Bonding wire polishing and coating integrated device

Abstract

The utility model provides a bonding wire polishing and coating integrated device, which is suitable for the technical field of bonding wires, and adopts the scheme that the bonding wire polishing and coating integrated device comprises a processing table, a protective shell, a rotating shell, a rotating seat and a coating box, the protective shell is fixedly connected to the upper surface of the processing table, the rotating shell is arranged on one side of the protective shell, and the rotating seat is arranged on the other side of the protective shell; rotating seats are symmetrically and fixedly connected to the upper surface of the machining table; a coating box is arranged on the side, away from the rotating shell, of the protective shell; by installing the machining table, the protective shell, the rotating shell, the rotating base, the coating box, the first motor, the driving bevel gear and the driven bevel gear, when the bonding wire raw materials are ground and polished, all-directional grinding and polishing can be achieved, the polishing quality of the bonding wire raw materials is guaranteed, and meanwhile, the polishing quality of the bonding wire raw materials is improved. Quickly mounting a coating on the polished bonding wire raw material; the utility model is also suitable for the field of bonding wires.

Description

Technical Field

[0001] The utility model relates to the technical field of bonding wires, in particular to a bonding wire polishing coating integrated device. Background Art

[0002] Bonding wire, as the core material of semiconductor packaging, is mainly made of gold, silver, copper and other metals or their alloys. It has excellent electrical conduction, thermal conductivity and excellent mechanical properties. Therefore, it plays a vital role in the manufacturing process of integrated circuits and discrete semiconductor devices. It is like a bridge, connecting the complex circuit inside the chip with the external lead frame, ensuring stable and efficient electrical connection between the chip and the external circuit.

[0003] However, in the production process of bonding wire, after fine wire drawing, fine burrs often appear on its surface. In order to eliminate these burrs and ensure the smoothness of the bonding wire surface, it is usually necessary to use a polishing roller for polishing. Unfortunately, the existing polishing roller design has limitations in all-round polishing of the bonding wire surface, which to a certain extent reduces the quality of the bonding wire polishing and affects its subsequent use effect. In addition, in order to ensure that the conductive performance of the bonding wire in semiconductor packaging reaches the best state, it is also necessary to install a specific coating on its surface. This step also requires delicate operation to ensure that the coating is evenly covered, which neither affects the overall performance of the bonding wire nor effectively enhances its conductivity. In summary, although bonding wire plays a vital role in semiconductor packaging, it still faces some challenges in its production process. How to optimize the polishing roller design, improve the polishing quality of the bonding wire, and how to accurately install the conductive coating are all issues that need to be solved urgently.

[0004] Therefore, it is necessary to provide a new integrated bonding wire polishing coating device to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides an integrated bonding wire polishing coating device.

[0006] The utility model provides an integrated bonding wire polishing coating device comprising: a processing table, a protective shell, a rotating shell, a rotating seat and a coating box, wherein the upper surface of the processing table is fixedly connected with the protective shell, a rotating shell is arranged on one side of the protective shell, the upper surface of the processing table is symmetrically fixedly connected with the rotating seat, and round rods on both sides of the rotating shell rotate on the inner wall of the circular hole of the rotating seat, a coating box is arranged on the side of the protective shell away from the rotating shell, and the bottom of the coating box is fixedly connected to the upper surface of the processing table; a first motor, an active bevel gear and a driven bevel gear, the inner wall of the protective shell is fixedly connected with the first motor, and the output shaft of the first motor is fixedly connected to the A driving bevel gear is connected, and a driven bevel gear is fixedly connected to the surface of the round rod on one side of the rotating shell close to the coating box, and the driving bevel gear and the driven bevel gear are connected by gear meshing. The bonding wire raw material passes through the round hole of the round rod of the rotating shell, and the grinding mechanism inside the rotating shell polishes the bonding wire raw material. The first motor on the inner wall of the protective shell is started, and the driving bevel gear on the output shaft of the first motor contacts the driven bevel gear on the surface of the round rod on one side of the rotating shell, driving the rotating shell to rotate, ensuring that the grinding mechanism inside the rotating shell polishes the bonding wire raw material in all directions. The polished bonding wire raw material enters the coating box for immersion and coating installation.

[0007] Preferably, circular holes are provided at the centers of the round rods on both sides of the rotating shell and at the centers of the surfaces of the driven bevel gears to ensure that the bonding wire stock can pass through the rotating shell and the driving bevel gears, thereby preventing the normal grinding and polishing of the bonding wire stock from being affected when the rotating shell rotates.

[0008] Preferably, a polishing assembly shell is symmetrically installed inside the rotating shell, and a bidirectional screw is rotatably connected to the inner wall of the rotating shell. The surfaces of the two polishing assembly shells close to the bidirectional screw are fixedly connected to transmission blocks, and the threaded surface of the bidirectional screw is meshed with the circular inner wall of the transmission block. The bidirectional screw on the inner wall of the rotating shell rotates, and the threaded surface of the bidirectional screw contacts the inner wall of the circular hole of the transmission block, driving the transmission blocks closer to each other, driving the polishing assembly shells closer to each other, and the grinding mechanism on the inner wall of the polishing assembly shell grinds and polishes the bonding wire raw material, so that bonding wire raw materials of different sizes can be processed.

[0009] Preferably, the upper and lower surfaces of the bidirectional screw are fixedly connected with driving wheels, and the driving wheel is rotated to drive the transmission block to rotate on the inner wall of the rotating shell, which is convenient for manual driving and improves the convenience of the transmission block.

[0010] Preferably, a second motor is fixedly installed on the inner walls of the two polishing assembly shells, a grinding wheel is provided on one side of the second motor, and the grinding wheel rotates on the inner wall of the polishing assembly shell, the output shaft of the second motor is meshed and connected with a round rod on a side of the grinding wheel close to the second motor through a bevel gear, and the second motor on the inner wall of the polishing assembly shell is started, and the bevel gear of the second motor output shaft contacts the bevel gear on the surface of the round rod on one side of the grinding wheel, driving the grinding wheel to rotate, thereby grinding and polishing the surface of the bonding wire raw material.

[0011] Preferably, an adjusting rod is slidably installed on the inner wall of the coating box, and an extrusion plate is fixedly connected to the bottom of the adjusting rod, and a return spring is symmetrically fixedly connected to the upper surface of the extrusion plate, and the top of the return spring is fixedly connected to the inner wall of the coating box. After polishing, the bonding wire raw material enters the coating box, and the coating liquid is poured into the coating box from the entrance. The bonding wire raw material is immersed in the coating liquid, and the coating is installed. The coating liquid enters the interior of the coating box, and the adjusting rod is pulled upward. The return spring contracts, and the bonding wire raw material passes through the circular hole of the coating box. The adjusting rod is released, and the return spring opens, driving the extrusion plate to extrude the bonding wire raw material downward, so that the bonding wire raw material is convenient for fully immersing the coating liquid.

[0012] Compared with the related art, the bonding wire polishing coating integrated device provided by the utility model has the following beneficial effects:

[0013] The utility model provides an integrated bonding wire polishing and coating device:

[0014] 1. By installing a processing table, a protective shell, a rotating shell, a rotating seat, a coating box, a first motor, an active bevel gear and a driven bevel gear, when grinding and polishing the bonding wire raw material, it can be fully ground and polished to ensure the quality of the bonding wire raw material polishing. At the same time, the polished bonding wire raw material can be quickly coated.

[0015] 2. A second motor is fixedly installed on the inner walls of two polishing assembly shells. A grinding wheel is provided on one side of the second motor, and the grinding wheel rotates on the inner wall of the polishing assembly shell. The output shaft of the second motor is meshed and connected with a round rod on a side of the grinding wheel close to the second motor through a bevel gear. When the second motor on the inner wall of the polishing assembly shell is started, the bevel gear on the output shaft of the second motor contacts the bevel gear on the surface of the round rod on one side of the grinding wheel, driving the grinding wheel to rotate, thereby grinding and polishing the surface of the bonding wire raw material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The overall structural diagram provided by the utility model;

[0017] Figure 2 A schematic cross-sectional view of a protective shell provided by the utility model;

[0018] Figure 3 A schematic cross-sectional view of a rotating shell provided by the utility model;

[0019] Figure 4 A schematic cross-sectional view of a polishing assembly shell provided by the utility model;

[0020] Figure 5 This is a cross-sectional schematic diagram of a coating box provided by the utility model.

[0021] Numbers in the figure: 1, processing table; 2, protective shell; 3, rotating shell; 4, rotating seat; 5, coating box; 6, first motor; 7, driving bevel gear; 8, driven bevel gear; 9, polishing assembly shell; 10, bidirectional screw; 11, transmission block; 12, driving wheel; 13, second motor; 14, grinding wheel; 15, adjusting rod; 16, extrusion plate; 17, reset spring. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The integrated bonding wire polishing coating device includes: a processing table 1, a protective shell 2, a rotating shell 3, a rotating seat 4 and a coating box 5. The upper surface of the processing table 1 is fixedly connected with the protective shell 2, and a rotating shell 3 is arranged on one side of the protective shell 2. The upper surface of the processing table 1 is symmetrically fixedly connected with the rotating seat 4, and the round rods on both sides of the rotating shell 3 rotate on the inner wall of the circular hole of the rotating seat 4. The coating box 5 is arranged on the side of the protective shell 2 away from the rotating shell 3, and the bottom of the coating box 5 is fixedly connected to the upper surface of the processing table 1; a first motor 6, a driving bevel gear 7 and a driven bevel gear 8. The inner wall of the protective shell 2 is fixedly connected with the first motor 6, and the output shaft of the first motor 6 is fixedly connected A driving bevel gear 7 is connected, and a driven bevel gear 8 is fixedly connected to the surface of the round rod on one side of the rotating shell 3 close to the coating box 5, and the driving bevel gear 7 and the driven bevel gear 8 are connected by gear meshing. The bonding wire raw material passes through the round hole of the round rod of the rotating shell 3, and the grinding mechanism inside the rotating shell 3 polishes the bonding wire raw material. The first motor 6 on the inner wall of the protective shell 2 is started, and the driving bevel gear 7 of the output shaft of the first motor 6 contacts the driven bevel gear 8 on the surface of the round rod on one side of the rotating shell 3, driving the rotating shell 3 to rotate, ensuring that the grinding mechanism inside the rotating shell 3 polishes the bonding wire raw material in all directions. The polished bonding wire raw material enters the coating box 5 for immersion and coating installation.

[0024] Embodiment 1:

[0025] In the specific implementation process, Figure 2 As shown, circular holes are provided at the centers of the round rods on both sides of the rotating shell 3 and the center of the surface of the driven bevel gear 8 to ensure that the bonding wire raw material can pass through the rotating shell 3 and the driving bevel gear 7 to prevent the rotating shell 3 from rotating and affecting the normal grinding and polishing of the bonding wire raw material.

[0026] refer to Figure 3As shown, a polishing assembly shell 9 is symmetrically installed inside the rotating shell 3, and a bidirectional screw 10 is rotatably connected to the inner wall of the rotating shell 3. A transmission block 11 is fixedly connected to the surfaces of the two polishing assembly shells 9 close to the bidirectional screw 10, and the threaded surface of the bidirectional screw 10 is meshed with the circular inner wall of the transmission block 11. The bidirectional screw 10 on the inner wall of the rotating shell 3 rotates, and the threaded surface of the bidirectional screw 10 contacts the inner wall of the circular hole of the transmission block 11, driving the transmission blocks 11 to approach each other, driving the polishing assembly shells 9 to approach each other, and the grinding mechanism on the inner wall of the polishing assembly shell 9 grinds and polishes the bonding wire raw material, and can process bonding wire raw materials of different sizes.

[0027] refer to Figure 3 As shown, the upper and lower surfaces of the bidirectional screw rod 10 are fixedly connected with a driving wheel 12 , and the driving wheel 12 is rotated to drive the transmission block 11 to rotate on the inner wall of the rotating shell 3 , which is convenient for manual driving and improves the convenience of the transmission block 11 .

[0028] refer to Figure 4 As shown, a second motor 13 is fixedly installed on the inner wall of the two polishing assembly shells 9, a grinding wheel 14 is arranged on one side of the second motor 13, and the grinding wheel 14 rotates on the inner wall of the polishing assembly shell 9, and the output shaft of the second motor 13 is meshed and connected with a round rod on one side of the grinding wheel 14 close to the second motor 13 through a bevel gear, and the second motor 13 on the inner wall of the polishing assembly shell 9 is started, and the bevel gear of the output shaft of the second motor 13 contacts the bevel gear on the surface of the round rod on one side of the grinding wheel 14, driving the grinding wheel 14 to rotate, and the surface of the bonding wire raw material is polished.

[0029] Embodiment 2:

[0030] refer to Figure 5 As shown, an adjusting rod 15 is slidably installed on the inner wall of the coating box 5, and an extrusion plate 16 is fixedly connected to the bottom of the adjusting rod 15. A reset spring 17 is symmetrically fixedly connected to the upper surface of the extrusion plate 16, and the top of the reset spring 17 is fixedly connected to the inner wall of the coating box 5. After polishing, the bonding wire raw material enters the coating box 5, and the coating liquid is poured from the entrance of the coating box 5. The bonding wire raw material is immersed in the coating liquid, and the coating is installed. The coating liquid enters the coating box 5, and the adjusting rod 15 is pulled upward. The reset spring 17 contracts, and the bonding wire raw material passes through the round hole of the coating box 5. The adjusting rod 15 is released, and the reset spring 17 opens, driving the extrusion plate 16 to extrude the bonding wire raw material downward, so that the bonding wire raw material is convenient for fully immersing the coating liquid.

[0031] The above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A bonding wire polishing coating integrated device, characterized in that: include: A processing table (1), a protective shell (2), a rotating shell (3), a rotating seat (4) and a coating box (5), wherein the upper surface of the processing table (1) is fixedly connected to the protective shell (2), a rotating shell (3) is arranged on one side of the protective shell (2), the upper surface of the processing table (1) is symmetrically fixedly connected to the rotating seat (4), and the round rods on both sides of the rotating shell (3) rotate on the inner wall of the circular hole of the rotating seat (4), and a coating box (5) is arranged on the side of the protective shell (2) away from the rotating shell (3), and the bottom of the coating box (5) is fixedly connected to the upper surface of the processing table (1); A first motor (6), a driving bevel gear (7) and a driven bevel gear (8), wherein the inner wall of the protective shell (2) is fixedly connected to the first motor (6), the output shaft of the first motor (6) is fixedly connected to the driving bevel gear (7), and the driven bevel gear (8) is fixedly connected to the round rod surface on one side of the rotating shell (3) close to the coating box (5), and the driving bevel gear (7) and the driven bevel gear (8) are connected by gear meshing.

2. The bonding wire polishing coating integrated device according to claim 1, characterized in that: Circular holes are provided at the centre of the round rods on both sides of the rotating shell (3) and at the centre of the surface of the driven bevel gear (8).

3. The bonding wire polishing coating integrated device according to claim 1, characterized in that: A polishing assembly shell (9) is symmetrically mounted inside the rotating shell (3), a bidirectional screw rod (10) is rotatably connected to the inner wall of the rotating shell (3), a transmission block (11) is fixedly connected to the surfaces of the two polishing assembly shells (9) close to the bidirectional screw rod (10), and the threaded surface of the bidirectional screw rod (10) is meshedly connected to the circular inner wall of the transmission block (11).

4. The bonding wire polishing coating integrated device according to claim 3, characterized in that: The upper and lower surfaces of the bidirectional screw rod (10) are fixedly connected to driving wheels (12).

5. The bonding wire polishing coating integrated device according to claim 3, characterized in that: A second motor (13) is fixedly mounted on the inner walls of the two polishing assembly shells (9), a grinding wheel (14) is arranged on one side of the second motor (13), and the grinding wheel (14) rotates on the inner wall of the polishing assembly shell (9).

6. The bonding wire polishing coating integrated device according to claim 5, characterized in that: The output shaft of the second motor (13) is meshedly connected to a round rod on one side of the grinding wheel (14) close to the second motor (13) via a bevel gear.

7. The bonding wire polishing coating integrated device according to claim 1, characterized in that: An adjusting rod (15) is slidably mounted on the inner wall of the coating box (5); an extrusion plate (16) is fixedly connected to the bottom of the adjusting rod (15); a return spring (17) is symmetrically fixedly connected to the upper surface of the extrusion plate (16); and the top of the return spring (17) is fixedly connected to the inner wall of the coating box (5).

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