Electroplating carrier and electroplating equipment

Abstract

The utility model discloses an electroplating carrier and electroplating equipment, the electroplating carrier comprises a frame, a conductive assembly and a cover plate, a hollow area is arranged in the frame, the conductive assembly comprises a conductive rod and a conductive sheet, the conductive rod is mounted in the frame, the conductive sheet is connected to the conductive rod, and at least part of the conductive sheet extends into the hollow area; the cover plate comprises a first end and a second end which are oppositely arranged, the first end is movably connected to the frame, and a locking piece is arranged between the second end and the frame; the cover plate can rotate relative to the frame, so that a workpiece to be plated is clamped and fixed through the cover plate and the conducting strip, and the cover plate and the frame are locked or unlocked through the locking piece. When the electroplating carrier is used, the to-be-plated workpiece can be quickly assembled and disassembled by rotating the cover plate, the electroplating carrier does not need to be disassembled from electroplating equipment, the operation process is greatly simplified, and the risk that the to-be-plated workpiece is damaged in the assembling and disassembling process can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of electroplating technology, and specifically relates to an electroplating carrier and electroplating equipment. Background Art

[0002] With the continuous development of solar cell production technology, the electrode preparation process of solar cells has gradually changed from screen printing process to electroplating preparation process. Electroplating electrodes have a higher aspect ratio and better conductivity than screen-printed electrodes, which reduces the internal resistance of the battery and reduces the loss of shading, etc., which helps to improve the photoelectric conversion efficiency of solar cells. In the electroplating process, it is usually necessary to use an electroplating carrier as a carrier for solar cells, and the electroplating carrier carries the cells in and out of the electroplating tank and runs between different stations.

[0003] In the electroplating carrier in the related art, the battery cells are mounted and fixed on the carrier by fixing components. When loading and unloading, the electroplating carrier needs to be removed from the electroplating equipment and laid flat, and then the fixing components are loosened by screwing, and then the battery cells are taken out of the electroplating carrier, and then replaced with new battery cells for reassembly. However, the operation process of using this electroplating carrier is cumbersome, and the battery cells are easily broken during the operation. Summary of the invention

[0004] The present application aims to provide an electroplating carrier and an electroplating device, which can solve the problem that the electroplating carrier used in the related technology has a cumbersome operation process and is prone to causing battery cells to break during the operation.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electroplating carrier, comprising:

[0007] A frame, wherein a hollow area is provided in the frame;

[0008] A conductive component, comprising a conductive rod and a conductive sheet, wherein the conductive rod is installed in the frame, and the conductive sheet is connected to the conductive rod and at least partially extends into the hollow area;

[0009] A cover plate, the cover plate includes a first end and a second end arranged opposite to each other, the first end is movably connected to the frame, and a locking member is provided between the second end and the frame; the cover plate can be rotated relative to the frame to clamp and fix the workpiece to be plated through the cover plate and the conductive sheet, and the locking member is used to lock or unlock the cover plate and the frame.

[0010] Optionally, the locking member includes a first locking member provided at the second end, and a second locking member provided at the frame, and the first locking member cooperates with the second locking member to lock or unlock the second end and the frame.

[0011] Optionally, the first locking member is a buckle, and the second locking member is a slot; or, the first locking member is a slot, and the second locking member is a buckle, and the buckle and the slot are engaged with each other to lock or unlock the second end and the frame.

[0012] Optionally, a accommodating groove is provided on the side of the first end facing the hollow area, and along the extension direction of the rotation axis of the cover plate, the accommodating groove has two side walls arranged opposite to each other, and the spacing between the two side walls on the side close to the second end is greater than the spacing on the side close to the first end.

[0013] Optionally, the electroplating carrier also includes a support plate, which is arranged on a side of the cover plate away from the frame, one end of the support plate is fixedly connected to the frame, and the other end of the support plate extends in a direction away from the frame, and a first angle is formed between the extension direction of the support plate and a side surface of the frame facing the support plate.

[0014] Optionally, the first angle is: 30°-90°.

[0015] Optionally, a boundary line is formed at the junction of the support plate and the frame, and an extension direction of the boundary line forms a second angle with the first direction.

[0016] Optionally, the second angle is: 1°-5°.

[0017] Optionally, a mounting hole is provided in the frame, the conductive rod is passed through the mounting hole, a limiting groove is provided on the hole wall of the mounting hole, a limiting protrusion is provided on the conductive rod, and the limiting protrusion is embedded in the limiting groove.

[0018] Optionally, a conductive contact is provided at one end of the conductive sheet away from the conductive rod, the conductive contact protrudes and extends from the surface of the conductive sheet toward the cover plate, and the conductive contact is used to electrically connect to the workpiece to be plated.

[0019] Optionally, a hook is provided on the frame; and / or the conductive sheet is an elastic conductive sheet.

[0020] Optionally, the conductive components are provided in plurality, and the plurality of conductive components are sequentially spaced apart in the frame to divide the hollow area into a plurality of electroplating areas, and each of the electroplating areas is provided with a corresponding cover plate.

[0021] Optionally, a plurality of the conductive sheets are disposed on the conductive rod, and the plurality of the conductive sheets on some of the conductive rods are disposed on both sides of the conductive rod, and the conductive sheets at least partially extend into the electroplating area.

[0022] In a second aspect, an embodiment of the present application proposes an electroplating device, comprising: an equipment body and an electroplating carrier as described in any one of the above items, wherein the equipment body is provided with an electroplating tank, and the electroplating carrier is used to carry a workpiece to be plated into and out of the electroplating tank.

[0023] In the embodiment of the present application, a hollow area is provided in the frame, a conductive rod is installed in the frame, and the conductive sheet on the conductive rod at least partially extends into the hollow area. At the same time, a rotatable cover is provided on the frame so that the workpiece to be plated can be placed in the hollow area, and then the cover and the conductive sheet are rotated to clamp and fix the workpiece to be plated, and the cover and the frame are locked or unlocked by a locking member. At the same time, the workpiece to be plated is in contact with the conductive sheet, and the conductive sheet can energize the workpiece to be plated. In this way, during operation and use, the workpiece to be plated can be quickly loaded and unloaded by rotating the cover without removing the electroplating carrier from the electroplating equipment, which greatly simplifies the operation process and can reduce the risk of damage to the workpiece to be plated during the disassembly and assembly process.

[0024] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 is a three-dimensional diagram of an electroplating carrier according to an embodiment of the present application;

[0027] Figure 2 is a front view of an electroplating carrier according to an embodiment of the present application;

[0028] Figure 3 is a side view of an electroplating carrier according to an embodiment of the present application;

[0029] Figure 4 is a partial schematic diagram of an electroplating carrier according to an embodiment of the present application;

[0030] Figure 5 is a schematic diagram of a cover plate according to an embodiment of the present application;

[0031] Figure 6 is a partial schematic diagram of a cover plate according to an embodiment of the present application;

[0032] Figure 7is a partial schematic diagram of a framework according to an embodiment of the present application;

[0033] Figure 8 It is a partial schematic diagram of a conductive component according to an embodiment of the present application.

[0034] Reference numerals:

[0035] 100: frame; 101: hollow area; 102: mounting hole; 102a: limiting groove; 103: first fixing rod; 104: second fixing rod; 120: hook; 200: conductive component; 210: conductive rod; 211: limiting protrusion; 220: conductive sheet; 221: conductive contact; 300: cover plate; 300a: first end; 300b: second end; 310: accommodating groove; 310a: side wall; 400: support plate; 400a: boundary line; 500: locking member; 510: first locking member; 520: second locking member; A: first angle; B: second angle; X: first direction; Y: second direction. DETAILED DESCRIPTION

[0036] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0037] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0038] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] The electroplating carrier and electroplating equipment provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0041] like Figures 1 to 5 As shown, according to some embodiments of the present application, the electroplating carrier includes: a frame 100, a conductive component 200 and a cover plate 300; the frame 100 is provided with a hollow area 101, the conductive component 200 includes a conductive rod 210 and a conductive sheet 220, the conductive rod 210 is installed in the frame 100, and the conductive sheet 220 is connected to the conductive rod 210 and at least partially extends into the hollow area 101; the cover plate 300 includes a first end 300a and a second end 300b arranged opposite to each other, and the first end 300a It is movably connected to the frame 100, and a receiving groove 310 is provided on the side of the first end 300a facing the hollow area 101, and the receiving groove 310 is used to insert the workpiece to be plated; the cover plate 300 can be rotated relative to the frame 100 to make the cover plate 300 approach or move away from the conductive sheet 220. When the cover plate 300 approaches the conductive sheet 220, the workpiece to be plated is clamped and fixed by the cover plate 300 and the conductive sheet 220, and the locking member 500 is used to lock or unlock the cover plate 300 and the frame 100.

[0042] In the embodiment of the present application, a hollow area 101 is provided in the frame 100, and the conductive rod 210 is installed in the frame 100, and the conductive sheet 220 on the conductive rod 210 at least partially extends into the hollow area 101. At the same time, a rotatable cover plate 300 is provided on the frame 100, so that the workpiece to be plated can be placed in the hollow area 101, and then the cover plate 300 is rotated so that the cover plate 300 and the conductive sheet 220 clamp and fix the workpiece to be plated, and the cover plate 300 and the frame 100 are locked or unlocked by the locking member 500. In this way, during operation and use, the workpiece to be plated can be quickly loaded and unloaded by rotating the cover plate, without removing the electroplating carrier from the electroplating equipment, which greatly simplifies the operation process and can reduce the risk of damage to the workpiece to be plated during the disassembly and assembly process.

[0043] It can be understood that the electroplating carrier in the present application can be used in the electroplating process, and the workpiece to be plated, such as a silicon wafer or a battery cell, can be installed in the electroplating carrier, and the electroplating carrier can carry the workpiece to be plated into the electroplating tank so that the workpiece to be plated contacts the electroplating liquid in the electroplating tank to realize the electroplating operation.

[0044] Specifically, one or more hollow areas 101 are provided in the frame 100 , a conductive rod 210 is provided in the hollow area 101 , and a conductive sheet 220 is provided on the conductive rod 210 , one end of the conductive sheet 220 is connected to the conductive rod 210 , and the other end of the conductive sheet 220 extends into the hollow area 101 .

[0045] Among them, the conductive rod 210 can be electrically connected to an external power supply, the conductive sheet 220 is electrically connected to the conductive rod 210, and the conductive sheet 220 is provided with a conductive part at one end away from the conductive rod 210. The conductive part can be used to contact the plating surface of the workpiece to be plated so as to supply electricity to the workpiece to be plated through the conductive rod 210 and the conductive sheet 220.

[0046] Furthermore, if Figure 1 and Figure 5 As shown, a cover plate 300 is disposed in the frame 100 , and the cover plate 300 has a first end 300 a and a second end 300 b opposite to each other. The first end 300 a of the cover plate 300 is rotatably connected to the frame 100 , and a locking member 500 is disposed between the second end 300 b of the cover plate 300 and the frame 100 .

[0047] In a specific application, the workpiece to be plated can be installed between the cover plate 300 and the conductive sheet 220, and then the cover plate 300 is rotated to be close to the conductive sheet 220 to clamp the workpiece to be plated in cooperation with the conductive sheet 220, and the cover plate 300 and the frame 100 are locked by the locking member 500 to achieve the installation of the workpiece to be plated. When the workpiece to be plated needs to be removed, it is only necessary to release the locking member 500 and flip the cover plate 300 to quickly realize the removal of the workpiece to be plated.

[0048] Furthermore, a receiving groove 310 is provided on the side of the first end 300a of the cover plate 300 facing the hollow area 101, and the notch of the receiving groove 310 faces the second end 300b, so that the workpiece to be plated can be at least partially inserted into the receiving groove 310, and the receiving groove 310 forms a limiting support for the workpiece to be plated.

[0049] It should be noted that the size of the space in the receiving groove 310 can be determined according to the size of the workpiece to be plated, so as to ensure that the receiving groove 310 is used to support and limit the workpiece to be plated. At the same time, there is a certain gap between the side walls 310a of the receiving groove 310 and the workpiece to be plated to avoid the receiving groove 310 from squeezing the workpiece to be plated and causing deformation and damage to the workpiece to be plated.

[0050] In a specific application, one end of the workpiece to be plated can be inserted into the receiving groove 310 of the first end 300a of the cover plate 300, and the non-electroplating surface of the workpiece to be plated can be facing the cover plate 300, so as to pre-fix the workpiece to be plated in the cover plate 300, and the position of the workpiece to be plated relative to the hollow area 101 can be adjusted by flipping the cover plate 300. Then, the cover plate 300 is rotated to move toward the direction close to the hollow area 101 until the electroplating surface of the workpiece to be plated contacts the conductive sheet 220 in the hollow area 101. In this way, the conductive sheet 220 and the cover plate 300 can be used to form a clamping fixation from both sides of the workpiece to be plated, so that the workpiece to be plated can be installed and fixed in the electroplating carrier, so that the workpiece to be plated can be disassembled, assembled and replaced by flipping the cover plate 300, which is simple and convenient to operate, and can greatly simplify the operation steps compared to the carrier plate of the related art.

[0051] It should be noted that the conductive sheet 220 is an elastic conductive sheet with a certain elastic deformation ability. When the cover plate 300 drives the workpiece to be plated to contact the conductive sheet 220, the conductive sheet 220 is compressed and deformed to generate elastic restoring force. Under the action of the resilience of the conductive sheet 220, the cover plate 300 can form a clamping effect on the workpiece to be plated, thereby preventing the workpiece to be plated from being rigidly squeezed and causing extrusion damage. At the same time, it can also ensure that the electroplating surface of the workpiece to be plated forms a good contact with the conductive sheet 220, so that the conductive sheet 220 can energize the workpiece to be plated.

[0052] When the workpiece to be plated is mounted and fixed in the electroplating carrier, the electroplating surface of the workpiece to be plated faces the hollow area 101, and the electroplating liquid can freely pass through the hollow area 101 to contact the electroplating surface of the workpiece to be plated, so as to realize the electroplating operation on the workpiece to be plated.

[0053] In some embodiments, the conductive rod 210 and the conductive sheet 220 are both made of conductive materials, for example, conductive metal materials such as copper, aluminum, silver, and iron can be selected, or non-metallic conductive materials such as conductive plastics and conductive fibers can be selected. The conductive rod 210 and the conductive sheet 220 can be made of the same material or different materials, which is not limited in the embodiments of the present application.

[0054] Furthermore, an insulating layer is provided on the outer surfaces of the conductive rod 210 and the conductive sheet 220 to form insulation isolation for the outer surfaces of the conductive rod 210 and the conductive sheet 220. At the same time, a conductive portion is provided on the portion of the conductive sheet 220 for electrically connecting to the workpiece to be plated, and the insulating layer does not cover the conductive portion, so that the conductive portion contacts the electroplating surface of the workpiece to be plated to form an electrical connection.

[0055] Alternatively, if Figure 1As shown, the rotation axis extension direction of the cover plate 300 is set to the first direction X, and the second direction Y is perpendicular to the first direction X. A plurality of conductive components 200 are provided, and the plurality of conductive components 200 are sequentially arranged in the frame 100 at intervals along the first direction X to divide the hollow area 101 into a plurality of electroplating areas, and each electroplating area is correspondingly provided with a cover plate 300.

[0056] In an embodiment of the present application, a plurality of conductive components 200 arranged at intervals are provided in the frame 100, and the hollow area 101 is divided into a plurality of electroplating areas by the plurality of conductive components 200. A cover plate 300 is provided corresponding to each electroplating area so that a workpiece to be plated can be installed in each electroplating area. Thus, the electroplating carrier can simultaneously carry a plurality of workpieces to be plated for electroplating operations, which helps to improve the electroplating efficiency.

[0057] In some embodiments, the frame 100 may include four frames, which enclose a hollow space, and at least one beam extending along the first direction X is arranged in the frame 100, and the hollow space is divided into at least two hollow areas 101 by the beam, and the at least two hollow areas 101 are arranged along the second direction Y.

[0058] Furthermore, a plurality of conductive rods 210 arranged at intervals along the first direction X may be provided in the frame 100, and each conductive rod 210 extends along the second direction Y and sequentially passes through at least two hollow areas 101, thereby dividing each hollow area 101 into a plurality of electroplating areas. In this way, multiple rows and columns of electroplating areas may be formed in the frame 100, and a cover plate 300 may be provided corresponding to each electroplating area, so that each electroplating area may be used to install a workpiece to be plated, so that batch coating operations can be realized and production efficiency is improved.

[0059] It should be noted that the number of hollow areas 101 and the number of electroplating areas in the frame can be flexibly set according to actual needs, and the embodiments of the present application do not limit this.

[0060] Alternatively, if Figure 4 and Figure 8 As shown, a plurality of conductive sheets 220 are disposed on the conductive rod 210 , and the plurality of conductive sheets 220 on some of the conductive rods 210 are disposed on both sides of the conductive rod 210 , and the conductive sheets 220 at least partially extend into the electroplating area.

[0061] Specifically, a plurality of conductive rods 210 are arranged in the frame 100 along the first direction X at intervals, two conductive rods 210 located at the edge positions of both sides are set as edge conductive rods, and a conductive rod located between the two edge conductive rods is set as a middle conductive rod.

[0062] Furthermore, a plurality of conductive sheets 220 are arranged on one side of the edge conductive rod close to the hollow area 101 , and a plurality of conductive sheets 220 are arranged on opposite sides of the middle conductive rod. The plurality of conductive sheets 220 on each conductive rod 210 are arranged at intervals along the second direction Y.

[0063] In the embodiment of the present application, multiple conductive sheets 220 are provided on each conductive rod 210, so that the conductive rod 210 can simultaneously energize multiple conductive sheets 220. At the same time, multiple conductive sheets 220 on the conductive rod 210 located in the middle are arranged on both sides of the conductive rod 210, so that multiple conductive sheets 220 located on the same side can contact the workpiece to be plated in the corresponding electroplating area. In this way, one conductive component 200 can simultaneously clamp and fix two workpieces to be plated, and can energize the two workpieces to be plated at the same time.

[0064] In addition, multiple conductive sheets 220 located on the same side of the conductive rod 210 are arranged in sequence along the extension direction of the conductive rod 210. By using multiple conductive sheets 220 to contact the same workpiece to be plated, a clamping effect can be formed on different positions of the workpiece to be plated, thereby improving the force uniformity and installation stability of the workpiece to be plated.

[0065] Alternatively, if Figure 4 and Figure 5 As shown, the locking member 500 includes a first locking member 510 and a second locking member 520. The second end 300b is provided with the first locking member 510, and the frame 100 is provided with a second locking member 520 at a position corresponding to the first locking member 510. The first locking member 510 cooperates with the second locking member 520 to lock or unlock the second end 300b of the cover 300 and the frame 100.

[0066] In the embodiment of the present application, a first locking member 510 is provided at the second end 300b of the cover plate 300, and a second locking member 520 is provided on the frame 100, so that when the cover plate 300 carries the workpiece to be plated and contacts the conductive sheet 220, the first locking member 510 and the second locking member 520 are locked and matched to lock the position of the cover plate 300. When the workpiece to be plated needs to be removed, the locking cooperation between the first locking member 510 and the second locking member 520 is released so that the cover plate 300 can be turned over freely.

[0067] Among them, the locking structure composed of the first locking member 510 and the second locking member 520 can be a latch locking structure, a snap locking structure, a clip locking structure, etc. Of course, other locking structures that can achieve the locking function can also be selected. Technical personnel in this field can flexibly set it according to actual conditions, and the embodiments of the present application do not limit this.

[0068] Alternatively, if Figure 4As shown, the first locking member 510 is a buckle, and the second locking member 520 is a slot; or the first locking member 510 is a slot, and the second locking member 520 is a buckle, and the buckle and the slot are engaged with each other to lock or unlock the second end 300b and the frame 100.

[0069] In the embodiment of the present application, a buckle is provided at the second end 300b of the cover plate 300, and a slot is provided on the frame 100; or a buckle is provided at the second end 300b of the cover plate 300, and a buckle is provided on the frame 100. By utilizing the snap-fitting cooperation between the buckle and the slot, the cover plate 300 and the frame 100 can be quickly locked or unlocked, thereby facilitating actual processing and operation.

[0070] In some embodiments, a first fixing rod 103 extending along the first direction X is provided in the frame 100 . The first fixing rod 103 is provided on a side of the hollow area 101 away from the first end 300 a of the cover plate 300 . The second locking member 520 is provided on the first fixing rod 103 .

[0071] Furthermore, when a plurality of hollow areas 101 are provided in the frame, a first fixing rod 103 may be provided corresponding to each hollow area 101; and when each hollow area 101 is divided into a plurality of electroplating areas, the first fixing rod 103 sequentially extends through the plurality of electroplating areas, so that a second locking member 520 may be provided at a position corresponding to each electroplating area on the first fixing rod 103. The provision of the fixing rod 103 not only facilitates the provision and installation of the second locking member 520, but also strengthens the overall structure of the frame 100.

[0072] Alternatively, if Figure 5 and Figure 6 As shown, along the first direction X, the receiving groove 310 has two opposite side walls 310 a , and the distance between the two side walls 310 a on the side close to the second end 300 b is greater than the distance between the two side walls 310 a on the side close to the first end 300 a .

[0073] In the embodiment of the present application, the spacing between the two side walls 310a of the accommodating groove 310 on the side close to the second end 300b is greater than the spacing on the side close to the first end 300a, that is, the accommodating groove 310 has a structure that is wide at the top and narrow at the bottom. In this way, when the workpiece to be plated is inserted into the accommodating groove 310, the two side walls 310a of the accommodating groove 310 can play a guiding and limiting role, thereby facilitating the installation of the workpiece to be plated.

[0074] In some embodiments, at least one side of the two side walls 310a facing the second end 300b can be set as an inclined surface or a curved surface, so that the distance between the two side walls 310a on the side close to the second end 300b is greater than the distance on the side close to the first end 300a. Of course, the side wall 310a can also be set as other structures, which can be flexibly set according to actual conditions, and the embodiments of the present application are not limited to this.

[0075] Alternatively, if Figures 1 to 4 As shown, the electroplating carrier also includes a support plate 400, which is arranged on the side of the cover plate 300 away from the frame 100, one end of the support plate 400 is fixedly connected to the frame 100, and the other end of the support plate 400 extends in a direction away from the frame 100, and a first angle A is formed between the extension direction of the support plate 400 and a side surface of the frame 100 facing the support plate 400.

[0076] In the embodiment of the present application, by arranging the support plate 400 on the frame 100, the support plate 400 is located on the side of the cover plate 300 away from the frame 100, the connection position of the support plate 400 and the frame 100 corresponds to the first end 300a of the cover plate 300, and the support plate 400 extends from the surface of the frame 100 toward the direction away from the frame 100 to form a limiting space between the support plate 400 and the frame 100, and the cover plate 300 can be freely turned over in the limiting space. Furthermore, when the cover plate 300 rotates toward the support plate 400, the position of the cover plate 300 can be limited by the support plate 400, and at the same time, the support plate 400 can also be used to support the cover plate 300 so as to load the workpiece to be plated into the cover plate 300.

[0077] Specifically, a second fixing rod 104 extending along the first direction X is provided in the frame 100, and the second fixing rod 104 is provided on one side of the hollow area 101 close to the first end 300a of the cover plate 300, and the support plate 400 is fixedly installed on the second fixing rod 104, wherein the fixing installation method includes but is not limited to welding, bolt connection, mortise and tenon connection and the like.

[0078] It should be noted that when a plurality of hollow areas 101 are provided in the frame, a second fixing rod 104 may be provided corresponding to each hollow area 101, and when each hollow area 101 is divided into a plurality of electroplating areas, the second fixing rod 104 sequentially extends through the plurality of electroplating areas, so that the support plate 400 may be installed at a position corresponding to each conductive area on the second fixing rod 104. The second fixing rod 104 is provided to facilitate the installation of the support plate and to strengthen the overall structure of the frame 100.

[0079] It can be understood that one end of the support plate 400 is fixedly connected to the frame 100, and the other end of the support plate 400 extends in a direction away from the frame 100, and the direction of the line from one end to the other end of the support plate 400 is also the extension direction of the support plate 400. If the surface of one side of the frame 100 facing the support plate 400 is regarded as a plane or a nearly plane, a certain angle is formed between the extension direction of the support plate 400 and the surface of one side of the frame 100 facing the support plate 400, which is the first angle A.

[0080] Alternatively, if Figure 3 As shown, the first angle A is: 30°-90°.

[0081] It is understandable that the support plate 400 is provided to form a limited support for the cover plate 300 when the cover plate 300 is turned over. If the first angle A is too small, the turning angle of the cover plate 300 will be limited, so that the angle space of the cover plate 300 relative to the frame 100 when it is opened is too small, and it is not convenient to load the workpiece to be plated into the receiving groove 310 of the cover plate 300. If the first angle A is too large, for example, greater than 90°, the turnable angle of the cover plate 300 is too large. When the turnable angle of the cover plate 300 is greater than 90°, the workpiece to be plated inserted in the cover plate 300 is easy to fall off.

[0082] To this end, in the embodiment of the present application, a reasonable angle range of the first angle A is set, which not only facilitates the operation of taking and placing the workpiece to be plated in the cover plate 300, but also prevents the cover plate 300 from flipping over at too large an angle, which may easily cause the workpiece to be plated to fall from the cover plate 300.

[0083] Exemplarily, the first angle A can be set to any angle such as 30°, 45°, 50°, 60°, 75°, 80°, 90°, or a range between any two angles.

[0084] Alternatively, if Figure 3 and Figure 4 As shown, a junction line 400 a is formed at the junction of the support plate 400 and the frame 100 , and a second angle B is formed between the extension direction of the junction line 400 a and the first direction X.

[0085] In the embodiment of the present application, the support plate 400 is fixedly connected to the frame 100, and a boundary line 400a is formed at the junction of the support plate 400 and the frame 100. The extension direction of the boundary line 400a is set to form a certain angle with the first direction X, that is, the boundary line 400a is inclined at a certain angle relative to the first direction X, so that when the electroplating carrier is taken out of the electroplating liquid, the electroplating liquid remaining at the junction of the support plate 400 and the frame 100 can be smoothly discharged.

[0086] It is understandable that when the electroplating carrier is used to carry the workpiece to be plated for electroplating, the electroplating carrier is placed vertically, and the horizontal direction is the first direction X. When the electroplating carrier is taken out of the electroplating solution, a portion of the electroplating solution will remain in the angle space where the support plate 400 and the frame 100 are connected. In the present application, the extending direction of the boundary line 400a is set to have a certain inclination angle with the horizontal direction, thereby facilitating the discharge of the residual electroplating solution.

[0087] In addition, the intersection line 400a formed at the intersection of the support plate 400 and the frame 100 can be a straight line or a curve. When the intersection line 400a is a straight line, the angle formed by the straight line and the first direction X is the second angle B; when the intersection line 400a is a curve, along the extension direction of the intersection line 400a, the angle formed by the line connecting the opposite ends of the intersection line 400a and the first direction X is the second angle B.

[0088] Alternatively, if Figure 4 As shown, the second angle B is: 1°-5°.

[0089] In the embodiment of the present application, by setting the angle range of the second angle B between the extension direction of the boundary line 400a and the first direction X, it is convenient to smoothly discharge the residual electroplating liquid at the junction of the support plate 400 and the frame 100, and it can also avoid the angle of the second angle B being too large, so that the support plate 400 cannot form an effective support effect on the cover plate 300.

[0090] It is understandable that if the angle of the second angle B is too large, that is, the inclination angle of the intersection line 400a relative to the first direction X is too large, there will be a large misalignment between the cover plate 300 and the support plate 400, and then when the cover plate 300 is flipped up, the contact area between the cover plate 300 and the support plate 400 will be reduced, which will affect the supporting effect of the support plate 400 on the cover plate 300, and at the same time, the cover plate 300 will be subjected to uneven force locally and twisted and deformed, thereby affecting the assembly of the workpiece to be plated and the cover plate 300.

[0091] Exemplarily, the second angle B can be set to any angle such as 1°, 1.5°, 2°, 2.5°, 3°, 3.5°, 4°, 4.5°, 5°, or a range between any two angles.

[0092] Alternatively, if Figure 7 and Figure 8 As shown, a mounting hole 102 is provided in the frame 100, a conductive rod 210 is passed through the mounting hole 102, a limiting groove 102a is provided on the hole wall of the mounting hole 102, a limiting protrusion 211 is provided on the conductive rod 210, and the limiting protrusion 211 is embedded in the limiting groove 102a.

[0093] In the embodiment of the present application, a mounting hole 102 is provided in the frame 100 so that the conductive rod 210 passes through the mounting hole 102 and is connected to the frame 100, and then a limiting groove 102a is provided in the hole wall of the mounting hole 102, and a limiting protrusion 211 is provided on the outer side of the conductive rod 210, so that the limiting protrusion 211 is embedded in the limiting groove 102a, so that the conductive rod 210 can be limited from rotating in the mounting hole 102.

[0094] In a specific application, one or more limiting protrusions 211 may be provided on the conductive rod 210, and the limiting grooves 102a provided on the hole wall of the mounting hole 102 correspond to the positions and the number of the limiting protrusions 211. When a plurality of limiting protrusions 211 are provided on the conductive rod 210, the plurality of limiting protrusions 211 are arranged at intervals along the circumference of the conductive rod 210.

[0095] Alternatively, if Figure 8 As shown, a conductive contact 221 is provided at one end of the conductive sheet 220 away from the conductive rod 210 . The conductive contact 221 protrudes and extends from the surface of the conductive sheet 220 toward the cover plate 300 . The conductive contact 221 is used to electrically connect to the workpiece to be plated.

[0096] In the embodiment of the present application, a conductive contact 221 is provided at one end of the conductive sheet 220 away from the conductive rod 210 so that the conductive contact 221 can be used to contact the plating surface of the workpiece to be plated, thereby ensuring that a good conductive connection can be formed between the conductive sheet 220 and the workpiece to be plated, and then the conductive component 200 is used to energize the workpiece to be plated during the electroplating process.

[0097] Alternatively, if Figure 1 As shown, a hook 120 is provided on the frame 100. When the frame 100 is placed vertically, the hook 120 is provided at the upper end of the frame 100. In the embodiment of the present application, by providing the hook 120 on the frame 100, the electroplating carrier can be hung in the electroplating equipment as a whole by using the hook 120, so as to facilitate the installation and removal of the electroplating carrier.

[0098] In some embodiments, when using the electroplating carrier of the present application to perform an electroplating operation, the specific steps of use are as follows:

[0099] S1. Install the electroplating carrier into the electroplating equipment, release the locks of the first locking member 320 and the second locking member 110, and flip the cover plate 300 outwards so that the cover plate 300 rests on the support plate 400, and then insert the workpiece to be plated into the receiving groove 310 in the cover plate 300. At this time, the non-electroplating surface of the workpiece to be plated faces the cover plate 300 and is at least partially in contact with the cover plate 300, and the receiving groove 310 can be used to support and limit the bottom of the workpiece to be plated.

[0100] S2. The cover plate 300 is rotated to move the workpiece to be plated toward the conductive component 200, so that the plating surface of the workpiece to be plated contacts the conductive contact 221 on the conductive sheet 220, and the first locking member 320 is locked with the second locking member 110. At this time, the conductive sheet 220 undergoes a certain elastic deformation, and the cover plate 300 and the conductive sheet 220 clamp and fix the workpiece to be plated from both sides, so that the workpiece to be plated is installed and fixed in the electroplating carrier.

[0101] S3. The electroplating carrier carries the workpiece to be plated into and out of the electroplating tank of the electroplating equipment so that the workpiece to be plated contacts the electroplating liquid in the electroplating tank, and the electroplating carrier is used to carry the workpiece to be plated and transport it between different locations to perform the electroplating process.

[0102] S4. After the electroplating is completed, the lock between the first locking member 320 and the second locking member 110 is released, and the cover plate 300 is flipped outward so that the cover plate 300 is against the support plate 400, and the workpiece to be plated is taken out. At this time, the conductive sheet 220 elastically returns to its original state.

[0103] S5, taking out the electroplating carrier from the electroplating equipment, and cleaning the electroplating carrier. During the cleaning process, the cover plate 300 may be closed or not. There is no limitation on this. Repeating the above operations can cyclically perform the electroplating operation.

[0104] Optionally, an embodiment of the present application further provides an electroplating device, comprising: an equipment body and the electroplating carrier in the above embodiment, wherein an electroplating tank is provided in the equipment body, and the electroplating carrier is used to carry the workpiece to be plated into and out of the electroplating tank.

[0105] In the embodiment of the present application, a hollow area 101 is provided in the frame 100, and the conductive rod 210 is installed in the frame 100, and the conductive sheet 220 on the conductive rod 210 at least partially extends into the hollow area 101. At the same time, a rotatable cover plate 300 is provided on the frame 100, so that the workpiece to be plated can be placed in the hollow area 101, and then the cover plate 300 is rotated so that the cover plate 300 and the conductive sheet 220 clamp and fix the workpiece to be plated, and the cover plate 300 and the frame 100 are locked or unlocked by the locking member 500. In this way, during operation and use, the workpiece to be plated can be quickly loaded and unloaded by rotating the cover plate, without removing the electroplating carrier from the electroplating equipment, which greatly simplifies the operation process and can reduce the risk of damage to the workpiece to be plated during the disassembly and assembly process.

[0106] Specifically, the electroplating equipment includes an equipment body, in which an electroplating tank is provided, and the electroplating tank is used to contain the electroplating solution. Then, by fixing the workpiece to be plated in the electroplating carrier, the workpiece to be plated can be carried in and out of the electroplating tank by the electroplating carrier. When the electroplating carrier carries the workpiece to be plated and immerses it in the electroplating solution, the electroplating solution can directly contact the electroplating surface of the workpiece to be plated through the hollow area 101 of the frame 100, thereby realizing the electroplating process.

[0107] In addition, the electroplating equipment may also be provided with a power supply so as to electrically connect the conductive component 200 to the power supply, and the power supply energizes the workpiece to be plated through the conductive component 200. Of course, the electroplating equipment may also be provided with other components, and those skilled in the art may flexibly set them according to actual conditions, and the embodiments of the present application are not limited thereto.

[0108] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0109] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electroplating carrier, characterized in that: include: A frame, wherein a hollow area is provided in the frame; A conductive component, comprising a conductive rod and a conductive sheet, wherein the conductive rod is installed in the frame, and the conductive sheet is connected to the conductive rod and at least partially extends into the hollow area; A cover plate, the cover plate includes a first end and a second end arranged opposite to each other, the first end is movably connected to the frame, and a locking member is provided between the second end and the frame; the cover plate can be rotated relative to the frame to clamp and fix the workpiece to be plated through the cover plate and the conductive sheet, and the locking member is used to lock or unlock the cover plate and the frame.

2. The electroplating carrier according to claim 1, characterized in that: The locking member includes a first locking member arranged at the second end, and a second locking member arranged at the frame, and the first locking member cooperates with the second locking member to lock or unlock the second end and the frame.

3. The electroplating carrier according to claim 1, characterized in that: A accommodating groove is provided on one side of the first end toward the hollow area, and along the extension direction of the rotation axis of the cover plate, the accommodating groove has two side walls arranged opposite to each other, and the spacing between the two side walls on the side close to the second end is greater than the spacing on the side close to the first end.

4. The electroplating carrier according to claim 1, characterized in that: The electroplating carrier also includes a support plate, which is arranged on a side of the cover plate away from the frame, one end of the support plate is fixedly connected to the frame, and the other end of the support plate extends in a direction away from the frame, and a first angle is formed between the extension direction of the support plate and a side surface of the frame facing the support plate.

5. The electroplating carrier according to claim 4, characterized in that: A boundary line is formed at the junction of the support plate and the frame, and an extending direction of the boundary line forms a second angle with the rotation axis of the cover plate.

6. The electroplating carrier according to claim 5, characterized in that: The first angle is: 30°-90°; and / or the second angle is: 1°-5°.

7. The electroplating carrier according to claim 1, characterized in that: The frame is provided with a hook; and / or the conductive sheet is an elastic conductive sheet.

8. The electroplating carrier according to any one of claims 1 to 7, characterized in that: The conductive components are provided in a plurality, and the plurality of conductive components are sequentially arranged in the frame at intervals to divide the hollow area into a plurality of electroplating areas, and each of the electroplating areas is provided with a corresponding cover plate.

9. The electroplating carrier according to claim 8, characterized in that: A plurality of the conductive sheets are disposed on the conductive rod, and the plurality of the conductive sheets on part of the conductive rod are disposed on both sides of the conductive rod, and the conductive sheets at least partially extend into the electroplating area.

10. An electroplating device, characterized in that: include: An equipment body and an electroplating carrier as described in any one of claims 1 to 9, wherein an electroplating tank is provided in the equipment body, and the electroplating carrier is used to carry the workpiece to be plated into and out of the electroplating tank.

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