Auxiliary positioning device for semiconductor production

Abstract

The utility model relates to the technical field of semiconductor production, in particular to an auxiliary positioning device for semiconductor production, and aims to solve the technical problems that most auxiliary positioning devices for semiconductor production are used for positioning in a clamping manner, the devices are operated by adopting preset parameters, the motion trail of each part of the devices is fixed, and the positioning accuracy is high. Therefore, the method does not have good adaptability to wafers with different sizes, an operator needs to adjust parameters again, and normal propulsion of a semiconductor production line is affected. According to the technical scheme, the auxiliary positioning device for semiconductor production comprises a bearing platform assembly, an air exhaust assembly, a first positioning assembly, a second positioning assembly, a first detection assembly and a second detection assembly; compared with a traditional semiconductor production auxiliary positioning device which cannot adapt to different sizes of wafers, the wafer clamping auxiliary positioning device has the advantages that a pressure detection function is added at a wafer clamping contact end through a mode of detecting clamping pressure, and whether clamping is in place or not is detected through pressure change.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to an auxiliary positioning device for semiconductor production. Background Art

[0002] Semiconductor technology refers to various semiconductor processing technologies, including wafer growth technology, thin film deposition, photolithography, etching, doping technology and process integration. Semiconductor technology is the technology of using semiconductors as materials to make components and integrated circuits. The elements in the periodic table can be roughly divided into three categories according to their conductivity: conductors, semiconductors and insulators. The most common semiconductor is silicon. Of course, semiconductors can also be compounds formed by two elements, such as gallium arsenide, but compound semiconductors are mostly used in optoelectronics. Very high precision is required in the semiconductor production process, so the wafer needs to be positioned. However, most semiconductor production auxiliary positioning devices use clamping for positioning. The device operates with pre-set parameters, and the movement trajectory of each component of the device is fixed. Therefore, it does not have good adaptability when facing wafers of different sizes, and the operator needs to adjust the parameters again, which affects the normal progress of the semiconductor production line. Utility Model Content

[0003] In order to overcome the problem that most semiconductor production auxiliary positioning devices use a clamping method for positioning, the device operates with pre-set parameters, and the movement trajectories of the various components of the device are fixed. Therefore, it does not have good adaptability when facing wafers of different sizes, and the operator needs to adjust the parameters again, affecting the normal advancement of the semiconductor production line.

[0004] The technical solution of the utility model is: a semiconductor production auxiliary positioning device, including a base, a support platform assembly, an exhaust assembly, a first positioning assembly, a second positioning assembly, a first detection assembly and a second detection assembly; a support platform assembly is arranged above the base, an exhaust assembly is arranged on one side of the support platform assembly, a first positioning assembly is arranged on one side of the support platform assembly, a second positioning assembly is arranged on one side of the support platform assembly, a first detection assembly is arranged on one side of the first positioning assembly, and a second detection assembly is arranged on one side of the second positioning assembly.

[0005] Preferably, a base is provided to bear the weight of the device, a work platform is provided by a base assembly, a vacuum environment is created by an exhaust assembly to adsorb the wafer, the wafer is centered by a first positioning assembly, the wafer is centered by a second positioning assembly, the clamping positioning pressure is detected by a first detection assembly, and the clamping positioning pressure is detected by a second detection assembly.

[0006] Preferably, the support platform assembly includes support legs and a suction cup platform; support legs are arranged above the base, and multiple groups of support legs are arranged, and a suction cup platform is arranged above the support legs; the weight of the suction cup platform is supported by the support legs, and the suction cup platform is used as a workbench.

[0007] Preferably, the vacuum assembly includes a vacuum pipe and a vacuum pump; a vacuum pipe is provided on one side of the suction cup platform, and a vacuum pump is provided at one end of the vacuum pipe; the air in the suction cup platform is drawn out through the vacuum pipe, and the air is pumped out through the vacuum pump to create a vacuum environment.

[0008] Preferably, the first positioning assembly includes a first slider, a first electric telescopic rod and a first buffer pad; a first slider is provided on one side of the suction cup table, two groups of first sliders are provided, a first electric telescopic rod is provided on one side of the first slider, and a first buffer pad is provided above the first slider; the wafer is clamped and positioned by the first slider, the first slider is moved by the first electric telescopic rod, and the wafer is protected and the first detection assembly is fixed by the first buffer pad.

[0009] Preferably, the second positioning assembly includes a second slider, a second electric telescopic rod and a second buffer pad; a second slider is provided on one side of the suction cup table, two groups of second sliders are provided, a second electric telescopic rod is provided on one side of the second slider, and a second buffer pad is provided above the second slider; the wafer is clamped and positioned by the second slider, the second slider is moved by the second electric telescopic rod, and the wafer is protected and the second detection assembly is fixed by the second buffer pad.

[0010] Preferably, the first detection component includes a first pressure probe and a first pressure sensor; the first pressure probe is arranged inside the first buffer pad, and the first pressure sensor is arranged on one side of the first pressure probe; the clamping pressure of the first slider is detected by the first pressure probe, and the detection data of the first pressure probe is processed by the first pressure sensor.

[0011] Preferably, the second detection component includes a second pressure probe and a second pressure sensor; a second pressure probe is arranged inside the second buffer pad, and a second pressure sensor is arranged on one side of the second pressure probe; the clamping pressure of the second slider is detected by the second pressure probe, and the detection data of the second pressure probe is processed by the second pressure sensor.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the traditional semiconductor production auxiliary positioning device, which uses clamping for positioning, the device operates with pre-set parameters, and the movement trajectory of each component of the device is fixed. Therefore, it does not have good adaptability to wafers of different sizes, and the operator needs to adjust the parameters again, which affects the normal advancement of the semiconductor production line. This device detects the clamping pressure and adds a pressure detection function to the contact end with the wafer clamping. It detects whether the clamping is in place through the change of pressure, and realizes the adaptation to wafers of different sizes;

[0014] 2. During positioning, the wafer is placed on the suction cup table, and the first electric telescopic rod is extended and retracted to drive the two groups of first sliders to move toward each other on the x-axis, drive the first buffer pad to move to contact the wafer and push the wafer to move. During this process, the first pressure probe detects the pressure data in real time and transmits it to the first pressure sensor. When the pressure reaches a certain value, the first electric telescopic rod stops working. At the same time, the second electric telescopic rod is extended and retracted to drive the two groups of second sliders to move toward each other on the y-axis, drive the second buffer pad to move to contact the wafer and push the wafer to move. During this process, the second pressure probe detects the pressure data in real time and transmits it to the second pressure sensor. When the pressure reaches a certain value, the second electric telescopic rod stops working, so as to solve the problem that most semiconductor production auxiliary positioning devices cannot adapt to wafers of different sizes;

[0015] 3. During operation, after the wafer is positioned, the vacuum pump starts to work, extracting the air in the suction cup through the vacuum pipe, and fixes the wafer on the suction cup by air pressure, which is convenient for subsequent processing. In this process, the support legs bear the weight of the suction cup and the wafer, and transfer the weight to the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 What is shown is a three-dimensional structural schematic diagram of a semiconductor production auxiliary positioning device of the utility model;

[0017] Figure 2 What is shown is a schematic diagram of the three-dimensional structure of a support platform component of a semiconductor production auxiliary positioning device of the utility model;

[0018] Figure 3 What is shown is a schematic diagram of the three-dimensional structure of a first positioning component of a semiconductor production auxiliary positioning device of the utility model;

[0019] Figure 4 What is shown is a schematic diagram of the three-dimensional structure of a first detection component of a semiconductor production auxiliary positioning device of the utility model.

[0020] Explanation of the reference numerals: 1. base; 2. support platform assembly; 3. vacuum assembly; 4. first positioning assembly; 5. second positioning assembly; 6. first detection assembly; 7. second detection assembly; 201. support leg; 202. suction cup platform; 301. vacuum pipe; 302. vacuum pump; 401. first slider; 402. first electric telescopic rod; 403. first buffer pad; 501. second slider; 502. second electric telescopic rod; 503. second buffer pad; 601. first pressure probe; 602. first pressure sensor; 701. second pressure probe; 702. second pressure sensor. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1 The utility model provides an embodiment: a semiconductor production auxiliary positioning device, including a base 1, a support platform assembly 2, an exhaust assembly 3, a first positioning assembly 4, a second positioning assembly 5, a first detection assembly 6 and a second detection assembly 7; the support platform assembly 2 is arranged above the base 1, the exhaust assembly 3 is arranged on one side of the support platform assembly 2, the first positioning assembly 4 is arranged on one side of the support platform assembly 2, the second positioning assembly 5 is arranged on one side of the support platform assembly 2, the first detection assembly 6 is arranged on one side of the first positioning assembly 4, and the second detection assembly 7 is arranged on one side of the second positioning assembly 5.

[0023] See also Figure 2 In this embodiment, the support platform assembly 2 includes a supporting leg 201 and a suction cup platform 202. The supporting leg 201 is arranged above the base 1. The supporting leg 201 is provided with multiple groups. The suction cup platform 202 is arranged above the supporting leg 201. The weight of the suction cup platform 202 is supported by the supporting leg 201, and the suction cup platform 202 is used as a workbench; the exhaust component 3 includes an exhaust pipe 301 and an exhaust pump 302. The exhaust pipe 301 is arranged on one side of the suction cup platform 202, and the exhaust pump 302 is arranged at one end of the exhaust pipe 301. The air in the suction cup platform 202 is drawn out through the exhaust pipe 301, and the air is exhausted by the exhaust pump 302 to create a vacuum environment.

[0024] See also Figure 3In this embodiment, the first positioning assembly 4 includes a first slider 401, a first electric telescopic rod 402 and a first buffer pad 403. The first slider 401 is arranged on one side of the suction cup table 202. The first slider 401 is arranged in two groups. The first electric telescopic rod 402 is arranged on one side of the first slider 401. The first buffer pad 403 is arranged above the first slider 401. The wafer is clamped and positioned by the first slider 401, and the first slider 401 is moved by the first electric telescopic rod 402. The wafer is protected and fixed by the first buffer pad 403. Component 6; the second positioning component 5 includes a second slider 501, a second electric telescopic rod 502 and a second buffer pad 503. The second slider 501 is arranged on one side of the suction cup table 202. The second slider 501 is arranged in two groups. A second electric telescopic rod 502 is arranged on one side of the second slider 501. A second buffer pad 503 is arranged above the second slider 501. The wafer is clamped and positioned by the second slider 501, and the second slider 501 is moved by the second electric telescopic rod 502. The wafer is protected by the second buffer pad 503 and the second detection component 7 is fixed.

[0025] See also Figure 4 In this embodiment, the first detection component 6 includes a first pressure probe 601 and a first pressure sensor 602. The first pressure probe 601 is arranged inside the first buffer pad 403, and the first pressure sensor 602 is arranged on one side of the first pressure probe 601. The clamping pressure of the first slider 401 is detected by the first pressure probe 601, and the detection data of the first pressure probe 601 is processed by the first pressure sensor 602. The model of the first pressure sensor 602 is MD-G301; the second detection component 7 includes a second pressure probe 701 and a second pressure sensor 702. The second pressure probe 701 is arranged inside the second buffer pad 503, and the second pressure sensor 702 is arranged on one side of the second pressure probe 701. The clamping pressure of the second slider 501 is detected by the second pressure probe 701, and the detection data of the second pressure probe 701 is processed by the second pressure sensor 702. The model of the second pressure sensor 702 is MD-G301.

[0026] During positioning, the wafer is placed on the suction cup table 202, and the first electric telescopic rod 402 is extended and retracted to drive the two groups of first sliders 401 to move toward each other, and drive the first buffer pad 403 to move to contact the wafer and push the wafer to move. In this process, the first pressure probe 601 detects pressure data in real time and transmits it to the first pressure sensor 602. When the pressure reaches a certain value, the first electric telescopic rod 402 stops working. At the same time, the second electric telescopic rod 502 is extended and retracted to drive the two groups of second sliders 501 to move toward each other in a direction perpendicular to the movement direction of the first slider 401, and drive the second buffer pad 503 to move to contact the wafer and push the wafer to move. In this process, the second pressure probe 701 detects pressure data in real time and transmits it to the second pressure sensor 702. When the pressure reaches a certain value, the second electric telescopic rod 502 stops working.

[0027] During operation, after the wafer is positioned, the vacuum pump 302 starts to work, and the air in the suction cup table 202 is extracted through the vacuum pipe 301, and the wafer is adsorbed and fixed on the suction cup table 202 by air pressure, which is convenient for subsequent processing. In this process, the support legs 201 bear the weight of the suction cup table 202 and the wafer, and transfer the weight to the base 1.

[0028] Through the above steps, the base 1 is set to bear the weight of the device, the base assembly 2 is used to provide a working platform, the vacuum assembly 3 is used to create a vacuum environment to adsorb the wafer, the first positioning assembly 4 is used to center the wafer, the second positioning assembly 5 is used to center the wafer, the first detection assembly 6 is used to detect the clamping positioning pressure, and the second detection assembly 7 is used to detect the clamping positioning pressure.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A semiconductor production auxiliary positioning device, comprising a base (1); characterized in that: The invention also comprises a support assembly (2), an exhaust assembly (3), a first positioning assembly (4), a second positioning assembly (5), a first detection assembly (6) and a second detection assembly (7); the support assembly (2) is arranged above the base (1); the exhaust assembly (3) is arranged on one side of the support assembly (2); the first positioning assembly (4) is arranged on one side of the support assembly (2); the second positioning assembly (5) is arranged on one side of the support assembly (2); the first detection assembly (6) is arranged on one side of the first positioning assembly (4); and the second detection assembly (7) is arranged on one side of the second positioning assembly (5).

2. A semiconductor production auxiliary positioning device according to claim 1, characterized in that: The support platform assembly (2) comprises support legs (201) and a suction cup platform (202); the support legs (201) are arranged above the base (1), the support legs (201) are arranged in multiple groups, and the suction cup platform (202) is arranged above the support legs (201).

3. A semiconductor production auxiliary positioning device according to claim 2, characterized in that: The air extraction component (3) comprises an air extraction pipe (301) and an air extraction pump (302); the air extraction pipe (301) is arranged on one side of the suction cup platform (202), and the air extraction pump (302) is arranged on one end of the air extraction pipe (301).

4. The semiconductor production auxiliary positioning device according to claim 2, characterized in that: The first positioning assembly (4) comprises a first slider (401), a first electric telescopic rod (402) and a first buffer pad (403); the first slider (401) is arranged on one side of the suction cup platform (202), the first slider (401) is arranged in two groups, the first electric telescopic rod (402) is arranged on one side of the first slider (401), and the first buffer pad (403) is arranged above the first slider (401).

5. The semiconductor production auxiliary positioning device according to claim 2, characterized in that: The second positioning assembly (5) comprises a second slider (501), a second electric telescopic rod (502) and a second buffer pad (503); the second slider (501) is arranged on one side of the suction cup platform (202), the second slider (501) is arranged in two groups, the second electric telescopic rod (502) is arranged on one side of the second slider (501), and the second buffer pad (503) is arranged above the second slider (501).

6. The semiconductor production auxiliary positioning device according to claim 4, characterized in that: The first detection component (6) comprises a first pressure probe (601) and a first pressure sensor (602); the first pressure probe (601) is arranged inside the first buffer pad (403), and the first pressure sensor (602) is arranged on one side of the first pressure probe (601).

7. The semiconductor production auxiliary positioning device according to claim 1, characterized in that: The second detection component (7) comprises a second pressure probe (701) and a second pressure sensor (702); the second pressure probe (701) is arranged inside the second buffer pad (503), and the second pressure sensor (702) is arranged on one side of the second pressure probe (701).

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