Defective product removing equipment

By designing a defective product removal device including an adsorption conveying device and air-cooled parts, the impact of twitching and high temperature on the sorting equipment during the silicon wafer transportation process is solved, and the position consistency and sorting accuracy of silicon wafers are improved.

CN222555923UActive Publication Date: 2025-03-04ZHEJIANG QIUSHI SEMICON EQUIP CO LTD
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Patent Information

Application Number
CN202420201761.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-26
Publication Date
2025-03-04
Estimated Expiration
2034-01-26

AI Technical Summary

Technical Problem

The position of the silicon wafer is inconsistent when transported to the sorting equipment, and the sorting error of the sorting equipment is high, mainly because the silicon wafers squirt during the transport of the defective product removal equipment, and the high temperature after the silicon wafer is drying has an adverse effect on the sorting equipment sensors and image acquisition equipment.

Method used

A defective product removal device is designed, including a first conveying device, an adsorption conveying device, a second conveying device and an air-cooled part. The adsorption conveying device can generate adsorption forces in a controlled manner to achieve stable transport of the conveyor; the air-cooled part cools the conveyor and defines the position through the downward airflow to avoid squirming.

Benefits of technology

It effectively avoids the twitching of the silicon wafer during the transportation process, reduces the sorting error, ensures the position consistency and sorting accuracy of the silicon wafer, and reduces the impact on the sorting equipment through cooling.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides defective product removing equipment which comprises a first conveying device, an adsorption conveying device and a second conveying device which are sequentially arranged in the first direction, the adsorption conveying device can controllably generate adsorption force, an air cooling piece is arranged above at least one of the first conveying device and the second conveying device, and the air cooling piece is connected with the first conveying device and the second conveying device. The air cooling piece is used for generating downward airflow. According to the defective product removing equipment, the conveying pieces are transferred between the first conveying device and the second conveying device through the adsorption conveying device, the adsorption conveying device can controllably generate the adsorption force, the adsorption conveying device is controlled to generate the adsorption force so that defective products can be removed, and meanwhile the defective product removing equipment can be used for removing the defective products. The air cooling part is arranged to provide downward air flow for the conveying part on the first conveying device and / or the second conveying device, on one hand, downward pressure is applied to the conveying part to limit the position of the conveying part and avoid movement, and on the other hand, the conveying part is cooled through the air flow.
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Description

Technical Field

[0001] The utility model relates to the field of silicon wafer production, in particular to a defective product rejection device. Background Art

[0002] Good silicon wafers are produced by cutting, unplugging, cleaning, drying, rejecting and sorting silicon rods. The rejecting process uses a defective rejecting device to transport the dried silicon wafers to the sorting device, and the defective silicon wafers are rejected by the defective rejecting device. The sorting device is used to classify silicon wafers according to different test results and sizes. In the related art, the silicon wafers transported to the sorting device are inconsistent with the set position, and the sorting device has a high sorting error. Utility Model Content

[0003] The present invention is based on the inventor's discovery and understanding of the following facts and problems:

[0004] During the production of silicon wafers, the inventor discovered that the position of the silicon wafers when they were transported to the sorting equipment was inconsistent with the set position. This was because the silicon wafers moved during the transportation by the defective product rejection equipment. The sorting error of the sorting equipment was high because the silicon wafers had a higher temperature after drying. In the sorting equipment, the higher temperature of the silicon wafers had an adverse effect on the sensors and image acquisition equipment of the sorting equipment, thereby affecting the sorting work of the sorting equipment.

[0005] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the embodiment of the utility model provides a defective product rejection device, which can ensure that the conveying parts do not move during the conveying process and has a cooling effect on the conveying parts.

[0006] The defective product rejection equipment of the embodiment of the utility model includes a first conveying device, an adsorption conveying device, a second conveying device and an air-cooling component. The first conveying device, the adsorption conveying device and the second conveying device are arranged in sequence along a first direction. At least part of the adsorption conveying device is located above the tail end of the first conveying device and the head end of the second conveying device. The adsorption conveying device can generate adsorption force in a controlled manner. The air-cooling component is provided above at least one of the first conveying device and the second conveying device, and the air-cooling component is used to generate a downward airflow.

[0007] The defective product rejection device of the embodiment of the utility model transfers the conveyor parts between the first conveyor device and the second conveyor device through an adsorption conveying device. The adsorption conveying device can generate adsorption force in a controlled manner. When the adsorption force is generated, the conveyor parts are adsorbed on the conveyor belt by the first conveyor device, and the conveyor belt transports the conveyor parts to the second conveyor device. When the adsorption force is not generated, the conveyor parts are dropped off by the second conveyor device or the adsorption component, thereby realizing the rejection of defective products. At the same time, an air-cooling part is provided to provide a downward airflow to the conveyor parts on the first conveyor device and / or the second conveyor device. On the one hand, downward pressure is applied to the conveyor parts to limit the position of the conveyor parts to avoid movement. On the other hand, the conveyor parts are cooled by the airflow.

[0008] In some embodiments, the defective product rejection equipment also includes a tidying device, at least part of which is located above the second conveying device, so as to tidy the position of the conveying members on the second conveying device along a second direction, and the second direction is orthogonal to the first direction and the vertical direction.

[0009] In some embodiments, the tidying device comprises:

[0010] At least two groups of tidying wheels, wherein the two groups of tidying wheels are arranged at intervals along the second direction to accommodate the conveying member, and each group of tidying wheels comprises at least two tidying wheels arranged at intervals along the first direction;

[0011] A driving assembly, wherein the driving assembly is arranged one-to-one with the tidying wheels arranged in groups, so as to drive all the tidying wheels in a corresponding group to rotate synchronously around a vertical direction, and enable the tidying wheels to drive the conveying member to move along the conveying direction of the second conveying device;

[0012] An adjusting component is connected to two of the groups of aligning wheels and is used to drive the two groups of aligning wheels to move relatively closer to or farther away from each other along the second direction.

[0013] In some embodiments, the air-cooling member corresponding to the first conveying device is located above the tail end of the first conveying device;

[0014] The air-cooling component corresponding to the second conveying device is arranged on the arranging device, and can move along the vertical direction and the second direction relative to the arranging device.

[0015] In some embodiments, the adsorption and delivery device comprises:

[0016] an adsorption component extending along the first direction and located above the tail end of the first conveying device and the head end of the second conveying device, wherein the adsorption component can generate an adsorption force in a controllable manner; and

[0017] A conveyor belt, at least a portion of which is disposed at the bottom of the adsorption assembly and can be transported and moved along the first direction.

[0018] In some embodiments, the adsorption conveying device has a conveying state and a rejecting state;

[0019] In the conveying state, the adsorption component generates an adsorption force to adsorb the conveyed member on the first conveying device to the bottom of the conveyor belt and convey the conveyed member to the second conveying device;

[0020] In the rejection state, the adsorption component has no adsorption force, so that the conveyor on the first conveying device falls from the tail end of the first conveying device, or the adsorption component stops generating adsorption force after starting to generate adsorption force, so that the conveyor at the bottom of the conveyor belt falls.

[0021] In some embodiments, the adsorption component includes an adsorption chamber and a vacuum generator. The adsorption chamber extends along the first direction and is located above the tail end of the first conveying device and the head end of the second conveying device. The bottom of the adsorption chamber has a plurality of air holes arranged at intervals along the first direction. The vacuum generator is connected to the adsorption chamber so that the air holes have an airflow flowing into the adsorption chamber in the conveying state, and the air holes have no airflow or have an airflow flowing out of the adsorption chamber in the removal state.

[0022] In some embodiments, the defective product rejection device also includes a detection device, at least part of which is located above the first conveying device, and the detection device is used to detect whether the conveyed parts on the first conveying device are good products or defective products, and send a corresponding signal to the adsorption conveying device, so that the adsorption conveying device is in a conveying state when the conveyed parts are good products, and is in a rejection state when the conveyed parts are defective products.

[0023] In some embodiments, the defective product rejection device also includes a sensor, which is located at the tail end of the first conveying device. The sensor is used to sense the conveyed object and send a signal to the adsorption conveying device when the conveyed object is sensed. After receiving the signal from the sensor, the adsorption conveying device switches to a corresponding conveying state or rejection state according to the signal from the detection device.

[0024] In some embodiments, the defective product rejection device further includes a waste box, which is located between the first conveying device and the second conveying device and is used to receive conveyed parts dropped by the first conveying device or the adsorption conveying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1It is a structural schematic diagram of a defective product rejection device according to an embodiment of the utility model;

[0026] Figure 2 It is a partial structural schematic diagram of a defective product rejection device according to an embodiment of the utility model;

[0027] Figure 3 It is a structural schematic diagram of the regularization device in the embodiment of the utility model;

[0028] Figure 4 It is a partial structural schematic diagram of the regularization device in the embodiment of the utility model.

[0029] Reference numerals:

[0030] 1. First conveying device; 2. Adsorption conveying device; 21. Adsorption assembly; 211. Adsorption chamber; 212. Adsorption chamber; 22. Conveyor belt; 3. Second conveying device; 4. Detection device; 5. Sensor; 6. Waste box; 7. Air cooling part; 8. Structuring device; 81. Structuring wheel; 82. Driving assembly; 83. Adjustment assembly; 84. Structuring rack; 85. Mounting bracket. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but cannot be understood as limiting the present invention.

[0032] Reference below Figure 1-Figure 4 The defective product rejection device according to the embodiment of the utility model is described.

[0033] like Figure 1-Figure 4 As shown, the defective product rejection device of the utility model embodiment includes a first conveying device 1, an adsorption conveying device 2, a second conveying device 3 and an air cooling part 7. The first conveying device 1, the adsorption conveying device 2 and the second conveying device 3 are arranged along a first direction (such as Figure 1 The first conveying device 1 and the second conveying device 3 are arranged in sequence in the front-to-back direction as shown, at least part of the adsorption conveying device 2 is located above the tail end of the first conveying device 1 and the head end of the second conveying device 3, the adsorption conveying device 2 can generate adsorption force in a controlled manner, and an air-cooling component 7 is provided above at least one of the first conveying device 1 and the second conveying device 3, and the air-cooling component 7 is used to generate a downward airflow.

[0034] Specifically, Figure 1-Figure 3 As shown, the first conveying device 1, the adsorption conveying device 2 and the second conveying device 3 are arranged in sequence along the front-to-back direction, and all convey the conveying object along the front-to-back direction. The first conveying device 1 and the second conveying device 3 are preferably belt conveying devices, and the conveying object is preferably a silicon wafer.

[0035] The adsorption conveying device 2 is located between the first conveying device 1 and the second conveying device 3, and at least part of the adsorption conveying device 2 is located above the tail end of the first conveying device 1 and the head end of the second conveying device 3. The adsorption conveying device 2 can generate adsorption force in a controlled manner. Under the action of the adsorption force of the adsorption conveying device 2, the silicon wafers at the tail end of the first conveying device 1 can be transferred to the head end of the second conveying device 3 by the adsorption conveying device 2. When the adsorption conveying device 2 does not generate adsorption force, the silicon wafers fall from the tail end of the first conveying device 1, or the adsorption conveying device 2 stops generating adsorption force during the process of transferring the silicon wafers, and the silicon wafers fall from the adsorption conveying device 2, thereby realizing the screening of the silicon wafers, in other words, eliminating defective products.

[0036] The air-cooling component 7 is in the shape of a strip extending in the left-right direction and is horizontally arranged above the corresponding first conveying device 1 or the second conveying device 3. There are preferably two air-cooling components 7, one of which is arranged above the first conveying device 1, preferably located above the tail end of the first conveying device 1, and the other air-cooling component 7 is arranged above the second conveying device 3.

[0037] The air-cooling component 7 is used to generate a downward airflow, and the airflow of the air-cooling component 7 is used to cool the silicon wafer to prevent the silicon wafer from being overly hot and affecting subsequent processes, such as affecting the accuracy and results of subsequent sorting processes. At the same time, the airflow of the air-cooling component 7 can also provide downward pressure on the silicon wafer to confine the silicon wafer to the corresponding first conveying device 1 or the second conveying device 3, thereby ensuring the stability and position of the silicon wafer during the conveying process and preventing the silicon wafer from moving.

[0038] The defective product rejection device of the embodiment of the utility model transfers the conveyor parts between the first conveyor device and the second conveyor device through an adsorption conveying device. The adsorption conveying device can generate adsorption force in a controlled manner. When the adsorption force is generated, the conveyor parts are adsorbed on the conveyor belt by the first conveyor device, and the conveyor belt transports the conveyor parts to the second conveyor device. When the adsorption force is not generated, the conveyor parts are dropped off by the second conveyor device or the adsorption component, thereby realizing the rejection of defective products. At the same time, an air-cooling part is provided to provide a downward airflow to the conveyor parts on the first conveyor device and / or the second conveyor device. On the one hand, downward pressure is applied to the conveyor parts to limit the position of the conveyor parts to avoid movement. On the other hand, the conveyor parts are cooled by the airflow.

[0039] In some embodiments, the defective product rejection device of the utility model embodiment further includes a tidying device 8, at least part of which is located above the second conveying device 3, so as to tidy the conveying parts on the second conveying device 3 along the second direction (such as Figure 1 The second direction is orthogonal to the first direction and the vertical direction.

[0040] like Figure 1 , Figure 3 and Figure 4As shown, the aligning device 8 spans over the second conveying device 3 in the left-right direction to align the positions of the conveying members on the second conveying device 3 in the left-right direction, so that the silicon wafers can be accurately conveyed to the next workstation by the second conveying device 3 .

[0041] In some embodiments, the tidying device 8 includes at least two groups of tidying wheels 81, a driving assembly 82 and an adjusting assembly 83. The two groups of tidying wheels 81 are arranged at intervals along the second direction to accommodate the conveying member, and each group of tidying wheels 81 includes at least two tidying wheels 81 arranged at intervals along the first direction. The driving assembly 82 is arranged one-to-one with the tidying wheels 81 arranged in groups to drive all the tidying wheels 81 in the corresponding group to rotate synchronously around the vertical direction, and the tidying wheels 81 can drive the conveying member to move along the conveying direction of the second conveying device 3. The adjusting assembly 83 is connected to two groups of tidying wheels 81, and is used to drive the two groups of tidying wheels 81 to be relatively close to and relatively far away from each other along the second direction.

[0042] like Figure 4 As shown, the tidying device 8 includes a tidying frame 84, which spans above the second conveying device 3 in the left-right direction. An adjusting component 83 is provided on the top of the tidying frame 84. The adjusting component 83 preferably includes an adjusting motor and an adjusting belt. The adjusting belt has two straight portions arranged at intervals in the front-to-back direction, and the straight portions extend in the left-to-right direction. The adjusting motor drives the adjusting belt to rotate so that the two straight portions move in opposite directions in the left-to-right direction.

[0043] The adjustment assembly 83 also includes two mounting seats, which are arranged one by one with the straight portion, and the two mounting seats are arranged at intervals in the left-right direction, so that the two mounting seats are driven to move in opposite directions in the left-right direction by adjusting the belt. Each mounting seat is provided with a corresponding set of regular wheels 81 and a driving assembly 82, each set of regular wheels 81 includes two regular wheels 81 arranged at intervals in the front-back direction, the regular wheels 81 are arranged at the bottom of the corresponding mounting seat, and can rotate around the vertical direction, the driving assembly 82 includes a driving motor and a driving belt, the driving belt drives the two regular wheels 81 on the same mounting seat and the driving motor to drive the two regular wheels 81 to rotate synchronously and in the same direction, and can drive the silicon wafers to move from front to back when abutting against the silicon wafers on the second conveying device 3, in other words, the regular wheels 81 can assist the second conveying device 3 in conveying silicon wafers.

[0044] When the silicon wafer moves on the second conveyor 3, it first contacts the aligning wheel 81 located in the moving direction of the silicon wafer. Driven by the rotation of the aligning wheel 81, the silicon wafer moves slightly in the left and right directions on the second conveyor 3, and then enters the space between the two sets of aligning wheels 81, and remains stable under the contact of the four aligning wheels 81 of the two sets of aligning wheels 81, so that the position and posture of the silicon wafer relative to the second conveyor 3 in the left and right directions remain fixed, thereby achieving the aligning of the silicon wafer. The distance between the two sets of aligning wheels 81 can be adjusted by adjusting the component 83, so as to adapt to silicon wafers of different sizes and models.

[0045] It is understood that the structure of the regularization device is not limited to Figure 4 In the structure shown, in other embodiments, the aligning device can align the silicon wafers by a push rod or a push plate.

[0046] In some embodiments, the air-cooling member 7 corresponding to the second conveying device 3 is disposed on the arranging device 8 and is movable in the vertical direction and the second direction relative to the arranging device 8 .

[0047] like Figure 1 and Figure 3 As shown, the tidying device 8 also includes a mounting bracket 85, which is arranged on the top of the tidying frame 84 and has three third mounting holes arranged at intervals in the left-right direction, and each third mounting hole extends in the vertical direction. The air-cooling component 7 located above the second conveying device 3 has four circular fourth mounting holes, and the four fourth mounting holes are arranged at intervals in the left-right direction. The connecting member connects the mounting bracket 85 to the air-cooling component 7 through the third mounting holes and the fourth mounting holes. By adjusting the position of the connecting member in the third mounting hole in the vertical direction, the position of the air-cooling component 7 relative to the tidying device 8 in the vertical direction can be adjusted. By selecting the three fourth mounting holes from left to right to be connected one-to-one with the three third mounting holes, or selecting the three fourth mounting holes from right to left to be connected one-to-one with the three third mounting holes, the position of the air-cooling component 7 relative to the tidying device 8 in the left-to-right direction can be adjusted.

[0048] In some embodiments, the adsorption conveying device 2 includes an adsorption component 21 and a conveyor belt 22. The adsorption component 21 extends along the first direction and is located above the tail end of the first conveying device 1 and the head end of the second conveying device 3. The adsorption component 21 can generate adsorption force in a controlled manner. At least a portion of the conveyor belt 22 is arranged at the bottom of the adsorption component 21 and can be transported and moved along the first direction.

[0049] like Figure 1 and Figure 2As shown, the adsorption conveying device 2 includes an adsorption component 21 and a conveyor belt 22. The adsorption component 21 extends in the front-to-back direction, and the front end of the adsorption component 21 is located above the tail end of the first conveying device 1, and the rear end of the adsorption component 21 is located above the head end of the second conveying device 3. The adsorption component 21 can generate an upward adsorption force in a controlled manner. Part of the conveyor belt 22 is arranged at the bottom of the adsorption component 21 and can be conveyed and moved in the direction from front to back relative to the adsorption component 21.

[0050] The adsorption conveying device 2 has a conveying state and a rejection state. In the conveying state, the adsorption component 21 generates an upward adsorption force to adsorb the silicon wafers on the tail end of the first conveying device 1 to the bottom of the conveyor belt 22 through the adsorption force, and the conveyor belt 22 transfers the adsorbed silicon wafers to the second conveying device 3 for further conveying. In the rejection state, the adsorption component 21 has no adsorption force, so that the conveyed parts on the first conveying device 1 fall from the tail end of the first conveying device 1, or the adsorption component 21 stops generating adsorption force after starting to generate adsorption force, so that the conveyed parts at the bottom of the conveyor belt 22 fall. In other words, in the rejection state, the adsorption component 21 can stop generating adsorption force during the process of conveying silicon wafers by the conveyor belt 22, so that the silicon wafers fall from the conveyor belt 22 between the first conveying device 1 and the second conveying device 3, and can also not generate adsorption force when the silicon wafers are located at the tail end of the first conveying device 1, so that the silicon wafers fall from the tail end of the first conveying device 1.

[0051] Thus, the adsorption conveying device 2 is used to screen the silicon wafers, so that the good silicon wafers can reach the second conveying device 3 and be transported to the next station by the second conveying device 3, and the bad silicon wafers can fall and cannot reach the second conveying device 3. At the same time, the adsorption conveying device 2 has high stability during the transportation process by cooperating with the conveyor belt 22 and the adsorption assembly 21 to transport the conveying parts.

[0052] In this embodiment, when the silicon wafer at the bottom of the conveyor belt 22 moves to the rear end of the adsorption component 21, it continues to move backward under the drive of the conveyor belt 22, or continues to move backward under inertia, thereby leaving the adsorption force range of the adsorption component 21 and automatically falling onto the second conveying device 3. It can be understood that in other embodiments, when the silicon wafer moves to the rear end of the adsorption component 21, the adsorption component 21 can be controlled to stop generating the adsorption force, thereby causing the silicon wafer to fall.

[0053] In some embodiments, the adsorption component 21 includes an adsorption chamber 211 and a vacuum generator 212. The adsorption chamber 211 extends along a first direction and is located above the tail end of the first conveying device 1 and the head end of the second conveying device 3. The bottom of the adsorption chamber 211 has a plurality of air holes arranged at intervals along the first direction. The vacuum generator 212 is connected to the adsorption chamber 211 so that the air holes have an airflow flowing into the adsorption chamber 211 in the conveying state, and the air holes have no airflow or have an airflow flowing out of the adsorption chamber 211 in the removal state.

[0054] like Figure 2 As shown, the adsorption component 21 includes an adsorption chamber 211 and a vacuum generator 212. The adsorption chamber 211 extends in the front-to-back direction. The front end of the adsorption chamber 211 is located above the tail end of the first conveying device 1, and the rear end of the adsorption chamber 211 is located above the head end of the second conveying device 3. The interior of the adsorption chamber 211 is hollow, and the bottom of the adsorption chamber 211 has a plurality of air holes arranged at intervals in the front-to-back direction. The vacuum generator 212 is connected to the inner cavity of the adsorption chamber 211 through a valve group.

[0055] In the conveying state, the vacuum generator 212 extracts air from the inner cavity of the adsorption chamber 211 so that the air holes have airflow flowing into the adsorption chamber 211, thereby generating an upward adsorption force at the bottom of the adsorption chamber 211. In the rejection state, the vacuum generator 212 is closed, the air holes have no airflow, and thus no adsorption force is generated, and the silicon wafer falls from the tail end of the first conveying device 1. Alternatively, the vacuum generator 212 supplies air to the inner cavity of the adsorption chamber 211 through the valve group so that the air holes have airflow flowing out of the adsorption chamber 211, that is, back-blowing airflow, and the silicon wafer falls quickly from the tail end of the first conveying device 1 through the back-blowing airflow.

[0056] The conveyor belt 22 is preferably wrapped around the adsorption chamber 211. The conveyor belt 22 is preferably two conveyor belts arranged at intervals in the left-right direction to abut the left and right ends of the silicon wafer to improve the stability of the silicon wafer during transportation. The adsorption and conveying device 2 also includes a power component, which is connected to the two conveyor belts 22 to drive the two conveyor belts 22 to move synchronously. Preferably, the power component includes a rotating motor and a pulley arranged at the upper end of the adsorption chamber 211.

[0057] Furthermore, the adsorption chamber 211 may include a plurality of sub-chambers arranged in sequence along the front-to-back direction, and each sub-chamber may be independently controlled to generate adsorption force. At this time, the size of the adsorption conveying device 2 in the front-to-back direction may be longer, and multiple silicon wafers may be conveyed at the same time. In the rejection state, the front sub-chamber may not generate adsorption force, so that the silicon wafers on the tail end of the first conveying device 1 may fall from the tail end of the first conveying device 1, while the silicon wafers conveyed by the conveyor belt 22 may still be conveyed. Alternatively, the middle sub-chamber may not generate adsorption force, so that the silicon wafers at the bottom of the sub-chamber may fall from the conveyor belt 22, while the remaining silicon wafers on the conveyor belt 22 may still be conveyed.

[0058] It is understandable that the structure of the adsorption assembly is not limited to including the adsorption chamber and the vacuum generator. In other embodiments, the adsorption assembly includes a plurality of Bernoulli suction cups arranged in sequence along the front-to-back direction.

[0059] In some embodiments, the defective product rejection device of the utility model embodiment also includes a detection device 4, at least part of which is located above the first conveying device 1, and the detection device 4 is used to detect whether the conveyed parts on the first conveying device 1 are good products or defective products, and send a corresponding signal to the adsorption conveying device 2, so that the adsorption conveying device 2 is in a conveying state when the conveyed parts are good products, and is in a rejection state when the conveyed parts are defective products.

[0060] like Figure 1 As shown, the detection device 4 includes an image acquirer and a detection frame. All or part of the detection frame is located above the first conveying device 1 and is provided with an image acquirer. The image acquirer is preferably a camera. The image acquirer is used to acquire the image of the silicon wafer on the first conveying device 1 and detect whether the silicon wafer is good or defective through image comparison.

[0061] The image acquisition device is electrically connected to the adsorption conveying device 2 to send a corresponding signal to the adsorption conveying device 2 according to the detection result. When the silicon wafer moved to the tail end of the first conveying device 1 is a good product, the adsorption conveying device 2 generates an adsorption force after receiving the corresponding signal, so as to be in a conveying state, thereby adsorbing and conveying the good silicon wafer to the second conveying device 3. When the silicon wafer moved to the tail end of the first conveying device 1 is a defective product, the adsorption conveying device 2 does not generate an adsorption force after receiving the corresponding signal, or stops generating an adsorption force during the conveying process, so as to be in a rejection state, so that the defective product falls from the tail end of the first conveying device 1 or the conveyor belt 22, thereby rejecting the defective product. Preferably, the detection device 4 is used for fragment detection.

[0062] Furthermore, the image acquirer is connected to the detection frame via a connecting bracket, the connecting bracket has a first mounting hole extending in the front-to-back direction, the first mounting hole is provided with a connector for connecting the image acquirer, the detection frame has a second mounting hole extending in the vertical direction, the second mounting hole is provided with a connector for connecting the connecting bracket, so that the image acquirer can move in the front-to-back direction and the vertical direction relative to the detection frame to adjust the position of the image acquirer relative to the detection frame, so that the image acquirer can accurately acquire the image of the silicon wafer on the first conveying device 1.

[0063] In some embodiments, the defective product rejection device of the utility model embodiment also includes a sensor 5, which is located at the tail end of the first conveying device 1. The sensor 5 is used to sense the conveyed object and send a signal to the adsorption conveying device 2 when sensing the conveyed object. After receiving the signal from the sensor 5, the adsorption conveying device 2 switches to the corresponding conveying state or rejection state according to the signal from the detection device 4.

[0064] like Figure 1 and Figure 2 As shown, a sensor 5 is provided at the tail end of the first conveying device 1, the detection device 4 is located in front of the sensor 5, the adsorption conveying device 2 is located behind the sensor 5, the sensor 5 is electrically connected to the adsorption conveying device 2, and the sensor 5 is used to sense the conveying object. In other words, the sensor 5 is used to sense whether there is a conveying object passing above it, and sends a signal to the adsorption conveying device 2 when sensing the conveying object.

[0065] The silicon wafer on the first conveying device 1 passes through the detection device 4 and the sensor 5 in sequence. The adsorption conveying device 2 first receives the signal from the detection device 4 and then receives the signal from the sensor 5. When the adsorption conveying device 2 receives the signal from the detection device 4, there is still a certain distance between the silicon wafer and the adsorption conveying device 2. When the adsorption conveying device 2 receives the signal from the sensor 5, the silicon wafer is located within the adsorption force range of the adsorption conveying device 2. Therefore, after receiving the signal from the sensor 5, the adsorption conveying device 2 switches to the corresponding conveying state or rejection state according to the signal from the detection device 4 received previously. In other words, if the silicon wafer is a good product, the adsorption conveying device 2 switches to the conveying state; if the silicon wafer is a defective product, the adsorption conveying device 2 switches to the rejection state.

[0066] In some embodiments, the defective product rejection device of the utility model embodiment also includes a waste box 6, which is located between the first conveying device 1 and the second conveying device 3 and is used to receive the conveyed parts dropped by the first conveying device 1 or the adsorption conveying device 2.

[0067] like Figure 1 and Figure 2 As shown, the top of the waste box 6 is open. The waste box 6 is located between the first conveying device 1 and the second conveying device 3 and below the adsorption assembly 21. It is used to receive silicon wafers dropped by the first conveying device 1 or the adsorption conveying device 2. When the waste box 6 receives silicon wafers dropped by the first conveying device 1, the top of the waste box 6 is lower than the top surface of the belt of the first conveying device 1.

[0068] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0069] In addition, the terms "first" and "second" are only used for distinction, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0070] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0071] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] In the present utility model, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0073] Although the above embodiments have been shown and described, it is to be understood that the above embodiments are illustrative and cannot be construed as limitations on the present invention. Changes, modifications, substitutions and variations of the above embodiments by those of ordinary skill in the art are all within the scope of protection of the present invention.

Claims

1. A defective product rejection device, characterized in that: The invention comprises a first conveying device (1), an adsorption conveying device (2), a second conveying device (3) and an air-cooling component (7); the first conveying device (1), the adsorption conveying device (2) and the second conveying device (3) are arranged in sequence along a first direction; at least part of the adsorption conveying device (2) is located above the rear end of the first conveying device (1) and the front end of the second conveying device (3); the adsorption conveying device (2) can generate an adsorption force in a controlled manner; the air-cooling component (7) is provided above at least one of the first conveying device (1) and the second conveying device (3); and the air-cooling component (7) is used to generate a downward airflow.

2. The defective product rejection device according to claim 1, characterized in that: It also includes a tidying device (8), at least part of which is located above the second conveying device (3) to tidy the position of the conveying member on the second conveying device (3) along a second direction, wherein the second direction is orthogonal to the first direction and the vertical direction.

3. The defective product rejection device according to claim 2, characterized in that: The tidying device (8) comprises: At least two groups of aligning wheels (81), wherein the two groups of aligning wheels (81) are arranged at intervals along the second direction to accommodate the conveying member, and each group of aligning wheels (81) comprises at least two aligning wheels (81) arranged at intervals along the first direction; A driving assembly (82), wherein the driving assembly (82) is arranged one-to-one with the aligning wheels (81) arranged in groups, so as to drive all the aligning wheels (81) in a corresponding group to rotate synchronously around a vertical direction, and enable the aligning wheels (81) to drive the conveying member to move along the conveying direction of the second conveying device (3); An adjusting component (83), wherein the adjusting component (83) is connected to two of the groups of the aligning wheels (81) and is used to drive the two groups of the aligning wheels (81) to move relatively closer to each other and relatively farther away from each other along the second direction.

4. The defective product rejection device according to claim 2, characterized in that: The air cooling component (7) corresponding to the first conveying device (1) is located above the rear end of the first conveying device (1); The air-cooling component (7) corresponding to the second conveying device (3) is arranged on the aligning device (8) and is movable along the vertical direction and the second direction relative to the aligning device (8).

5. The defective product rejection device according to claim 1, characterized in that: The adsorption and conveying device (2) comprises: an adsorption component (21), the adsorption component (21) extending along the first direction and being located above the tail end of the first conveying device (1) and the head end of the second conveying device (3), the adsorption component (21) being controllably capable of generating an adsorption force; and A conveyor belt (22), at least a portion of which is arranged at the bottom of the adsorption component (21) and can be transported and moved along the first direction.

6. The defective product rejection device according to claim 5, characterized in that: The adsorption conveying device (2) has a conveying state and a rejecting state; In the conveying state, the adsorption component (21) generates an adsorption force to adsorb the conveying member on the first conveying device (1) to the bottom of the conveyor belt (22), and convey the conveying member to the second conveying device (3); In the rejection state, the adsorption component (21) has no adsorption force, so that the conveying member on the first conveying device (1) falls from the tail end of the first conveying device (1), or the adsorption component (21) stops generating adsorption force after starting to generate adsorption force, so that the conveying member at the bottom of the conveyor belt (22) falls.

7. The defective product rejection device according to claim 6, characterized in that: The adsorption component (21) comprises an adsorption chamber (211) and a vacuum generator (212); the adsorption chamber (211) extends along the first direction and is located above the tail end of the first conveying device (1) and the head end of the second conveying device (3); the bottom of the adsorption chamber (211) has a plurality of air holes arranged at intervals along the first direction; the vacuum generator (212) is connected to the adsorption chamber (211) so that the air holes have an airflow flowing into the adsorption chamber (211) in the conveying state, and the air holes have no airflow or have an airflow flowing out of the adsorption chamber (211) in the rejection state.

8. The defective product rejection device according to claim 6, characterized in that: It also includes a detection device (4), at least part of which is located above the first conveying device (1), and the detection device (4) is used to detect whether the conveyed part on the first conveying device (1) is a good product or a defective product, and send a corresponding signal to the adsorption conveying device (2), so that the adsorption conveying device (2) is in a conveying state when the conveyed part is a good product, and is in a rejection state when the conveyed part is a defective product.

9. The defective product rejection device according to claim 8, characterized in that: The device further comprises a sensor (5), wherein the sensor (5) is located at the rear end of the first conveying device (1), and the sensor (5) is used to sense the conveyed object, and send a signal to the adsorption conveying device (2) when the conveyed object is sensed. After receiving the signal from the sensor (5), the adsorption conveying device (2) switches to a corresponding conveying state or a rejection state according to the signal from the detection device (4).

10. The defective product rejection device according to claim 1, characterized in that: It also comprises a waste box (6), which is located between the first conveying device (1) and the second conveying device (3) and is used to receive conveying parts dropped by the first conveying device (1) or the adsorption conveying device (2).