Wafer detection device

By designing a wafer detection device that adopts a combined structure of base, upper support and lower support, the problem of poor compatibility and adaptability in the prior art is solved, and compatibility between ordinary wafers and blue film wafers is realized on the same device, reducing production costs.

CN222562626UActive Publication Date: 2025-03-04AKRIBIS SYST SHANGHAI
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Patent Information

Application Number
CN202323462400.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-18
Publication Date
2025-03-04
Estimated Expiration
2033-12-18

AI Technical Summary

Technical Problem

The existing wafer detection devices have poor compatibility and adaptability, and cannot compatiblely detect ordinary wafers and blue film wafers on the same device, resulting in the need to be equipped with two different detection devices, which increases production costs.

Method used

A wafer detection device is designed, adopting a combined structure of a base, an upper support and a lower support. Through the coordinated work of the upper drive cylinder and the lower drive cylinder, the detection of ordinary wafers and blue film wafers is realized. The upper support includes a blue film iron ring and an upper drive cylinder, and the lower support includes an electrostatic chuck and a lower drive cylinder, which improves compatibility and adaptability through a double-layer separation arrangement.

Benefits of technology

It realizes compatible detection of ordinary wafers and blue film wafers on the same device, improves the compatibility and adaptability of the detection device, is convenient to operate, and saves production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer detection device, and relates to the technical field of wafer detection, the wafer detection device comprises a pedestal, an upper layer supporting member and a lower layer supporting member, the upper layer supporting member is configured to support a blue film wafer, the upper layer supporting member comprises a blue film iron ring and an upper layer driving cylinder, and the blue film iron ring is provided with a centering abdicating hole; the fixed end of the upper-layer driving cylinder is connected with the base, and the movable end of the upper-layer driving cylinder is connected with the blue membrane iron ring; the lower-layer supporting piece is configured to bear a common wafer, the lower-layer supporting piece comprises an electrostatic chuck and a lower-layer driving cylinder, and the electrostatic chuck is arranged at the position of a middle receding hole of the blue membrane iron ring; the fixed end of the lower-layer driving cylinder is connected with the base, and the movable end of the lower-layer driving cylinder is connected with the electrostatic chuck; wherein the blue membrane iron ring and the electrostatic chuck are arranged at different height positions. The wafer detection device provided by the utility model has the effects of improving compatibility and adaptability, being convenient to operate and saving production cost.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer detection device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. After the wafer is manufactured, it needs to be inspected for quality to confirm whether the product is qualified. In the prior art, the wafer inspection device includes a multi-axis precision motion platform, which controls the stepping and scanning of the wafer to be inspected to achieve comprehensive scanning inspection.

[0003] However, there are many types of wafers, including ordinary wafers and blue film wafers. Ordinary wafers and blue film wafers have different supporting parts during detection. Ordinary wafers need to be supported by an electrostatic chuck, and blue film wafers need to be supported by a special blue film iron ring. The compatibility and adaptability of wafer detection devices in the prior art are poor. Ordinary wafers and blue film wafers cannot be detected on the same device. Two different detection devices are required, and the production cost is high. Utility Model Content

[0004] To this end, the technical problem to be solved by the utility model is to overcome the problem that the compatibility and adaptability of the wafer detection device in the prior art are poor, and there is a problem that ordinary wafers and blue film wafers cannot be compatibly detected on the same wafer detection device.

[0005] In order to solve the above technical problems, the utility model provides a wafer detection device, comprising:

[0006] Pedestal;

[0007] An upper support member, the upper support member is configured to support a blue film wafer, the upper support member comprises a blue film iron ring and an upper drive cylinder, the blue film iron ring is provided with a centrally centered clearance hole; the fixed end of the upper drive cylinder is connected to the base, and the movable end of the upper drive cylinder is connected to the blue film iron ring;

[0008] A lower support member, the lower support member is configured to support an ordinary wafer, the lower support member comprises an electrostatic chuck and a lower drive cylinder, the electrostatic chuck is arranged at the position of the central yield hole of the blue film iron ring; the fixed end of the lower drive cylinder is connected to the base, and the movable end of the lower drive cylinder is connected to the electrostatic chuck;

[0009] Wherein, the blue film iron ring and the electrostatic chuck are arranged at different height positions.

[0010] In one embodiment of the utility model, the upper support member also includes an upper vacuum suction cup, and the upper vacuum suction cup is evenly distributed on the blue film iron ring.

[0011] In one embodiment of the present invention, the upper support member further includes a positioning pin, the positioning pin is connected to the blue film iron ring, and the positioning pin is configured to position the blue film wafer.

[0012] In one embodiment of the present invention, the lower support member further includes a lower vacuum suction cup, and the lower vacuum suction cup is arranged on the electrostatic chuck.

[0013] In one embodiment of the utility model, it also includes an air supply component, which includes an air source and a diverter block. The diverter block is connected to the air source, and the diverter block is provided with a plurality of groups of air outlet passages. Some of the air outlet passages are connected to the upper driving cylinder, and the remaining air outlet passages are connected to the lower driving cylinder.

[0014] In one embodiment of the utility model, eight groups of the air outlet passages are provided, of which four groups of the air outlet passages are connected to the upper driving cylinder, and the remaining four groups of the air outlet passages are connected to the lower driving cylinder.

[0015] In one embodiment of the utility model, the air supply assembly further comprises an upper solenoid valve, and the upper solenoid valve is respectively connected to the upper drive cylinder and part of the air outlet passage of the diverter block.

[0016] In one embodiment of the utility model, the air supply assembly further comprises a lower solenoid valve, and the lower solenoid valve is respectively connected to the lower drive cylinder and part of the air outlet passage of the diverter block.

[0017] In one embodiment of the present invention, it also includes a first linear drive member, which is connected to the base and is configured to drive the base, the upper support member and the lower support member to move linearly synchronously.

[0018] In one embodiment of the utility model, it also includes a second linear drive member and a base, the second linear drive member is connected to the first linear drive member, and the two are vertically arranged, the second linear drive member is configured to drive the base, the upper support member and the lower support member to move linearly synchronously along a direction perpendicular to the driving direction of the first linear drive member; the second linear drive member is installed on the base.

[0019] The above technical solution of the utility model has the following advantages compared with the prior art:

[0020] The wafer detection device described in the utility model includes a base, an upper support member and a lower support member, the upper support member is configured to support a blue film wafer, the upper support member includes a blue film iron ring and an upper drive cylinder, the blue film iron ring is provided with a central clearance hole; the fixed end of the upper drive cylinder is connected to the base, and the movable end of the upper drive cylinder is connected to the blue film iron ring; the lower support member is configured to support an ordinary wafer, the lower support member includes an electrostatic chuck and a lower drive cylinder, the electrostatic chuck is arranged at the position of the central clearance hole of the blue film iron ring; the fixed end of the lower drive cylinder is connected to the base, and the movable end of the lower drive cylinder is connected to the electrostatic chuck; wherein, the blue film iron ring and the electrostatic chuck are arranged at different height positions. The wafer detection device integrates ordinary wafer detection and blue film wafer detection on the same base. When detecting ordinary wafers, the lower driving cylinder drives the electrostatic chuck to rise, and the external manipulator moves the ordinary wafer to the electrostatic chuck to complete loading, and then the lower driving cylinder adjusts the height position of the ordinary wafer until the detection lens is focused for detection; when detecting blue film wafers, the lower supporting part is reset, and the external manipulator moves the blue film wafer to the blue film iron ring to complete loading, and then the upper driving cylinder adjusts the height position of the blue film wafer until the detection wafer is docked for detection; through the double-layer separation setting, the compatibility and adaptability of the wafer detection device are effectively improved, the operation is convenient, and the production cost is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

[0022] Figure 1 It is a structural schematic diagram of a wafer detection device in a preferred embodiment of the utility model;

[0023] Figure 2 yes Figure 1 A schematic diagram of the structure of the upper support member and the lower support member in the wafer inspection device shown;

[0024] Figure 3 yes Figure 1 A schematic structural diagram of an upper support member and a lower support member in a wafer inspection device shown in another perspective.

[0025] Explanation of the reference numerals in the drawings in the specification: 1. base; 2. upper support member; 21. blue film iron ring; 211. center clearance hole; 22. upper drive cylinder; 23. upper vacuum suction cup; 24. positioning pin; 3. lower support member; 31. electrostatic chuck; 32. lower drive cylinder; 33. lower vacuum suction cup; 4. air supply assembly; 41. diverter block; 42. air outlet passage; 43. upper solenoid valve; 44. lower solenoid valve; 5. first linear drive member; 6. second linear drive member; 7. base. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0027] Reference Figures 1 to 3 As shown, the utility model discloses a wafer detection device, comprising:

[0028] Base 1;

[0029] The upper support member 2 is configured to support the blue film wafer, and the upper support member 2 includes a blue film iron ring 21 and an upper drive cylinder 22. The blue film iron ring 21 is provided with a centrally centered clearance hole 211; the fixed end of the upper drive cylinder 22 is connected to the base 1, and the movable end of the upper drive cylinder 22 is connected to the blue film iron ring 21;

[0030] The lower support member 3 is configured to support a common wafer, and includes an electrostatic chuck 31 and a lower drive cylinder 32. The electrostatic chuck 31 is arranged at the position of the central yield hole 211 of the blue film iron ring 21; the fixed end of the lower drive cylinder 32 is connected to the base 1, and the movable end of the lower drive cylinder 32 is connected to the electrostatic chuck 31;

[0031] The blue film iron ring 21 and the electrostatic chuck 31 are arranged at different heights.

[0032] The wafer detection device integrates ordinary wafer detection and blue film wafer detection on the same base 1. When detecting ordinary wafers, the lower driving cylinder 32 drives the electrostatic chuck 31 to rise, and the external manipulator transports the ordinary wafer to the electrostatic chuck 31 to complete loading, and then the lower driving cylinder 32 adjusts the height position of the ordinary wafer until the detection lens is focused for detection; when detecting blue film wafers, the lower support 3 is reset, and the external manipulator transports the blue film wafer to the blue film iron ring 21 to complete loading, and then the upper driving cylinder 22 adjusts the height position of the blue film wafer until the detection lens is focused for detection; through the double-layer separation setting, the compatibility and adaptability of the wafer detection device are effectively improved, the operation is convenient, and the production cost is saved.

[0033] In this embodiment, refer to Figure 2 and Figure 3 Preferably, the upper support member 2 also includes an upper vacuum suction cup 23 , and the upper vacuum suction cup 23 is evenly distributed on the blue film iron ring 21 .

[0034] The upper vacuum suction cup 23 is arranged corresponding to the blue film wafer. After the blue film wafer is loaded, the blue film wafer is stably adsorbed to ensure the detection stability.

[0035] In this embodiment, preferably, the upper support member 2 further includes a positioning pin 24 , the positioning pin 24 is connected to the blue film iron ring 21 , and the positioning pin 24 is configured to position the blue film wafer.

[0036] By providing the positioning pin 24, the positioning pin 24 and the blue film wafer are in contact with each other, which facilitates the accuracy of blue film wafer loading and improves the detection accuracy and detection efficiency.

[0037] In this embodiment, preferably, the lower support member 3 further includes a lower vacuum suction cup 33 , and the lower vacuum suction cup 33 is disposed on the electrostatic chuck 31 .

[0038] The lower vacuum suction cup 33 is set corresponding to the ordinary wafer. When the lower driving cylinder 32 drives the electrostatic chuck 31 to rise, the height of the lower vacuum suction cup 33 rises to the upper side of the blue film iron ring 21, which is convenient for material connection. After the material connection, the lower vacuum suction cup 33 adsorbs the ordinary wafer to ensure stability during detection.

[0039] In this embodiment, preferably, the wafer detection device also includes an air supply component 4, the air supply component 4 includes an air source (not shown in the figure) and a diverter block 41, the diverter block 41 is connected to the air source, the diverter block 41 is provided with a plurality of groups of air outlet passages 42, some of the air outlet passages 42 are connected to the upper driving cylinder 22, and the remaining air outlet passages 42 are connected to the lower driving cylinder 32.

[0040] By providing the diverter block 41, the diverter block 41 diverts the gas supplied by the gas source, so that the upper driving cylinder 22 and the lower driving cylinder 32 can be controlled separately, thereby improving the integration of the device.

[0041] In the present embodiment, specifically, eight groups of air outlet passages 42 are provided, of which four groups of air outlet passages 42 are connected to the upper driving cylinder 22 , and the remaining four groups of air outlet passages 42 are connected to the lower driving cylinder 32 .

[0042] In this embodiment, preferably, the air supply assembly 4 further includes an upper electromagnetic valve 43 , and the upper electromagnetic valve 43 is respectively connected to the upper driving cylinder 22 and a part of the air outlet passage 42 of the diverter block 41 .

[0043] In this embodiment, preferably, the air supply assembly 4 further includes a lower electromagnetic valve 44 , and the lower electromagnetic valve 44 is respectively connected to the lower driving cylinder 32 and a part of the air outlet passage 42 of the diverter block 41 .

[0044] By providing the upper electromagnetic valve 43 and the lower electromagnetic valve 44 , the selective control of the upper driving cylinder 22 and the lower driving cylinder 32 is effectively guaranteed, thereby improving the reliability of the wafer detection device.

[0045] In this embodiment, refer to Figure 1As shown, preferably, the wafer inspection device further comprises a first linear drive member 5, which is connected to the base 1, and the first linear drive member 5 is configured to drive the base 1, the upper support member 2 and the lower support member 3 to move linearly synchronously.

[0046] In this embodiment, preferably, the wafer detection device also includes a second linear drive 6 and a base 7. The second linear drive 6 is connected to the first linear drive 5, and the two are vertically arranged. The second linear drive 6 is configured to drive the base 1, the upper support 2 and the lower support 3 to move linearly synchronously along a direction perpendicular to the driving direction of the first linear drive 5; the second linear drive 6 is installed on the base 7.

[0047] By setting the first linear drive 5 and the second linear drive 6, multi-directional rapid adjustment of the wafer detection position can be achieved, and ordinary wafer detection and blue film wafer detection share the same set of first linear drive 5 and second linear drive 6 drives, effectively saving production costs.

[0048] The implementation principle of this embodiment is as follows: when the wafer detection device is in use, the gas source provides air flow to the diverter block 41. When an ordinary wafer is detected, the lower solenoid valve 44 is opened, the upper solenoid valve 43 is closed, and the fluid enters the lower drive cylinder 32. The lower drive cylinder 32 drives the electrostatic chuck 31 to rise, and an external manipulator transports the ordinary wafer to the electrostatic chuck 31 to complete loading. Then, the lower drive cylinder 32 adjusts the height position of the ordinary wafer until the detection lens is focused for detection; when a blue film wafer is detected, the lower support 3 is reset, the lower solenoid valve 44 is closed, and the external manipulator transports the blue film wafer to the blue film iron ring 21 to complete loading. Then, the upper solenoid valve 43 is opened, and the air flow enters the upper drive cylinder 22. The upper drive cylinder 22 adjusts the height position of the blue film wafer until the detection wafer is docked for detection.

[0049] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer inspection device, characterized in that: include: Pedestal; An upper support member, the upper support member is configured to support a blue film wafer, the upper support member comprises a blue film iron ring and an upper drive cylinder, the blue film iron ring is provided with a centrally centered clearance hole; the fixed end of the upper drive cylinder is connected to the base, and the movable end of the upper drive cylinder is connected to the blue film iron ring; A lower support member, the lower support member is configured to support an ordinary wafer, the lower support member comprises an electrostatic chuck and a lower drive cylinder, the electrostatic chuck is arranged at the position of the central yield hole of the blue film iron ring; the fixed end of the lower drive cylinder is connected to the base, and the movable end of the lower drive cylinder is connected to the electrostatic chuck; Wherein, the blue film iron ring and the electrostatic chuck are arranged at different height positions.

2. The wafer inspection device according to claim 1, characterized in that: The upper support also includes an upper vacuum suction cup, and the upper vacuum suction cup is evenly distributed on the blue film iron ring.

3. The wafer inspection device according to claim 1, characterized in that: The upper support also includes a positioning pin, which is connected to the blue film iron ring and is configured to position the blue film wafer.

4. The wafer inspection device according to claim 1, characterized in that: The lower layer support member further includes a lower layer vacuum suction cup, and the lower layer vacuum suction cup is arranged on the electrostatic chuck.

5. The wafer inspection device according to claim 1, characterized in that: It also includes an air supply component, which includes an air source and a diverter block. The diverter block is connected to the air source, and the diverter block is provided with multiple groups of air outlet passages. Some of the air outlet passages are connected to the upper driving cylinder, and the remaining air outlet passages are connected to the lower driving cylinder.

6. The wafer inspection device according to claim 5, characterized in that: The air outlet passages are provided with eight groups, of which four groups are connected to the upper driving cylinders, and the remaining four groups are connected to the lower driving cylinders.

7. The wafer inspection device according to claim 5, characterized in that: The air supply assembly further comprises an upper electromagnetic valve, which is respectively connected to the upper driving cylinder and part of the air outlet passages of the diverter block.

8. The wafer inspection device according to claim 5, characterized in that: The air supply assembly also includes a lower electromagnetic valve, which is respectively connected to the lower driving cylinder and part of the air outlet passage of the diverter block.

9. The wafer inspection device according to claim 1, characterized in that: It also includes a first linear drive member, which is connected to the base and is configured to drive the base, the upper support member and the lower support member to move linearly synchronously.

10. The wafer inspection device according to claim 9, characterized in that: It also includes a second linear drive member and a base, wherein the second linear drive member is connected to the first linear drive member and the two are vertically arranged, and the second linear drive member is configured to drive the base, the upper support member and the lower support member to move linearly synchronously along a direction perpendicular to the driving direction of the first linear drive member; the second linear drive member is installed on the base.