Special-shaped ceramic machining tool for water-jet guided laser

Abstract

The utility model relates to a special-shaped ceramic processing tool for water-jet guided laser, which belongs to the technical field of water-jet guided laser processing and comprises a vacuum cavity and a rotary pitching table. A plurality of adsorption areas and hollow areas are arranged on the vacuum cavity in a staggered manner, the adsorption surfaces of the adsorption areas are arranged in a coplanar manner, and a plurality of adsorption holes are uniformly formed in each adsorption area; the surfaces of the plurality of hollow areas are lower than the adsorption surface; a rubber ring is arranged around the periphery of the plurality of adsorption areas; the vacuum cavity adsorbs the special-shaped ceramic through a plurality of adsorption holes, and the hollowed-out area coincides with the to-be-machined area of the special-shaped ceramic; and the rotary pitching table drives the vacuum cavity to do rotary motion or pitching motion. Based on vacuum adsorption, the hollowed-out area is arranged outside the adsorption area, the hollowed-out area coincides with the to-be-machined area of the special-shaped ceramic, in the machining process of the water-guided laser, the machining track of the water-guided laser is located in the hollowed-out area all the time, and the adsorption performance of the special-shaped ceramic is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of water-conducting laser processing, and in particular relates to a tooling for processing special-shaped ceramics using water-conducting laser. Background Art

[0002] In recent years, with the rapid development of electronic technology, large-scale integrated circuits have been widely used, the functions of integrated devices have become increasingly complex, and the output power has continued to increase. Electronic devices, especially related electronic products in the downstream industrial chain of the Internet of Things, such as mobile phones, computers, smart homes, etc., need to reduce the packaging volume of devices due to the needs of miniaturization and mobility, making the structural design of electronic devices develop in the direction of ultra-small assembly, and the packaging density of devices has increased accordingly. At the same time, the power dissipation required per unit area continues to increase, increasing the heat dissipated by electronic components, and the heat flux density has also increased exponentially. The application of advanced ceramic materials in electronic packaging has largely solved the problem of chip thermal management. For example, alumina (Al2O3) ceramics have the advantages of abundant raw material sources, low price, high insulation, heat shock resistance, chemical corrosion resistance and high mechanical strength. It is a ceramic substrate material with good comprehensive performance, accounting for more than 80% of the total ceramic substrate material.

[0003] Water-guided laser processing technology uses a water jet to guide the laser beam to cut the workpiece to be processed. Due to the different refractive indices of water and air, when the laser beam is irradiated at a certain angle on the interface between water and air, if the incident angle of the laser beam is less than its critical angle of total reflection, the laser beam will be totally reflected and will not be transmitted out, so that the laser energy is confined in the pure water column and propagates along the direction of the pure water column. The pure water column carrying the laser beam reaches the surface of the workpiece to be processed and removes the material by laser burning. At the same time, the pure water column also plays a role in removing impurities on the surface of the workpiece to be processed and cooling the processing area.

[0004] Applying water-guided laser processing technology to the processing of ceramic workpieces is conducive to improving the processing quality. However, during the water-guided laser processing, the impact of the pure water column will cause the ceramic workpiece to shift, affecting the processing accuracy and quality of the ceramic workpiece. In addition, the special-shaped ceramic workpiece is fixed by sticking a film on the back and using a vacuum suction cup to absorb and fix. During the processing, as part of the processing area of ​​the special-shaped ceramic workpiece is penetrated, the vacuum suction force generated by the vacuum suction cup will gradually decrease (that is, the pressure drop phenomenon occurs), causing the ceramic workpiece to move slightly, causing the processing position of the water-guided laser to shift and affect the processing size. At the same time, since the vacuum suction cup has high requirements for the integrity of the adsorption area, when there is an adsorption gap in part of the processing area, it will affect the overall adsorption performance. It is usually necessary to gradually adjust the valve to increase the suction according to the degree of the pressure drop phenomenon, and then observe the water backflow condition of the processing area and the sound feedback of the processing position to judge whether the processing is completed. In the actual processing process, it is difficult to accurately judge the pressure drop phenomenon and whether the processing is completely completed, which will also affect the processing accuracy and quality.

[0005] Therefore, a processing tool for water-guided laser is needed to improve the processing accuracy and quality of special-shaped ceramic workpieces. Utility Model Content

[0006] In order to solve the above problems existing in the prior art, the utility model provides a tooling for special-shaped ceramic processing by water-guided laser. The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0007] The utility model provides a tooling for processing special-shaped ceramics by water-guided laser, comprising: a vacuum cavity and a rotating pitching platform; the upper surface of the vacuum cavity is staggered with a plurality of adsorption areas and a plurality of hollow areas, wherein the adsorption surfaces of the plurality of adsorption areas are coplanarly arranged, and a plurality of adsorption holes are evenly arranged in each adsorption area; the surfaces of the plurality of hollow areas are all lower than the adsorption surface; rubber rings are arranged around the peripheries of the plurality of adsorption areas; the vacuum cavity adsorbs the special-shaped ceramics through the plurality of adsorption holes, and the hollow areas partially overlap with the areas to be processed of the special-shaped ceramics; the vacuum cavity is arranged on the rotating pitching platform; the rotating pitching platform is used for driving the vacuum cavity to perform rotating motion or pitching motion.

[0008] In one embodiment of the present invention, the adsorption area is used to adsorb the non-processing area of ​​the shaped ceramic, and the overlapping area between the adsorption area and the non-processing area of ​​the shaped ceramic is not less than 90% of the surface area of ​​the non-processing area of ​​the shaped ceramic.

[0009] In one embodiment of the present invention, the overlapping area between the adsorption area and the non-processing area of ​​the special-shaped ceramic is not less than 80% of the surface area of ​​the special-shaped ceramic.

[0010] In one embodiment of the present invention, the outer dimension of the adsorption area is smaller than the outer dimension of the area to be processed of the special-shaped ceramic.

[0011] In one embodiment of the utility model, surfaces of several hollow areas are provided with a polytetrafluoroethylene waterproof layer.

[0012] In one embodiment of the utility model, an outer frame adsorption area is also provided on the upper surface of the vacuum chamber, the outer frame adsorption area is arranged away from the adsorption area, and a hollow area is provided between the adsorption area and the outer frame adsorption area; a plurality of adsorption holes are evenly arranged in the outer frame adsorption area, and a rubber ring is arranged around the periphery of the adsorption area.

[0013] In one embodiment of the present invention, the vacuum chamber comprises: an upper chamber and a lower chamber, the upper chamber is sealingly connected to the lower chamber, and the lower chamber is detachably connected to the rotating pitch platform.

[0014] In one embodiment of the present invention, the middle areas of the upper cavity and the lower cavity are sealed and connected by a rubber seal, and the surrounding areas of the upper cavity and the lower cavity are connected by screws.

[0015] In one embodiment of the utility model, the adsorption area, the hollow area and the outer frame adsorption area are all arranged on the upper cavity; the upper cavity is connected to the external vacuum equipment, and a negative pressure is formed on the adsorption surface of the adsorption area and the outer frame adsorption area to adsorb special-shaped ceramics.

[0016] In one embodiment of the utility model, the tooling for processing special-shaped ceramics by water-guided laser also includes: a base, a vacuum chamber, a rotating pitch platform and a base arranged in sequence from top to bottom, and the base is fixedly connected to a machine tool workbench.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model is a tool for processing special-shaped ceramics by water-guided laser. Based on vacuum adsorption, a hollow area is arranged outside the adsorption area, and the hollow area is made to overlap with the area to be processed of the special-shaped ceramic. During the processing of the water-guided laser, the processing trajectory of the water-guided laser is always located in the hollow area, which will not damage the tool and avoid the pressure drop phenomenon caused by the penetration of the adsorption area. The suction force will not decrease during the whole processing process, thereby ensuring the adsorption performance of the special-shaped ceramic, and further ensuring the processing accuracy and processing quality.

[0019] The adsorption area of ​​the vacuum cavity of the utility model is evenly provided with a plurality of adsorption holes, and the adsorption surfaces composed of the plurality of adsorption holes are all in the same plane, so that the contact surface between the vacuum cavity and the special-shaped ceramic remains flat, and then the rubber ring is used to provide sealing for the adsorption area, thereby ensuring close contact between the vacuum cavity and the special-shaped ceramic, and being able to provide continuous and stable vacuum suction.

[0020] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of a tooling for special-shaped ceramic processing by water-guided laser provided in an embodiment of the utility model;

[0022] Figure 2 It is a top view of the structure of a tooling for special-shaped ceramic processing by water-guided laser provided in an embodiment of the utility model;

[0023] Figure 3 It is a schematic diagram of the structure of the special-shaped ceramic processing tooling and special-shaped ceramics for water-guided laser provided in the embodiment of the utility model;

[0024] Figure 4 It is a schematic diagram of the exploded structure of the vacuum chamber provided in an embodiment of the utility model.

[0025] Figure numerals: 100 - vacuum chamber; 110 - adsorption area; 120 - hollow area; 130 - rubber ring; 140 - outer frame adsorption area; 150 - upper chamber; 160 - lower chamber; 200 - rotating pitch platform; 300 - base; 10 - special-shaped ceramic. DETAILED DESCRIPTION

[0026] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the following is a detailed description of a special-shaped ceramic processing tool for water-guided laser proposed according to the present invention in combination with the accompanying drawings and specific implementation methods.

[0027] The above and other technical contents, features and effects of the utility model are clearly presented in the following detailed description of the specific implementation mode in conjunction with the accompanying drawings. Through the description of the specific implementation mode, the technical means and effects adopted by the utility model to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation, and are not used to limit the technical solution of the utility model.

[0028] Embodiment 1

[0029] The to-be-processed area of ​​special-shaped ceramics is usually arranged alternately with its non-processed area. During the water-guided laser processing, as part of the processing area of ​​the special-shaped ceramic is penetrated, the suction force changes when using the traditional whole-surface adsorption fixing method, that is, the pressure drop phenomenon occurs, which causes the special-shaped ceramic to move slightly and further affects the processing accuracy and processing quality. In view of this, the utility model provides a special-shaped ceramic processing tool for water-guided laser.

[0030] like Figures 1 to 4 As shown, in this embodiment, a tool for processing special-shaped ceramics using water-guided laser includes: a vacuum chamber 100 and a rotating pitch platform 200 .

[0031] Specifically, a plurality of adsorption areas 110 and a plurality of hollow areas 120 are alternately arranged on the vacuum chamber 100, wherein the adsorption surfaces of the plurality of adsorption areas 110 are coplanar, and a plurality of adsorption holes are evenly arranged in each adsorption area 110; the surfaces of the plurality of hollow areas 120 are all lower than the adsorption surface; a rubber ring 130 is arranged around the periphery of the plurality of adsorption areas 110; the vacuum chamber 100 adsorbs the special-shaped ceramic 10 through the plurality of adsorption holes, and the hollow area 120 coincides with the area to be processed of the special-shaped ceramic 10.

[0032] The principle is that a vacuum adsorption flow channel is provided in the vacuum chamber 100, through which a plurality of adsorption holes are connected with external vacuum equipment, and negative pressure is formed on the adsorption surfaces of a plurality of adsorption areas 110 to adsorb the shaped ceramics 10; at the same time, in order to ensure stable adsorption, the adsorption surfaces of the plurality of adsorption areas 110 are set to be flat surfaces located in the same plane, and a rubber ring 130 is arranged around the adsorption area 110 to prevent air leakage and prevent the shaped ceramics 10 from micro-moving due to insufficient suction caused by air leakage.

[0033] Exemplarily, the adsorption area 110 is used to adsorb the non-processed area of ​​the shaped ceramic 10 , and the overlapping area between the adsorption area 110 and the non-processed area of ​​the shaped ceramic 10 is not less than 90% of the surface area of ​​the non-processed area of ​​the shaped ceramic 10 .

[0034] Furthermore, the overlapping area between the adsorption area 110 and the non-processing area of ​​the shaped ceramic 10 is not less than 80% of the surface area of ​​the shaped ceramic 10 .

[0035] It should be noted that the shaped ceramic 10 itself often has a certain degree of warping, which indicates the flatness of the shaped ceramic 10, that is, the shaped ceramic 10 to be adsorbed and fixed does not have a completely horizontal surface. Therefore, it is necessary to ensure at least 90% overlap area and at least 80% adsorption area, and maintain sufficient suction force so that the surface of the shaped ceramic 10 is in close contact with the adsorption area 110.

[0036] In an optional embodiment, the surfaces of the plurality of hollow areas 120 are provided with a polytetrafluoroethylene waterproof layer, and the waterproof treatment is performed to prevent the water-conducting laser from penetrating the processing area of ​​the shaped ceramic 10 and damaging the surface of the vacuum chamber 100.

[0037] It is worth noting that since a hollow area 120 is provided on the vacuum chamber 100, the non-processing area of ​​the shaped ceramic 10 is avoided through the hollow area 120. During the water-guided laser processing, the processing trajectory of the water-guided laser is always located in the hollow area 120. The water-guided laser will not damage the tooling, and it also avoids air leakage caused by penetration of the adsorption area, thereby ensuring the processing accuracy and processing quality.

[0038] like Figure 2 and Figure 3 As shown, the outer dimensions of the adsorption area 110 are S 1 is smaller than the outer dimensions of the area to be processed of the shaped ceramic 10 S 2, in order to prevent the water-conducting laser from penetrating the processing area of ​​the special-shaped ceramic 10 and damaging the surface of the vacuum chamber 100, thereby causing air leakage in the vacuum chamber 100.

[0039] Furthermore, in order to prevent the outer contour of the ceramic from falling off during water-conducting laser cutting and causing damage to the processed special-shaped ceramic 10, an outer frame adsorption area 140 is also provided on the upper surface of the vacuum chamber 100. The outer frame adsorption area 140 is provided away from the adsorption area 110, and a hollow area 120 is provided between the adsorption area 110 and the outer frame adsorption area 140; a plurality of adsorption holes are evenly provided in the outer frame adsorption area 140, and a rubber ring 130 is provided around the periphery of the adsorption area 110.

[0040] The principle is that during the water-guided laser processing, it is necessary to process based on the ceramic plate, first process the internal contour, that is, the area to be processed between the non-processing areas, and then process the external contour, that is, cut the next circle along the periphery. After the external contour processing is completed, if an independent outer frame adsorption area 140 is not set, the ceramic outer contour will fall freely, thereby damaging the processed special-shaped ceramic 10. By setting the outer frame adsorption area 140, the cut ceramic outer contour still maintains a good adsorption state, ensuring the processing quality.

[0041] like Figure 4 As shown, in an optional embodiment, the vacuum chamber 100 includes: an upper chamber 150 and a lower chamber 160, the upper chamber 150 is sealed and connected to the lower chamber 160, and the lower chamber 160 is detachably connected to the rotating tilting stage 200. The middle area of ​​the upper chamber 150 and the lower chamber 160 is sealed and connected by a rubber seal, and the surrounding areas of the upper chamber 150 and the lower chamber 160 are connected by screws.

[0042] The principle is that, for the convenience of assembly, the adsorption area 110, the hollow area 120 and the outer frame adsorption area 140 are all arranged on the upper cavity 150, and then a lower cavity 160 is separately arranged to connect the upper cavity 150 and the rotating pitch table 200 respectively; the upper cavity 150 is connected to the external vacuum equipment, and a negative pressure is formed on the adsorption surface of the adsorption area 110 and the outer frame adsorption area 140 to adsorb the special-shaped ceramic 10.

[0043] In this embodiment, the vacuum chamber 100 is disposed on a rotating pitching platform 200, and the rotating pitching platform 200 is used to drive the vacuum chamber 100 to perform rotational motion or pitching motion. The rotational motion makes the shaped ceramic 10 perpendicular to the water-guided laser, and the pitching motion reduces the machining taper of the upper and lower surfaces of the shaped ceramic 10, thereby ensuring machining accuracy and quality.

[0044] Exemplarily, the rotating pitch platform 200 is manually adjusted, and its model is GFY6030. The uppermost layer and the lower layer of the rotating pitch platform 200 can make a relative rotation of 360°. The lower layer of the rotating pitch platform 200 is respectively provided with two relatively vertical fine-tuning screws. The pitch adjustment along the left and right directions and the front and back directions can be achieved by rotating the corresponding fine-tuning screws.

[0045] It is worth noting that when the warping of the shaped ceramic 10 is too large, the water-guided laser processing in the vertical direction will cause a large error between the upper and lower surfaces of the shaped ceramic 10. The pitch adjustment can compensate to a certain extent for the effect of the warping of the shaped ceramic 10 itself on the processing accuracy and reduce the taper of the upper and lower surfaces.

[0046] In an optional embodiment, the tooling for special-shaped ceramic processing by water-guided laser further includes: a base 300, wherein the vacuum chamber 100, the rotating pitch platform 200 and the base 300 are arranged in sequence from top to bottom, and the base 300 is fixedly connected to the machine tool workbench.

[0047] The working principle of the special-shaped ceramic processing tooling for water-guided laser of the utility model is:

[0048] The entire tooling is fixed on the machine tool workbench through the base 300, and the rotating pitch table 200 and the vacuum chamber 100 are connected in sequence, and the shaped ceramic 10 is adsorbed on the vacuum chamber 100, and the vacuum suction force is adjusted to keep the vacuum suction force above 20kPa. The surface of the shaped ceramic 10 is observed by the equipment camera on the water-guided laser, and the pitch position of the shaped ceramic 10 is adjusted by the rotating pitch table 200, so that the marking line on the shaped ceramic 10 coincides with or is parallel to the camera crosshairs, and the center point of the marking line on the shaped ceramic 10 is collected as the processing zero point. The water-guided laser processing program is generated according to the processing requirements, and the shaped ceramic 10 is cut from the processing zero point. During the processing, the internal contour is processed first, that is, the area to be processed between the non-processing areas, and then the external contour is processed to ensure stable adsorption. After the overall processing is completed, the vacuum chamber 100 is separated from the vacuum, and the processed shaped ceramic 10 is removed.

[0049] The utility model is a tool for processing special-shaped ceramics by water-guided laser. Based on vacuum adsorption, a hollow area is arranged outside the adsorption area, and the hollow area is made to overlap with the area to be processed of the special-shaped ceramic. During the processing of the water-guided laser, the processing trajectory of the water-guided laser is always located in the hollow area, which will not damage the tool and avoid the pressure drop phenomenon caused by the penetration of the adsorption area. The suction force will not decrease during the whole processing process, thereby ensuring the adsorption performance of the special-shaped ceramic, and further ensuring the processing accuracy and processing quality.

[0050] The adsorption area of ​​the vacuum cavity of the utility model is evenly provided with a plurality of adsorption holes, and the adsorption surfaces composed of the plurality of adsorption holes are all in the same plane, so that the contact surface between the vacuum cavity and the special-shaped ceramic remains flat, and then the rubber ring is used to provide sealing for the adsorption area, thereby ensuring close contact between the vacuum cavity and the special-shaped ceramic, and being able to provide continuous and stable vacuum suction.

[0051] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant is intended to cover non-exclusive inclusion, so that the article or device including a series of elements includes not only those elements, but also other elements that are not explicitly listed. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or device including the elements. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The orientation or position relationship indicated by "up", "down", "left", "right", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the utility model.

[0052] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A tool for processing special-shaped ceramics by water-guided laser, characterized in that: include: A vacuum chamber (100) and a rotating pitch table (200); The upper surface of the vacuum chamber (100) is staggered with a plurality of adsorption areas (110) and a plurality of hollow areas (120), wherein the adsorption surfaces of the plurality of adsorption areas (110) are arranged coplanarly, and a plurality of adsorption holes are evenly arranged in each of the adsorption areas (110); the surfaces of the plurality of hollow areas (120) are all lower than the adsorption surface; and a rubber ring (130) is arranged around the periphery of the plurality of adsorption areas (110); The vacuum chamber (100) adsorbs the shaped ceramic (10) through a plurality of the adsorption holes, and the hollow area (120) partially overlaps with the area to be processed of the shaped ceramic (10); The vacuum chamber (100) is arranged on the rotating and pitching platform (200); the rotating and pitching platform (200) is used to drive the vacuum chamber (100) to perform a rotating motion or a pitching motion.

2. The special-shaped ceramic processing tool for water-guided laser according to claim 1 is characterized in that: The adsorption area (110) is used to adsorb the non-processing area of ​​the shaped ceramic (10), and the overlapping area between the adsorption area (110) and the non-processing area of ​​the shaped ceramic (10) is not less than 90% of the surface area of ​​the non-processing area of ​​the shaped ceramic (10).

3. The special-shaped ceramic processing tool for water-guided laser according to claim 1 is characterized in that: The overlapping area between the adsorption area (110) and the non-processing area of ​​the special-shaped ceramic (10) is not less than 80% of the surface area of ​​the special-shaped ceramic (10).

4. The special-shaped ceramic processing tool for water-guided laser according to claim 1 is characterized in that: The external dimensions of the adsorption area (110) are smaller than the external dimensions of the area to be processed of the special-shaped ceramic (10).

5. The tooling for special-shaped ceramic processing for water-guided laser according to claim 1 is characterized in that: The surfaces of the plurality of hollow areas (120) are all provided with a polytetrafluoroethylene waterproof layer.

6. The tooling for special-shaped ceramic processing for water-guided laser according to claim 1 is characterized in that: The upper surface of the vacuum chamber (100) is further provided with an outer frame adsorption area (140), the outer frame adsorption area (140) is arranged away from the adsorption area (110), and the hollow area (120) is arranged between the adsorption area (110) and the outer frame adsorption area (140); A plurality of adsorption holes are evenly arranged in the outer frame adsorption area (140), and the rubber ring (130) is arranged around the outer periphery of the adsorption area (110).

7. The tooling for special-shaped ceramic processing for water-guided laser according to claim 6 is characterized in that: The vacuum chamber (100) comprises: an upper chamber (150) and a lower chamber (160); the upper chamber (150) is sealedly connected to the lower chamber (160); and the lower chamber (160) is detachably connected to the rotating tilting platform (200).

8. The tooling for special-shaped ceramic processing for water-guided laser according to claim 7 is characterized in that: The middle areas of the upper cavity (150) and the lower cavity (160) are sealed and connected via a rubber seal, and the surrounding areas of the upper cavity (150) and the lower cavity (160) are connected via screws.

9. The tooling for special-shaped ceramic processing for water-guided laser according to claim 7, characterized in that: The adsorption area (110), the hollow area (120) and the outer frame adsorption area (140) are all arranged on the upper cavity (150); the upper cavity (150) is connected to an external vacuum device, and forms a negative pressure on the adsorption surfaces of the adsorption area (110) and the outer frame adsorption area (140) to adsorb the special-shaped ceramic (10).

10. The tooling for special-shaped ceramic processing for water-guided laser according to claim 1, characterized in that: Also includes: A base (300), the vacuum chamber (100), the rotating pitch platform (200) and the base (300) are arranged in sequence from top to bottom, and the base (300) is fixedly connected to a machine tool workbench.

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