3D uniform temperature plate radiator

By adding three-dimensional heat pipes and spiral capillary structures to the temperature uniform plate, the problem of insufficient heat transfer capacity in the three-dimensional space in the prior art is solved, and a more efficient heat dissipation effect is achieved.

CN222547888UActive Publication Date: 2025-02-28LIANDE ELECTRONIC TECH (CHANGSHU) CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421225820.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2025-02-28
Estimated Expiration
2034-05-31

AI Technical Summary

Technical Problem

The prior art is difficult to achieve three-dimensional space heat transfer in the heat dissipation of electronic components, resulting in limited heat transfer capability and the inability to quickly carry out large heat heat transfer.

Method used

A 3D temperature equalization plate radiator is designed. By adding a three-dimensional heat pipe structure to the temperature equalization plate and setting a spiral capillary structure inside the heat pipe, the reflow of the temperature equalization plate is enhanced and the performance of the radiator is improved.

Benefits of technology

Three-dimensional space heat transfer is achieved, significantly improving the performance of the radiator, and enabling large heat exchange more quickly and efficiently.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
  • Figure 00000000_0001_ABST
    Figure 00000000_0001_ABST
Patent Text Reader

Abstract

A three-dimensional heat pipe structure is additionally arranged on a vapor chamber, spiral capillary structures are arranged in the vapor chamber and a heat pipe, backflow of the vapor chamber is increased, and the performance of the radiator is improved. The composite uniform temperature plate comprises a plurality of columnar heat pipes, a bottom shell and a cover plate; and a plurality of heat dissipation fins. The lower portion of the bottom shell is concaved downwards to form a working medium containing cavity, the cover plate covers the upper surface of the bottom shell, a working medium used for cooling is placed in the working medium containing cavity, a plurality of sets of heat pipe containing holes are formed in the upper surface of the cover plate, and the bottoms of columnar heat pipes are fixedly inserted and connected to the corresponding heat pipe containing holes in a welded mode. A plurality of grooves are formed in an inner cavity of the heat pipe and used for communicating the bottom contact face of the heat pipe with the inner cavity of the heat pipe to form a heat exchange channel.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of water cooling and heat dissipation structures, in particular to a 3D temperature equalizing plate radiator. Background Art

[0002] At present, there are two main types of heat dissipation technologies for electronic components: air cooling technology and liquid cooling technology. Air cooling technology includes natural convection air cooling technology and forced convection air cooling technology. Natural convection air cooling technology is mainly used for electronic devices with low heat generation per unit volume. Forced convection air cooling technology is generally used in combination with heat pipes and temperature averaging technology. However, simple heat pipes and temperature averaging can only conduct linear heat transfer and surface heat transfer, and the heat transfer capacity is limited. In order to quickly exchange large amounts of heat, a temperature averaging structure that can conduct heat transfer in three dimensions is urgently needed to improve the performance of the radiator. Summary of the invention

[0003] In view of the above problems, the utility model provides a 3D temperature equalizing plate radiator, which adds a three-dimensional heat pipe structure to the temperature equalizing plate, and makes a spiral capillary structure inside the temperature equalizing plate and the heat pipe to increase the reflux of the temperature equalizing plate and improve the performance of the radiator.

[0004] A 3D vapor chamber heat sink, characterized in that it comprises:

[0005] A composite temperature-averaging plate, comprising a plurality of columnar heat pipes, a bottom shell, and a cover plate;

[0006] and a number of heat sink fins;

[0007] The lower part of the bottom shell is concave to form a working medium placement cavity, the cover plate is installed on the upper surface of the bottom shell, the working medium placement cavity is placed with a working medium for cooling, the upper surface of the cover plate is provided with a plurality of groups of heat pipe placement holes, the bottom of the columnar heat pipe is fixedly inserted and welded to the corresponding heat pipe placement holes, and a plurality of grooves are provided in the inner cavity of the heat pipe, and the grooves are used to conduct the bottom contact surface of the heat pipe and the inner cavity of the heat pipe to form a heat exchange channel;

[0008] All columnar heat pipes are arranged vertically, and a plurality of groups of heat dissipating fins arranged at intervals in the height direction are provided in the height direction of the columnar heat pipes. Each group of heat dissipating fins is provided with a through positioning hole corresponding to the position of the columnar heat pipe, and the through positioning holes of the heat dissipating fins and the fixed position of the columnar heat pipe are arranged.

[0009] It is further characterized by:

[0010] The composite temperature plate also includes a sintered capillary structure, which is horizontally laid on the bottom of the working medium placement cavity, so that the thermal cycle in the horizontal position can be carried out quickly and reliably;

[0011] Each of the columnar heat pipes comprises an outer metal tube body, a first coil spring, and a sintered powder material, wherein the outer portion of the sintered powder material is in close contact with the inner wall of the outer metal tube body, the first coil spring is arranged inside the sintered powder material, and the sintered powder material forms a groove after sintering;

[0012] The height of the first coil spring extends from bottom to top to the inner cavity of the entire outer metal tube body, ensuring drainage and support effects;

[0013] The groove is pre-embedded with a wire bundle, which facilitates the gaseous working medium to enter the heat pipe from bottom to top, and facilitates the liquid working medium to flow into the working medium placement cavity from top to bottom again;

[0014] Several groups of support columns are evenly distributed in the inner cavity of the composite temperature equalizing plate, and each group of support columns includes a sintered liquid wick and a capillary ring tube with holes. The outer ring of the sintered liquid wick is provided with a capillary ring tube with holes, and the capillary ring tube with holes is used to support the height of the working medium cavity between the bottom shell and the cover plate. The capillary ring tube with holes conducts the gasified working medium of the bottom layer to the top layer, and at the same time, the sintered liquid wick absorbs the liquid that absorbs heat after gasification of the top layer and flows back to the bottom layer;

[0015] The perforated capillary ring tube is specifically a structure with a plurality of groups of raised teeth on the outer ring surface, which increases the contact area with the working medium and facilitates heat dissipation with greater power;

[0016] A second coil spring is also sleeved on the outer circumference of the capillary ring tube with holes, the height of the second coil spring is equal to that of the capillary ring tube with holes, and the second coil spring is used for liquid drainage and support effect of the working medium;

[0017] The surface of the heat dissipation fin is provided with outwardly protruding fins to facilitate heat dissipation.

[0018] After adopting the above technical scheme, the lower surface of the bottom shell contacts the heat source for heat transfer, and the working medium inside the working medium placement cavity changes from liquid to gas, and then the gaseous working medium enters the inner cavity of the columnar heat pipe through the positioning hole, and the gaseous working medium completes heat conduction from bottom to top through the columnar heat pipe and the cooling fins. The cooling fins are cooled by external wind, and the gaseous working medium becomes liquid after cooling and flows into the working medium placement cavity through the groove again. The wind from the cooling fins takes away the heat to achieve the effect of heat dissipation. A heat pipe structure is added to the temperature equalizing plate, and a capillary structure is made between the temperature equalizing plate and the inside of the heat pipe to increase the reflux of the temperature equalizing plate and improve the performance of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 It is a schematic diagram of a three-dimensional exploded view of the composite temperature averaging plate and a plurality of heat dissipation fins of the utility model;

[0021] Figure 3 It is a schematic diagram of the three-dimensional exploded view structure of the composite temperature equalizing plate of the utility model;

[0022] Figure 4 It is a partial cross-sectional structural schematic diagram of the columnar heat pipe of the utility model;

[0023] Figure 5 This is a front view of the support column of the utility model;

[0024] Figure 6 It is a top view of the support column of the utility model;

[0025] The names corresponding to the serial numbers in the figure are as follows:

[0026] Composite temperature equalizing plate 10, heat dissipation fins 20, through positioning holes 21, sleeves 211, enclosures 22, columnar heat pipes 30, outer metal tube bodies 31, first coil springs 32, sintered powder materials 33, grooves 34, bottom shells 40, working fluid placement chambers 41, cover plates 50, heat pipe placement holes 51, sintered capillary structures 60, avoidance holes 61, support columns 70, sintered liquid wicks 71, capillary ring tubes with holes 72, and second coil springs 73. DETAILED DESCRIPTION

[0027] A 3D vapor chamber heat sink, see Figure 1 , which includes a composite temperature averaging plate 10 and a plurality of heat dissipation fins 20;

[0028] The composite temperature plate 10 includes a plurality of columnar heat pipes 30, a bottom shell 40, and a cover plate 50; each columnar heat pipe 30 includes an outer metal tube body 31, a first coil spring 32, and a sintered powder material 33, the outer portion of the sintered powder material 33 is in close contact with the inner wall of the outer metal tube body 31, and the first coil spring 32 is arranged in the sintered powder material 33, and a groove 34 is formed after the sintering of the sintered powder material 33, and the groove 34 is used to conduct the bottom contact surface of the columnar heat pipe 30 and the top of the inner cavity of the columnar heat pipe 30 to form a heat exchange channel;

[0029] The lower part of the bottom shell 40 is concave to form a working medium placement cavity 41. The cover plate 50 is mounted on the upper surface of the bottom shell 40. The working medium for cooling is placed in the working medium placement cavity 41. The upper surface of the cover plate 50 is provided with a plurality of groups of heat pipe placement holes 51. The bottom of the columnar heat pipe 30 is fixedly inserted and welded to the corresponding heat pipe placement holes 51.

[0030] All columnar heat pipes 30 are arranged vertically, and a plurality of groups of heat dissipation fins 20 are arranged at intervals in the height direction of the columnar heat pipes 30. Each group of heat dissipation fins 20 is provided with a through positioning hole 21 corresponding to the position of the columnar heat pipe 30, and the through positioning hole 21 of the heat dissipation fin 20 and the columnar heat pipe 30 are fixedly positioned.

[0031] In a specific implementation, all the heat sink fins 20 are identical fins, the surface area of ​​the heat sink fins 20 and the surface area of ​​the cover plate 50 are set the same, the height intervals between the heat sink fins 20 in the height direction are equally arranged, the through positioning holes 21 of each heat sink fin are guide holes with sleeves 211, and adjacent heat sink fins 20 are welded through the enclosures 22 on both sides to form an integral heat sink fin assembly.

[0032] In a specific embodiment, the height of the first coil spring 32 extends from bottom to top to the inner cavity of the entire outer metal tube body 31 to ensure drainage and support effects.

[0033] The composite temperature plate 10 further includes a sintered capillary structure 60, which is horizontally laid on the bottom of the working medium placement cavity 41, so that the thermal cycle in the horizontal position can be carried out quickly and reliably;

[0034] A wire bundle is pre-embedded in the groove 34 (because it is too small to be directly drawn, it is placed in the groove 34), and the wire bundle is used to form a groove with a gas flow direction, and at the same time facilitate the liquid working medium to flow from top to bottom again into the working medium placement chamber 41;

[0035] Several groups of support columns 70 are evenly distributed in the inner cavity of the composite temperature equalizing plate 10, and each group of support columns 70 includes a sintered liquid wick 71 and a capillary ring tube with holes 72. The outer ring of the sintered liquid wick 71 is provided with a capillary ring tube with holes 72, and the capillary ring tube with holes 72 is used to support the height of the working medium cavity between the bottom shell 40 and the cover plate 50. The capillary ring tube with holes 72 conducts the gasified working medium of the bottom layer to the top layer, and at the same time, the sintered liquid wick 71 absorbs the liquid that absorbs heat after gasification of the top layer and flows back to the bottom layer;

[0036] The sintered capillary structure 60 is provided with avoidance holes 61 at positions corresponding to each group of support pillars 70;

[0037] The perforated capillary ring tube 72 is specifically a structure with a plurality of groups of raised teeth on the outer ring surface, which increases the contact area with the working medium and facilitates heat dissipation with greater power;

[0038] A second coil spring 73 is also sleeved on the outer circumference of the capillary ring tube 72 with holes. The height of the second coil spring 73 is equal to that of the capillary ring tube 72 with holes. The second coil spring 73 is used for liquid drainage and support of the working medium.

[0039] The surface of the heat dissipation fin 20 is provided with outwardly protruding fins to facilitate heat dissipation.

[0040] The assembly process is as follows:

[0041] 1. The outer metal tube body, the first coil spring, the sintered powder material and the wire bundle are sintered together to form a columnar heat pipe;

[0042] 2. Sintering the liquid wick, the capillary ring tube with holes and flower teeth, and the second coil spring together to form a support column;

[0043] 3. Install the sintered capillary structure and the support column to the concave positioning hole of the bottom shell, then cover the cover plate on the upper surface of the bottom shell, insert the columnar heat pipe into the heat pipe placement hole corresponding to the cover plate, sinter them together, and then fill the working medium inside the sintered structure to form a composite temperature plate. The working medium injection port is not drawn in the figure and can be arranged according to the actual structure;

[0044] 4. The columnar heat pipe passes through the corresponding positioning hole of the heat sink fin assembly, and the composite temperature equalizing plate and the enclosure of the heat sink fin at the bottom of the heat sink fin assembly are welded together to assemble.

[0045] Its working principle is as follows: the lower surface of the bottom shell contacts the heat source for heat transfer, and the working medium inside the working medium placement cavity changes from liquid to gas, and then the gaseous working medium enters the inner cavity of the columnar heat pipe through the positioning hole, and the gaseous working medium completes heat conduction from bottom to top through the columnar heat pipe and the cooling fins. The cooling fins are cooled by external wind, and the gaseous working medium becomes liquid after cooling, and flows into the working medium placement cavity through the groove again. The wind from the cooling fins takes away the heat to achieve the effect of heat dissipation.

[0046] Its beneficial effects are as follows:

[0047] This technology uses a wire bundle (or groove) plus spring structure for the columnar heat pipe. The spiral structure of the spring can accelerate the circulation of the internal liquid and improve the heat transfer. At the same time, the spring structure greatly enhances the strength of the columnar heat pipe. The internal support column of the temperature equalizer adopts a capillary flower tube with a hole groove and a sintered capillary structure inside. The spiral spring structure is added on the outside, which improves the reflux speed of the liquid and also strengthens the strength of the temperature equalizer.

[0048] The 3D temperature-averaging radiator greatly improves the overall temperature uniformity of the radiator. In terms of design, the internal structure of the temperature-averaging board is improved and a spiral structure is added to speed up the circulation of the internal liquid. A straight tube with a spiral structure is set up on the temperature-averaging board to achieve multi-directional spatial heat exchange and high heat absorption efficiency. The entire technical product uses corrosion-resistant materials, which can provide more efficient thermal conduction performance, reliability and lifespan.

[0049] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0050] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A 3D vapor chamber heat sink, characterized in that: It includes: A composite temperature-averaging plate, comprising a plurality of columnar heat pipes, a bottom shell, and a cover plate; and a number of heat sink fins; The lower part of the bottom shell is concave to form a working medium placement cavity, the cover plate is installed on the upper surface of the bottom shell, the working medium placement cavity is placed with a working medium for cooling, the upper surface of the cover plate is provided with a plurality of groups of heat pipe placement holes, the bottom of the columnar heat pipe is fixedly inserted and welded to the corresponding heat pipe placement holes, and a plurality of grooves are provided in the inner cavity of the heat pipe, and the grooves are used to conduct the bottom contact surface of the heat pipe and the inner cavity of the heat pipe to form a heat exchange channel; All columnar heat pipes are arranged vertically, and a plurality of groups of heat dissipating fins arranged at intervals in the height direction are provided in the height direction of the columnar heat pipes. Each group of heat dissipating fins is provided with a through positioning hole corresponding to the position of the columnar heat pipe, and the through positioning holes of the heat dissipating fins and the fixed position of the columnar heat pipe are arranged.

2. The 3D vapor chamber heat sink according to claim 1, characterized in that: The composite temperature balancing plate further comprises a sintered capillary structure, and the sintered capillary structure is horizontally paved on the bottom of the working medium placement cavity.

3. A 3D vapor chamber heat sink according to claim 1 or 2, characterized in that: Each of the columnar heat pipes includes an outer metal tube body, a first coil spring, and a sintered powder material. The outer portion of the sintered powder material is in close contact with the inner wall of the outer metal tube body, the first coil spring is arranged inside the sintered powder material, and the sintered powder material forms a groove after sintering.

4. The 3D vapor chamber heat sink according to claim 3, characterized in that: The height of the first coil spring extends from bottom to top to the inner cavity of the entire outer metal tube body.

5. The 3D vapor chamber heat sink according to claim 3, characterized in that: The groove is pre-embedded with a wire bundle, which facilitates the gaseous working medium to enter the heat pipe from bottom to top, and also facilitates the liquid working medium to flow into the working medium placement cavity again from top to bottom.

6. The 3D vapor chamber heat sink according to claim 1, characterized in that: Several groups of support columns are evenly distributed in the inner cavity of the composite temperature equalizing plate, each group of support columns includes a sintered liquid wick and a capillary ring with holes, and the outer ring of the sintered liquid wick is provided with a capillary ring with holes, and the capillary ring with holes is used to support the height of the working medium cavity between the bottom shell and the cover plate.

7. The 3D vapor chamber heat sink according to claim 6, characterized in that: The capillary ring tube with holes is specifically a structure with a plurality of groups of raised teeth arranged on the outer ring surface.

8. The 3D vapor chamber heat sink according to claim 6, characterized in that: A second coil spring is sleeved on the outer circumference of the capillary ring tube with holes, and the height of the second coil spring is equal to that of the capillary ring tube with holes.

9. The 3D vapor chamber heat sink according to claim 1, characterized in that: The surface of the heat dissipation fin is provided with outwardly convex fins.