Base assembly and three-dimensional forming equipment

Abstract

The utility model provides a base assembly and three-dimensional forming equipment. The base assembly comprises a base which comprises a containing cavity with an operation opening; the circuit board is detachably installed in the containing cavity, and the circuit board is configured to be capable of being installed or detached through the operation opening. Therefore, in the maintenance process of the circuit board, the circuit board located in the containing cavity can be mounted and dismounted through the operation opening, the circuit board is moved to the interior or the exterior of the containing cavity through the operation opening, the operation that the whole bottom plate of the base is dismounted to maintain the circuit board is simplified, the maintenance efficiency of the circuit board is improved, and the maintenance efficiency of the circuit board is improved. And the maintenance convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of three-dimensional printing, in particular to a base component and three-dimensional molding equipment. Background Art

[0002] Stereoscopic molding equipment is a kind of cumulative manufacturing technology and a machine of rapid prototyping technology. It is based on a digital model file and uses special wax materials, powdered metal or plastic and other adhesive materials to print multiple layers of adhesive materials in sequence to create three-dimensional objects.

[0003] Among them, the photocuring three-dimensional molding equipment adopts photocuring printing technology. It uses photosensitive resin as the printing material, and focuses light of specific wavelength and intensity onto the surface of the photocuring material to solidify it, completing the solidification of one layer, and then moves the height of a layer in the vertical direction, and then solidifies another layer, and stacks layers in sequence to form a three-dimensional entity.

[0004] In the related art, the three-dimensional forming equipment, circuit boards, light boards and other devices are installed on the bottom plate of the base. When the circuit board fails or needs to be repaired, the bottom plate of the entire base needs to be removed and then the circuit board on it needs to be repaired and replaced. Since other fragmentary parts are usually installed on the bottom plate, it is heavy and has many wirings, which makes it inconvenient to disassemble and assemble, thus affecting the repair or maintenance experience of the circuit board. Utility Model Content

[0005] In view of this, the utility model provides a base assembly and a three-dimensional forming device. An operating port is opened in the accommodating cavity of the base, and the circuit board in the accommodating cavity is installed and removed by using the operating port, and the circuit board is moved to the inside or outside of the accommodating cavity through the operating port, thereby simplifying the operation of disassembling the bottom plate of the base as a whole to repair the circuit board, which is beneficial to improving the repair efficiency of the circuit board and enhancing the convenience of repair.

[0006] The first aspect of the utility model provides a base assembly, comprising: a base, the base comprising a housing cavity having an operation port; a circuit board, the circuit board is detachably installed inside the housing cavity, and the circuit board is configured to be installable or detachable through the operation port.

[0007] Furthermore, the base includes a bottom plate, a top plate, and a side plate connecting the bottom plate and the top plate to enclose a receiving cavity, and the operation port is located on the bottom plate or the side plate, opposite to the circuit board.

[0008] Furthermore, the base assembly also includes: a reflector and a light source assembly located in the accommodating cavity, the top plate is provided with a light-transmitting portion, the reflector is arranged on the outgoing light path of the outgoing light of the light source assembly, and the light-transmitting portion is located on the reflected light path of the reflector; wherein the circuit board is located between the reflector and the bottom plate.

[0009] Furthermore, the reflector is tiltedly arranged inside the accommodating cavity; the circuit board is arranged horizontally; or the circuit board is tiltedly arranged, and the tilt direction of the circuit board is the same as the tilt direction of the reflector at the relative position; the tilt angle of the circuit board is the same as or different from the tilt angle of the reflector at the relative position, or the angle between the arrangement plane of the circuit board and the arrangement plane of the reflector at the relative position is smaller than a preset angle.

[0010] Furthermore, the base assembly also includes: an airflow driving component, which is installed inside the accommodating cavity and is located between the circuit board and the reflector.

[0011] Furthermore, the base assembly also includes: a first mounting frame, the first mounting frame is located inside the accommodating cavity and between the reflector and the bottom plate, the circuit board is detachably connected to the first mounting frame and is located on the side of the first mounting frame facing the operating port; wherein the first mounting frame and the base are a split structure; or, the first mounting frame and the cavity wall of the accommodating cavity are an integrated structure.

[0012] Furthermore, the airflow driving member of the base assembly is connected to the first mounting frame, and the airflow driving member and the circuit board are located on both sides of the first mounting frame.

[0013] Furthermore, the operation port is opened on the bottom plate, and the base assembly also includes a support frame connected between the first mounting frame and the bottom plate;

[0014] Among them, the support frame, the first mounting frame, and the base plate are an integrated structure; or, at least two of the support frame, the first mounting frame, and the base plate are split structures; or, any two of the support frame, the first mounting frame, and the base plate are split structures.

[0015] Furthermore, the base assembly also includes: an electrical connector and a connecting wire, the electrical connector is installed on a support frame, the support frame is provided with a wire passing hole, and the connecting wire passes through the wire passing hole to connect the electrical connector and the circuit board; wherein the electrical connector includes a connecting surface provided with a jack, and an avoidance hole is provided at a position opposite to the side panel and the connecting surface.

[0016] Furthermore, the base assembly also includes: a second mounting frame located in the accommodating cavity, the reflector is connected to the second mounting frame, and the second mounting frame and the first mounting frame are located on the same side of the support frame; wherein the second mounting frame is connected to the base plate and is a split structure, or the second mounting frame and the base plate are an integrated structure.

[0017] Furthermore, the base assembly also includes: a cover plate, which is movably connected to the base to close or open the operation port.

[0018] Furthermore, the cover plate is provided with ventilation holes, and there are a plurality of ventilation holes, which are arranged in rows and columns.

[0019] A second aspect of the present invention provides a three-dimensional forming device, comprising: a base assembly according to any one of the first aspects.

[0020] The base assembly and three-dimensional forming equipment provided by the embodiment of the utility model include a base and an electric control board. The accommodating cavity of the base is provided with an operation port, and the circuit board is configured to be installed or removed through the operation port, so that the circuit board located in the accommodating cavity can be installed and removed through the operation port, and then the circuit board can be conveniently moved to the inside or outside of the accommodating cavity through the operation port. Therefore, when the circuit board fails, the circuit board can be conveniently removed through the operation port and moved to the outside of the accommodating cavity for repair or overhaul, and the repaired or overhauled circuit board can be conveniently installed in the inside of the accommodating cavity through the operation port. Compared with the related art in which the entire bottom plate of the base needs to be removed and the bottom plate is heavy due to the installation of other components such as a heat dissipation fan, the operation is simple and the maintenance is convenient, which is conducive to improving the maintenance efficiency and the maintenance experience of users or other operators, and can also improve the assemblability and debuggability of the production process of the three-dimensional forming equipment.

[0021] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Various other advantages and benefits will become apparent to those skilled in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only used for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used throughout the accompanying drawings to represent the same components. Among them:

[0023] Figure 1 A three-dimensional structural schematic diagram showing a partial structure of a base assembly of the utility model from one viewing angle;

[0024] Figure 2 A structural schematic diagram showing a partial structure of the base assembly of the utility model from one viewing angle;

[0025] Figure 3 A three-dimensional structural schematic diagram showing a partial structure of a base assembly of the utility model from one viewing angle;

[0026] Figure 4 A structural schematic diagram showing a partial structure of the base assembly of the utility model from another perspective;

[0027] Figure 5 Shows Figure 4 A local enlarged schematic diagram shown;

[0028] Figure 6 A structural schematic diagram showing a partial structure of the base assembly of the utility model from another viewing angle;

[0029] Figure 7 A partial structural schematic diagram of a three-dimensional forming device of the utility model is shown from one viewing angle.

[0030] in, Figures 1 to 7 The corresponding relationship between the reference numerals and the component names is as follows:

[0031] 100 base assembly, 110 base, 111 operation port, 112 bottom plate, 1121 first mounting frame, 1122 support frame, 1123 second mounting frame, 1124 wire hole, 113 side plate, 114 top plate, 120 circuit board, 130 reflector, 140 air flow drive member, 150 electrical connector, 151 connecting surface, 160 support foot, 170 screw, 180 cooling fan, 200 three-dimensional molding equipment, 210 material trough, 220 molding platform, 230 guide frame. DETAILED DESCRIPTION

[0032] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

[0033] Refer to the following Figures 1 to 7 The base assembly 100 and the stereoscopic molding device 200 provided in some embodiments of the present invention are described. The stereoscopic molding device 200 may be a photocuring 3D printer, and the base assembly 100 is applied to the stereoscopic molding device 200.

[0034] like Figure 1 , Figure 2 and Figure 4 As shown, an embodiment of the first aspect of the utility model provides a base assembly 100, including: a base 110 and a circuit board 120, the base 110 includes a accommodating cavity with an operating port 111; the circuit board 120 is detachably installed inside the accommodating cavity, and the circuit board 120 is configured to be installable or removable through the operating port 111.

[0035] The base assembly 100 provided in the embodiment of the utility model includes a base 110 and a circuit board 120. By providing an operation port 111 in the receiving cavity of the base 110, the circuit board 120 is configured to be installed or removed through the operation port 111, so that the circuit board 120 located in the receiving cavity can be installed and removed through the operation port 111, and then the circuit board 120 can be conveniently moved to the inside or outside of the receiving cavity through the operation port 111. Therefore, when the circuit board 120 fails and needs to be repaired, the circuit board 120 can be conveniently removed through the operation port 111 and moved to the outside of the receiving cavity for repair, and the repaired circuit board 120 can be conveniently installed in the inside of the receiving cavity through the operation port 111. Compared with the related art that requires the entire bottom plate of the base to be removed and the bottom plate is heavy due to the installation of other components such as a heat dissipation fan, the operation is simple and the maintenance is convenient, which is conducive to improving the maintenance efficiency and the maintenance experience of users or other operators, and can also improve the assemblability and debuggability of the production process of the three-dimensional molding equipment.

[0036] Among them, the circuit board 120 can be a PCB (Printed Circuit Board) board, an FPC (Flexible Printed Circuit board) board, or other circuit boards with integrated circuits. It is understandable that the circuit board 120 can be electrically connected to the heat dissipation fan 180 in the accommodating cavity. Further, the three-dimensional molding device 200 can also include a light source assembly installed in the base assembly 100, and the circuit board 120 can be connected to the light source assembly. Further, a control board can also be installed in the accommodating cavity of the base 110, and the circuit board 120 is electrically connected to the control board so that the control board controls the light source assembly, the heat dissipation fan 180, etc. through the circuit board 120. It is understandable that in some examples, the control chip can be integrated on the circuit board 120, and the control chip controls the light source assembly, the heat dissipation fan 180, etc. through the circuit board 120.

[0037] Among them, the circuit board 120 is detachably installed in the accommodating cavity, that is, the circuit board 120 is connected to the cavity wall of the accommodating cavity in a detachable manner. Specifically, the circuit board 120 can be detachably connected to the cavity wall of the accommodating cavity by at least one of a threaded structure, a snap-on structure, a mortise and tenon structure, a plug-in structure, and a magnetic structure to facilitate maintenance.

[0038] like Figure 1 , Figure 2 and Figure 7As shown, in some possible embodiments provided by the present invention, the base 110 includes a bottom plate 112, a top plate 114, and a side plate 113 connecting the bottom plate 112 and the top plate 114 to form a accommodating cavity, and the operating port 111 is located on the bottom plate 112 or the side plate 113 and opposite to the circuit board 120.

[0039] The bottom plate 112 is located at the bottom of the base 110, and the top plate 114 is located at the top of the base 110. Figure 7 The Z-axis direction is the direction of the top and bottom of the base 110 .

[0040] In this embodiment, the operation port 111 can be provided on the bottom plate 112 or on the side plate 113 , so that the position of the operation port 111 can be reasonably set according to the specific arrangement of the components in the base 110 .

[0041] Among them, the operation port 111 is opened on the bottom plate 112, which is beneficial to improving the aesthetic appearance of the base 110. However, during operation, the base assembly 100 needs to be placed sideways or reversely to facilitate the disassembly, assembly and movement of the circuit board 120 through the operation port 111.

[0042] The operation port 111 is provided on the side panel 113, so that the circuit board 120 can be disassembled and moved through the operation port 111 without moving the device, which is convenient for the user to operate. However, the operation port 111 on the side panel 113 is easily visible to the user, affecting the aesthetic appearance of the base 110. Further, in order to reduce the aesthetic appearance of the operation port 111 on the side panel 113, the operation port 111 can be provided on the side panel 113 located on the side of the stereoscopic molding device 200 away from the user, such as the operation port 111 is provided on the side panel 113 behind the stereoscopic molding device 200.

[0043] Among them, the operation port 111 is opposite to the circuit board 120, so that the circuit board 120 can be intuitively seen through the operation port 111, and the circuit board 120 can be disassembled and assembled more directly, conveniently and quickly, and the circuit board 120 can be accurately and quickly moved to the inside or outside of the accommodating cavity through the operation port 111.

[0044] Specifically, the opening area of ​​the operating port 111 can be larger than the area of ​​the larger surface of the circuit board 120 to ensure that the circuit board 120 can be moved smoothly and quickly to the inside or outside of the accommodating cavity. The larger operating port 111 facilitates the user to operate the tool to improve the disassembly and assembly efficiency and movement efficiency of the circuit board 120, thereby improving the maintenance efficiency.

[0045] It is understandable that, in some examples, the opening area of ​​the operation port 111 may be equal to or slightly smaller than the area of ​​the larger surface of the circuit board 120 , so that the circuit board 120 can be placed at an angle to pass through the operation port 111 .

[0046] Among them, usually, such as Figure 3 , Figure 4 and Figure 6 As shown, the base assembly 100 of the stereoscopic molding device 200 includes a heat dissipation fan 180, which is mounted on the bottom plate. The number of the heat dissipation fans 180 can be one, two, or more. The air inlet end or the air outlet end of the heat dissipation fan 180 can be opposite to the bottom plate or the side plate, such as Figure 3 As shown, there are three heat dissipation fans 180, and the air inlet or outlet of the heat dissipation fans 180 is opposite to the side plate. The arrangement of the heat dissipation fans 180 can provide good ventilation and heat dissipation effects for the circuit boards and other electrical components in the accommodating cavity, thereby reducing the failure rate of the circuit boards and other electrical components and increasing the service life of the circuit boards and other electrical components.

[0047] In the base assembly of the related art, when repairing the circuit board, the bottom plate and the side plate need to be disassembled and separated. Since the heat dissipation fan is connected to the base, the bottom plate is heavy and inconvenient for users to move, which affects the maintenance experience of the circuit board. In contrast, the embodiment provided by the utility model provides an operation port 111 on the base 110, and uses the operation port 111 to install and remove the circuit board 120 located in the accommodating cavity, and moves the circuit board 120 to the inside or outside of the accommodating cavity through the operation port 111, which simplifies the operation of disassembling the bottom plate 112 of the base 110 as a whole to repair the circuit board, which is conducive to improving the maintenance efficiency of the circuit board 120, improving the convenience of maintenance, and also improving the assemblability and debuggability of the production process of the three-dimensional molding equipment.

[0048] In some possible embodiments provided by the present invention, the base assembly 100 further includes a light source assembly located in the accommodating cavity. It can be understood that the light source assembly is used to emit curing light. The top plate 114 is provided with a light-transmitting portion, which can be a light-transmitting port or a light-transmitting member, wherein the light-transmitting member can be a glass member or a plastic member.

[0049] Furthermore, if Figure 7As shown, the three-dimensional molding device 200 further includes a material tank 210, a guide frame 230 and a molding platform 220. The material tank 210 is used to contain resin materials. The material tank 210 is placed on the top of the base 110 and is located above the light-transmitting portion. The guide frame 230 is connected to the base 110. The molding platform 220 is movably connected to the guide frame 230 and is located above the material tank 210. The molding platform 220 can move toward or away from the material tank 210 along the guide frame 230. When the molding platform 220 is adjusted to a suitable position along the Z axis relative to the guide frame 230, the light emitted by the light source assembly in the base 110 is focused onto the resin surface in the material tank 210 through the light-transmitting portion, so that it solidifies sequentially from point to line and from line to surface, completing the solidification of one layer, and then the molding platform 220 is moved along the Z axis in a direction away from the base 110 by the height of a layer, and then another layer is solidified, and layers are stacked in sequence to form a three-dimensional entity.

[0050] like Figure 3 , Figure 4 and Figure 5 As shown, the base assembly 100 provided by the embodiment of the utility model further includes a reflector 130 located in the accommodating cavity, the reflector 130 is arranged on the outgoing light path of the outgoing light of the light source assembly, and the light-transmitting portion is located on the reflected light path of the reflector 130, thereby, the light emitted by the light source assembly is transmitted through the reflector 130 through the light-transmitting portion to the material tank 210 to achieve the curing of the resin material. Among them, the arrangement of the reflector 130 can make the light provided by the light source assembly fall into the light-transmitting portion, that is, the light provided by the light source assembly can fall into the molding area, the light concentration is better, the influence of stray light on the printing effect can be avoided, thereby improving the printing quality, reducing the waste of light energy, and improving the utilization rate of light energy.

[0051] The circuit board 120 is located between the reflector 130 and the bottom plate 112. This arrangement enables the circuit board 120 to reasonably utilize the space between the reflector 130 and the bottom plate 112, reducing the space occupied by the circuit board 120, and enabling the various components in the accommodating cavity to be reasonably arranged, thereby reducing the volume of the base 110 and saving manufacturing costs. At the same time, arranging the circuit board 120 between the reflector 130 and the bottom plate 112 can prevent the circuit board 120 from being located between the reflector 130 and the top plate 114 and affecting the emission light path of the light source assembly, or affecting the reflection light path of the reflector 130, so as to further improve the concentration of the curing light, reduce the influence of stray light on the printing effect, and improve the utilization rate of light energy.

[0052] The reflector 130 may be a transmitting reflector. Specifically, the reflector 130 may be a concave reflector.

[0053] In the above embodiment, the reflector 130 is obliquely arranged inside the accommodating cavity, for example, the light source assembly can be located obliquely above the reflector 130, the light-transmitting portion is located directly above the reflector 130, the reflected light path is directly opposite to the light-transmitting portion, and the outgoing light path is obliquely downwardly directed to the reflector 130. Such an arrangement enables the illumination provided by the light source assembly to be reflected more concentratedly to the light-transmitting opening by the reflector 130, that is, it can ensure that the light falls concentratedly into the molding area, and at the same time, the light source assembly, the reflector 130, and the light-transmitting portion can be designed compactly, which is conducive to reducing the volume of the base 110 and meeting the design requirements of the base 110 being small in volume and compact in structure.

[0054] The circuit board 120 is arranged horizontally, or the circuit board 120 is arranged tilted, and the tilt direction of the circuit board 120 is the same as the tilt direction of the reflector 130 at the relative position. Therefore, the direction of the circuit board 120 can be reasonably arranged according to the size of the circuit board 120, so that the space between the reflector 130 and the bottom plate 112 can accommodate circuit boards 120 of different sizes.

[0055] Specifically, when the size of the circuit board 120 is small, the circuit board 120 can be arranged horizontally between the reflector 130 and the bottom plate 112, and at this time, the reflector 130 will not interfere with the circuit board 120. When the size of the circuit board 120 is large, if the circuit board 120 is arranged horizontally between the reflector 130 and the bottom plate 112, there is a situation where the circuit board 120 interferes with the reflector 130. At this time, the circuit board 120 can be arranged tilted, and the tilt direction of the circuit board 120 is the same as the tilt direction of the reflector 130 at the relative position, such as the tilt direction of the circuit board 120 is the same as the tilt direction of the reflector 130 close to the bottom plate 112. As a result, the circuit board 120 of a larger size can still be placed between the reflector 130 and the bottom plate 112, expanding the use range of the base assembly 100 and meeting the design requirement of a smaller base 110.

[0056] Among them, when the circuit board 120 is arranged at an angle and the inclination direction of the circuit board 120 is the same as the inclination direction of the reflector 130 at the relative position, the inclination angle of the circuit board 120 and the inclination angle of the reflector 130 at the relative position can be the same or different, or, the angle between the arrangement plane 120 of the circuit board 120 and the arrangement plane of the reflector 130 at the relative position is less than the preset angle. Therefore, on the basis of ensuring that a larger-sized circuit board 120 can be placed between the reflector 130 and the base plate 112, the arrangement mode of the circuit board 120 can be reasonably arranged according to the specific structures of the circuit board 120 and the reflector 130, so as to maximize the utilization of the base space and realize miniaturization of the equipment, and ensure that there is a certain space between the circuit board 120 and the reflector 130 for air circulation to ensure good ventilation and heat dissipation effects.

[0057] Specifically, the circuit board 120 and the reflector 130 at the relative position can be arranged substantially in parallel to ensure the same tilt angle, or the circuit board 120 can be tilted slightly closer to or slightly away from the reflector 130 at the relative position. The preset angle between the arrangement plane 120 of the circuit board and the arrangement plane of the reflector 130 at the relative position can be 10° to 30°, such as the preset angle can be 10°, 20°, 30° or other angles, and correspondingly, the angle between the arrangement plane 120 of the circuit board and the arrangement plane of the reflector 130 at the relative position can range from 0° to 10°, 0° to 20°, 0° to 30°, etc.

[0058] like Figure 4 and Figure 5 As shown, in some possible embodiments provided by the present invention, the base assembly 100 also includes: an airflow driving member 140, which is installed inside the accommodating cavity, and the airflow driving member 140 is located between the circuit board 120 and the reflector 130. The setting of the airflow driving member 140 can ventilate and dissipate heat for the circuit board 120, thereby ensuring that the circuit board 120 has a good heat dissipation effect, reducing the possibility of high-temperature failure of the circuit board 120, and increasing the service life of the circuit board 120.

[0059] Among them, the airflow driving member 140 is arranged between the circuit board 120 and the reflector 130, so that the airflow driving member 140 can reasonably use the space between the reflector 130 and the bottom plate 112, reduce the volume of the base 110, and help save manufacturing costs. At the same time, this arrangement can prevent the airflow driving member 140 from being located between the reflector 130 and the top plate 114 and affecting the emission light path of the light source assembly, or affecting the reflection light path of the reflector 130, so as to further improve the concentration of light and improve the utilization rate of light energy. In addition, it can prevent the airflow driving member 140 from being located between the circuit board 120 and the operating port 111 and affecting the smoothness of disassembling and assembling the moving circuit board 120 through the operating port 111. Specifically, the airflow driving member 140 can be a fan.

[0060] like Figure 4 and Figure 5As shown, in some possible embodiments provided by the present invention, the base assembly 100 further includes: a first mounting frame 1121, the first mounting frame 1121 is located inside the accommodating cavity and between the reflector 130 and the bottom plate 112, and the circuit board 120 is detachably connected to the first mounting frame 1121, thereby enabling the circuit board 120 to be reliably and stably installed inside the accommodating cavity. At the same time, the circuit board 120 is located on the side of the first mounting frame 1121 facing the operating port 111, so that the circuit board 120 can be quickly and accurately removed from the first mounting frame 1121 or installed on the first mounting frame 1121 through the operating port 111, thereby improving the efficiency and accuracy of disassembly and assembly of the circuit board 120.

[0061] Specifically, the circuit board 120 can be detachably connected to the first mounting frame 1121 by means of screws 170, so that the screws 170 can be quickly and accurately operated through the operation port 111 using tools such as a screwdriver or an electric drill to achieve the removal and installation of the circuit board 120 and the first mounting frame 1121. Specifically, as Figure 1 and Figure 2 As shown, the circuit board 120 is detachably connected to the first mounting frame 1121 by four screws 170. The first mounting frame 1121 is a frame structure, so that when the airflow driving member 140 is working, the airflow can smoothly flow through the first mounting frame 1121 and the circuit board 120 to ensure that the circuit board 120 has good ventilation and heat dissipation effects.

[0062] In some examples, the first mounting frame 1121 and the base 110 are split structures, such as the first mounting frame 1121 can be connected to the cavity wall of the accommodating cavity by a threaded structure, a clamping structure, a mortise and tenon structure, a welding method, a bonding method, etc., wherein the cavity wall can be the bottom plate 112 or the side plate 113 or the top plate 114 of the base.

[0063] In other examples, the first mounting frame 1121 and the cavity wall of the accommodating cavity are an integrated structure, such as the first mounting frame 1121 and the cavity wall of the accommodating cavity can be an integrated injection molding structure, which is convenient for processing, easy to produce, and simplifies the assembly operation, which is beneficial to saving manufacturing costs and improving production efficiency, wherein the cavity wall can be the bottom plate 112, side plate 113, or top plate 114 of the base 110.

[0064] like Figure 4 and Figure 5As shown, in some possible embodiments provided by the present invention, the airflow driving member 140 of the base assembly 100 is connected to the first mounting frame 1121, and the airflow driving member 140 and the circuit board 120 are located on both sides of the first mounting frame 1121, that is, the airflow driving member 140 is located on the side of the first mounting frame 1121 facing the reflector 130, and the circuit board 120 is located on the side of the first mounting frame 1121 facing the operation port 111, thereby, using a first mounting frame 1121, the circuit board 120 and the airflow driving member 140 can be installed, which simplifies the structure, saves manufacturing costs, and is conducive to saving space, meeting the design requirements of the base 110 with a small volume. In addition, this setting can reduce the distance between the airflow driving member 140 and the circuit board 120, improve the sufficiency of airflow flowing through the circuit board 120, and ensure that the circuit board 120 has a good heat dissipation effect.

[0065] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in some possible embodiments provided by the utility model, the operation port 111 is opened on the bottom plate 112, and the base assembly 100 further includes a support frame 1122 connected between the first mounting frame 1121 and the bottom plate 112. The setting of the support frame 1122 can ensure that the first mounting frame 1121 is at a certain distance from the bottom plate 112, thereby allowing a certain space between the circuit board 120 and the bottom plate 112 to facilitate airflow, so that the circuit board 120 has a good heat dissipation effect, and at the same time, avoid the circuit board 120 and the bottom plate 112 being too close, so that impurities, liquids, etc. outside the accommodating cavity flow into the interior of the accommodating cavity through the operation port 111 to pollute the circuit board 120 or other components, so as to reduce the failure rate of the circuit board 120 or other components and increase the service life of the circuit board 120 or other components.

[0066] In some examples, the support frame 1122, the first mounting frame 1121, and the bottom plate 112 are an integrated structure, which is convenient for processing, easy to produce, and simplifies the assembly operation, which is conducive to reducing manufacturing costs and improving production efficiency. Specifically, the support frame 1122, the first mounting frame 1121, and the bottom plate 112 can be an integrated injection molding structure.

[0067] In other examples, at least two of the support frame 1122, the first mounting frame 1121, and the base plate 112 are split structures. Specifically, the support frame 1122, the first mounting frame 1121, and the base plate 112 are all split structures. In this case, the support frame 1122 is connected to the base plate 112 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., and then the first mounting frame 1121 is connected to the support frame 1122 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., to achieve the assembly of the support frame 1122, the first mounting frame 1121, and the base plate 112. Alternatively, the support frame 1122 and the first mounting frame 1121 may be an integrally formed structure, and then the two are regarded as a separate structure as a whole with the bottom plate 112. In this case, the support frame 1122 is connected to the bottom plate 112 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., so as to realize the assembly of the support frame 1122, the first mounting frame 1121, and the bottom plate 112. Alternatively, the support frame 1122 and the bottom plate 112 may be an integrally formed structure, and then the two are regarded as a separate structure as a whole with the connecting frame. In this case, the first mounting frame 1121 is connected to the support frame 1122 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., so as to realize the assembly of the support frame 1122, the first mounting frame 1121, and the bottom plate 112.

[0068] In some other examples, any two of the support frame 1122, the first mounting frame 1121, and the base plate 112 are split structures, that is, the support frame 1122, the first mounting frame 1121, and the base plate 112 are split structures from each other. At this time, the support frame 1122 is connected to the base plate 112 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., and then the first mounting frame 1121 is connected to the support frame 1122 by a threaded structure, a clamping structure, a mortise and tenon structure, a plug-in structure, a welding method, a bonding method, etc., to achieve the assembly of the support frame 1122, the first mounting frame 1121, and the base plate 112.

[0069] like Figure 3 , Figure 5 and Figure 6As shown, in some possible embodiments provided by the present invention, the base assembly 100 further includes: an electrical connector 150 and a connecting wire, the electrical connector 150 is mounted on the support frame 1122, the support frame 1122 is provided with a wire hole 1124, and the connecting wire passes through the wire hole 1124 to connect the electrical connector 150 and the circuit board 120, thereby, the circuit board 120 can be electrically connected to the electrical connector 150, and since the electrical connector 150 can be connected to an external power source, the circuit board 120 can be connected to an external power source. In addition, this arrangement makes the function of the support frame 1122 diversified, that is, the support frame 1122 can connect the bottom plate 112 and the first mounting frame 1121 to support the first mounting frame 1121, and provide a mounting carrier for the electrical connector 150, and provide a routing space for the connecting wire connecting the circuit board 120 and the electrical connector 150, which greatly simplifies the structure, reduces the manufacturing cost, and can reduce the space occupied in the accommodating cavity, which can meet the design requirements of a small volume of the base 110, and is suitable for popularization and application.

[0070] like Figure 3 and Figure 6 As shown, in the above embodiment, the electrical connector 150 includes a connection surface 151 provided with a socket, and a avoidance hole is provided at a position opposite to the side panel 113 and the connection surface 151, that is, after the base assembly 100 is assembled, the connection surface 151 provided with the socket of the electrical connector 150 is exposed to the outside through the avoidance hole, thereby, the socket of the electrical connector 150 can be connected to the external power supply through a wire from the outside of the base 110 through the avoidance hole, which is simple to operate and easy to use.

[0071] It is understandable that, when the base assembly 100 or the stereoscopic molding device 200 needs to be transported or moved, the electrical connector 150 can be separated from the external power supply to facilitate the base assembly 100 or the stereoscopic molding device 200 to be moved to the target location. Furthermore, when power supply is not required, the electrical connector 150 can also be separated from the external power supply.

[0072] Furthermore, the electrical connector 150 may be a socket, which is an electrical standard part, easy to process, suitable for mass production, and low in cost. Specifically, the electrical connector 150 may be detachably connected to the support frame 1122 by a bolt structure, a clamping structure, a mortise and tenon structure, a plug-in structure, etc., to facilitate maintenance of the electrical connector 150. It is understood that in some examples, the electrical connector 150 may also be connected to the support frame 1122 by bonding or the like.

[0073] like Figure 3 and Figure 5As shown, in some possible embodiments provided by the present invention, the base assembly 100 also includes a second mounting bracket 1123 located in the accommodating cavity, and the reflector 130 is connected to the second mounting bracket 1123. Thus, the reflector 130 can be reliably and stably fixed in the accommodating cavity of the base 110 through the second mounting bracket 1123, so as to ensure that the reflector 130 can stably and accurately concentrate the light provided by the light source into the light-transmitting portion, thereby improving the concentration and stability of the light.

[0074] The second mounting frame 1123 and the bottom plate 112 are of a split structure, that is, the second mounting frame 1123 can be connected to the bottom plate 112 by a bolt structure, a plug-in structure, a mortise and tenon structure, a clamping structure, a magnetic structure, a bonding method, etc. Alternatively, the second mounting frame 1123 and the bottom plate 112 are of an integrated structure, such as the second mounting frame 1123 and the bottom plate 112 can be an integrated injection molding structure, which is convenient for processing, easy to produce, and simplifies the assembly operation, which is conducive to saving manufacturing costs and improving production efficiency.

[0075] Specifically, the first mounting frame 1121, the second mounting frame 1123, the support frame 1122 and the base plate 112 are an integrated structure, such as the first mounting frame 1121, the second mounting frame 1123, the support frame 1122 and the base plate 112 are integrally injection molded. This arrangement is convenient for processing, easy to produce, and greatly simplifies the assembly operation, which can save manufacturing costs and improve production efficiency, and is suitable for promotion and application.

[0076] Among them, the second mounting frame 1123 and the first mounting frame 1121 are located on the same side of the support frame 1122, thereby ensuring that the first mounting frame 1121 is located between the reflector 130 installed on the second mounting frame 1123 and the base plate 112, and further ensuring that the circuit board 120 and the airflow driving member 140 installed on the first mounting frame 1121 are located between the reflector 130 and the base plate 112, so as to save space and reduce the volume of the base 110.

[0077] Specifically, the reflector 130 can be connected to the second mounting frame 1123 by bonding, or the reflector 130 can be connected to the second mounting frame 1123 by a connecting frame. For example, the reflector 130 can be a reflector, which is fixed on the connecting frame and connected to the second mounting frame 1123 by the connecting frame. For example, the connecting frame and the second mounting frame 1123 are connected by bolts. In this way, the reflector 130 can be fixedly connected to the base plate 112. The operation is simple and the reflector 130 can be easily repaired and replaced.

[0078] It is understandable that, in other examples, the reflective member 130 may also be connected to the top plate 114 , or the reflective member 130 may be connected to the side plate 113 .

[0079] In some possible embodiments provided by the present invention, the base assembly 100 also includes: a cover plate, which is movably connected to the base 110 to close or open the operating port 111. Therefore, when the circuit board 120 needs to be repaired, the operating port 111 is opened by using the cover plate, and the circuit board 120 is removed through the operating port 111 and moved to the outside of the accommodating cavity for repair. After the repair is completed, the circuit board 120 is moved to the inside of the accommodating cavity through the operating port 111 and installed on the first mounting frame 1121, and then the operating port 111 is closed by using the cover plate. This can reduce the risk of impurities, liquids, etc. outside the accommodating cavity entering the interior of the accommodating cavity through the operating port 111 and damaging the circuit board 120 or other components. Therefore, the cleanliness of the interior of the accommodating cavity can be improved, and the circuit board 120 or other components inside the accommodating cavity can be well protected, which is beneficial to extending the service life of the circuit board 120 or other components and improving the overall reliability of the base assembly 100.

[0080] The cover plate and the base 110 can be movably connected by at least one of a bolt structure, a plug-in structure, a clamping structure, a mortise and tenon structure, and a magnetic structure, so as to facilitate the cover plate to open or close the operation port 111. Specifically, when the operation port 111 is provided on the bottom plate 112, the cover plate can be movably connected to the bottom plate 112; when the operation port 111 is provided on the side plate 113, the cover plate can be movably connected to the side plate 113.

[0081] Furthermore, ventilation holes are provided on the cover plate. The provision of the ventilation holes can realize the circulation of airflow inside and outside the accommodating cavity, and then under the action of the airflow driving member 140 and / or the heat dissipation fan 180, better airflow inside and outside the accommodating cavity can be achieved, so that the circuit board 120 and other components in the accommodating cavity have good ventilation and heat dissipation effects, reducing the failure rate of the circuit board 120 and other components in the accommodating cavity, and improving the overall reliability of the base assembly 100.

[0082] The ventilation holes may be circular, elliptical, regular polygonal or irregular in shape. Specifically, the ventilation holes may be long and slender holes. Thus, while ensuring that the ventilation holes have good ventilation effects and have a certain filtering effect, they can isolate larger garbage outside the accommodating cavity and reduce the possibility of larger garbage entering the accommodating cavity and damaging the circuit board 120 or other components, thereby further extending the service life of the circuit board 120 and other components in the accommodating cavity.

[0083] Furthermore, there are multiple ventilation holes, which can ensure good airflow inside and outside the accommodating cavity, thereby ensuring good ventilation and heat dissipation effects. At the same time, the size of the ventilation holes can be reasonably set to ensure that the ventilation holes have a good filtering effect and improve the cleanliness of the interior of the accommodating cavity. Among them, the multiple ventilation holes are arranged in rows and columns, and the row and column arrangement can be a single-row arrangement, a multi-row arrangement, a staggered arrangement, etc. Therefore, the ventilation holes can be reasonably arranged according to the size of the ventilation holes, ventilation requirements, etc.

[0084] like Figure 1 , Figure 2 and Figure 6 As shown, in some possible embodiments provided by the present invention, the base assembly 100 also includes a support foot 160, which is located outside the accommodating cavity and connected to the bottom of the base plate 112. The setting of the support foot 160 enables the entire base assembly 100 to be reliably and stably supported on the operating platform.

[0085] Furthermore, the support foot 160 is arranged so that there is a certain distance between the bottom plate 112 and the end of the support foot 160 away from the bottom plate 112. In this way, when the three-dimensional molding equipment 200 is placed on the operating platform, there is a certain distance between the bottom plate 112 and the operating platform. Therefore, when the operating port 111 is opened on the bottom plate 112 and the cover plate closes the operating port 111, there is a certain distance between the cover plate and the operating platform, that is, there is also a certain distance between the ventilation holes on the cover plate and the operating platform, which provides sufficient circulation space for the airflow flowing through the ventilation holes on the cover plate to ensure that the base assembly 100 has good ventilation and heat dissipation effects. In addition, this arrangement facilitates the maintenance of the circuit board 120, ensures that the appearance of the base assembly 100 is more beautiful, and can prevent the possibility of larger garbage entering the accommodating cavity and damaging the circuit board 120 or other components, thereby improving the reliability of the base assembly 100.

[0086] like Figure 7 As shown, the embodiment of the second aspect of the utility model provides a three-dimensional molding device 200, including the base assembly 100 of any embodiment of the first aspect. Since the three-dimensional molding device 200 includes the base assembly 100 of any of the aforementioned embodiments, it has all the technical effects of the aforementioned base assembly 100.

[0087] like Figure 7As shown, further, the three-dimensional molding equipment 200 also includes a material trough 210, a guide frame 230 and a molding platform 220. The material trough 210 is used to contain resin material. The material trough 210 is placed on the top of the base 110, above the light-transmitting portion of the base 110. The guide frame 230 is connected to the base 110. The molding platform 220 is movably connected to the guide frame 230 and is located above the material trough 210. The molding platform 220 is configured to move along the guide frame 230 toward or away from the material trough 210.

[0088] Specifically, Figures 1 to 7 As shown, the utility model also provides the following implementation modes:

[0089] Label 1, a base assembly 100, including: a base 110, the base 110 includes a receiving cavity with an operation port 111; a circuit board 120, the circuit board 120 is detachably installed inside the receiving cavity, and the circuit board 120 is configured to be installable or detachable through the operation port 111.

[0090] Label 2, according to the base assembly 100 of label 1, the base 110 includes a bottom plate 112, a top plate 114, and a side plate 113 connecting the bottom plate 112 and the top plate 114 to form a accommodating cavity, and the operating port 111 is located on the bottom plate 112 or the side plate 113, opposite to the circuit board 120.

[0091] Label 3, according to the base assembly 100 of label 2, it also includes: a reflector 130 and a light source assembly located in the accommodating cavity, the top plate 114 is provided with a light-transmitting portion, the reflector 130 is arranged on the outgoing light path of the outgoing light of the light source assembly, and the light-transmitting portion is located on the reflected light path of the reflector 130; wherein the circuit board 120 is located between the reflector 130 and the bottom plate 112.

[0092] Label 4, according to the base assembly 100 of label 3, the reflector 130 is tiltedly arranged inside the accommodating cavity; the circuit board 120 is arranged horizontally; or the circuit board 120 is tiltedly arranged, and the tilt direction of the circuit board 120 is the same as the tilt direction of the reflector 130 at the relative position; the tilt angle of the circuit board 120 is the same as or different from the tilt angle of the reflector 130 at the relative position, or, the angle between the arrangement plane 120 of the circuit board and the arrangement plane of the reflector 130 at the relative position is smaller than the preset angle.

[0093] Label 5. According to the base assembly 100 of label 3, it also includes: an airflow driving member 140, which is installed inside the accommodating cavity and is located between the circuit board 120 and the reflector 130.

[0094] Label 6, according to the base assembly 100 of label 3, also includes: a first mounting frame 1121, the first mounting frame 1121 is located inside the accommodating cavity and between the reflector 130 and the bottom plate 112, the circuit board 120 is detachably connected to the first mounting frame 1121, and is located on the side of the first mounting frame 1121 facing the operating port 111; wherein the first mounting frame 1121 and the base 110 are a split structure; or, the first mounting frame 1121 and the cavity wall of the accommodating cavity are an integrated structure.

[0095] Label 7 , according to the base assembly 100 of label 6 , the airflow driving member 140 of the base assembly 100 is connected to the first mounting frame 1121 , and the airflow driving member 140 and the circuit board 120 are located on both sides of the first mounting frame 1121 .

[0096] Label 8, according to the base assembly 100 of label 6, the operating port 111 is opened on the bottom plate 112, and the base assembly 100 also includes a support frame 1122 connected between the first mounting frame 1121 and the bottom plate 112; wherein the support frame 1122, the first mounting frame 1121, and the bottom plate 112 are an integrated structure; or, at least two of the support frame 1122, the first mounting frame 1121, and the bottom plate 112 are split structures; or, any two of the support frame 1122, the first mounting frame 1121, and the bottom plate 112 are split structures.

[0097] Label 9, according to the base assembly 100 of label 8, also includes: an electrical connector 150 and a connecting wire, the electrical connector 150 is installed on the support frame 1122, the support frame 1122 is provided with a wire hole 1124, the connecting wire passes through the wire hole 1124 to connect the electrical connector 150 and the circuit board 120; wherein, the electrical connector 150 includes a connecting surface 151 provided with a jack, and an avoidance hole is provided at a position opposite to the side panel 113 and the connecting surface 151.

[0098] Label 10, according to the base assembly 100 of label 8, also includes: a second mounting frame 1123 located in the accommodating cavity, the reflector 130 is connected to the second mounting frame 1123, and the second mounting frame 1123 and the first mounting frame 1121 are located on the same side of the support frame 1122; wherein the second mounting frame 1123 is connected to the base plate 112 and is a split structure, or the second mounting frame 1123 and the base plate 112 are an integrated structure.

[0099] Reference numeral 11 , according to the base assembly 100 of reference numeral 1 , further comprising: a cover plate, the cover plate being movably connected to the base 110 to close or open the operating port 111 .

[0100] Reference numeral 12, according to the base assembly 100 of reference numeral 11, ventilation holes are provided on the cover plate, and the number of ventilation holes is multiple, and the multiple ventilation holes are arranged in rows and columns.

[0101] The utility model also provides the following implementation modes:

[0102] Label 13. A three-dimensional molding device 200, comprising: a base assembly 100 as described in any one of labels 1 to 12.

[0103] In the description of the present invention, the term "plurality" refers to two or more than two. Unless otherwise clearly defined, the terms "upper" and "lower" indicate positions or positional relationships based on the positions or positional relationships described in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention. The terms "connection", "installation", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0104] For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A base assembly, characterized in that: include: A base, the base comprising a receiving cavity having an operation port; A circuit board is detachably mounted inside the accommodating cavity, and the circuit board is configured to be installable or detachable through the operating port.

2. The base assembly according to claim 1, characterized in that: The base includes a bottom plate, a top plate, and a side plate connecting the bottom plate and the top plate to enclose the accommodating cavity. The operation port is located on the bottom plate or the side plate, opposite to the circuit board.

3. The base assembly according to claim 2, characterized in that: Also includes: A reflector and a light source assembly are located in the accommodating cavity, the top plate is provided with a light-transmitting portion, the reflector is provided on the outgoing light path of the outgoing light of the light source assembly, and the light-transmitting portion is located on the reflected light path of the reflector; Wherein, the circuit board is located between the reflector and the bottom plate.

4. The base assembly according to claim 3, characterized in that: The reflector is obliquely arranged inside the accommodating cavity; The circuit board is arranged horizontally; or The circuit board is arranged at an angle, and the inclination direction of the circuit board is the same as the inclination direction of the reflector at the relative position; the inclination angle of the circuit board is the same as or different from the inclination angle of the reflector at the relative position, or the angle between the arrangement plane of the circuit board and the arrangement plane of the reflector at the relative position is smaller than a preset angle.

5. The base assembly according to claim 3, characterized in that: Also includes: An airflow driving component is installed inside the accommodating cavity and is located between the circuit board and the reflecting component.

6. The base assembly according to claim 3, characterized in that: Also includes: a first mounting frame, the first mounting frame being located inside the accommodating cavity and between the reflector and the bottom plate, the circuit board being detachably connected to the first mounting frame and being located on a side of the first mounting frame facing the operation port; Wherein, the first mounting frame and the base are of separate structures; or, The first mounting frame and the cavity wall of the accommodating cavity are an integrated structure.

7. The base assembly according to claim 6, characterized in that: The airflow driving member of the base assembly is connected to the first mounting bracket, and the airflow driving member and the circuit board are located on both sides of the first mounting bracket.

8. The base assembly according to claim 6, characterized in that: The operation port is opened on the bottom plate, and the base assembly further includes a support frame connected between the first mounting frame and the bottom plate; Among them, the support frame, the first mounting frame, and the base plate are an integrated structure; or, at least two of the support frame, the first mounting frame, and the base plate are split structures; or, any two of the support frame, the first mounting frame, and the base plate are split structures.

9. The base assembly according to claim 8, characterized in that: Also includes: An electrical connector and a connecting wire, wherein the electrical connector is mounted on the supporting frame, the supporting frame is provided with a wire-passing hole, and the connecting wire passes through the wire-passing hole to connect the electrical connector and the circuit board; Wherein, the electrical connector comprises a connection surface provided with a plug hole, and an avoidance hole is provided at a position of the side plate opposite to the connection surface.

10. The base assembly according to claim 8, characterized in that: Also includes: a second mounting frame located in the accommodating cavity, the reflector being connected to the second mounting frame, and the second mounting frame and the first mounting frame being located on the same side of the supporting frame; Wherein, the second mounting frame is connected to the bottom plate and is a split structure, or The second mounting frame and the bottom plate are an integrated structure.

11. The base assembly according to claim 1, characterized in that: Also includes: A cover plate is movably connected to the base to close or open the operation port.

12. The base assembly according to claim 11, characterized in that: The cover plate is provided with ventilation holes, and there are a plurality of ventilation holes arranged in rows and columns.

13. A three-dimensional forming device, characterized in that: include: A base assembly as claimed in any one of claims 1 to 12.

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