Discharging mechanism of quartz wafer frequency sorting equipment

Abstract

The utility model relates to quartz wafer sorting equipment. The blanking mechanism of the quartz wafer frequency sorting equipment comprises a mounting frame, the mounting frame is mounted on a central shaft, an air source is mounted on the mounting frame and connected with a micro filter, the micro filter is connected with a suction nozzle through an air pipe, the suction nozzle is mounted on the mounting frame, a suction hole is formed in the suction nozzle, and the suction hole is communicated with the micro filter. The area of the suction hole area is larger than that of the quartz wafer to be sucked. The blanking mechanism of the quartz wafer frequency sorting equipment is simple in structure, capable of effectively preventing air holes from being blocked, high in blanking device efficiency, good in stability and low in fault rate. The technical problems that in the prior art, when a suction nozzle sucks a wafer, dust and wafer fragments are sucked, the suction nozzle is blocked, the wafer is broken, shutdown maintenance is needed, and then a large amount of time is wasted are solved.

Description

Technical Field

[0001] The utility model relates to a quartz wafer sorting device, in particular to a material unloading mechanism of the quartz wafer frequency sorting device. Background Art

[0002] Quartz wafers, quartz wafers are referred to as wafers, and the quartz wafer frequency sorting and unloading mechanism is referred to as unloading arm. The wafers are cut into large square pieces using quartz crystal rods, and then processed into smaller wafers through a series of processes. When the wafer is subjected to an external alternating electric field, it will produce mechanical vibrations. When the frequency of the alternating electric field is the same as the natural frequency of the quartz crystal, the vibration becomes very strong. This is the characteristic of the wafer frequency. Using this characteristic, the frequency of a single wafer can be measured for classification, and the unloading arm can be used for terminal sorting.

[0003] In the application of quartz wafer sorting, using traditional unloading arms, unloading failures account for more than half of the frequency sorting machine failures, such as: pore blockage, etc. Therefore, it is urgent to reduce the failure rate and improve equipment efficiency. At present, a suitable unloading device is needed to improve efficiency. Summary of the invention

[0004] The utility model provides a feeding mechanism for quartz chip frequency sorting equipment which has a simple structure, effectively prevents pore blockage, has a high feeding device efficiency, good stability and low failure rate; it solves the technical problem in the prior art that dust and chip fragments are sucked up by the suction nozzle during the process of sucking the chip, which may cause the suction nozzle to be blocked, break the chip, require shutdown for maintenance and waste a lot of time.

[0005] The above technical problems of the utility model are solved by the following technical solutions: a material unloading mechanism of a quartz wafer frequency sorting device, including a mounting frame, the mounting frame is mounted on a central axis, an air source is mounted on the mounting frame, the air source is connected to a micro filter, the micro filter is connected to a suction nozzle through an air pipe, the suction nozzle is mounted on the mounting frame, a suction hole is provided on the suction nozzle, and the area of ​​the suction hole region is larger than the area of ​​the quartz wafer to be sucked. The dust and wafer fragments sucked by the unloading arm during operation are filtered by the micro filter, which reduces the problem of clogging of the suction nozzle, greatly reduces the maintenance time of the equipment, and improves the efficiency of a small part. The enlarged suction hole area makes the effect of sucking the wafer better and more firm.

[0006] Preferably, the number of the suction holes is 5 to 8. Increasing the number of suction holes on the suction nozzle reduces the risk of blockage and improves the success rate of sucking wafers, thereby reducing the risk of wafer breakage and improving efficiency.

[0007] Preferably, the aperture is 0.08 mm to 0.1 mm. The diameter of the suction hole becomes smaller. After multiple uses, the diameter of the suction hole is much smaller than the size of the wafer. During the suction process, if the end face of the suction hole is damaged, the impact on the wafer is small.

[0008] Preferably, the suction holes are arranged in a cross, a ring or a triangle shape to improve the suction effect.

[0009] Preferably, a through hole is provided above the suction nozzle, and the through hole is sealed by a sealing member, which is detachably connected to the suction nozzle. The sealing member can prevent air leakage on one hand, and on the other hand, the sealing member is detachable, which is convenient for replacement, and also convenient for opening the suction nozzle from the top to clear it after the suction nozzle is blocked.

[0010] Preferably, the mounting frame comprises a mounting seat and a mounting plate, the mounting seat is fixed on the central axis, a mounting groove is provided on the mounting seat, the mounting plate is mounted on the mounting groove, and the suction nozzle is fixed on the mounting plate.

[0011] Preferably, each side of the mounting groove is provided with a mounting screw, and the two mounting screws are arranged along the length direction of the mounting plate. The position of the mounting plate in the mounting groove can be adjusted by the two mounting screws, so as to facilitate the adjustment of the suction nozzle along the length direction of the mounting plate.

[0012] Preferably, one end of the mounting frame is connected to the central axis, and the other end of the mounting frame is provided with a suction nozzle hole, in which the suction nozzle is installed, and a screw hole is provided in the radial direction of the side wall of the suction nozzle hole, and the suction nozzle is fixed by an inner screw of the screw hole. The radial screw can adjust the position of the suction nozzle in the axial direction. In combination with the mounting screws on the mounting plate, the specific position of the suction nozzle can be adjusted to facilitate the suction of the wafer.

[0013] Preferably, the suction nozzle is made of stainless steel.

[0014] Therefore, the unloading mechanism of a quartz wafer frequency sorting device of the utility model has the following advantages: the nozzle sucks the wafer, and the original three-hole nozzle is changed to five-hole, which not only increases the suction hole area, but also increases the number of holes. At the same time, a micro filter is added between the solenoid valve and the nozzle. This filter can filter the dust and wafer fragments sucked during the operation of the unloading arm, reduce the problem of nozzle blockage, greatly reduce the maintenance time of the equipment, and improve the efficiency of a small part. At the same time, adjusting the position of the nozzle by screws can allow the nozzle to better complete the process of sucking the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a three-dimensional diagram of a material unloading mechanism of a quartz wafer frequency sorting device.

[0016] Figure 2 yes Figure 1Another perspective view.

[0017] Figure 3 yes Figure 1 3D image of the nozzle. DETAILED DESCRIPTION

[0018] The technical solution of the utility model is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0019] Example:

[0020] like Figure 1 and 2 As shown in Figure 3, a material unloading mechanism of a quartz wafer frequency sorting device includes a central axis 11, and the central axis 11 is installed on the sorting device. A mounting frame is fixed on the central axis 11, and the mounting frame includes a mounting seat 10 and a mounting plate 8. The mounting seat 10 is fixed on the central axis 11 and moves with the rotation of the central axis 11. A mounting groove 7 is provided on the mounting seat 10, and a long strip of mounting plate 8 is installed in the mounting groove 7, one end of the mounting plate 8 extends out of the mounting groove 7, and a suction nozzle hole is provided at the end of the mounting plate 8. A suction nozzle 4 is installed in the suction nozzle hole, and the suction nozzle 4 is square on the top and round on the bottom.

[0021] A mounting screw 9 is installed on each side of the mounting groove 7, and the two mounting screws 9 are arranged along the length direction of the mounting plate 8, and the two mounting screws 9 are arranged alternately. The mounting plate is locked in the mounting groove 7 by the mounting screws 9, and the movement of the mounting plate 8 in the mounting groove 7 also drives the movement of the suction nozzle 4 installed at the end of the mounting plate, thereby determining the position of the suction nozzle 4.

[0022] A through hole is provided on the upper end surface of the suction nozzle 4, and a seal 5 is installed in the through hole. The seal 5 is detachably installed in the through hole. Five suction holes 12 are provided on the lower end surface of the cylindrical part of the suction nozzle 4. The suction holes 12 are in a "cross" shape, and the diameter of the suction holes 12 is 0.1 mm. The diameter of the suction hole area formed by the suction holes 12 is about 0.3 mm, which is convenient for sucking wafers.

[0023] A screw hole is provided in the radial direction of the suction nozzle 4, and a screw 6 is installed in the screw hole to fix the position of the suction nozzle in the axial direction.

[0024] An air source seat is installed on the mounting seat, and an air source 1 is installed on the air source seat. The air source 1 is connected to an air pipe 3 through a micro filter 2. The micro filter 2 uses a micro filter of model SFC33 with an air pressure range of 0.1~1.0Mpa. The other end of the air pipe 3 is connected to a suction nozzle 4. The micro filter 2 can filter out impurities and water vapor in the air source, and can effectively prevent the suction nozzle of the feeding mechanism from being blocked. The suction nozzle is made of stainless steel.

[0025] When in use, the central axis is driven to rotate by a motor according to the vibration frequency of the wafer, and the suction nozzle is brought to the front of different wafer boxes.

[0026] The specific embodiments described herein are merely examples of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A material unloading mechanism for a quartz wafer frequency sorting device, comprising a mounting frame, the mounting frame being mounted on a central axis, a gas source being mounted on the mounting frame, characterized in that: The air source is connected to a micro filter, the micro filter is connected to a suction nozzle through an air pipe, the suction nozzle is installed on a mounting frame, a suction hole is opened on the suction nozzle, and the area of ​​the suction hole is larger than the area of ​​the quartz wafer to be sucked.

2. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1, characterized in that: The number of the suction holes is 5 to 8.

3. A material unloading mechanism for a quartz wafer frequency sorting device according to claim 1 or 2, characterized in that: The diameter of the suction hole is 0.08 mm to 0.1 mm.

4. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1 or 2, characterized in that: The suction holes are arranged in a cross shape, a ring shape or a triangle shape.

5. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1 or 2, characterized in that: A through hole is arranged above the suction nozzle, and the through hole is sealed by a sealing member, and the sealing member is detachably connected to the suction nozzle.

6. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1, characterized in that: The mounting frame comprises a mounting seat and a mounting plate. The mounting seat is fixed on the central axis. A mounting groove is provided on the mounting seat. The mounting plate is mounted on the mounting groove. The suction nozzle is fixed on the mounting plate.

7. The unloading mechanism of the quartz wafer frequency sorting device according to claim 6, characterized in that: A mounting screw is respectively arranged on the side of the mounting groove, and the two mounting screws are arranged along the length direction of the mounting plate.

8. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1 or 2, characterized in that: One end of the mounting frame is connected to the central axis, and the other end of the mounting frame is provided with a suction nozzle hole, in which the suction nozzle is installed. A screw hole is provided in the radial direction of the side wall of the suction nozzle hole, and the suction nozzle is fixed by an inner screw of the screw hole.

9. The unloading mechanism of the quartz wafer frequency sorting device according to claim 1 or 2, characterized in that: The suction nozzle is made of stainless steel.

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