PCB patch solder paste thickness detector

Abstract

The utility model relates to the technical field of PCB patch solder paste thickness detectors, in particular to a PCB patch solder paste thickness detector which comprises a table body, a conveying belt, a solder paste detector body and a clamping mechanism, the clamping mechanism comprises a positioning frame, two clamping assemblies and an intercepting assembly, and each clamping assembly comprises a placing plate, a jacking plate, a hydraulic cylinder, a driving part and a clamping plate. When the thickness of PCB flitch solder paste is detected, a PCB is conveyed to an intercepting assembly by a conveying belt, two hydraulic cylinders are started, two shelving plates are pushed to be close to two jacking plates, the two jacking plates jack the PCB, the two shelving plates clamp the PCB, two driving parts are started, the two clamping plates are pressed downwards, the two shelving plates clamp the PCB, at the moment, the conveying belt does not operate temporarily, and the PCB flitch solder paste thickness is detected. After the solder paste detector body completes detection, the two driving pieces and the two hydraulic cylinders are started, the PCBs fall back to the conveying belt, the intercepting assembly and the conveying belt are started, the PCBs are discharged, and the effects that the PCBs of different sizes and thicknesses are clamped and fixed, and the detection precision is improved are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB patch solder paste thickness detectors, in particular to a PCB patch solder paste thickness detector. Background Art

[0002] When using solder paste for PCB mounting, the thickness of the solder paste will directly affect the size and reliability of welding, so a solder paste thickness detector is required to detect the thickness of the solder paste. The existing solder paste thickness detector is difficult to disassemble and inconvenient to repair and maintain.

[0003] Prior art CN213842051U discloses a three-dimensional solder paste detector and a bracket that is easy to move, including a base, a table, a conveyor belt, a solder paste detector body, a fixed column, a bracket body, a card plate, a card sleeve, a limit block and a spring. The table body is fixedly connected to the top of the base, the conveyor belt is rotatably connected to the table body, the solder paste detector body is slidably connected to the top of the table body, the fixed column is fixedly connected to one side of the solder paste detector body and is provided with a groove, the bracket body is rotatably connected to one side of the base, the card plate is slidably connected to the surface of the bracket body, the card sleeve is fixedly connected to the top of the bracket body and is connected to the fixed column The limit block is slidably connected to the card plate and partially located in the groove. The spring 1 is fixedly connected to the limit block and located in the card plate. When the solder paste detector body needs to be removed for inspection and maintenance, the card plate is slid down, and the limit block is squeezed out of the groove of the fixed column under the pull of the card plate. The bracket body is rotated to drive the card sleeve to rotate, so that the card sleeve is separated from the fixed column. At this time, the fixation of the solder paste detector body is released, and the solder paste detector body can be pulled out upward for inspection and maintenance. After the inspection and maintenance is completed, the above operations can be performed in reverse, so as to obtain the effect of convenient disassembly and assembly of the solder paste detector body and convenient inspection and maintenance.

[0004] However, the above existing technologies cannot clamp and fix the PCB, which will cause errors during detection, resulting in inaccurate solder paste detection data and reducing the quality of PCB patches. Utility Model Content

[0005] The purpose of the utility model is to provide a PCB patch solder paste thickness detector, which solves the problem that the prior art cannot clamp and fix the PCB, which will cause errors during detection, resulting in inaccurate solder paste detection data and reducing the quality of PCB patches.

[0006] To achieve the above-mentioned purpose, the utility model provides a PCB patch solder paste thickness detector, including a table, a conveyor belt, a solder paste detector body and a clamping mechanism, the clamping mechanism includes a positioning frame, two clamping assemblies and an intercepting assembly, the clamping assembly includes a shelf plate, a lifting plate, a hydraulic cylinder, a driving member and a clamping plate, the conveyor belt is rotatably connected to the table body, the solder paste detector body is located on one side of the table body, the positioning frame is fixedly connected to the top of the table body, the two clamping assemblies are located above the positioning frame, the intercepting assembly is located on one side of the positioning frame, the shelf plate is slidably connected to the top of the positioning frame, the lifting plate is fixedly connected to one side of the shelf plate, the output end of the hydraulic cylinder is fixedly connected to the shelf plate and fixedly connected to the top of the positioning frame, the driving member is located above the shelf plate, and the clamping plate is located on one side of the driving member.

[0007] Among them, the driving member includes a protective shell, a rotating motor and a threaded rod. The protective shell is fixedly connected to the shelf plate and is located on one side of the clamping plate. The rotating motor is fixedly connected in the protective shell, and the threaded rod is fixedly connected to the output end of the rotating motor.

[0008] Wherein, the driving member also includes a threaded sleeve and a connecting plate, the threaded sleeve is threadedly connected to the threaded rod and is slidably connected in the protective shell, and the connecting plate is fixedly connected to the threaded sleeve and fixedly connected above the clamping plate.

[0009] Wherein, the interception component includes an interception motor and a rotating frame, the interception motor is fixedly connected to one side of the positioning frame, and the rotating frame is fixedly connected to the positioning frame and is located on one side of the interception motor.

[0010] Wherein, the interception assembly also includes an interception plate and an interception block, the interception plate is rotatably connected to the rotating frame and fixedly connected to the output end of the interception motor, and the interception block is fixedly connected to the interception plate and is located below the positioning frame.

[0011] Among them, the PCB patch solder paste thickness detector also includes two disassembly and assembly mechanisms, which include a mounting frame, a fixing plate and a fastening stud. The two disassembly and assembly mechanisms are respectively located on both sides of the positioning frame. The mounting frame is fixedly connected to one side of the positioning frame, the fixing plate is slidably connected in the positioning frame, the fastening stud is rotatably connected in the mounting frame, and is threadedly connected to the fixing plate, and passes through the mounting frame and the fixing plate.

[0012] The utility model provides a PCB patch solder paste thickness detector. When detecting the solder paste thickness of the PCB, the PCB is transported to the interception component by the conveyor belt, and the two hydraulic cylinders are started to push the two shelf plates and the two lifting plates closer together until the two lifting plates lift the PCB and the two shelf plates clamp the PCB, and then the two driving members are started to press the two clamping plates downward until the PCB is clamped together with the two shelf plates. At this time, the conveyor belt does not run temporarily. After the detection of the solder paste detector body is completed, the two driving members and the two hydraulic cylinders are started again, the PCB falls back to the conveyor belt, the interception component and the conveyor belt are started, and the PCB that has been detected is discharged, so as to obtain the effect of clamping and fixing PCBs of different sizes and thicknesses, thereby improving the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0014] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model.

[0015] Figure 2 It is a cross-sectional view of the driving member of the first embodiment of the utility model.

[0016] Figure 3 It is a schematic structural diagram of the positioning frame and the interception assembly in the first embodiment of the utility model.

[0017] Figure 4 It is a schematic diagram of the overall structure of the second embodiment of the utility model.

[0018] Figure 5 It is a structural schematic diagram of the disassembly and assembly mechanism of the second embodiment of the utility model.

[0019] 101-body, 102-conveyor belt, 103-solder paste detector body, 104-positioning frame, 105-shelf plate, 106-lifting plate, 107-clamping plate, 108-protective shell, 109-rotating motor, 110-threaded rod, 111-threaded sleeve, 112-connecting plate, 113-interception motor, 114-rotating frame, 115-interception plate, 116-interception block, 117-hydraulic cylinder, 201-mounting frame, 202-fixing plate, 203-fastening studs. DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0021] The first embodiment of the present application is:

[0022] See also Figure 1-Figure 3 ,in Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model; Figure 2 is a cross-sectional view of the driving member of the first embodiment of the utility model; Figure 3 It is a schematic structural diagram of the positioning frame and the interception assembly in the first embodiment of the utility model.

[0023] The utility model provides a PCB patch solder paste thickness detector: comprising a table 101, a conveyor belt 102, a solder paste detector body 103 and a clamping mechanism, the clamping mechanism comprising a positioning frame 104, two clamping components and an intercepting component, the clamping component comprising a shelf plate 105, a lifting plate 106, a hydraulic cylinder 117, a driving member and a clamping plate 107, the driving member comprising a protective shell 108, a rotating motor 109, a threaded rod 110, a threaded sleeve 111 and a connecting plate 112, the intercepting component comprising an intercepting motor 113, a rotating frame 114, an intercepting plate 115 and an intercepting block 116, the above-mentioned solution solves the problem that the above prior art cannot clamp and fix the PCB, errors will occur during detection, resulting in inaccurate solder paste detection data and reduced quality of PCB patches.

[0024] According to the present specific embodiment, the conveyor belt 102 is rotatably connected to the platform 101, the solder paste detector body 103 is located on one side of the platform 101, the positioning frame 104 is fixedly connected to the top of the platform 101, the two clamping assemblies are located above the positioning frame 104, the intercepting assembly is located on one side of the positioning frame 104, the shelf plate 105 is slidably connected to the top of the positioning frame 104, the lifting plate 106 is fixedly connected to one side of the shelf plate 105, the output end of the hydraulic cylinder 117 is fixedly connected to the shelf plate 105 and fixedly connected to the top of the positioning frame 104, the driving member is located above the shelf plate 105, the clamping plate 107 is located on one side of the driving member, and when the PC When the solder paste thickness of the B-board is tested, the PCB is transported to the intercepting assembly by the conveyor belt 102, and the two hydraulic cylinders 117 are started to push the two shelf plates 105 and the two lifting plates 106 closer together until the two lifting plates 106 lift the PCB and the two shelf plates 105 clamp the PCB, and then the two driving members are started to press the two clamping plates 107 downward until the PCB is clamped together with the two shelf plates 105. At this time, the conveyor belt 102 is temporarily stopped. After the detection of the solder paste detector body 103 is completed, the two driving members and the two hydraulic cylinders 117 are started again, the PCB falls back to the conveyor belt 102, the intercepting assembly and the conveyor belt 102 are started, and the PCB that has been tested is discharged.

[0025] Among them, the protective shell 108 is fixedly connected to the shelf plate 105 and is located on one side of the clamping plate 107. The rotating motor 109 is fixedly connected in the protective shell 108. The threaded rod 110 is fixedly connected to the output end of the rotating motor 109. When the driving member is in use, the protective shell 108 protects the rotating motor 109, the rotating motor 109 provides power, and the threaded rod 110 transmits power.

[0026] Secondly, the threaded sleeve 111 is threadedly connected to the threaded rod 110 and is slidably connected in the protective shell 108. The connecting plate 112 is fixedly connected to the threaded sleeve 111 and is fixedly connected to the top of the clamping plate 107. When the driving member is used, the rotating motor 109 is started, and the threaded rod 110 rotates. With the assistance of the protective shell 108, the threaded sleeve 111 moves up and down along the protective shell 108. Driven by the connecting plate 112, the clamping plate 107 moves up and down with the threaded sleeve 111 to clamp PCBs of different thicknesses.

[0027] At the same time, the intercepting motor 113 is fixedly connected to one side of the positioning frame 104, and the rotating frame 114 is fixedly connected to the positioning frame 104 and is located on one side of the intercepting motor 113. When the intercepting component is started, the intercepting motor 113 provides power, and the rotating frame 114 is used to provide a rotation place.

[0028] At the same time, the interception plate 115 is rotationally connected to the rotating frame 114 and fixedly connected to the output end of the interception motor 113. The interception block 116 is fixedly connected to the interception plate 115 and is located below the positioning frame 104. When the interception component is started, the interception motor 113 is started, and the interception plate 115 starts to rotate, driving the interception block 116 to rotate, so that the interception plate 115 and the interception block 116 are flipped over, and the conveyor belt 102 is no longer intercepted, so that the conveyor belt 102 can transport the PCB that has been inspected.

[0029] When the thickness of the solder paste on the PCB is detected, the PCB is transported to the interception assembly by the conveyor belt 102 and is blocked by the interception block 116 and cannot move forward. At this time, the conveyor belt 102 is paused, and the two hydraulic cylinders 117 are started to push the two shelf plates 105 and the two lifting plates 106 closer together until the two lifting plates 106 lift the PCB and the two shelf plates 105 clamp the PCB. Then the two driving members are started, the rotating motor 109 is started, and the threaded rod 110 rotates. With the assistance of the protective shell 108, the threaded sleeve 111 moves downward along the protective shell 108. Driven by the connecting plate 112, the clamping plate 107 moves downward with the threaded sleeve 111 until the PCB is clamped together with the two shelf plates 105 so as to clamp PCBs of different thicknesses. The solder paste detector body 103 is started to detect the thickness of the solder paste on the PCB. After the detection of the solder paste detector body 103 is completed, the reverse start is started. The two driving members and the two hydraulic cylinders 117 are moved, the PCB is released and falls back to the conveyor belt 102, the interception motor 113 is started, the interception plate 115 starts to rotate, driving the interception block 116 to rotate, so that the interception plate 115 and the interception block 116 are flipped, and the conveyor belt 102 is no longer intercepted. The conveyor belt 102 is started, and the PCB that has been tested is discharged so that the solder paste thickness of the next PCB can be tested. In summary, the device aligns and clamps each PCB to be tested in the middle position, so that all the solder paste on the PCB is within the detection range of the solder paste thickness detector body 103, and the situation that only part of the solder paste thickness can be detected due to different solder paste positions, resulting in inaccurate data, will not occur. The problem that the prior art cannot clamp and fix the PCB, errors will occur during detection, resulting in inaccurate solder paste detection data and reduced PCB patch quality is avoided, and the effect of clamping and fixing PCBs of different sizes and thicknesses to improve detection accuracy is achieved.

[0030] The second embodiment of the present application is:

[0031] See also Figure 4-Figure 5 ,in Figure 4 It is a schematic diagram of the overall structure of the second embodiment of the utility model; Figure 5 It is a structural schematic diagram of the disassembly and assembly mechanism of the second embodiment of the utility model.

[0032] On the basis of the first embodiment, the PCB patch solder paste thickness detector of this embodiment further includes two disassembly and assembly mechanisms, and the disassembly and assembly mechanisms include a mounting frame 201 , a fixing plate 202 and a fastening stud 203 .

[0033] Among them, the two disassembly and assembly mechanisms are respectively located on both sides of the positioning frame 104, the mounting frame 201 is fixedly connected to one side of the positioning frame 104, the fixing plate 202 is slidably connected to the positioning frame 104, the fastening stud 203 is rotatably connected to the mounting frame 201, and is threadedly connected to the fixing plate 202, and passes through the mounting frame 201 and the fixing plate 202. When it is necessary to move or repair the clamping mechanism, the two disassembly and assembly mechanisms are screwed, the fastening stud 203 is rotated, and the fixing plate 202 is moved downward along the mounting frame 201 with the assistance of the mounting frame 201 to release the platform 101. At this time, the clamping mechanism can be moved along the platform 101, or the clamping mechanism can be removed for replacement and repair, thereby achieving the effect of adjusting the position of the clamping mechanism and facilitating repair.

[0034] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A PCB patch solder paste thickness detector, comprising a platform, a conveyor belt and a solder paste detector body, wherein the conveyor belt is rotatably connected to the platform body, and the solder paste detector body is located on one side of the platform body, characterized in that: Also included is a clamping mechanism; The clamping mechanism includes a positioning frame, two clamping assemblies and an intercepting assembly, the clamping assembly includes a shelf plate, a lifting plate, a hydraulic cylinder, a driving member and a clamping plate, the positioning frame is fixedly connected to the top of the platform, the two clamping assemblies are located above the positioning frame, the intercepting assembly is located on one side of the positioning frame, the shelf plate is slidably connected to the top of the positioning frame, the lifting plate is fixedly connected to one side of the shelf plate, the output end of the hydraulic cylinder is fixedly connected to the shelf plate and fixedly connected to the top of the positioning frame, the driving member is located above the shelf plate, and the clamping plate is located on one side of the driving member.

2. The PCB patch solder paste thickness detector as claimed in claim 1, characterized in that: The driving member includes a protective shell, a rotating motor and a threaded rod. The protective shell is fixedly connected to the shelf plate and is located on one side of the clamping plate. The rotating motor is fixedly connected in the protective shell, and the threaded rod is fixedly connected to the output end of the rotating motor.

3. The PCB patch solder paste thickness detector as claimed in claim 2, characterized in that: The driving member also includes a threaded sleeve and a connecting plate. The threaded sleeve is threadedly connected to the threaded rod and is slidably connected in the protective shell. The connecting plate is fixedly connected to the threaded sleeve and is fixedly connected above the clamping plate.

4. The PCB patch solder paste thickness detector as claimed in claim 1, characterized in that: The interception assembly comprises an interception motor and a rotating frame. The interception motor is fixedly connected to one side of the positioning frame. The rotating frame is fixedly connected to the positioning frame and is located on one side of the interception motor.

5. The PCB patch solder paste thickness detector as claimed in claim 4, characterized in that: The interception assembly also includes an interception plate and an interception block. The interception plate is rotatably connected to the rotating frame and fixedly connected to the output end of the interception motor. The interception block is fixedly connected to the interception plate and is located below the positioning frame.

6. The PCB patch solder paste thickness detector according to claim 1, characterized in that: The PCB patch solder paste thickness detector also includes two disassembly and assembly mechanisms, which include a mounting frame, a fixing plate and a fastening stud. The two disassembly and assembly mechanisms are respectively located on both sides of the positioning frame. The mounting frame is fixedly connected to one side of the positioning frame, the fixing plate is slidably connected to the positioning frame, the fastening stud is rotatably connected to the mounting frame, and is threadedly connected to the fixing plate, and passes through the mounting frame and the fixing plate.

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