Novel stamping die

Abstract

The utility model provides a novel stamping die, and belongs to the field of dies. The problem that buffering in an existing stamping die is not good enough is solved. The novel stamping die comprises an upper die base, a lower die base and a base, a guide mechanism used for positioning and guiding is arranged between the upper die base and the lower die base, the guide mechanism comprises a guide column and a guide sleeve, and the novel stamping die is characterized in that the lower die base is fixedly installed on the base, buffering mechanisms used for stamping buffering are arranged on the two sides of the upper die base respectively, and the guide column is fixedly installed on the base. The buffering mechanism comprises a fixing base of a concave structure, an elastic piece used for punching buffering, a connecting column used for installation of the elastic piece in a sleeved mode and a limiting plate matched with the fixing base and used for limiting, and the connecting column and the elastic piece are both installed in the fixing base. The two sides of the upper die base extend outwards to be provided with guiding parts matched with the connecting columns in a guiding mode, and the guiding parts are provided with connecting lugs movably connected with the connecting columns. The buffer device has the advantages of high buffer, high stability and high strength.

Description

Technical Field

[0001] The utility model belongs to the field of molds and relates to a mold, in particular to a novel stamping mold. Background Art

[0002] Moulds are various molds and tools used in industrial production to obtain the required products by injection molding, blow molding, extrusion, die casting or forging, smelting, stamping and other methods. Punching dies are a special process equipment for processing materials (metal or non-metal) into parts (or semi-finished products).

[0003] At present, before processing parts, the stamping die will manually push the sheet material into the die, and the processed parts will be formed under the operation of the die. The existing stamping die does not have a buffer mechanism. Therefore, during the stamping work, it is extremely easy to cause damage and loss of the die, affecting the stamping quality of the die and reducing the stamping efficiency of the die. Summary of the Invention

[0004] The purpose of this utility model is to provide a new stamping die to solve the above problems existing in the prior art.

[0005] The purpose of the utility model can be achieved through the following technical solutions: A new stamping die, including an upper die base, a lower die base and a base, a guide mechanism for positioning and guiding is provided between the upper die base and the lower die base, the guide mechanism includes a guide column and a guide sleeve, and is characterized in that the lower die base is fixedly mounted on the base, and a buffer mechanism for stamping buffer is provided on both sides of the upper die base;

[0006] The buffer mechanism includes a fixing seat with a "concave" structure, an elastic member for stamping and buffering, a connecting column for the elastic member to be mounted, and a limiting plate that cooperates with the fixing seat and is used for limiting the position. The connecting column and the elastic member are both installed in the fixing seat.

[0007] Guide parts that cooperate with the connecting posts are extended outwards on both sides of the upper die base, and the guide parts are provided with connecting ears that are movably connected with the connecting posts.

[0008] In the above-mentioned novel stamping die, the guide pin and guide sleeve are arranged in a relative structure and are respectively located on the upper die base and the lower die base. A plurality of balls are movably arranged on the inner side wall of the guide sleeve for reducing the wear strength of the guide pin.

[0009] In the above-mentioned new stamping die, the guide part and the connecting part are both integrally formed with the side wall of the upper die base. The upper die base is coordinated through the connecting column, elastic part and connecting ear structure, and the elastic characteristics of the elastic part are used to achieve stamping buffering.

[0010] In the above-mentioned novel stamping die, the buffer mechanisms are respectively located on both sides of the upper die base and are arranged in corresponding structures.

[0011] Compared with the existing technology, the new stamping die has a simple structural design and utilizes a buffer mechanism structure to provide effective buffering protection during die stamping, solving the problem of insufficient buffering in the existing die stamping device and improving the protection of the utility model. At the same time, the guide part and the connecting ear are integrated with the upper die base as a molded structure, which greatly improves the stamping stability of the upper die base. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional structural schematic diagram of the new stamping die.

[0013] Figure 2 It is a schematic diagram of the partial three-dimensional structure of the new stamping die.

[0014] In the figure, 1. upper die base; 2. lower die base; 3. base; 4. fixed base; 5. elastic member; 6. connecting column; 7. limiting plate; 8. guide part; 9. connecting ear. DETAILED DESCRIPTION

[0015] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0016] like Figure 1 、 Figure 2 As shown, the new stamping die comprises an upper die base 1, a lower die base 2 and a base 3. A guide mechanism for positioning and guiding is provided between the upper die base 1 and the lower die base 2. The guide mechanism comprises a guide column and a guide sleeve. It is characterized in that the lower die base 2 is fixedly mounted on the base 3. A buffer mechanism for stamping buffer is provided on both sides of the upper die base 1. The buffer mechanism comprises a fixed seat 4 with a "concave" structure, an elastic member 5 for stamping buffer, a connecting column 6 for the elastic member 5 to be sleeved and installed, and a limiting plate 7 that cooperates with the fixed seat 4 and is used for limiting. The connecting column 6 and the elastic member 5 are both installed in the fixed seat 4, and the upper die base 1 is provided with a guide portion 8 extending outward on both sides to guide and cooperate with the connecting column 6. The guide portion 8 has a connecting ear 9 movably connected to the connecting column 6. The structure is simple in design and utilizes the buffer mechanism structure to provide effective buffering protection during mold stamping, which solves the problem of insufficient buffering in the existing mold stamping device and improves the protection of the utility model. At the same time, the guide portion 8 and the connecting ear 9 are an integrally formed structure with the upper die base 1, which greatly improves the stamping stability of the upper die base 1.

[0017] To further elaborate, in order to improve the guiding positioning accuracy of the upper die base 1 and the lower die base 2, and reduce the wear of the guide pins, the guide pins and guide sleeves are arranged in a relative structure and are respectively located on the upper die base 1 and the lower die base 2. A number of balls are movably arranged on the inner wall of the guide sleeve for reducing the wear intensity of the guide pins.

[0018] To elaborate further, in order to improve the stamping stability and buffering performance of the upper die base 1, the guide part 8 and the connecting part are both integrally formed with the side wall of the upper die base 1. The upper die base 1 is coordinated through the connecting column 6, the elastic part 5 and the connecting ear 9 structure, and utilizes the elastic characteristics of the elastic part 5 to achieve stamping buffering.

[0019] To elaborate further, in order to achieve a stabilizing effect on the stamping buffer of the upper die base 1, the buffer mechanism is respectively located on both sides of the upper die base 1 and is arranged in a corresponding structure.

[0020] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope defined by the appended claims.

[0021] Although this document frequently uses terms such as upper die base 1, lower die base 2, base 3, fixing base 4, elastic member 5, connecting column 6, limiting plate 7, guide portion 8, and connecting ear 9, the use of other terms is not excluded. These terms are used solely to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitations is contrary to the spirit of the present invention.

Claims

1. A novel stamping die, comprising an upper die seat (1), a lower die seat (2) and a base (3), wherein a guide mechanism for positioning and guiding is provided between the upper die seat (1) and the lower die seat (2), wherein the guide mechanism comprises a guide column and a guide sleeve, and wherein: The lower die seat (2) is fixedly mounted on the base (3), and buffer mechanisms for punching buffer are provided on both sides of the upper die seat (1); The buffer mechanism comprises a fixing seat (4) having a "concave" structure, an elastic member (5) for punching buffer, a connecting column (6) for the elastic member (5) to be sleeved and installed, and a limiting plate (7) that cooperates with the fixing seat (4) and is used for limiting position, wherein the connecting column (6) and the elastic member (5) are both installed in the fixing seat (4); Guide parts (8) for guiding and cooperating with the connecting column (6) are provided on both sides of the upper die seat (1) and extend outwards. The guide parts (8) are provided with connecting ears (9) movably connected to the connecting column (6).

2. A new stamping die according to claim 1, characterized in that: The guide post and the guide sleeve are arranged in a relative structure and are respectively located on the upper die seat (1) and the lower die seat (2). A plurality of balls for reducing the wear strength of the guide post are movably arranged on the inner side wall of the guide sleeve.

3. A new stamping die according to claim 1, characterized in that: The guide portion (8) and the connection portion are both integrally formed with the side wall of the upper die seat (1), and the upper die seat (1) cooperates with the connection column (6), the elastic member (5) and the connection ear (9) structure, and utilizes the elastic characteristics of the elastic member (5) to achieve stamping buffering.

4. A new stamping die according to claim 1, characterized in that: The buffer mechanisms are respectively located on two side edges of the upper die seat (1) and are arranged in a corresponding structure.

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