Crystal oscillator machining and grinding equipment

Abstract

The utility model discloses crystal oscillator machining and polishing equipment, and relates to the technical field of crystal oscillator machining. The crystal oscillator machining and grinding equipment comprises an equipment box, a machining cavity is formed in the surface of the front side of the equipment box, grinding equipment is arranged on the top wall of the machining cavity, rotating shafts are rotationally connected to the surfaces of the left side and the right side of the machining cavity correspondingly, and control blocks are fixedly connected to the surfaces of the sides, close to each other, of the two rotating shafts correspondingly; the surfaces of the sides, close to each other, of the two control blocks are slidably connected with sliding plates correspondingly, the surfaces of the sides, close to each other, of the two sliding plates are fixedly connected with first clamping rings, the upper surfaces of the first clamping rings are fixedly connected with positioning blocks, and the interior of the equipment box is hollow. According to the crystal oscillator polishing device, the crystal oscillator and the clamping device can be directly rotated and turned over through the turning-over structure after polishing is completed, so that the operation of clamping canceling, turning-over and clamping again like a traditional structure is not needed, the machining steps are simplified, and the overall polishing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal oscillator processing, in particular to a crystal oscillator processing and polishing device. Background Art

[0002] The crystal oscillator, abbreviated as crystal, is used to generate the original clock frequency. This frequency becomes various bus frequencies in the computer after being multiplied or divided by the frequency generator.

[0003] The crystal oscillator is one of the important components of the crystal oscillator. The thin and round crystal oscillator comes from a polyhedral quartz rod. It is first cut into a shiny hexahedral rod, and then through repeated cutting and grinding, the quartz rod is finally made into a pile of thin discs. In the processing of the crystal oscillator, both sides need to be polished to ensure its smooth surface for subsequent processing. However, the existing polishing equipment can only polish one side during polishing, resulting in the need to turn over and polish again after polishing. The overall process is relatively cumbersome, which reduces the polishing efficiency. In view of this, we propose a crystal oscillator processing and polishing equipment. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a crystal oscillator processing and polishing device, which can solve the problem that after single-side polishing, the surface needs to be turned over and re-fixed before the reverse side can be polished.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a crystal oscillator processing and polishing equipment, including an equipment box, a processing cavity is opened on the front surface of the equipment box, a polishing equipment is arranged on the top wall of the processing cavity, the left and right side surfaces of the processing cavity are respectively rotatably connected with rotating shafts, the side surfaces close to the two rotating shafts are fixedly connected with control blocks, the side surfaces close to the two control blocks are respectively slidably connected with sliding plates, the side surfaces close to the two sliding plates are fixedly connected with a first clamping ring, the upper surface of the first clamping ring is fixedly connected with a positioning block, the interior of the equipment box is arranged to be hollow, the right side rotating shaft rotates and penetrates into the interior of the equipment box, and a flip structure is arranged on the rotating shaft.

[0006] Preferably, the flip structure includes a worm wheel, which is sleeved on the outer surface of one end of the rotating shaft located inside the equipment box, and the outer surface of the worm wheel is meshingly connected with a worm, and the front end of the worm rotates to penetrate the front surface of the equipment box, and a sliding groove is provided on the side surface adjacent to the two control blocks, and the bottom walls of the two sliding grooves are rotatably connected to threaded rods, and the upper ends of the two threaded rods respectively rotate to penetrate the upper surfaces of the two control blocks.

[0007] Preferably, the two sliding plates are respectively threadedly sleeved on the outer surfaces of the two threaded rods, the side surfaces adjacent to the two control blocks are respectively fixedly connected with fixed plates, the side surfaces adjacent to the two fixed plates are fixedly connected with a second clamping ring, and the lower surface of the second clamping ring is provided with a groove adapted to the positioning block.

[0008] Preferably, a second sliding groove is provided on the rear inner wall of the processing chamber, and the second sliding groove extends into the interior of the equipment box. A connecting rod is fixedly connected to the rear surface of the grinding equipment, and a tooth plate is slidably connected to the inner wall of the second sliding groove. The rear end of the connecting rod is fixedly connected to the tooth plate, and the lower surface of the tooth plate extends into the interior of the equipment box.

[0009] Preferably, the left side surface of the tooth plate is meshedly connected with a first gear, a rotating rod is sleeved inside the first gear, the front and rear ends of the rotating rod are respectively rotatably connected to the inner wall of the equipment box, and a second gear is sleeved on the outer surface of the rotating rod.

[0010] Preferably, the outer surface of the second gear is meshingly connected with a second tooth plate, the upper end of the second tooth plate is fixedly connected with a sliding rod, the upper end of the sliding rod slides into the interior of the processing cavity, the upper end of the sliding rod is fixedly connected with a support plate, and the support plate is adapted to the inner walls of the first clamping ring and the second clamping ring.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] (1) When the crystal oscillator processing and polishing equipment is used for processing, the crystal oscillator is placed inside the first clamping ring and the edge of the crystal oscillator is closely aligned with the positioning block. The crystal oscillator is then clamped by the subsequent structure and then polished by the polishing equipment. After polishing, the right rotating shaft can be driven to rotate by the flipping structure. The rotation of the rotating shaft drives the first clamping ring to flip by the control block, and then the crystal oscillator is further polished. Through the above structure, when the crystal oscillator is polished, the flipping structure can be used to directly rotate and flip the crystal oscillator and the clamping equipment after polishing. Therefore, there is no need to cancel the clamping, flip and re-clamping operations as in the traditional structure, which simplifies the processing steps and improves the overall polishing efficiency.

[0013] (2) In the crystal oscillator processing and polishing equipment, the first gear rotates to drive the second gear to rotate using the rotating rod. After the second gear rotates, it drives the second tooth plate to rise. After the second tooth plate rises, it drives the support plate to rise through the sliding rod, thereby supporting the crystal oscillator. After the polishing is completed, the worm can be rotated to synchronously drive the worm wheel to rotate. After the worm wheel rotates, it drives the rotating shaft to rotate, thereby completing the flipping. Through the above structure, not only can the flipping after single-sided polishing be simple and convenient, but also the support plate can be automatically lifted up by the cooperation of the tooth plate and other structures when the polishing equipment descends to support the crystal oscillator, thereby avoiding the pressure generated by polishing causing the crystal oscillator to deform. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0015] Figure 1 This is a structural schematic diagram of a crystal oscillator processing and polishing device of the utility model;

[0016] Figure 2 This is a schematic diagram of the flip structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the toothed plate of the utility model;

[0018] Figure 4 for Figure 1 Enlarged view of point A in the middle;

[0019] Figure 5 for Figure 1 Enlarged view of point B in the middle.

[0020] Figure numerals: 1. Equipment box; 2. Processing chamber; 3. Grinding equipment; 4. Rotating shaft; 5. Control block; 6. Sliding plate; 7. First clamping ring; 8. Positioning block; 9. Worm gear; 10. Worm; 11. Sliding groove; 12. Threaded rod; 13. Fixed plate; 14. Second sliding groove; 15. Connecting rod; 16. Tooth plate; 17. First gear; 18. Rotating rod; 19. Second gear; 20. Second tooth plate; 21. Sliding rod; 22. Support plate; 23. Second clamping ring. DETAILED DESCRIPTION

[0021] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0022] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the present utility model, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] See also Figure 1-5 The utility model provides a technical solution: a crystal oscillator processing and polishing device, including an equipment box 1, a processing cavity 2 is opened on the front surface of the equipment box 1, a polishing device 3 is arranged on the top wall of the processing cavity 2, the left and right side surfaces of the processing cavity 2 are rotatably connected with rotating shafts 4, the side surfaces close to the two rotating shafts 4 are fixedly connected with control blocks 5, the side surfaces close to the two control blocks 5 are slidably connected with sliding plates 6, the side surfaces close to the two sliding plates 6 are fixedly connected with a first clamping ring 7, the upper surface of the first clamping ring 7 is fixedly connected with a positioning block 8, the interior of the equipment box 1 is set to be hollow, the right side rotating shaft 4 rotates and penetrates into the interior of the equipment box 1, and a flip structure is arranged on the rotating shaft 4. When processing, the crystal oscillator piece is turned by turning the crystal oscillator piece. It is placed inside the first clamping ring 7, and the edge of the crystal oscillator is closely aligned with the positioning block 8. The crystal oscillator is then clamped by the subsequent structure and then polished by the polishing equipment 3. After polishing, the right rotating shaft 4 can be driven to rotate by the flipping structure. The rotating shaft 4 rotates to drive the first clamping ring 7 to flip by the control block 5, and then the crystal oscillator can continue to be polished. Through the above structure, when polishing the crystal oscillator, the flipping structure can be used to directly rotate and flip the crystal oscillator and the clamping device after polishing. There is no need to cancel the clamping, flip and clamp again as in the traditional structure, which simplifies the processing steps and improves the overall polishing efficiency.

[0026] Furthermore, the flip structure includes a worm wheel 9, which is sleeved on the outer surface of one end of the rotating shaft 4 located inside the equipment box 1. The outer surface of the worm wheel 9 is meshedly connected with a worm 10, and the front end of the worm 10 rotates to penetrate the front surface of the equipment box 1. A sliding groove 11 is provided on the side surface adjacent to the two control blocks 5. The bottom walls of the two sliding grooves 11 are rotatably connected with threaded rods 12. The upper ends of the two threaded rods 12 respectively rotate to penetrate the upper surfaces of the two control blocks 5. The two sliding plates 6 are respectively threadedly sleeved on the outer surfaces of the two threaded rods 12. The side surfaces adjacent to the two control blocks 5 are respectively fixedly connected with a fixing plate 13, and the side surfaces adjacent to the two fixing plates 13 are fixedly connected with a second clamping ring 23, a groove matching the positioning block 8 is provided on the lower surface of the second clamping ring 23, a second sliding groove 14 is provided on the rear inner wall of the processing chamber 2, and the second sliding groove 14 extends into the interior of the equipment box 1, a connecting rod 15 is fixedly connected to the rear surface of the grinding device 3, a tooth plate 16 is slidably connected to the inner wall of the second sliding groove 14, the rear end of the connecting rod 15 is fixedly connected to the tooth plate 16, the lower surface of the tooth plate 16 extends into the interior of the equipment box 1, and the left side surface of the tooth plate 16 is meshed and connected with a first gear 17, and a rotating rod 18 is sleeved inside the first gear 17, and the front and rear ends of the rotating rod 18 are respectively rotatably connected to the inner wall of the equipment box 1, and the outer surface of the rotating rod 18 is sleeved with a second gear 19, the outer surface of the second gear 19 is meshedly connected with the second tooth plate 20, the upper end of the second tooth plate 20 is fixedly connected with the sliding rod 21, the upper end of the sliding rod 21 slides into the interior of the processing chamber 2, the upper end of the sliding rod 21 is fixedly connected with the support plate 22, the support plate 22 is adapted to the inner walls of the first clamping ring 7 and the second clamping ring 23, after the crystal oscillator is placed, the two threaded rods 12 are rotated, and the threaded rods 12 drive the sliding plate 6 to rise, so that the upper surface of the crystal oscillator is in contact with the second clamping ring 23 to complete the clamping, and when the grinding equipment descends for grinding, it will synchronously drive the tooth plate 16 to descend through the connecting rod 15, and the tooth plate 16 will drive the first gear 17 to rotate after it descends, and the first gear 1 7 is rotated so that the rotating rod 18 drives the second gear 19 to rotate. After the second gear 19 rotates, it drives the second toothed plate 20 to rise. After the second toothed plate 20 rises, it drives the support plate 22 to rise through the sliding rod 21, so as to support the crystal oscillator. After the grinding is completed, the worm 10 can be rotated, and the worm 10 can synchronously drive the worm wheel 9 to rotate. After the worm wheel 9 rotates, it drives the rotating shaft 4 to rotate, so as to complete the turning. Through the above structure, not only can the turning after the single-sided grinding is completed be simple and convenient, but also when the grinding equipment descends, the support plate 22 can be automatically lifted up through the cooperation of the toothed plate 16 and other structures to support the crystal oscillator, so as to avoid the pressure generated by the grinding causing the crystal oscillator to deform.

[0027] Working principle: During processing, the crystal oscillator is placed inside the first clamping ring 7, and the edge of the crystal oscillator is closely aligned with the positioning block 8. The crystal oscillator is then clamped by the subsequent structure and then polished by the polishing device 3. After polishing, the right rotating shaft 4 can be driven to rotate by the turning structure. The rotating shaft 4 rotates to drive the first clamping ring 7 to turn over by the control block 5, and then the crystal oscillator can be further polished. After the crystal oscillator is placed, the two threaded rods 12 are rotated. After the threaded rods 12 rotate, the sliding plate 6 is driven to rise, so that the upper surface of the crystal oscillator is aligned with the second clamping ring. The holding ring 23 contacts and completes the clamping. When the grinding equipment descends for grinding, it will synchronously drive the tooth plate 16 to descend through the connecting rod 15. After the tooth plate 16 descends, it drives the first gear 17 to rotate. The first gear 17 rotates and uses the rotating rod 18 to drive the second gear 19 to rotate. After the second gear 19 rotates, it drives the second tooth plate 20 to rise. After the second tooth plate 20 rises, it drives the support plate 22 to rise through the sliding rod 21, thereby forming support for the crystal oscillator. After the grinding is completed, the worm 10 can be rotated, and the worm 10 synchronously drives the worm wheel 9 to rotate. After the worm wheel 9 rotates, it drives the rotating shaft 4 to rotate, thereby completing the flipping.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A crystal oscillator processing and polishing device, comprising a device box (1), characterized in that: The front surface of the equipment box (1) is provided with a processing cavity (2), the top wall of the processing cavity (2) is provided with a grinding device (3), the left and right side surfaces of the processing cavity (2) are rotatably connected with rotating shafts (4), the side surfaces close to the two rotating shafts (4) are fixedly connected with control blocks (5), the side surfaces close to the two control blocks (5) are slidably connected with sliding plates (6), the side surfaces close to the two sliding plates (6) are fixedly connected with a first clamping ring (7), and the upper surface of the first clamping ring (7) is fixedly connected with a positioning block (8), the interior of the equipment box (1) is arranged to be hollow, the right side rotating shaft (4) rotates and penetrates into the interior of the equipment box (1), and a flip structure is arranged on the rotating shaft (4).

2. The crystal oscillator processing and polishing equipment according to claim 1, characterized in that: The flip structure comprises a worm wheel (9), which is sleeved on the outer surface of one end of the rotating shaft (4) located inside the equipment box (1), and the outer surface of the worm wheel (9) is meshingly connected with a worm (10), and the front end of the worm (10) rotates to penetrate the front side surface of the equipment box (1), and a sliding groove (11) is opened on the side surface close to the two control blocks (5), and the bottom walls of the two sliding grooves (11) are both rotatably connected with threaded rods (12), and the upper ends of the two threaded rods (12) respectively rotate to penetrate the upper surfaces of the two control blocks (5).

3. The crystal oscillator processing and polishing equipment according to claim 2, characterized in that: The two sliding plates (6) are respectively threadedly sleeved on the outer surfaces of the two threaded rods (12); the adjacent side surfaces of the two control blocks (5) are respectively fixedly connected with a fixing plate (13); the adjacent side surfaces of the two fixing plates (13) are respectively fixedly connected with a second clamping ring (23); and the lower surface of the second clamping ring (23) is provided with a groove adapted to the positioning block (8).

4. The crystal oscillator processing and polishing equipment according to claim 1, characterized in that: The rear inner wall of the processing chamber (2) is provided with a second sliding groove (14), which extends into the interior of the equipment box (1). The rear surface of the grinding device (3) is fixedly connected with a connecting rod (15), and the inner wall of the second sliding groove (14) is slidably connected with a tooth plate (16). The rear end of the connecting rod (15) is fixedly connected to the tooth plate (16), and the lower surface of the tooth plate (16) extends into the interior of the equipment box (1).

5. The crystal oscillator processing and polishing equipment according to claim 4, characterized in that: The left side surface of the toothed plate (16) is meshedly connected with a first gear (17), a rotating rod (18) is sleeved inside the first gear (17), front and rear ends of the rotating rod (18) are respectively rotatably connected to the inner wall of the equipment box (1), and a second gear (19) is sleeved on the outer surface of the rotating rod (18).

6. The crystal oscillator processing and polishing equipment according to claim 5, characterized in that: The outer surface of the second gear (19) is meshingly connected with a second tooth plate (20), the upper end of the second tooth plate (20) is fixedly connected with a sliding rod (21), the upper end of the sliding rod (21) slides into the interior of the processing cavity (2), the upper end of the sliding rod (21) is fixedly connected with a support plate (22), and the support plate (22) is adapted to the inner walls of the first clamping ring (7) and the second clamping ring (23).

Images