Quickly assembled and disassembled replaceable polishing head

Abstract

The utility model discloses a quick dismounting replaceable polishing head, which comprises a rotating shaft, a lock pin mechanism, a pushing device, an upper bearing disc and a lower bearing disc, the lock pin mechanism comprises a central lock pin plate, the rotating shaft is connected with the central lock pin plate, the central lock pin plate is fixedly connected on the upper bearing disc and is provided with a movable lock pin, the lock pin is provided with a first pin penetrating hole, and the first pin penetrating hole is provided with a second pin penetrating hole. The pushing device is used for pushing the lock pins to move, the upper bearing disc is provided with second pin penetrating holes penetrating up and down, the center lock pin plate is provided with third pin penetrating holes, at least two pins are arranged on the top face of the lower bearing disc, flanges are arranged on the tops of the pins, the pins stretch into the first pin penetrating holes, and an adsorption pad is arranged on the bottom face of the lower bearing disc. When the lock pin moves, the pin is aligned with or deviates from the axis of the first pin penetrating hole, and when the pin deviates from the axis of the first pin penetrating hole, the flange is clamped and hung on the lock pin to enable the lower bearing disc to be hung below the upper bearing disc. The lower bearing disc is convenient to replace so as to be flexibly and conveniently applied to polishing of samples of multiple sizes.

Description

Technical Field

[0001] The utility model relates to a grinding and polishing device, in particular to a quickly disassembled and replaceable polishing head. Background Art

[0002] During the surface treatment of semiconductor wafers and materials, they need to be ground and polished. Grinding is to subtract thickness, remove a certain thickness of material, and make the wafer and material thinner as a whole. Polishing is to remove the damage caused by the grinding process to improve the surface quality and finish, and prepare for subsequent processes.

[0003] Before polishing, the wafer and material need to be fixed on / inside the polishing head by vacuum or other means, and then precision processed on the polishing machine; during the processing, the polishing head is applied with a certain pressure on the surface of the wafer or material to ensure that the wafer or material is polished correctly; after polishing is completed, the wafer or material is removed from the polishing head manually or by a robot.

[0004] In current polishing equipment, there are generally two ways to fix wafers and materials: Method 1 - directly adsorbed in the polishing head for polishing; Method 2 - first use wax to bond the wafer / material to the ceramic disc, then place the ceramic disc on the polishing disc with the wafer / material facing down, and fix the ceramic disc by pressing down the polishing head for polishing. Method 1 Direct adsorption is suitable for wafers / materials with thicker thickness and greater hardness. The polishing head cooperates with the upper and lower wafer workstations for upper and lower wafers; but the size of the polishing head is fixed, which is generally only suitable for polishing wafers / materials of the same size, and the polishing head is troublesome to replace, and is not suitable for processing wafers and materials of different sizes on the same machine; Method 2 Ceramic disc bonding method, the polishing head and the ceramic disc are separated before and after polishing, and there is no firmware to connect. Therefore, the upper and lower discs of the ceramic disc cannot be transferred by the polishing head, and need to be handled manually or by a separate robot, and the ceramic disc needs to adopt wax bonding process, which has more procedures than the direct adsorption process, but the wax bonding process can be applied to wafers and materials of different sizes, thicknesses and hardness. Utility Model Content

[0005] In view of the above-mentioned defects of the prior art, the task of the utility model is to provide a quickly disassembled and replaceable polishing head, which is suitable for polishing by direct adsorption or wax adhesion process, and at the same time realizes rapid disassembly and replacement, thereby improving the flexibility and adaptability of the process.

[0006] The technical scheme of the utility model is as follows: a quick-disassembly and replaceable polishing head, comprising a rotating shaft, a locking pin mechanism, a pushing device, an upper bearing plate and a lower bearing plate, the locking pin mechanism comprising a central locking pin plate, the rotating shaft is connected to the central locking pin plate, the central locking pin plate is fixedly connected to the upper bearing plate, the central locking pin plate is provided with a movable locking pin, the locking pin is provided with a first pin through hole, the pushing device is used to push the locking pin to move, the upper bearing plate is provided with a second pin through hole running through from top to bottom, the central locking pin plate is provided with a third pin through hole, the first pin through hole The positions of the first hole, the second pin hole and the third pin hole correspond to each other, at least two pins are arranged on the top surface of the lower supporting plate, and the top of the pin is provided with a flange protruding laterally, and the pin extends into the first pin hole through the second pin hole and the third pin hole, and the bottom surface of the lower supporting plate is provided with an adsorption pad for adsorbing the material to be ground; when the locking pin moves, the pin is aligned with or deviated from the axis of the first pin hole, and when the pin deviates from the axis of the first pin hole, the flange is clamped on the locking pin so that the lower supporting plate is mounted under the upper supporting plate.

[0007] Furthermore, in order to facilitate the alignment of the pin with the second pin hole on the bottom surface of the upper carrier plate, a guide groove is provided on the bottom surface of the upper carrier plate, the guide groove connects the second pin hole and an opening is provided on the side of the upper carrier plate.

[0008] Furthermore, a reduced diameter section is provided on the upper portion of the pin, the reduced diameter section constitutes a groove structure circumferentially arranged around the pin, and the top wall of the groove structure constitutes the flange.

[0009] Furthermore, in order to avoid vacuum adsorption between the upper carrier plate and the lower carrier plate, at least one of the top surface of the lower carrier plate and the bottom surface of the upper carrier plate is provided with an air guide groove.

[0010] Furthermore, a ball head is provided at the bottom end of the rotating shaft, a concave pressure block is provided on the top surface of the upper supporting plate, the rotating shaft is mortgaged on the concave pressure block through the ball head, and the rotating shaft is connected to the center lock pin plate.

[0011] Furthermore, a transverse pin hole is provided at the lower portion of the rotating shaft, a fixing pin hole is provided on the central locking pin plate, a fixing pin is provided in the fixing pin hole, and the fixing pin is used to penetrate into the transverse pin hole of the rotating shaft to connect the rotating shaft.

[0012] Furthermore, a transverse branch rod is provided at the lower part of the rotating shaft, and a fixed top plate is fixedly connected to the top surface of the center locking pin plate. The fixed top plate is provided with a central through hole and avoidance grooves extending from the central through hole to both sides. The center locking pin plate is provided with a center hole, and butterfly grooves are provided on both sides of the center hole.

[0013] Furthermore, a straight groove is provided on the bottom surface of the butterfly groove, and the axis of the avoidance groove is arranged non-parallel to the axis of the straight groove.

[0014] Furthermore, a top cover of the fixed top plate is provided with a rubber corrugated sealing sleeve, and the rotating shaft penetrates from the top of the rubber corrugated sealing sleeve.

[0015] Furthermore, the rotating shaft is a hollow structure, and a guide hole for passing a pipeline is provided on a lower side wall of the rotating shaft.

[0016] The advantages of the utility model compared with the prior art are:

[0017] The utility model drives the lock pin to move by the push device, and then cooperates with the flange of the pin to realize the rapid loading of the lower bearing plate. Similarly, when the lock pin moves, the pin can quickly escape from the first pin hole, the second pin hole and the third pin hole, so as to realize the rapid unloading of the lower bearing plate, thereby facilitating the replacement of the lower bearing plate to flexibly and conveniently apply to the polishing of samples of multiple sizes. The utility model can realize the polishing of multiple samples on the same machine, reduce the number of machines and the occupied space, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of a quick-detachable and replaceable polishing head according to an embodiment.

[0019] Figure 2 It is a schematic diagram of the structure of the rotating shaft.

[0020] Figure 3 Schematic diagram of the locking pin mechanism.

[0021] Figure 4 Schematic diagram of the center lock pin plate.

[0022] Figure 5 Schematic diagram of the upper carrier plate.

[0023] Figure 6 Schematic diagram of the lower carrier plate.

[0024] Figure 7 It is a schematic diagram of the structure of the pin and the locking pin.

[0025] Figure 8 This is a schematic diagram of the positions of the pins and locking pins during installation or unloading of the lower carrier plate.

[0026] Fig. 9 Schematic diagram of the position of the pins and locking pins after the lower carrier plate is installed. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the embodiments, but is not intended to limit the present invention.

[0028] Please combine Figure 1 As shown, the embodiment involves a quick-detachable and replaceable polishing head, which mainly includes a rotating shaft 1, a locking pin mechanism 2, a pushing device 3, an upper supporting plate 4 and a lower supporting plate 5.

[0029] Please combine Figure 2 As shown, the rotating shaft 1 has a hollow rotating rod 11, the upper part of which is connected to a motor and a cylinder (not shown), and can rotate under the drive of the motor, and can also rise and fall under the action of the cylinder. The top of the rotating rod 11 is used to install a rotating joint (not shown), and pipelines (not shown) are passed through the hollow structure of the rotating rod 11. These pipelines are led out from the guide hole 15 on the lower side wall of the rotating rod 11 to provide pressure / vacuum and electric energy to the jacking device 3 and the lower bearing plate 5. The bottom of the rotating rod 11 is designed with a universal hemispherical ball head 12, and the two sides of the universal hemispherical ball head 12 are provided with transverse support rods 13, and the universal hemispherical ball head 12 is provided with a through transverse pin hole 14, which is used to locate the position of the rotating shaft 1 and the locking pin mechanism 2 and allow the locking pin mechanism 2 to swing to tilt at a certain angle. In this embodiment, the axis of the transverse pin hole 14 is perpendicular to the transverse support rod 13.

[0030] Please combine Figure 2 , Figure 3 , Figure 4 and Figure 7 As shown, the main body of the lock pin mechanism 2 is a central lock pin plate 203, and a spring lock pin device consisting of a limit pin 204, a lock pin 206, a spring 207, and a sealing ring 208 is arranged on the central lock pin plate 203. The central lock pin plate 203 is circular, and has a central hole 216 in the center. The left and right sides of the central hole 216 are butterfly grooves 212 consisting of fan-shaped grooves, and the bottom of the butterfly groove 212 has a straight groove 213 arranged in the radial direction. The butterfly groove 212 cooperates with the straight groove 213 and is mainly used for the installation of the rotating shaft 1. There are two opposite side lock pin holes 210 on the side of the central lock pin plate 203, and the side lock pin holes 210 are blind holes, which are used to install the spring lock pin device. The front part of the lock pin 206 is sleeved with a spring 207 and placed in the side lock pin hole 210, and the tail of the lock pin 206 is sleeved with a sealing ring 208 and sealed with the side lock pin hole 210.

[0031] The central lock pin plate 203 is provided with a third pin through hole 214 and a lock pin limiting hole 215 which penetrate from top to bottom. The third pin through hole 214 and the lock pin limiting hole 215 are both connected with the side lock pin hole 210. A limiting pin hole 220 and a first pin through hole 221 which penetrate from top to bottom of the lock pin 206 are provided in the middle of the lock pin 206. The limiting pin hole 220 is a waist-shaped hole. The limiting pin 204 is inserted into the lock pin limiting hole 215 of the central lock pin plate 203 and penetrates into the limiting pin hole 220. The axial movement distance of the lock pin 206 is limited by the limiting pin 204. A section of axial plane is milled out of the middle of the lock pin 206 at the position of the first pin through hole 221 as a pin support surface 222. The pin support surface 222 is used to mount the pin 502. The specific mounting structure is described later. After the lock pin 206 moves forward and compresses the spring 207 , the position of the first pin through hole 221 on the lock pin 206 and the position of the third pin through hole 214 on the central lock pin plate 203 are connected vertically correspondingly.

[0032] The center lock pin plate 203 is provided with a fixing screw hole a 217 to fix the fixed top plate 202 on the top surface of the center lock pin plate 203, and to fix the upper carrier plate 4 on the bottom surface of the center lock pin plate 203. The fixed top plate 202 is provided with a central through hole 218 and an avoidance groove 219 extending radially from the central through hole 218 to both sides. After the fixed top plate 202 is fixed to the top surface of the center lock pin plate 203, the central through hole 218 of the fixed top plate 202 is aligned with the central hole 216 of the center lock pin plate 203, the avoidance groove 219 is located at one side of the butterfly groove 212, and the straight groove 213 forms an angle with the avoidance groove 219. In this embodiment, the axes of the two form an angle of 45 degrees. There are also two opposite fixing pin holes 211 on the side of the center lock pin plate 203, which are used to install the fixing pin 205 to position and fix it to the transverse pin hole 14 of the rotating shaft 1.

[0033] When installing the rotating shaft 1 and the locking pin mechanism 2, first align the center of the rotating shaft 1 with the center of the fixed top plate 202, then align the horizontal branch rod 13 of the rotating shaft 1 with the avoidance groove 219, move the rotating shaft 1 downward so that the horizontal branch rod 13 enters the butterfly groove 212, and then rotate the rotating shaft 1 45 degrees to align the horizontal branch rod 13 with the straight groove 213. Then continue to lower the rotating shaft 1 until the horizontal branch rod 13 is pressed into the straight groove 213 and does not move, and then tighten the two fixing pins 205 on the side of the central locking pin plate 203 to make them penetrate into the horizontal pin hole 14 of the rotating shaft 1. In this way, the locking pin mechanism 2 is suspended on the rotating shaft 1, and the depth space of the butterfly groove 212 and the top surface of the fixed top plate 202 are used to limit the locking pin mechanism 2 to a certain angle.

[0034] In order to prevent dust, polishing liquid, water, etc. from entering the locking pin mechanism 2, the locking pin mechanism 2 is also provided with a rubber bellows seal 201. A small hole is provided on the top of the rubber bellows seal 201 for the shaft 1 to pass through. The lower end of the rubber bellows seal 201 is stuck on the outer edge of the fixed top plate 202, thereby sealing the shaft 1 and the fixed top plate 202.

[0035] Please combine Figure 2 , Figure 4 and Figure 5 As shown, as mentioned above, the center lock pin plate 203 is fixed to the upper carrier plate 401 by screws. The upper carrier plate 401 is provided with a second pin through hole 403 opposite to the position of the third pin through hole 214 of the center lock pin plate 203, and the second pin through hole 403 passes through the upper carrier plate 401 from top to bottom. In addition, a limit pin countersunk hole 404 and a wear-resistant and pressure-resistant concave pressure block 402 located in the center are also provided on the top surface of the upper carrier plate 401. The top surface of the wear-resistant and pressure-resistant concave pressure block 402 is a concave spherical surface, which matches the universal hemispherical ball head 12 at the lower end of the rotating shaft 1. When the rotating shaft 1 is pressed down during polishing, the universal hemispherical ball head 12 fits together with the concave pressure block 402 to pressurize the entire upper carrier plate 401. A V-shaped guide groove 406 is designed at the bottom of the bottom surface of the upper carrier plate 401 . The guide groove 406 connects the two second pin through holes 403 and is provided with an opening on the side of the upper carrier plate 401 .

[0036] Please combine Figure 1 As shown, the push device 3 is fixedly mounted on the top surface of the central lock pin plate 203 and is located opposite to the side lock pin hole 210. The push device 3 is a small cylinder or an electric cylinder, which is used to push the lock pin 206 to unlock the lock pin mechanism 2.

[0037] Please combine Figure 5 and Figure 6 The lower carrier plate 5 is composed of a metal carrier plate 501, a pin 502, a template 503 and an adsorption pad 504. The top surface of the metal carrier plate 501 is provided with a cross air guide groove 506, which is used to prevent the lower carrier plate 5 from being vacuum adsorbed with the upper carrier plate 401 when it is installed. Two pins 502 are fixed on the top surface of the metal carrier plate 501. The pin 502 has a conical head, and the middle part is waisted and becomes smaller to form a reduced diameter section. The reduced diameter section constitutes a groove structure 5021 arranged circumferentially around the pin, and the top wall of the groove structure 5021 constitutes a flange 5021a. The reduced diameter section becomes thicker downwards, and a thread is provided at the bottom, and it is fixed to the metal carrier plate 501 through a screw hole. Except for the reduced diameter section, the outer diameters of the top and lower parts of the pin 502 are the same, ensuring that the position of the pin 502 is stable when it moves up and down in the second pin through-hole 403 and the third pin through-hole 214.

[0038] The template 503 is attached to the bottom of the metal carrier 501 by adhesive or screws. The adsorption pad 504 is placed freely or attached by adhesive in the sample groove at the center of the template 503. The template 503 and the adsorption pad 504 are customized according to the sample size, and the polished material with a certain thickness and hardness can be directly adsorbed and polished; in addition, the polished material can also be first adhered to a sapphire or glass substrate of a certain thickness, and then adsorbed in the template 503. Liquid guide grooves 505 are set around the adsorption pad 504 on the template 503.

[0039] Please combine Figures 1 to 9 As shown, the process of quickly disassembling and assembling the quick-disassembly and replaceable polishing head of this embodiment is as follows:

[0040] 1. Rotate the upper carrier plate 401 so that its V-shaped guide groove 406 faces you, and wipe the bottom surface of the upper carrier plate 401.

[0041] 2. Press the foot switch, and the push devices 3 on both sides will work. Figure 8 , the pushing device 3 pushes the lock pin 206 inward to move it and limit it to the inward limit position by the limit pin 204, at which time the spring 207 is compressed. The first pin through hole 221 on the lock pin 206 is aligned with the third pin through hole 214 of the central lock pin plate 203 and the second pin through hole 403 of the upper carrier plate 4, and the lock pin 206 is in the unlocked position, and the lower carrier plate 5 can be loaded or unloaded.

[0042] 3. Spray a certain amount of water on the surface of the adsorption pad 504 in the center of the template 503, then place the polished wafer or material face up into the groove, rotate the wafer / material and squeeze it to drain the excess water. Then hold the left and right sides of the lower carrier plate 5 with both hands and turn it over so that the two pins 502 face up.

[0043] 4. Align the two pins 502 with the edges of the two V-shaped guide grooves 406, and then hold the lower carrier plate 5 upwards so that the two pins 502 are close to the two V-shaped guide grooves 406. Push the lower carrier plate 5 along the V-shaped guide grooves 406 to slide the two pins 502 to the position of the second pin through-hole 403. When the pins 502 are aligned with the second pin through-hole 403, push the lower carrier plate 5 upwards again so that the two pins 502 penetrate into the second pin through-hole 403. Push the lower carrier plate 5 further upwards so that its top surface is close to the bottom surface of the upper carrier plate 4. At this time, the pin 502 penetrates into the third pin through-hole 214, and the groove structure 5021 of the reduced diameter section of the pin 502 is located at the first pin through-hole 221 on the locking pin 206. The pin 502, the first pin through-hole 221, the second pin through-hole 403 and the third pin through-hole 214 are all on the same axis.

[0044] 5. Step on the foot switch again, and the pushing devices 3 on both sides stop pushing. The locking pin 206 moves outward under the elastic force of the spring 207 and is stopped by the limiting pin 204. Figure 7 and Fig. 9 At this time, due to the movement of the locking pin 206, the pin 502 deviates from the axis of the first pin through hole 221. The pin support surface 222 moves to below the flange 5021a of the pin 502. At this time, both hands release the lower carrier plate 5, and after it falls, the pin 502 also falls, and the flange 5021a contacts the pin support surface 222, so that the pin 502 is stuck on the pin support surface 222. At this time, the mounting of the lower carrier plate 5 is completed. The program can be started for polishing.

[0045] 6. After polishing is completed, the polishing head is raised. Turn the upper carrier plate 4 so that its V-shaped guide groove 406 faces you. Hold the left and right edges of the lower carrier plate 5 with both hands, step on the foot switch, and the push devices 3 on both sides work. As in step 2, the lock pin 206 is in the release position, and the lower carrier plate 5 can be unloaded.

[0046] 7. Under the action of gravity, the lower carrier plate 5 falls, and the pin 502 passes through the second pin hole 403. At this time, the lower carrier plate 5 is taken out and turned over, and after it is placed firmly, the polished surface of the wafer can be rinsed and the wafer can be taken out.

[0047] In addition, a robot can be used in conjunction with an automatic program to perform automatic and rapid loading and unloading.

[0048] Through experiments, it is verified that the quick-disassembly and replaceable polishing head of the utility model is simple and convenient to operate, quick to replace, and suitable for processed materials of different types and sizes.

Claims

1. A quick-detachable and replaceable polishing head, characterized in that: The invention comprises a rotating shaft, a locking pin mechanism, a pushing device, an upper bearing plate and a lower bearing plate, wherein the locking pin mechanism comprises a central locking pin plate, the rotating shaft is connected to the central locking pin plate, the central locking pin plate is fixedly connected to the upper bearing plate, the central locking pin plate is provided with a movable locking pin, the locking pin is provided with a first pin through hole, the pushing device is used to push the locking pin to move, the upper bearing plate is provided with a second pin through hole running through from top to bottom, the central locking pin plate is provided with a third pin through hole, the first pin through hole, the second pin through hole and the third pin through hole are provided The positions of the perforations correspond to each other, and at least two pins are provided on the top surface of the lower supporting plate. The top of the pins is provided with a laterally protruding flange, and the pin extends into the first pin perforation through the second pin perforation and the third pin perforation. The bottom surface of the lower supporting plate is provided with an adsorption pad for adsorbing the material to be ground; when the locking pin moves, the pin is aligned with or deviates from the axis of the first pin perforation, and when the pin deviates from the axis of the first pin perforation, the flange is clamped on the locking pin so that the lower supporting plate is mounted under the upper supporting plate.

2. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: A guide groove is provided on the bottom surface of the upper supporting plate, the guide groove is connected to the second pin through hole and an opening is provided on the side surface of the upper supporting plate.

3. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: A reduced diameter section is provided on the upper portion of the pin, and the reduced diameter section constitutes a groove structure circumferentially arranged around the pin, and the top wall of the groove structure constitutes the flange.

4. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: At least one of the top surface of the lower supporting plate and the bottom surface of the upper supporting plate is provided with an air guide groove.

5. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: A ball head is provided at the bottom end of the rotating shaft, a concave pressing block is provided on the top surface of the upper bearing plate, the rotating shaft is mortgaged on the concave pressing block through the ball head, and the rotating shaft is connected to the central locking pin plate.

6. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: A transverse pin hole is provided at the lower part of the rotating shaft, a fixing pin hole is provided on the central locking pin plate, a fixing pin is provided in the fixing pin hole, and the fixing pin is used to penetrate into the transverse pin hole of the rotating shaft to connect with the rotating shaft.

7. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: A transverse branch rod is provided at the lower part of the rotating shaft, and a fixed top plate is fixedly connected to the top surface of the center lock pin plate. The fixed top plate is provided with a central through hole and avoidance grooves extending from the central through hole to both sides. The center lock pin plate is provided with a center hole, and butterfly grooves are provided on both sides of the center hole.

8. The quick-detachable and replaceable polishing head according to claim 7, characterized in that: A straight groove is provided on the bottom surface of the butterfly groove, and the axis of the avoidance groove is arranged non-parallel to the axis of the straight groove.

9. The quick-detachable and replaceable polishing head according to claim 7, characterized in that: The top cover of the fixed top plate is provided with a rubber corrugated sealing sleeve, and the rotating shaft penetrates from the top of the rubber corrugated sealing sleeve.

10. The quick-detachable and replaceable polishing head according to claim 1, characterized in that: The rotating shaft is a hollow structure, and a guide hole for passing pipelines is provided on the lower side wall of the rotating shaft.

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