, such as solid, liquid, gas, plasma, etc. We usually call materials with poor conductivity, such as coal, artificial crystals, amber, ceramics, etc. insulators, and metals with better conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., conductors. Materials between conductors and insulators can be simply called semiconductors. Compared with conductors and insulators, semiconductor materials were discovered the latest. It was not until the 1930s, when the material purification technology was improved, that the existence of semiconductors was truly recognized by the academic community.
[0003] In the semiconductor manufacturing process, wafer cutting is a key step. However, since a large amount of heat is generated during the cutting process, if the heat cannot be dissipated in a timely and effective manner, it will cause wafer damage, equipment failure, and even affect the operation of the entire production line. Therefore, the development of efficient heat dissipation devices in semiconductor wafer cutting has important practical significance and application value. Summary of the invention
[0004] In order to solve the problem that a large amount of heat is generated during the cutting process, which will cause chip damage and equipment failure if the heat cannot be dissipated in time and effectively, the utility model provides a semiconductor chip efficient cooling device to solve the above problem.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A semiconductor wafer efficient cooling device comprises a cutting device body, a wafer body and a cutting blade, wherein the cutting device body is provided with a cutting blade, the wafer body is provided below the cutting blade, a fan is fixed on one side of the cutting device body, an air outlet is provided on the top surface of the fan, a first fixed block is fixed below a side of the cutting device body away from the fan, an air duct is fixed on the first fixed block, an opening is provided at one end of the air duct close to the cutting blade, a first transmission pipe is provided at one end of the air duct away from the cutting blade, the first transmission pipe is fixed inside the cutting device body, one end of the first transmission pipe is fixedly connected to the air duct, and the other end of the first transmission pipe is fixedly connected to the air outlet.
[0007] Furthermore, a second fixed block is fixed on a side of the cutting device body away from the first fixed block, a dust box is fixed on an end of the second fixed block close to the cutting blade, a dust suction port is opened on a side of the dust box close to the cutting blade, a second transmission tube is arranged on the top surface of the dust box, the second transmission tube is fixed to one side of the cutting device body, one end of the second transmission tube is fixedly connected to the dust box, the other end of the second transmission tube is fixedly connected to a recovery box, and the top surface of the recovery box is fixedly connected to the fan.
[0008] Furthermore, the opening on the air duct is aligned with the contact end of the cutting blade and the wafer body, and the bottom end of the air duct is located above the bottom end of the cutting blade.
[0009] Furthermore, the bottom end of the dust collection box is provided with an inclined surface facing the cutting blade, and the bottom end of the dust collection box is located above the bottom end of the cutting blade.
[0010] Furthermore, a detachable recovery box is slidably connected inside the recovery box, and the recovery box is fixed inside the recovery box by a lock.
[0011] Furthermore, the lock is composed of a buckle ring and a buckle plate, the recycling box and the recycling bin are both fixed with buckles, and buckle plates are inserted inside the two buckles.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. In the utility model, by fixing the fan on the side of the cutting device body, and then connecting the first transmission pipe to the air outlet, the fan transmits the wind to the air duct through the first transmission pipe, so that when the cutting blade cuts the wafer body, the wind blown out of the air duct takes out the heat generated by the cutting, which solves the problem that a large amount of heat will be generated during the cutting process. If the heat cannot be dissipated in time and effectively, it will cause damage to the wafer and equipment failure.
[0014] 2. In the utility model, a recovery box is arranged at the bottom of the fan, and the air inlet of the fan is inserted into the recovery box, so that a negative pressure is formed inside the recovery box, so that the debris generated by the cutting blade when cutting the wafer body is sucked into the recovery box through the dust collection box, thereby solving the problem that the debris generated when the cutting blade cuts the wafer body is difficult to recover and pollutes the cutting environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 is a schematic diagram of a three-dimensional structure according to an embodiment of the present application;
[0017] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the heat dissipation structure in the embodiment shown;
[0018] Figure 3 yes Figure 1 A three-dimensional schematic diagram of the dust collection structure in the illustrated embodiment;
[0019] Figure 4 yes Figure 1 A three-dimensional schematic diagram of the recovery structure in the embodiment shown.
[0020] The meanings of the reference numerals in the figure are: 1. Cutting device body; 2. Wafer body; 3. Cutting blade; 4. First fixed block; 5. Fan; 6. First transmission pipe; 7. Air duct; 8. Second fixed block; 9. Duct box; 10. Second transmission pipe; 11. Recovery box; 12. Recovery box; 13. Buckle ring; 14. Buckle plate; 15. Air outlet. DETAILED DESCRIPTION
[0021] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0022] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 A semiconductor wafer efficient cooling device comprises a cutting device body 1, a wafer body 2 and a cutting blade 3, wherein the cutting blade 3 is arranged on the cutting device body 1, and the wafer body 2 is arranged below the cutting blade 3, a fan 5 is fixed on one side of the cutting device body 1, and an air outlet 15 is opened on the top surface of the fan 5, a first fixed block 4 is fixed below the side of the cutting device body 1 away from the fan 5, an air duct 7 is fixed on the first fixed block 4, an opening is arranged at one end of the air duct 7 close to the cutting blade 3, a first transmission pipe 6 is arranged at one end of the air duct 7 away from the cutting blade 3, the first transmission pipe 6 is fixed inside the cutting device body 1, one end of the first transmission pipe 6 is fixedly connected to the air duct 7, and the other end of the first transmission pipe 6 is fixedly connected to the air outlet 15, so that the air duct 7 dissipates heat to the wafer body 2 and the cutting blade 3.
[0023] Specifically, the opening on the air duct 7 is aligned with the contact end of the cutting blade 3 and the wafer body 2 , and the bottom end of the air duct 7 is located above the bottom end of the cutting blade 3 to prevent the air duct 7 from blocking the cutting blade 3 .
[0024] As an optimization solution, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a second fixed block 8 is fixed on a side of the cutting device body 1 away from the first fixed block 4, a dust box 9 is fixed on an end of the second fixed block 8 close to the cutting blade 3, a dust suction port is opened on the side of the dust box 9 close to the cutting blade 3, a second transmission tube 10 is arranged on the top surface of the dust box 9, the second transmission tube 10 is fixed to one side of the cutting device body 1, one end of the second transmission tube 10 is fixedly connected to the dust box 9, the other end of the second transmission tube 10 is fixedly connected to a recovery box 11, and the top surface of the recovery box 11 is fixedly connected to the fan 5, so that the recovery box 11 recovers the debris of the cutting blade 3 cutting the chip body 2.
[0025] Specifically, the bottom end of the dust box 9 is provided with an inclined surface facing the cutting blade 3, and the bottom end of the dust box 9 is located above the bottom end of the cutting blade 3 to prevent the dust box 9 from blocking the cutting blade 3. A detachable recycling box 12 is slidably connected to the inside of the recycling box 11, and the recycling box 12 is fixed to the inside of the recycling box 11 by a lock. The lock is composed of a buckle 13 and a buckle plate 14. Buckles 13 are fixed on the recycling box 12 and the recycling box 11, and buckle plates 14 are inserted into the two buckles 13 to facilitate the staff to clean the recycling box 12.
[0026] Working principle: The cutting blade 3 is started through the cutting device body 1 to cut the wafer body 2. At the same time of cutting, the fan 5 is started, so that the fan 5 transmits the wind through the air outlet 15 to the inside of the first transmission pipe 6, and then transmits it to the air duct 7 through the first transmission pipe 6. At the same time, the opening of the air duct 7 is aligned with the contact point between the cutting blade 3 and the wafer body 2, so that the flowing wind brings out the heat generated by the cutting blade 3 cutting the wafer body 2. At the same time, when the fan 5 is started, the fan 5 sucks away the air inside the recovery box 11, so that a negative pressure state is formed inside the recovery box 11, so that the dust collection box 9 absorbs the debris generated by the cutting blade 3 cutting the wafer body 2, and the inhaled debris is discharged into the recovery box 11 through the second transmission pipe 10. When the inside of the recovery box 12 needs to be cleaned, the staff pulls the buckle plate 14 upwards to release the limit of the buckle plate 14 on the buckle ring 13 on the recovery box 12, so that the staff can pull the buckle ring 13 on the recovery box 12 to draw the recovery box 12 out of the recovery box 11 for cleaning.
[0027] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
[0028] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A semiconductor wafer high-efficiency cooling device, comprising a cutting device body (1), a wafer body (2) and a cutting blade (3), wherein the cutting device body (1) is provided with a cutting blade (3), and the wafer body (2) is provided below the cutting blade (3), characterized in that: A fan (5) is fixed on one side of the cutting device body (1), and an air outlet (15) is provided on the top surface of the fan (5). A first fixed block (4) is fixed below the side of the cutting device body (1) away from the fan (5), and an air duct (7) is fixed on the first fixed block (4). An opening is provided at one end of the air duct (7) close to the cutting blade (3), and a first transmission tube (6) is provided at one end of the air duct (7) away from the cutting blade (3). The first transmission tube (6) is fixed inside the cutting device body (1), one end of the first transmission tube (6) is fixedly connected to the air duct (7), and the other end of the first transmission tube (6) is fixedly connected to the air outlet (15).
2. The semiconductor wafer efficient cooling device according to claim 1, characterized in that: A second fixed block (8) is fixed on a side of the cutting device body (1) away from the first fixed block (4); a dust box (9) is fixed on an end of the second fixed block (8) close to the cutting blade (3); a dust suction port is provided on a side of the dust box (9) close to the cutting blade (3); a second transmission tube (10) is provided on the top surface of the dust box (9); the second transmission tube (10) is fixed to one side of the cutting device body (1); one end of the second transmission tube (10) is fixedly connected to the dust box (9); the other end of the second transmission tube (10) is fixedly connected to a recovery box (11); and the top surface of the recovery box (11) is fixedly connected to the fan (5).
3. The semiconductor wafer efficient cooling device according to claim 1, characterized in that: The opening on the air duct (7) is aligned with the contact end of the cutting blade (3) and the wafer body (2), and the bottom end of the air duct (7) is located above the bottom end of the cutting blade (3).
4. The semiconductor wafer efficient cooling device according to claim 2, characterized in that: The bottom end of the dust collection box (9) is provided with an inclined surface facing the cutting blade (3), and the bottom end of the dust collection box (9) is located above the bottom end of the cutting blade (3).
5. The semiconductor wafer efficient cooling device according to claim 2, characterized in that: A detachable recovery box (12) is slidably connected to the interior of the recovery box (11), and the recovery box (12) is fixed to the interior of the recovery box (11) via a lock.
6. The semiconductor wafer efficient cooling device according to claim 5, characterized in that: The lock buckle is composed of a buckle ring (13) and a buckle plate (14); the buckle ring (13) is fixed on both the recycling box (12) and the recycling bin (11); and the buckle plates (14) are inserted inside the two buckles (13).