Assembling tool for radiator and power element and assembling production line formed by assembling tool

Abstract

The utility model provides an assembly tool of a radiator and a power element and an assembly production line formed by the assembly tool of the radiator and the power element, and the assembly tool comprises a base which is provided with a placing groove matched with the radiator; the thermal grease positioning plate is provided with a smearing through hole, and the smearing through hole corresponds to an area to be smeared with thermal grease in the radiator; the power element positioning plate is provided with element through holes matched with the power elements, and the element through holes correspond to areas, where the power elements are to be assembled, in the radiator; the area to be coated with the thermal grease in the radiator coincides with the area to be assembled with the power element in the radiator. According to the invention, uniform coating of the thermal grease is realized by means of the thermal grease positioning plate, accurate placement and assembly of the power element are realized by means of the power element positioning plate, and the assembly accuracy of the power element is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component assembly, in particular to an assembly tool for a heater and a power component and an assembly production line formed therefrom. Background Art

[0002] In the electronics industry, power components and heat sinks need to be assembled together. Power components include IPM components, IGBTs, rectifier bridges and other components. The heat sink is a device that uses air cooling or water cooling to remove the heat of the power components in operation in a timely manner.

[0003] The method of assembling power components and heat sinks in the prior art is: first brush the heat dissipation solder paste on the heat sink or power component, and after brushing the heat dissipation solder paste, manually take a single power component and place it on the heat sink coated with the heat dissipation solder paste, and then fix the power component and the heat sink. During the operation, the manual placement of the power component may be offset or exceed the quality abnormality of the area coated with the heat dissipation solder paste. Moreover, since the application of the heat dissipation solder paste and the placement of the power component are two separate steps, it is impossible to effectively ensure the accuracy of the heat dissipation solder paste coating position, and it is also impossible to ensure the correspondence between the heat dissipation solder paste coating position and the power component placement position, thereby affecting the assembly efficiency and accuracy of the power component and the heat sink. At the same time, the manual application of the heat dissipation solder paste in the prior art cannot ensure the uniformity of the application of the heat dissipation solder paste, and it will also cause the problem of loose connection between the power component and the heat sink. Utility Model Content

[0004] In order to overcome the problems existing in the related technology, one of the purposes of the utility model is to provide an assembly tool for a heat sink and a power element, which can achieve uniform coating of the heat sink paste with the help of a heat sink paste positioning plate, and can achieve precise placement and assembly of the power element with the help of a power element positioning plate, thereby improving the assembly accuracy of the power element.

[0005] An assembly tool for a radiator and a power element, comprising:

[0006] The base is provided with a placement groove adapted to the radiator;

[0007] A heat dissipation paste positioning plate is provided with a coating through hole, wherein the coating through hole corresponds to an area of ​​the heat sink to be coated with the heat dissipation paste;

[0008] The power element positioning plate is provided with element through holes adapted to the power elements, and the element through holes correspond to the areas in the radiator where the power elements are to be assembled; the areas in the radiator where the thermal paste is to be applied overlap with the areas in the radiator where the power elements are to be assembled.

[0009] When designing the component through holes and the coating through holes, the present application fully considers their positions, ensures that the thermal paste is evenly coated and precisely positioned, ensures that the power components are accurately assembled, and improves the assembly efficiency and assembly accuracy of the power components and the heat sink.

[0010] In a preferred technical solution of the utility model, the heat dissipation paste positioning plate is hinged to the base.

[0011] This application requires the use of a thermal paste positioning plate for positioning when applying thermal paste, and a power element positioning plate for positioning when placing power elements. Therefore, during the assembly of the power element and the heat sink, the thermal paste positioning plate and the power element positioning plate need to be frequently replaced. In this embodiment, the thermal paste positioning plate is hinged in the base, and the thermal paste positioning plate and the base can be assembled and separated by simply holding the thermal paste positioning plate and rotating it, which helps to improve the assembly efficiency between the thermal paste positioning plate and the base.

[0012] In a preferred technical solution of the utility model, a hinge shaft is provided in the heat dissipation paste positioning plate, a hinge seat is provided on the side where the groove is placed in the base, and both ends of the hinge shaft are rotatably connected to the hinge seat.

[0013] The hinge shaft is located at the edge of the thermal paste positioning plate, and the two ends of the hinge shaft are rotatably connected to the two hinge seats respectively. When the hinge shaft is rotated at any position of the thermal paste positioning plate, the thermal paste positioning plate can be covered in the placement groove, or rotated to a position separated from the placement groove. The structure of the hinge shaft and the hinge seat can ensure that the thermal paste positioning plate rotates smoothly relative to the base.

[0014] In a preferred technical solution of the utility model, a first positioning column is provided in the base, and a first positioning through hole adapted to the first positioning column is provided in the power element positioning plate.

[0015] When the power component positioning plate is covered in the base, it needs to be covered at the preset position and cannot be offset. If it is offset, it will cause the position of the component through hole to deviate, affecting the assembly position of the power component. At the same time, the power component positioning plate and the base need to be frequently assembled and separated. During each assembly, the first positioning column and the first positioning through hole can ensure that the position of the power component positioning plate in the base is fixed each time it is assembled. This ensures that the position of the power component placed in the same batch of radiators is consistent each time, improving the performance stability of the same batch of products.

[0016] In a preferred technical solution of the utility model, a second positioning column is provided in the base, and a second positioning through hole adapted to the second positioning column is provided in the heat dissipation grease positioning plate.

[0017] Since the position of the through hole in the thermal paste positioning plate needs to correspond to the position of the thermal paste to be applied in the radiator, when the thermal paste positioning plate is covered in the base, it needs to be covered at the preset position and cannot be offset. If it is offset, it will cause the position of the through hole to deviate, affecting the thermal paste application effect. At the same time, the thermal paste positioning plate and the base need to be frequently assembled and separated. During each assembly, the second positioning column and the second positioning through hole can ensure that the position of the thermal paste positioning plate in the base is fixed each time it is assembled. This ensures that the position of each application of thermal paste in the same batch of radiators is consistent, improving the performance stability of the same batch of products.

[0018] In a preferred technical solution of the utility model, the power element positioning plate is hinged to the base, the thermal grease positioning plate is hinged to the base, and the power element positioning plate and the thermal grease positioning plate are respectively located on opposite sides of the placement groove.

[0019] Through the structure of the articulated shaft and the articulated seat, it can be ensured that the power element positioning plate rotates smoothly relative to the base, and it can be ensured that the heat dissipation paste positioning plate rotates smoothly relative to the base.

[0020] In a preferred technical solution of the utility model, a fixing through hole is provided in the area of ​​the heat sink where the power element is to be assembled, and when the power element positioning plate is assembled with the base, the fixing through hole is located inside the element through hole.

[0021] In a preferred technical solution of the present utility model, the cross-sectional area of ​​the component through hole is greater than or equal to the cross-sectional area of ​​the coating through hole.

[0022] In the present application, the cross-sectional area of ​​the component through-hole is greater than or equal to the cross-sectional area of ​​the coating through-hole. This is because there is a one-to-one correspondence between the applied thermal paste and the coating through-hole, a one-to-one correspondence between the component through-hole and the power component, and there are multiple pins or contact surfaces in the power component that need to be assembled with the radiator. Therefore, the component through-hole includes the cross-sectional area of ​​at least one coating through-hole. When one of the surfaces of the power component needs to contact the radiator, the component through-hole corresponding to the power component has the same cross-sectional area as the coating through-hole corresponding to the power component. When only part of the power component needs to contact the radiator, the component through-hole corresponding to the power component is larger than the coating through-hole corresponding to the power component.

[0023] In a preferred technical solution of the utility model, two placement grooves are provided in the base.

[0024] In actual operation, by changing the size of the base, multiple placement grooves can be set in the base at the same time. Correspondingly, the positions and numbers of the coating through holes and component through holes in the thermal paste positioning plate and the power component positioning plate also need to correspond to multiple heat sinks.

[0025] The second purpose of the utility model is to provide an assembly production line, including an assembly tool for a heat sink and a power component as described above.

[0026] The thermal paste positioning plate is used to achieve uniform coating of the thermal paste, and the power component positioning plate is used to achieve precise placement and assembly of the power components, thereby improving the assembly accuracy of the power components and forming electronic devices of the same batch with stable performance.

[0027] The beneficial effects of the utility model are:

[0028] The utility model provides an assembly tool for a heat sink and a power element, comprising a base, a heat dissipation paste positioning plate and a power element positioning plate, wherein a placement groove adapted to the heat sink is provided in the base plate, and the placement groove is used to place the heat sink; a coating through hole is provided in the heat dissipation paste positioning plate, and the coating through hole corresponds to the area in the heat sink to be coated with solder paste; and a component through hole adapted to the power element is provided in the power element positioning plate, and the component through hole corresponds to the area in the heat sink to be assembled with the power element. When the heat dissipation paste positioning plate is covered on the base, the coating through hole exposes the position where the heat dissipation paste needs to be coated, and at this time, the heat dissipation paste can be coated in the heat sink through the coating through hole, and the heights of the multiple coating through holes are the same, ensuring that the thickness of the heat dissipation paste coated at different positions of the heat sink is the same, and due to the limiting effect of the coating through hole, the heat dissipation paste with the same thickness and uniform distribution can be coated at the position where the heat dissipation paste needs to be coated. When the power element positioning plate is covered in the base, since the power element corresponds to the element through-hole one by one, the power element can be placed in the element through-hole at this time. Since the area in the radiator to be coated with solder paste overlaps with the area in the radiator to be assembled with the power element, the power element and the radiator can be assembled through the combination of thermal paste. Due to the limiting effect of the element through-hole, the placement position of the power element can be ensured to be accurate. When designing the element through-hole and the coating through-hole, the position of the element through-hole is fully considered in this application, ensuring that the thermal paste is evenly coated and accurately positioned, ensuring the accurate assembly position of the power element, and improving the assembly efficiency and assembly accuracy of the power element and the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of the structure of the base;

[0030] Figure 2 Schematic diagram of the assembly of the base and thermal paste positioning plate;

[0031] Figure 3 It is a structural schematic diagram of the power component positioning board;

[0032] Figure 4 This is a schematic diagram of the structure of the assembly tooling for this application.

[0033] Reference numerals:

[0034] 10. Assembly platform; 11. Base; 12. Placement groove; 13. First positioning column; 14. Articulated seat; 21. Thermal paste positioning plate; 22. Application through hole; 23. First positioning through hole; 24. Articulated shaft; 31. Power component positioning plate; 32. Component through hole; 33. Second positioning through hole. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0036] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "the" used in the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0037] It should be understood that although the terms "first", "second", "third", etc. may be used to describe various information in the present invention, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0038] Example 1

[0039] like Figure 1-Figure 4 As shown, a heat sink and power component assembly tool includes:

[0040] The base 11 is provided with a placement groove 12 adapted to the radiator; the placement groove 12 is used to place the radiator;

[0041] The thermal paste positioning plate 21 is provided with an application through hole 22, and the application through hole 22 corresponds to the area of ​​the radiator to be applied with thermal paste; when the thermal paste positioning plate 21 covers the base 11, the application through hole 22 exposes the position where the thermal paste needs to be applied, and at this time, the thermal paste can be applied to the radiator through the application through hole 22. The heights of multiple application through holes 22 are the same, ensuring that the thickness of the thermal paste applied at different positions of the radiator is the same, and due to the limiting effect of the application through hole 22, the thermal paste with the same thickness and uniform distribution can be applied to the position where the thermal paste needs to be applied.

[0042] The power element positioning plate 31 is provided with an element through hole 32 adapted to the power element, and the element through hole 32 corresponds to the area of ​​the radiator where the power element is to be assembled; the area of ​​the radiator where the thermal paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled. When the power element positioning plate 31 is covered in the base 11, since the power element corresponds to the element through hole 32 one by one, the power element can be placed in the element through hole 32 at this time, and since the area of ​​the radiator where the solder paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled, the power element and the radiator can be assembled through the combination of the thermal paste, and the positioning of the power element can be ensured to be accurate due to the limiting effect of the element through hole 32.

[0043] In the present application, the radiator can be connected to multiple power components at the same time. When each power component is connected to the radiator, it is necessary to apply thermal paste on multiple pins or other contact surfaces of the power component. Therefore, the position of the coating through hole 22 is not necessarily one-to-one corresponding to the power component. For the same power component, its multiple pins and other contact surfaces can be assembled with the radiator. Therefore, multiple coating through holes 22 need to be set for the same power component. When setting the coating through holes 22, the position of the pins and contact surfaces that need to be assembled on the power component needs to be considered, and all positions that need to contact the radiator are correspondingly set with coating through holes 22. In other words, the position of the coating through holes 22 in the thermal paste positioning plate 21 in the present application corresponds one-to-one to the position and size of the radiator where thermal paste needs to be applied. When the thermal paste positioning plate 21 is covered on the base 11, the coating through holes 22 can expose the area in the radiator where thermal paste needs to be applied. At the same time, the thickness of the thermal paste positioning plate 21 of the present application is uniform and consistent, which can ensure that the thickness of each coating through hole 22 is the same. It is only necessary to evenly apply the thermal paste in the coating through hole 22 according to the position and size of the coating through hole 22, so as to ensure that the area in the radiator that needs to be coated with thermal paste is coated with thermal paste of uniform thickness and will not exceed the boundary of the set area.

[0044] In the present application, the power element positioning plate 31 needs to correspond to and fit with the power element one by one. When the power element positioning plate 31 is covered in the base 11, the size of the element through hole 32 can be greater than or equal to the size of the area that has been coated with solder paste. When designing the element through hole 32, the size and shape of the power element have been taken into consideration to ensure that the shape and size of the power element and the element through hole 32 correspond. In this way, it is only necessary to place the power element in the element through hole 32, and use the gravity of the power element itself or the external pressing force to fix the power element and the radiator together with the thermal paste. In the present application, in addition to being adapted to the shape and size of the power element, the element through hole 32 also needs to correspond in position to the area to be coated with thermal paste, or the area that has been coated with thermal paste, so as to ensure that when the power element is placed, the thermal paste has been coated between the power element and the radiator.

[0045] When the power element positioning plate 31 is covered in the base 11, the element through hole 32 may contain multiple thermal pastes that have been applied, that is, multiple pins or contact surfaces in the power element need to be fixed in the radiator. In view of the one-to-one correspondence between the applied thermal paste and the application through hole 22, it is explained that the size of the element through hole 32 in this application is greater than or equal to the application through hole 22. The application through hole 22 is set at the position where the thermal paste needs to be applied, and the element through hole 32 is set at the position where the power element needs to be placed, and the position where the power element needs to be placed must have been fully or partially coated with thermal paste.

[0046] When designing the component through hole 32 and the coating through hole 22, the present application fully considers their positions, ensures that the thermal paste is evenly coated and accurately positioned, ensures that the power component is accurately assembled, and improves the assembly efficiency and assembly accuracy of the power component and the heat sink.

[0047] Example 2

[0048] like Figure 1-Figure 4 As shown, a heat sink and power component assembly tool includes:

[0049] The base 11 is provided with a placement groove 12 adapted to the radiator; the placement groove 12 is used to place the radiator;

[0050] The thermal paste positioning plate 21 is provided with an application through hole 22, and the application through hole 22 corresponds to the area of ​​the radiator to be applied with thermal paste; when the thermal paste positioning plate 21 covers the base 11, the application through hole 22 exposes the position where the thermal paste needs to be applied, and at this time, the thermal paste can be applied to the radiator through the application through hole 22. The heights of multiple application through holes 22 are the same, ensuring that the thickness of the thermal paste applied at different positions of the radiator is the same, and due to the limiting effect of the application through hole 22, the thermal paste with the same thickness and uniform distribution can be applied to the position where the thermal paste needs to be applied.

[0051] The power element positioning plate 31 is provided with an element through hole 32 adapted to the power element, and the element through hole 32 corresponds to the area of ​​the radiator where the power element is to be assembled; the area of ​​the radiator where the thermal paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled. When the power element positioning plate 31 is covered in the base 11, since the power element corresponds to the element through hole 32 one by one, the power element can be placed in the element through hole 32 at this time, and since the area of ​​the radiator where the solder paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled, the power element and the radiator can be assembled through the combination of the thermal paste, and the positioning of the power element can be ensured to be accurate due to the limiting effect of the element through hole 32.

[0052] Furthermore, the thermal paste positioning plate 21 described in the present application is hinged to the base 11. That is to say, the thermal paste positioning plate 21 can be rotatably connected to the base 11, which can increase the assembly and separation efficiency between the thermal paste positioning plate 21 and the base 11. The present application requires the use of the thermal paste positioning plate 21 for positioning when applying thermal paste, and the power element positioning plate 31 is required for positioning when placing power elements. Therefore, during the assembly process of the power element and the radiator, the thermal paste positioning plate 21 and the power element positioning plate 31 need to be frequently replaced. In this embodiment, the thermal paste positioning plate 21 is hinged to the base 11, and the assembly and separation between the thermal paste positioning plate 21 and the base 11 can be achieved by only holding the thermal paste positioning plate 21 and rotating it, which helps to improve the assembly efficiency between the thermal paste positioning plate 21 and the base 11.

[0053] In the present application, a hinge shaft 24 is provided in the heat dissipation grease positioning plate 21, and a hinge seat 14 is provided on the side of the base 11 where the groove 12 is placed. Specifically, the base 11 can be fixed in the assembly platform 10, and a hinge seat 14 is provided in the assembly platform 10. The hinge seat 14 is located on the side of the base 11, and the two ends of the hinge shaft 24 are rotatably connected to the hinge seat 14. The hinge shaft 24 is located at the edge of the heat dissipation grease positioning plate 21, and the two ends of the hinge shaft 24 are rotatably connected to the two hinge seats 14 respectively. Figure 2 As shown, when the handheld thermal paste positioning plate 21 rotates the hinge shaft 24 at any position, the thermal paste positioning plate 21 can cover the placement groove 12, or rotate to a position separated from the placement groove 12. Through the structure of the hinge shaft 24 and the hinge seat 14, it can be ensured that the thermal paste positioning plate 21 rotates smoothly relative to the base 11.

[0054] The base 11 described in the present application is provided with a second positioning column, and the thermal paste positioning plate 21 is provided with a second positioning through hole 33 adapted to the second positioning column. Since the position of the application through hole 22 in the thermal paste positioning plate 21 needs to correspond to the position of the thermal paste to be applied in the radiator, when the thermal paste positioning plate 21 is covered in the base 11, it needs to be covered at the preset position and no position shift can occur. If a position shift occurs, it will cause the position of the application through hole 22 to deviate, affecting the application effect of the thermal paste. At the same time, the thermal paste positioning plate 21 and the base 11 need to be frequently assembled and separated. During each assembly, with the help of the second positioning column and the second positioning through hole 33, it can be ensured that the position of the thermal paste positioning plate 21 assembled in the base 11 is fixed each time, so that the position of each application of the thermal paste in the same batch of radiators can be ensured to be consistent, thereby improving the performance stability of the same batch of products.

[0055] Correspondingly, the base 11 of the present application is provided with a first positioning column 13 , and the power element positioning plate 31 is provided with a first positioning through hole 23 adapted to the first positioning column 13 .

[0056] Similarly, when the power element positioning plate 31 is covered in the base 11, it needs to be covered at the preset position and cannot be offset. If it is offset, it will cause the position of the element through hole 32 to deviate, affecting the assembly position of the power element. At the same time, the power element positioning plate 31 and the base 11 need to be frequently assembled and separated. During each assembly, the first positioning column 13 and the first positioning through hole 23 can ensure that the position of the power element positioning plate 31 in the base 11 is fixed each time, so that the position of the power element placed in the same batch of radiators can be kept consistent each time, thereby improving the performance stability of the same batch of products.

[0057] In this embodiment, the power element positioning plate 31 and the base 11 are two independent entities. The power element positioning plate 31 and the base 11 are assembled and separated by the cooperation of the first positioning column 13 and the first positioning through hole 23. Figure 2 shown.

[0058] Example 3

[0059] The difference from Example 2 is that: the power element positioning plate 31 is hinged to the base 11, the thermal grease positioning plate 21 is hinged to the base 11, and the power element positioning plate 31 and the thermal grease positioning plate 21 are respectively located on opposite sides of the placement groove 12.

[0060] Specifically, the base 11 is fixed in the assembly platform 10. The base 11 is arranged in the middle position of the assembly platform 10 of the present application. Two hinged seats 14 are arranged on both sides of the base 11. The two hinged seats 14 located on the same side of the base 11 form a group of fixing parts for rotationally connecting with the heat dissipation paste positioning plate 21 or the power element positioning plate 31.

[0061] In actual operation, a base 11 is provided in the middle position of the assembly platform 10, and a group of fixing parts are provided on the left side of the base 11, and the fixing parts include two hinge seats 14. A first hinge shaft is provided on the side of the power element positioning plate 31, and the first hinge shaft is rotatably connected to the two hinge seats 14 on the left side. In this embodiment, the power element positioning plate 31 is hinged in the assembly platform 10, and the assembly and separation between the power element positioning plate 31 and the assembly platform 10 can be achieved by only holding the power element positioning plate 31 and rotating it, which helps to improve the assembly efficiency between the power element positioning plate 31 and the base 11. When the first hinge shaft is rotated at any position of the handheld power element positioning plate 31, the power element positioning plate 31 can be covered in the placement groove 12, or rotated to a position separated from the placement groove 12. Through the structure of the first hinge shaft and the hinge seat 14, it can be ensured that the power element positioning plate 31 rotates smoothly in the assembly platform 10.

[0062] Another set of fixing parts is provided on the right side of the assembly platform 10, and the fixing parts include two hinge seats 14. A second hinge shaft is provided on the side of the thermal paste positioning plate 21, and the second hinge shaft is rotatably connected to the two hinge seats 14 on the right side. In this embodiment, the thermal paste positioning plate 21 is hinged in the assembly platform 10, and the thermal paste positioning plate 21 can be assembled and separated from the base 11 only by holding the thermal paste positioning plate 21 and rotating it, which helps to improve the assembly efficiency between the thermal paste positioning plate 21 and the base 11. When the thermal paste positioning plate 21 is held and the second hinge shaft is rotated at any position, the thermal paste positioning plate 21 can be covered in the placement groove 12, or rotated to a position separated from the placement groove 12. The structure of the second hinge shaft and the hinge seat 14 can ensure that the thermal paste positioning plate 21 rotates smoothly in the assembly platform 10.

[0063] Example 4

[0064] like Figure 1-Figure 4 As shown, a heat sink and power component assembly tool includes:

[0065] The base 11 is provided with a placement groove 12 adapted to the radiator; the placement groove 12 is used to place the radiator;

[0066] The thermal paste positioning plate 21 is provided with an application through hole 22, and the application through hole 22 corresponds to the area of ​​the radiator to be applied with thermal paste; when the thermal paste positioning plate 21 covers the base 11, the application through hole 22 exposes the position where the thermal paste needs to be applied, and at this time, the thermal paste can be applied to the radiator through the application through hole 22. The heights of multiple application through holes 22 are the same, ensuring that the thickness of the thermal paste applied at different positions of the radiator is the same, and due to the limiting effect of the application through hole 22, the thermal paste with the same thickness and uniform distribution can be applied to the position where the thermal paste needs to be applied.

[0067] The power element positioning plate 31 is provided with an element through hole 32 adapted to the power element, and the element through hole 32 corresponds to the area of ​​the radiator where the power element is to be assembled; the area of ​​the radiator where the thermal paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled. When the power element positioning plate 31 is covered in the base 11, since the power element corresponds to the element through hole 32 one by one, the power element can be placed in the element through hole 32 at this time, and since the area of ​​the radiator where the solder paste is to be applied overlaps with the area of ​​the radiator where the power element is to be assembled, the power element and the radiator can be assembled through the combination of the thermal paste, and the positioning of the power element can be ensured to be accurate due to the limiting effect of the element through hole 32.

[0068] The area to be assembled with the power element in the radiator of the present application is provided with a fixing through hole, and when the power element positioning plate 31 is assembled with the base 11, the fixing through hole is located inside the element through hole 32. When the power element and the radiator are assembled together by the thermal paste, it is also necessary to realize the fixed assembly of the radiator and the power element by fixing screws. The power element is provided with a fixing through hole, and the fixing through hole in the power element corresponds to the fixing through hole in the radiator. When the power element positioning plate 31 is covered in the placement groove 12, the fixing through hole in the radiator for connecting the power element is located inside the element through hole 32, which will not affect the assembly connection between the radiator and the power element. After the radiator and the power element are fixed by fixing screws, the power element positioning plate 31 is separated from the base 11. At this time, the radiator is assembled with the power element by the thermal paste and fixing screws, and the assembled components can be directly taken out from the placement groove 12.

[0069] In the present application, the cross-sectional area of ​​the component through hole 32 is greater than or equal to the cross-sectional area of ​​the coating through hole 22. This is because there is a one-to-one correspondence between the applied thermal paste and the coating through hole 22, and there is a one-to-one correspondence between the component through hole 32 and the power component, and there are multiple pins or contact surfaces in the power component that need to be assembled with the heat sink. Therefore, the component through hole 32 includes the cross-sectional area of ​​at least one coating through hole 22. When one of the surfaces of the power component needs to contact the heat sink, the component through hole 32 corresponding to the power component has the same cross-sectional area as the coating through hole 22 corresponding to the power component. When only part of the power component needs to contact the heat sink, the component through hole 32 corresponding to the power component is larger than the coating through hole 22 corresponding to the power component.

[0070] That is to say, the application through hole 22 is set at the position where the thermal paste needs to be applied, and the component through hole 32 is set at the position where the power component needs to be placed, and the position where the power component needs to be placed must have been fully or partially coated with thermal paste.

[0071] In order to improve the assembly efficiency of the heat sink, the present application can set two placement grooves 12 in the same base 11 for assembling two heat sinks at the same time. In actual operation, by changing the size of the base 11, multiple placement grooves 12 can be set in the base 11 at the same time. Correspondingly, the positions and numbers of the coating through holes 22 and the component through holes 32 in the thermal paste positioning plate 21 and the power component positioning plate 31 also need to correspond to the multiple heat sinks.

[0072] The present application also provides an assembly production line, including the assembly tooling of the heat sink and the power element as described above, for realizing the assembly of electronic devices. The heat dissipation paste positioning plate 21 is used to realize the uniform coating of the heat dissipation paste, and the power element positioning plate 31 is used to realize the accurate placement and assembly of the power element, thereby improving the assembly accuracy of the power element and forming electronic devices of the same batch with stable performance.

[0073] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings. In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0074] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a power element or feature and other power elements or features as shown in the figures. It should be understood that the spatially relative terms are intended to include different orientations of the power elements in use or operation in addition to the orientations described in the figures. For example, if the power element in the accompanying drawings is inverted, the power element described as "above other power elements or structures" or "above other power elements or structures" will be positioned as "below other power elements or structures" or "below other power elements or structures". Thus, the exemplary term "above" may include both "above" and "below". The power element may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein are interpreted accordingly.

[0075] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0076] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An assembly tool for a heat sink and a power component, characterized in that: include: A base (11) is provided with a placement groove (12) adapted to the radiator; A heat dissipation paste positioning plate (21) is provided with an application through hole (22), wherein the application through hole (22) corresponds to an area in the heat sink to which the heat dissipation paste is to be applied; The power element positioning plate (31) is provided with an element through hole (32) adapted to the power element, wherein the element through hole (32) corresponds to an area in the heat sink where the power element is to be assembled; and an area in the heat sink where the heat dissipation paste is to be applied overlaps with an area in the heat sink where the power element is to be assembled.

2. The assembly tool for heat sink and power element according to claim 1, characterized in that: The heat dissipation grease positioning plate (21) is hinged to the base (11).

3. The assembly tool for heat sink and power element according to claim 2, characterized in that: The heat dissipation grease positioning plate (21) is provided with a hinge shaft (24), and a hinge seat (14) is provided on the side of the base (11) where the groove (12) is placed, and both ends of the hinge shaft (24) are rotatably connected to the hinge seat (14).

4. The assembly tool for heat sink and power element according to claim 1, characterized in that: A first positioning column (13) is provided in the base (11), and a first positioning through hole (23) adapted to the first positioning column (13) is provided in the power element positioning plate (31).

5. The assembly tool for heat sink and power element according to claim 1, characterized in that: A second positioning column is provided in the base (11), and a second positioning through hole (33) adapted to the second positioning column is provided in the heat dissipation paste positioning plate (21).

6. The assembly tool for heat sink and power element according to claim 1, characterized in that: The power element positioning plate (31) is hinged to the base (11), the heat dissipation grease positioning plate (21) is hinged to the base (11), and the power element positioning plate (31) and the heat dissipation grease positioning plate (21) are respectively located on opposite sides of the placement groove (12).

7. The assembly tool for heat sink and power element according to claim 1, characterized in that: A fixing through hole is provided in the area of ​​the heat sink where the power element is to be assembled. When the power element positioning plate (31) is assembled with the base (11), the fixing through hole is located inside the element through hole (32).

8. The assembly tool for heat sink and power element according to claim 1, characterized in that: The cross-sectional area of ​​the element through hole (32) is greater than or equal to the cross-sectional area of ​​the coating through hole (22).

9. The assembly tool for heat sink and power element according to claim 1, characterized in that: Two placement grooves (12) are arranged in the base (11).

10. An assembly line, characterized in that: An assembly tool comprising a heat sink and a power element as described in any one of claims 1 to 9.

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